TWI721760B - Electroplating device and method - Google Patents

Abstract

An electroplating device and an electroplating method using the electroplating device. The electroplating device includes an electroplating tank, a power supply module, a pair of anode plates, a hanging module, a driving module, and a control module; the electroplating device is arranged in the electroplating tank through the driving module Above and drive the hanging module and move the objects to be plated; the control module controls the drive module, and the drive module drives the hanging module so that the distance between adjacent objects to be plated is less than or equal to 10 Millimeters, according to this, the hanging position of each plated object is determined by the width of the plated object and the distance between adjacent plated objects, and it is controlled to start energizing after all the plated objects enter the electrolytic cell body, thereby improving The usage rate of each hanger can also effectively achieve the advantage of consistent coating thickness of the object to be plated.

Description

Electroplating device and method

The present invention relates to an electroplating device and an electroplating method, in particular to a method that can calculate the hanging position of each electroplated object according to the width of the electroplated object and the distance between adjacent electroplated objects, and arrange all the objects to be electroplated An electroplating device that starts electroplating after positioning and an electroplating method using the electroplating device.

There are two types of existing electroplating devices. In one of the electroplating devices, the electroplating tank includes a material inlet and a discharge port. A plurality of objects to be electroplated are sequentially put into and hung in the electroplating tank through the material inlet of the electroplating tank. Inside the tank, and the objects to be electroplated will be moved to the discharge port of the electroplating tank in sequence according to the travel path, and then moved out of the electroplating tank from the discharge port after the electroplating is completed. This method is also known as an electroplating device with "loading and unloading on different sides". For example, the inlet is on the front side of the electroplating tank, and the outlet is on the back side of the electroplating tank. In another type of electroplating device, the electroplating tank contains only one inlet and outlet. For example, the inlet and outlet are on the front side of the electroplating tank, and the feeding and discharging positions of the electroplated objects are on the left and right sides of the inlet and outlet respectively. A plurality of objects to be plated are sequentially placed and hung in the electroplating tank through the feeding position on the left side of the entrance and exit of the front side of the electroplating tank, and the objects to be plated will be moved to the electroplating tank in sequence according to the travel path. The U-shaped rotation of the travel path is performed on the back side, and then the travel path after the U-shaped rotation moves the object to be electroplated from the back side of the electroplating tank to the exit on the right side of the inlet and outlet on the front side of the electroplating tank. The material position is moved out of the electroplating tank from the material discharging position after the electroplating is completed. This method is also called "the same side of loading and unloading" electroplating device.

In the aforementioned existing electroplating device, the placement position of each object to be plated is fixed, that is, regardless of the width of the object to be plated, each object to be plated is placed in the same position, and the same number of objects to be plated are placed at a time. However, for objects to be plated with a small width, the utilization rate of the electroplating device is wasted, and the distance between adjacent objects to be plated is relatively large. Moreover, during the electroplating process, the current density at the edge of the object to be plated is relatively strong, so a thicker plating layer is formed on the edge of the object to be plated, so there is a problem of inconsistent plating thickness of the object to be plated.

In view of this, the purpose of the present invention is to provide an electroplating device and an electroplating method, which can determine the hanging position of each object to be plated according to the width of the object to be plated and the distance between adjacent objects, and control it in all objects to be plated After entering the electrolytic cell body, the power is turned on, thereby increasing the usage rate of each hanging and avoiding the problem of inconsistent coating thickness of the object to be plated.

An embodiment of the electroplating device of the present invention includes an electroplating tank, a power module, a pair of anode plates, a hanging module, a driving module, and a control module. The electroplating tank has an accommodating space, and the accommodating space is loaded with electroplating liquid. The power module provides a positive potential and a negative potential. The pair of anode plates are connected to a positive potential and are arranged in the accommodating space. The hanging module is arranged above the electroplating tank and located between the pair of anode plates. The object to be plated is suspended from the hanging module and located between the pair of anode plates and immersed in the electroplating solution. The hanging module is connected to Negative potential. The driving module is arranged above the electroplating tank and drives the hanging module, and can move the objects to be plated. The control module is electrically connected to the drive module and the power module. The control module controls the drive module, and the drive module drives the hanging module so that the distance between adjacent objects to be plated is less than or equal to 10 mm.

In another embodiment, when the number of objects to be plated hanging on the hanging module reaches a set amount, the control module controls the power module to supply power to the pair of anode plates and the hanging module.

In another embodiment, the set number is the maximum number of objects to be plated by the hanging module.

In another embodiment, the control module calculates the maximum number of objects that can be hung by the suspension module according to the width of the suspension module, the width of the object to be plated, and the distance between the objects to be plated.

In another embodiment, the electroplating apparatus of the present invention further includes a pair of dummy plates, wherein the objects to be plated are arranged in a row and located between the pair of dummy plates.

In another embodiment, the hanging module includes a hanging rail and a plurality of clamps, and the clamps are movably arranged on the hanging rail, and each of the clamps clamps an object to be plated.

In another embodiment, the driving module includes a transverse rail, a driving body, a first driver, a moving mechanism, and a toggle mechanism. The first driver and the toggle mechanism are disposed on the driving body, and the first driver drives The moving mechanism makes the driving body move along the horizontal moving track, and the toggle mechanism pushes the jig to move along the hanging track.

In another embodiment, the traverse rail is parallel to the suspension rail.

In another embodiment, the moving mechanism includes a leading element, a guided element, and a position sensor. The guided element is fixed to the driving body and guided by the leading element to travel a predetermined lead. The sensor senses the position of the guided part.

In another embodiment, the leading member is a rack and the guided member is a gear, and the gear is driven to rotate by the first driver.

In another embodiment, the rack is parallel to the traverse rail.

In another embodiment, the lead member is a lead screw, and the guided member is a slider, the slider is screwed to the lead screw, and the lead screw is driven to rotate by the first driver.

In another embodiment, the toggle mechanism includes a second driver, a toggle member, and an angle sensor. The second driver rotates the toggle member around a rotation axis parallel to the hanging rail, and the angle sensor detects Measure the angle of rotation of the toggle.

In another embodiment, the toggle member can abut against the clamp.

In another embodiment, the control module includes a processor, a plated object width unit, a pitch unit, a quantity unit, and a stroke unit. The plated object width unit is connected to a plated object width database. The unit is connected to a spacing parameter library, the width of the plated object reads a width parameter of the plated object from the width parameter library of the plated, the spacing unit reads a spacing parameter from the spacing database, and the processor is based on the width of the plated object. The width parameter, the spacing parameter and the width of the hanging module calculate the quantity and the position of each object to be plated in the hanging module to output a quantity parameter to the quantity unit and a position parameter to the stroke unit, and the processor is based on The position parameter and the quantity parameter drive the driving module, and the driving module moves the hanging module to move the objects to be plated to a predetermined position.

In another embodiment, the control module further includes a clamp unit connected to a clamp width database, and the clamp unit reads a clamp width parameter from the clamp width database.

In another embodiment, the control module further includes an input unit, the input unit is connected to the processor, and the width parameter and the spacing parameter of the object to be plated are input through the input unit.

In another embodiment, the control module further includes an output unit connected to the processor and the drive module, and the processor transmits the control signal to the drive module according to the position parameter and the quantity parameter.

In addition, an embodiment of an electroplating method provided by the present invention is applicable to the electroplating apparatus as described above, wherein the electroplating method at least includes the following steps: obtaining parameters: obtaining a plurality of parameters, the parameters including a clamp width Parameters, a number of fixtures, a number of objects to be plated, a width parameter of the objects to be plated, and a distance parameter between the objects to be plated; step of calculating the position of the parameters: calculate a position parameter of each object to be plated through these parameters ; Fixture positioning step: move each fixture and the plated object held by each fixture to the position corresponding to the position parameter; electroplating step: when all the fixtures and the plated object held are moved to these positions After that, electroplating is performed.

In another embodiment of the electroplating method, before the electroplating step, the step of clamping and setting the dummy plate is further included: by setting at least one dummy plate beside the object to be plated, when the dummy plate is removed After that, the coating of the object to be plated can reach uniformity.

In another embodiment of the electroplating method, there are two dummy plating plates, and each of the objects to be plated is arranged in a row and located between the two dummy plating plates.

In another embodiment of the electroplating method, the clamp unit is connected to a clamp width database, and the clamp unit reads the clamp width parameter from the clamp width database.

In another embodiment of the electroplating method, wherein the parameter of the spacing between the objects to be plated is less than or equal to 10 mm.

In another embodiment of the electroplating method, wherein, between the step of obtaining parameters and the step of calculating the position of the parameters, an input parameter step of inputting each parameter to a control module is further included, which is used to obtain After inputting the parameters, calculate the distance, width or quantity of the object to be plated, so that the control module can adjust the operation of the electroplating device.

In another embodiment of the electroplating method, the control module includes a processor, a width unit of the object to be plated, a pitch unit, a quantity unit, and a stroke unit, and the width unit of the object to be plated is connected to a width unit to be plated. Object width database, the spacing unit is connected to a spacing database, the plated object width unit reads a plated object width parameter from the plated object width database, and the spacing unit reads a spacing from the spacing database Parameters, the processor calculates the quantity and the position of each plated object in the hanging module according to the width parameter of the plated object, the spacing parameter and the width of the hanging module to output a quantity parameter to the quantity unit And a position parameter to the stroke unit, the processor drives the driving module according to the position parameter and the quantity parameter, and the driving module moves the hanging module to move the objects to be plated to predetermined positions.

In another embodiment of the electroplating method, before the electroplating step, the control module can perform the electroplating step after all the fixtures holding the object to be plated or the dummy plated plate are positioned.

The present invention provides an electroplating device and an electroplating method using the electroplating device. The control module calculates each plated object according to the width of the object to be plated, the distance between adjacent objects to be plated, and the width of the hanging module. The hanging module is driven by the drive module to move each plated object to a predetermined position, so that the utilization rate of each hanging object can be optimized.

In addition, the electroplating device of the present invention and the electroplating method using the electroplating device mainly control the power supply unit to start power supply after all the objects to be plated enter the electroplating tank, and then turn off the power supply unit after the electroplating is finished. By removing the plated object, each object to be plated can be plated with the same thickness. In addition, provision of dummy plating plates at the extreme edges of the two sides of the rows of objects to be plated can make the areas with higher current density be formed on the dummy plates, avoiding the problem of uneven plating thickness of the actual objects to be plated.

Please refer to FIG. 1, FIG. 2, and FIG. 3, which show an embodiment of the electroplating apparatus of the present invention. The electroplating device 100 of the present invention includes an electroplating tank 10, a power module (not shown in the figure), a pair of anode plates 11 (Figure 13), a hanging module 20, a driving module 30, and a control Module 40 (Figure 11). The electroplating tank 10 has an accommodating space (FIG. 13, not numbered), and the accommodating space is loaded with electroplating solution. The power module provides a positive potential and a negative potential. The pair of anode plates 11 are connected to a positive potential and are arranged in the accommodating space. The hanging module 20 is arranged above the electroplating tank 10 and between the pair of anode plates. A plurality of objects O (Figure 4) to be plated are suspended from the hanging module 20 and located between the pair of anode plates 11. And immersed in the electroplating solution, the hanging module 20 is connected to a negative potential. The driving module 30 is arranged above the electroplating tank 10 and drives the hanging module 20 and moves the objects O to be plated. The control module 40 is electrically connected to the drive module 30 and the power supply module. The control module 40 controls the driving module 30, and the driving module 30 drives the hanging module 20 so that the distance between the adjacent objects O to be plated is less than or equal to 10 mm.

As shown in FIG. 1, an extension wall W is provided on the side of the electroplating tank 10, and the hanging module 20 and the driving module 30 are both provided on the extension wall W. The hanging module 20 includes a hanging rail 21 and a plurality of clamps 22 (please refer to Figure 4). The clamps 22 are movably arranged on the hanging rail 21, and each clamp 22 clamps an object to be plated. O. In this embodiment, the object O to be plated may be, for example, a circuit board. The electrolyte may be, for example, a copper sulfate solution (CuSO ₄ ), and the pair of anode plates 11 may be, for example, a copper plate.

The driving module 30 includes a transverse rail 31, a driving body 32, a first driver 33, a moving mechanism 34, and a toggle mechanism 35. The first driver 33 and the toggle mechanism 35 are disposed on the driving body 32. The driver 33 drives the moving mechanism 34 to move the moving mechanism 34 to drive the main body 32 to move along the horizontal moving track 31, and the toggle mechanism 35 pushes the clamp 22 to move along the hanging track 21. The traverse rail 31 is arranged on the extension wall W and is parallel to the hanging rail 21. When the driving body 32 moves along the traverse rail 31, the toggle mechanism 35 pushes the clamp 22 to move along the hanging rail 21 in the same direction.

In this embodiment, as shown in Figures 2 and 3, the driving body 32 is provided with two sets of upper and lower rollers 321. The rollers 321 clamp the transverse rail 31 and can roll on the transverse rail 31 to make the driving body 32 Move along the traverse rail 31. The driving body 32 further includes an extension arm 322, and the toggle mechanism 35 is disposed at the front end of the extension wall. The extension arm 322 is parallel to the hanging rail 21 and the traverse rail 31. The first driver 33 is disposed on the driving body 32. In this embodiment, the first driver 33 is a motor, such as a stepping motor or a servo motor.

The moving mechanism 34 includes a guide member 341, a guided member 342, and a position sensor 343. The guided member 342 is disposed on the driving body 31 and guided by the guide member 341 to travel a predetermined lead. The detector 343 senses the position of the guided member 342. In this embodiment, the guiding member 341 is a rack, the guided member 342 is a gear, and the guided member 342 is driven to rotate by the first driver 33. As shown in FIG. 3, the guided member 342 is pivoted to the driving body 32 and is driven to rotate by the first driver 33, the guide member 341 is provided on the extension wall W, and the guided member 342 is engaged with the guide member 341. When the guided member 342 is driven to rotate by the first driver 33, the guided member 342 travels along the guide member 341, the pitch of the guide member 341 is used as the lead, and how many pitches the guided member 342 has moved is calculated. Distance, the distance that the guided member 342 moves can be calculated. Therefore, the position sensor 343 can use the angle sensor that senses the rotation of the first driver 33 to indirectly calculate the distance moved by the guided member 342. The position sensor 343 can also use a linear sensor, such as an optical ruler, to measure the distance moved by the guided member 342.

In addition, as shown in FIG. 3, the output shaft of the first driver 33 directly penetrates the gear as the guided member 342. In another embodiment, the output shaft of the first driver 33 may also be parallel to the rack as the guide member 341, so the output shaft of the first driver 31 may penetrate a worm and be driven by the worm as the guided member 342 gear (worm gear), so that it can transmit rotational power in two orthogonal directions. Alternatively, the output shaft of the first driver 33 can pass through a bevel gear, and the gear as the guided member 342 can be connected to another bevel gear in series. The two bevel gears mesh with each other, or they can be orthogonal to each other. The effect of transmitting rotational power in the direction.

In another embodiment, the guide member 341 may also be a lead screw, and the guided member 342 may also be a slider screwed with the lead screw. The first driver 33 drives the rotating guide member 341 (lead screw) to move the guided member 342 (slider) along the guide member 341. In other embodiments, the first driver 33 may also be installed on the extension wall W instead of being installed on the driving body 32.

As shown in Figures 2 and 3, the toggle mechanism 35 includes a second driver 351, a toggle member 352, and an angle sensor 353. The second driver 351 makes the toggle member 352 run parallel to the hanging rail. A rotation axis of 21 rotates, and the angle sensor 353 detects the rotation angle of the toggle member 352. In this embodiment, the second driver 351 is provided at the front end of the extension arm 322 of the driving body 32, the toggle member 352 is installed on the output shaft of the second driver 351, and two angle sensors are provided on the second driver 351 353. The two angle sensors 353 are separated by a predetermined angular distance. When the second driver 351 drives the toggle member 352 to rotate, the toggle member 352 moves to be sensed by any angle sensor 353, and the second driver 351 The rotation is stopped, so that the two angle sensors 353 define the rotation angle of the dial 352.

Please refer to Fig. 4, Fig. 5 and Fig. 6, which show the process of feeding the material to be plated in the electroplating device. The clamp 22 together with the object to be plated O clamped by the clamp 22 is placed on the hanging rail 21 from the entrance of the electrolytic cell body 10. At this time, the first driver 33 drives the guided member 342 to move along the guide member 341 so that the driving body 32 moves to the entrance along the traverse rail 31. At this time. As shown in FIG. 5, after the toggle member 352 rotates clockwise and avoids the clamp 22, it rotates counterclockwise to make the toggle member 352 abut against the clamp 22 so that the toggle member 352 is positioned in front of the clamp. Then the first driver 33 reverses and drives the guided member 342 to move in the opposite direction along the guide member 341 so that the driving body 32 moves to a predetermined position along the traverse rail 31, while the toggle member 352 pushes the clamp 22 along the hanging The rail 21 moves to a predetermined position. Each clamp 22 together with the object to be plated O clamped by the clamp 22 moves one by one to a corresponding predetermined position.

In this embodiment, the power supply module is turned on after the object to be plated O reaches the set number in the hanging module 20 and all enters the electroplating tank 10, and power is supplied to the pair of anode plates and the hanging module 20, so all The object to be plated can be electroplated at the same time. When the plating layer on the surface of the plated object reaches a predetermined thickness, first turn off the power module, and then take out the plated object O one by one. In this way, each object O can be plated with a uniform thickness.

Please refer to Figure 7, which shows the process of removing the material to be plated in the electroplating device of the present invention. The first driver 33 drives the guided member 342 to move along the guide member 341 to move the driving body 32 to the clamp 22 along the traverse rail 31, and then rotates the toggle member 352 so that the toggle member 352 abuts against the clamp 22, Then the first driver 31 drives the guided member 342 to move along the guide member 341 so that the driving body 32 moves to the entrance along the traverse rail 31, while the toggle member 352 pushes the clamp 22 to move along the hanging rail 21 to the entrance. Then take out the plated objects O together with the clamp 22 one by one.

The set number of the above-mentioned objects O to be plated in the hanging module 20 may be the maximum number of the objects O to be plated by the hanging module 20 hanging. The control module 40 calculates the maximum number of objects O that can be hung by the suspension module 20 according to the width of the suspension module 20, the width of the object O to be plated, and the distance between the objects O to be plated. For example, the length of the hanging rail 21 of the hanging module 20 is 3 meters (300 cm), the width of each object O to be plated is 20 cm, and the distance between two objects O to be plated is 10 mm, so it can be calculated The maximum number of the plated objects O that can be hung from the hanging module 20 is 14 pieces. Then the control module 40 calculates the position coordinates of each clamp 22 on the hanging rail 21, and then moves each clamp 22 to the set coordinates as described above.

Please refer to Figures 8 and 9, which show that two different widths of the plated object O (circuit board) are placed on the hanging module 20, and the control module 40 will be based on the width of the plated object O and the two The spacing of the plating objects O allows the hanging module 20 to suspend the plating objects O to the maximum amount. Unlike the prior art, regardless of the width of the object O to be plated, the fixture is moved to a certain position, which is likely to cause a decrease in the utilization rate.

Please refer to FIG. 10, which is a schematic diagram of the hanging module of the electroplating device of the present invention hanging the dummy plate and the object to be plated. Because of the electroplating device of the present invention, the spacing between the objects O to be plated can be reduced to less than or equal to 10 mm, so the entire row of multiple objects O can be treated as the same large-width object to be plated for current. Therefore, the current density on the left and right sides is the largest. Therefore, a dummy plate DO is added to the left and right sides of the entire column of the plated object O, so that the dummy plate DO is subjected to a larger current density to generate a thicker plating layer. The real O to be plated can obtain a more uniform current density and form a more average plating thickness.

Please refer to FIG. 11, which is a block diagram of the control module of the electroplating apparatus of the present invention. The control module 40 includes a processor 41, an object width unit 42, a spacing unit 43, an object quantity unit 44 and a stroke unit 45. The plated object width unit 42 is connected to a plated object width database 421, and the spacing unit 43 is connected to a spacing database 431. The object width unit 42 reads and/or writes an object width parameter 4211 from the object width database 421, and the object width parameter 4211 contains the width of the object O. The spacing unit 43 reads and/or writes a spacing parameter 4311 from the spacing database 431, and the spacing parameter 4311 contains the spacing between two objects O to be plated. The processor 41 calculates the maximum number of the plated objects O that can be hung by the hanging module 20 according to the width parameter 4211 of the plated object, the spacing parameter 4311, and the width of the hanging module 20, and each object to be plated O at the corresponding position of the hanging module 20 (position coordinates on the hanging rail 21) to output a plated quantity parameter 4411 carrying the quantity of the plated object to a plated object of the plated quantity unit 44 The quantity database 441, and a position parameter 4511 carrying the position coordinates of the object O on the hanging rail 21 to the position database 451 of the travel unit 45. The processor 41 controls the driving module 30 according to the position parameter 4511 and the number of objects to be plated parameter 4411, and the driving module 30 moves the hanging module 20 to move the objects O to a predetermined position.

The control module further includes a clamp unit 46, which is connected to a clamp width database 461, and the clamp unit 46 reads a clamp width parameter 4611 containing the width of the clamp 22 from the clamp width database 461; and the clamp unit 46 is further connected to a fixture quantity database 462 from which the fixture unit 46 reads a fixture quantity parameter 4621 containing the quantity of fixtures 22. The processor 41 also calculates the number of clamps 22 and the position of each clamp 22 on the hanging module 20 (the position coordinates of the clamp 22 on the hanging rail 21) according to the clamp width parameter 4611.

The control module 40 further includes an input unit 47, the input unit 47 is connected to the processor 41, and the width parameter 4211 and the spacing parameter 4311 of the object to be plated are input through the input unit 47. The input unit 47 may be a keyboard or a touch panel.

The control module 40 further includes an output unit 48 connected to the drive module 30 and the power supply module. The processor 41 transmits the control signal to the drive module 30 via the output unit 48 according to the position parameter 4511 and the quantity parameter 4411 to be plated. After receiving the control signal, the drive module 30 transports the plated objects O to the hanging rail one by one. The corresponding position coordinate on 21. After the number of objects to be plated on the hanging rail 21 reaches the number set by the number of objects to be plated parameter 4411, the processor 41 transmits the control signal to the power supply unit via the output unit 48, and starts to supply power to the anode plate 11 and the object to be plated O.

Please refer to Figure 12, which shows a flowchart of the electroplating method of the present invention. In an embodiment of the electroplating method of the present invention, at least the following steps are included:

In the parameter obtaining step S1, the processor 41 (CPU) obtains the clamp width, the number of clamps, the number of objects to be plated, the width of the objects to be plated, and the distance between the objects to be plated from the input unit 51, or separately from the clamp width database of the clamp unit 46 461 Obtain the fixture width parameter with the fixture width 4611, acquire the fixture quantity parameter with the number of fixtures 4621 from the fixture quantity database 462 of the fixture unit 46, and acquire the load from the plated object quantity database 441 of the quantity of the plated object unit 44 The plated object quantity parameter 4411 with the number of plated objects obtained from the plated object width database 421 of the plated object width unit 42, the plated object width parameter 4211 containing the plated object width, and the distance from the pitch unit 43 The database 431 obtains a spacing parameter 4311 containing the spacing. Then enter the step S2 of calculating position parameters.

In step S2 of calculating the position parameter, the processor 41 is based on the fixture width, the number of objects to be plated, the width and spacing of the objects to be plated, or the processor 41 is based on the fixture width parameter 4611, the number of fixture parameters 4621, the number of objects to be plated parameter 4411 The plating width parameter 4211 and the spacing parameter 4311 calculate the corresponding position of the fixture 22 hanging each object O on the hanging rail 21 to form the corresponding position parameter 4511, and store the corresponding position parameter 4511 in the position database 451. Then enter the fixture positioning step S3.

In the fixture positioning step S3, the first driver 33 (stepping motor or servo motor) sequentially suspends the fixture 22 with the object to be plated O, and moves each fixture 22 along each corresponding position parameter 4511 in sequence. Move the hanging rail 21 to the corresponding position. Then proceed to the electroplating step S4.

In the electroplating step S4, when the predetermined number of fixtures 22 with the object to be plated O are all moved to the corresponding positions, the power module starts to be turned on to perform electroplating.

In the electroplating method of the present invention, it may further include the following steps: there are two dummy plating plates DO, and each object O to be plated is arranged in a row and located between the two dummy plating plates DO. The clamp unit 46 is connected to a clamp width database 461, and the clamp unit 46 reads the clamp width parameter 4611 from the clamp width database 461. In another embodiment of the present invention, the spacing parameter 4311 between each of the objects O to be plated is less than or equal to 10 mm. In yet another embodiment of the present invention, between the parameter obtaining step S1 and the calculating parameter position step S2, an input parameter step of inputting each parameter to a control module 40 is further included, which is used to obtain the parameter After inputting, perform calculation of the distance, width or quantity of the object O to be plated, so that the control module 40 can adjust the operation of the electroplating device; wherein, the control module 40 includes a processor 41 and a width unit of the object to be plated. 42. A spacing unit 43, a plated object quantity unit 44, and a stroke unit 45, the plated object width unit 42 is connected to a plated object width database 421, and the spacing unit 43 is connected to a spacing database 431, The plated object width unit 42 reads a plated object width parameter 4211 from the plated object width database 421, the spacing unit 43 reads a distance parameter 4311 from the spacing database 431, and the processor 41 reads a distance parameter 4311 from the plated object width database 421. The plating width parameter 4211, the spacing parameter 4311 and the width of the hanging module 20 calculate the number of the plated objects O that can be hung and the position of each plated object O in the hanging module to output a The plated quantity parameter 4411 to the plated quantity unit 44 and a position parameter 4511 to the stroke unit 45. The processor 41 drives the driving module 30 according to the position parameter 4511 and the plated quantity parameter 4411. The module 30 moves the hanging module 20 to move the objects O to a predetermined position. Furthermore, before the electroplating step, the control module 40 needs to wait for all the clamps 22 holding the object O to be plated to be positioned before proceeding to the electroplating step.

In addition, in still another embodiment of the present invention, before the electroplating step, the step of clamping and setting the dummy plate is further included: by setting at least one dummy plate (dummy plate) DO next to the object to be plated O, according to this, when After the dummy plate DO is removed, it can make the coating of the object O to be plated to achieve the advantage of uniformity.

Please also refer to FIG. 13, which is a structural diagram of the electroplating tank of the electroplating apparatus of the present invention. In an embodiment of the present invention, the electroplating tank 10 has an accommodating space, and the accommodating space is loaded with an electroplating solution. The power module provides a positive potential and a negative potential. The pair of anode plates 11 are connected to a positive potential and are arranged in the accommodating space. The hanging module 20 is arranged above the electroplating tank 10 and between the pair of anode plates 11. The plated object O is suspended on the hanging module 20 and immersed in the electroplating solution, and the hanging module 20 is connected to a negative potential . The driving module 30 is arranged above the electroplating tank 10 and drives the hanging module 20 and moves the objects O to be plated.

The electroplating device and the electroplating method of the present invention calculate the position of each object to be plated by the control module according to the width of the object to be plated, the distance between adjacent objects to be plated and the width of the hanging module, and drive The module drives the hanging module to move each plated object to a predetermined position, so that the utilization rate of each hanging plated object can be optimized. In addition, the electroplating device of the present invention controls the power supply unit to start power supply after all the objects to be plated enter the electroplating tank, and then the power supply unit is turned off at the end of electroplating, and then the objects to be plated are removed, so that each object to be plated can be removed. Both get the same thickness of plating. In addition, provision of dummy plating plates at the extreme edges of the two sides of the rows of objects to be plated can make the areas with higher current density be formed on the dummy plates, avoiding the problem of uneven plating thickness of the actual objects to be plated.

However, the above are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent. In addition, any embodiment of the present invention or the scope of the patent application does not have to achieve all the objectives or advantages or features disclosed in the present invention. In addition, the abstract part and title are only used to assist in searching for patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the element (element) or to distinguish different embodiments or ranges, and are not used to limit the number of elements. Upper or lower limit.

100: Electroplating device 10: Electroplating tank 11: Anode plate 20: Hanging module 21: Hanging rail 22: Fixture 30: drive module 31: Transverse track 32: Drive body 321: Wheel 322: Extension arm 33: first drive 34: mobile mechanism 341: Lead Piece 342: Guided Parts 343: Position Sensor 35: Toggle mechanism 351: second drive 352: Toggle Piece 353: Angle Sensor 40: control module 41: processor 42: Width unit of the plated object 421: Width database of plated objects 4211: Width of the plated object 43: Pitch unit 431: Spacing Database 4311: Spacing parameter 44: Number of objects to be plated unit 441: Database of the number of objects to be plated 4411: Parameter of the number of objects to be plated 45: stroke unit 451: Location Database 4511: positional parameters 46: Fixture unit 461: Fixture Width Database 4611: Fixture width parameter 462: Fixture Quantity Database 4621: Number of Fixtures Parameters 47: input unit 48: output unit DO: false plating W: Extension wall O: Plated S1: Steps to obtain parameters S2: Steps to calculate position parameters S3: Fixture positioning steps S4: Electroplating step

Figure 1 is a schematic diagram of an embodiment of the electroplating apparatus of the present invention. Figure 2 is a schematic diagram of the structure of some components of the drive module of the electroplating apparatus of the present invention. Figure 3 is a side view of the drive module of the electroplating apparatus of the present invention. Figure 4 is a schematic diagram of the material to be plated in the electroplating apparatus of the present invention. Figure 5 is a schematic diagram of the operation of the pushing mechanism of the electroplating apparatus of the present invention. Figure 6 is a schematic diagram of the driving module of the electroplating device of the present invention pushing the hanging module to move the object to be plated to a predetermined position. Figure 7 is a schematic diagram of the material to be plated withdrawn in the electroplating apparatus of the present invention. Figure 8 is a schematic diagram of the hanging module of the electroplating apparatus of the present invention hanging a large-width object to be plated. Figure 9 is a schematic diagram of the hanging module of the electroplating apparatus of the present invention hanging a plated object with a small width. Figure 10 is a schematic diagram of the hanging module of the electroplating apparatus of the present invention hanging the dummy plate and the object to be plated. Figure 11 is a block diagram of the control module of the electroplating apparatus of the present invention. Figure 12 is a flowchart of the electroplating method of the present invention. Figure 13 is a schematic view of the structure of the electroplating tank of the electroplating apparatus of the present invention.

100: Electroplating device

10: Electroplating tank

20: Hanging module

21: Hanging rail

30: drive module

31: Transverse track

32: Drive body

33: first drive

34: mobile mechanism

341: Lead Piece

342: Guided Parts

35: Toggle mechanism

351: second drive

352: Toggle Piece

353: Angle Sensor

W: Extension wall

Claims (25)

An electroplating device for electroplating a plurality of objects to be plated. The electroplating device includes: an electroplating tank with an accommodating space; a power module that provides a positive potential and a negative potential; and a pair of anode plates. Connected to the positive potential and arranged in the accommodating space; a hanging module is arranged above the electroplating tank, the objects to be plated are hanging on the hanging module and located on the pair of anode plates In between, the hanging module is connected to the negative potential; a driving module, which is arranged above the electroplating tank and drives the hanging module, and can move the objects to be plated; and a control module, which is electrically Connected to the drive module and the power module; wherein the control module controls the drive module, and the drive module drives the hanging module so that the distance between adjacent objects to be plated is less than or equal to 10 mm, the control module includes a processor, a width unit of the object to be plated, a spacing unit, a quantity unit, and a stroke unit. The width unit of the object to be plated is connected to a database of the width of the object to be plated. The spacing unit Connected to a spacing database, the plated object width unit reads a plated object width parameter from the plated object width database, the spacing unit reads a spacing parameter from the spacing database, and the processor is based on the plated object width database. Calculate the number of plated object width parameters, the spacing parameters, and the width of the hanging module and the position of each object to be plated in the hanging module to output a quantity parameter to the quantity unit and a position parameter to the stroke Unit, the processor drives the driving module according to the position parameter and the quantity parameter, and the driving module moves the hanging module to move the plated objects to a predetermined position. The electroplating device described in the first item of the scope of patent application, wherein when the number of the plated objects hanging on the hanging module reaches a set amount, the control module controls the power module to supply power to the pair of anodes For the board and the hanging module, the set number is the maximum number of the plated objects hanging by the hanging module. For example, the electroplating device described in item 2 of the scope of patent application, wherein the control module calculates the suspension module according to the width of the suspension module, the width of the object to be plated, and the distance between the objects to be plated. The maximum number of hanging objects to be plated. For example, the electroplating device described in item 1 of the scope of patent application further includes a pair of dummy plates, wherein the objects to be plated are arranged in a row and located between the pair of dummy plates. For the electroplating device described in item 1 of the scope of patent application, the hanging module includes a hanging rail and a plurality of clamps, the clamps are movably arranged on the hanging rail, and each clamp clamps One that should be plated. As described in item 5 of the scope of patent application, the driving module includes a lateral movement track, a driving body, a first driver, a moving mechanism, and a toggle mechanism, and the toggle mechanism is arranged on the drive The main body, the first driver drives the moving mechanism, the moving mechanism makes the driving body move along the horizontal moving track, and the toggle mechanism pushes the clamp to move along the hanging track. The electroplating device described in item 6 of the scope of patent application, wherein the lateral movement rail is parallel to the hanging rail. The electroplating device described in item 6 of the scope of patent application, wherein the moving mechanism includes a lead part, a guided part, and a position sensor, and the guided part is arranged in the driving unit The body is guided by the lead element to travel a predetermined lead, and the position sensor detects the position of the guided element. For the electroplating device described in item 8 of the scope of patent application, the guide member is a rack, the guided member is a gear, the guided member is driven to rotate by the first driver, and the first driver is installed on the On the drive body. The electroplating device described in item 9 of the scope of patent application, wherein the rack is parallel to the traverse rail. For the electroplating device described in item 8 of the scope of patent application, wherein the lead part is a lead screw, the guided part is a slider, the slider is screwed to the lead screw, and the lead part is formed by the first The drive is driven to rotate. For the electroplating device described in item 6 of the scope of patent application, the toggle mechanism includes a second driver, a toggle member, and an angle sensor, and the second driver makes the toggle member rotate parallel to the hanging A rotation axis of the guide rail rotates, and the angle sensor detects the rotation angle of the toggle member. Such as the electroplating device described in item 12 of the scope of patent application, wherein the toggle member can abut against the clamp. According to the electroplating device described in claim 1, wherein the control module further includes a fixture unit, the fixture unit is connected to a fixture width database, and the fixture unit reads a fixture width parameter from the fixture width database . According to the electroplating device described in claim 1, wherein the control module further includes an input unit, the input unit is connected to the processor, and the width parameter of the object to be plated and the spacing parameter are input through the input unit. For the electroplating device described in the first item of the patent application, the control module further includes an output unit, the output unit is connected to the processor and the drive module, and the processor transmits according to the position parameter and the quantity parameter Control signal to the drive module. An electroplating method, which is suitable for the electroplating device described in item 5 of the scope of patent application, wherein the electroplating method includes at least the following steps: obtaining parameters step: obtaining a plurality of parameters, the parameters including a clamp width parameter and a clamp quantity Parameters, a parameter of the quantity of the plated object, a parameter of the width of the plated object, and a parameter of the distance between the plated objects; step of calculating position parameters: calculating a position parameter of each object to be plated through these parameters; fixture positioning step : Move each clamp and the plated object held by each clamp to the position corresponding to the position parameter; electroplating step: When all the clamps and the plated object clamped move to the position After the position, electroplating is performed. For example, the electroplating method described in item 17 of the patent application further includes a step of clamping and setting a dummy plate before the electroplating step: by setting at least one dummy plate (dummy plate) beside the object to be plated, when the dummy plate is placed After the plating plate is removed, the plating layer of the object to be plated can reach uniformity. According to the electroplating method described in item 18 of the scope of patent application, there are two dummy plating plates, and each of the objects to be plated is arranged in a row and located between the two dummy plating plates. The electroplating method described in item 17 of the scope of patent application, wherein the drive module includes a traverse rail, a drive body, a first driver, a moving mechanism, and a toggle mechanism. The toggle mechanism is arranged on the drive. The main body, the first driver drives the moving mechanism, the moving mechanism moves the driving body along the lateral movement track, the toggle mechanism pushes the clamp to move along the hanging track, and the first drive is a stepping motor or a servo motor. For the electroplating method described in item 17 of the scope of patent application, the clamp unit is connected to a clamp width database, and the clamp unit reads the clamp width parameter from the clamp width database. The electroplating method described in item 17 of the scope of patent application, wherein the parameter of the spacing between the objects to be plated is less than or equal to 10 mm. For example, the electroplating method described in item 17 of the scope of patent application, wherein, between the step of obtaining parameters and the step of calculating the position of the parameters, further includes an input parameter step of inputting each parameter to a control module, which is used After obtaining the parameters and inputting, calculate the distance, width or quantity of the object to be plated, so that the control module can adjust the operation of the electroplating device. For the electroplating method described in item 23 of the scope of the patent application, the control module includes a processor, a width unit of the object to be plated, a pitch unit, a quantity unit and a stroke unit, and the width unit of the object to be plated is connected to a The width database of the plated object, the spacing unit is connected to a spacing database, the width unit of the plated object reads a width parameter of the plated object from the width database of the plated object, and the spacing unit reads the width parameter of the plated object from the spacing database A spacing parameter. The processor calculates the quantity according to the width parameter of the plated object, the spacing parameter and the width of the hanging module and the position of each plated object on the hanging module to output a quantity parameter to the A quantity unit and a position parameter are sent to the stroke unit, the processor drives the driving module according to the position parameter and the quantity parameter, and the driving module moves the hanging module to move the plated objects to a predetermined position respectively . For example, the electroplating method described in item 17 or 18 of the scope of patent application, before the electroplating step, the control module needs to wait for all the fixtures holding the object to be plated to be positioned before proceeding to the electroplating step.

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