JP6687415B2 - Partial plating method and mask member used therefor - Google Patents

Description

  The present invention relates to a partial plating method and a mask member used therefor, and more particularly to a partial plating method for plating a predetermined portion on a strip-shaped material to be plated and a mask member used therefor.

  Conventionally, as a method of plating a predetermined portion of a strip-shaped material to be plated, a long strip-shaped material to be plated is adhered to the outer peripheral surface of a mask member composed of a rotatable substantially cylindrical non-conductive member. While being transported, the plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member, and the anode and cathode as the anode and cathode arranged on the inner peripheral surface side of the mask member are provided. A method is known in which an electric current is passed between the plating material and a portion of the masking material on the material to be plated, the portion facing each opening.

  As a mask member used in such a partial plating method, a masking jig has been proposed in which a rubber sheet having a plating hole formed in a desired portion for supplying a plating solution is provided on the peripheral surface of a grid-shaped roll frame ( See, for example, Patent Document 1).

  However, when a plating film (such as an Au plating film) is formed on a desired portion of the material to be plated using the masking jig of Patent Document 1, the plating film is relatively large (for example, 6 mm × 6 mm or more). In the case of the size, the thickness of the peripheral edge (edge) of the plating film is larger than that of the central portion, the amount of expensive metal (such as Au) deposited is increased, and the cost is increased.

  In order to prevent such an increase in the film thickness at the peripheral edge of the plating film, an insulating shielding plate that adjusts the opening between the anode and the tape-shaped product (material to be plated) is provided to A method has been proposed in which the thickness of the peripheral portion in the width direction is prevented from increasing and the plating thickness is made uniform (see, for example, Patent Document 2).

JP, 2013-256680, A (paragraph number 0015). JP, 2009-293114, A (paragraph number 0014-0015).

  However, in the method of Patent Document 2, in the case of plating the portions of the strip-shaped material to be plated that are spaced apart at a predetermined interval in the longitudinal direction, the width direction of the material to be plated in the peripheral portion of each plating film It is not possible to prevent an increase in the film thickness of the extending peripheral portion.

  For example, in the case of plating a substantially rectangular portion of the strip-shaped material to be plated which is spaced at a predetermined interval in the longitudinal direction, when the length of each plated portion (of the material to be plated) in the longitudinal direction is 10 mm or more, If it is longer than the length in the width direction (of the material to be plated), the peripheral portion of each plating film extending in the width direction of the material to be plated tends to become thicker. The increase in film thickness cannot be prevented.

  Therefore, the present invention, in view of such a conventional problem, it is possible to make the thickness of the plating film formed in the portion separated at a predetermined interval in the longitudinal direction of the strip-shaped material to be plated, uniform, An object is to provide a partial plating method and a mask member used therefor.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have arranged a strip-shaped material to be plated in close contact with one surface of a mask member having a plurality of openings, and then each of the mask members. The plating solution is supplied to the material to be plated through the opening of the mask member, and a current is caused to flow between the electrode and the material to be plated arranged on the other surface side of the mask member to form a mask member on the material to be plated. In the method of plating a portion facing the opening of the mask member, by disposing the shielding wall protruding from the inner wall of each opening of the mask member away from the material to be plated, If the amount of electric lines of force between the peripheral portion of the portion facing the opening and the electrode is reduced, the plating film formed on the portion of the strip-shaped material to be plated that is separated at a predetermined interval in the longitudinal direction. See that the thickness can be uniform And it has led to the completion of the present invention.

  That is, in the partial plating method according to the present invention, a strip plate-shaped material to be plated is placed in close contact with one surface of a mask member having a plurality of openings, and then the mask member is exposed through each opening of the mask member. While supplying the plating solution to the plating material, a current is caused to flow between the electrode arranged on the other surface side of the mask member and the material to be plated, and the portion facing the opening of the mask member on the material to be plated is removed. In the plating method, the shielding wall protruding from the inner wall of each opening of the mask member is arranged apart from the material to be plated, so that the peripheral edge of the portion of the material to be plated that faces each opening of the mask member. It is characterized by reducing the amount of lines of electric force between the section and the electrode.

  In this partial plating method, the shielding wall preferably extends along the circumferential direction of the inner wall of each opening of the mask member, and extends all around the inner wall of each opening of the mask member. preferable. Further, it is preferable that the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. In this case, the mask member is rotatable in the circumferential direction, and while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed, it is possible to plate the portion of the plated material facing the opening of the mask member. preferable. In addition, the opening is substantially rectangular, and the shielding wall projects from each of a pair of opposing surfaces in the circumferential direction of the mask member of the two opposing surfaces of the inner wall of the opening, and the pair of the other pair respectively. It preferably extends the entire length between each of the faces. Alternatively, it is preferable that the opening is substantially rectangular, and the shielding wall projects from the four surfaces of the inner wall of the opening and extends in the circumferential direction over the entire circumference of the inner wall. Moreover, it is preferable that the shielding wall projects substantially perpendicularly to the inner wall of the opening. Further, the mask member is preferably made of a non-conductive member, and the height of the shielding wall protruding from the inner wall of the opening of the mask member is preferably 0.5 to 2 mm.

  Further, in the mask member according to the present invention, a plurality of openings, which are spaced apart from each other in the circumferential direction of the mask member body, are formed in the substantially cylindrical mask member body, and the mask member protrudes from the inner wall of each of the openings. It is characterized in that the wall is arranged apart from one end of the opening.

  In this mask member, the shielding wall preferably extends along the circumferential direction of each inner wall of each opening, and preferably extends all around the inner wall of each opening. In addition, the opening is substantially rectangular, and the shielding wall projects from each of a pair of opposing surfaces in the circumferential direction of the mask member of the two opposing surfaces of the inner wall of the opening, and the pair of the other pair respectively. It preferably extends the entire length between each of the faces. Alternatively, it is preferable that the opening is substantially rectangular, and the shielding wall projects from the four surfaces of the inner wall of the opening and extends in the circumferential direction over the entire circumference of the inner wall. Further, it is preferable that the shielding wall projects substantially perpendicularly to the inner wall of the opening, and one end is preferably an end on the outer peripheral surface side of the mask member. Further, the mask member is preferably made of a non-conductive member, and the height of the shielding wall protruding from the inner wall of the opening of the mask member is preferably 0.5 to 2 mm.

  ADVANTAGE OF THE INVENTION According to this invention, the partial plating method and the mask member used for it which can make uniform the thickness of the plating film formed in the longitudinal direction of a strip | belt-shaped to-be-plated material at the part spaced apart at predetermined intervals are provided. can do.

It is a figure which shows the side surface of the partial plating apparatus used for embodiment of the partial plating method by this invention. It is sectional drawing which cut | disconnects and shows the partial plating apparatus of FIG. 1 by a horizontal surface. It is an expanded sectional view which cuts and shows the partial plating apparatus of FIG. 2 by the III-III line.

  Hereinafter, embodiments of a partial plating method according to the present invention and a mask member used therefor will be described in detail with reference to the accompanying drawings.

  1 is a view showing a side surface of a partial plating apparatus used in an embodiment of a partial plating method according to the present invention, FIG. 2 is a sectional view showing the partial plating apparatus of FIG. 1 taken along a horizontal plane, and FIG. It is an expanded sectional view which cuts and shows the partial plating equipment of No. 2 by the III-III line. In FIG. 1, in order to make it easier to see the material to be plated before and after being placed on the mask member, a support roll that changes the direction of the material to be plated is shown outside the mask member.

  As shown in FIGS. 1 to 3, in the embodiment of the partial plating method according to the present invention, a long strip-shaped material 14 to be plated is adhered to one surface of the mask member 12 of the partial plating apparatus 10. After the arrangement, the plating solution is supplied to the material 14 to be plated through each of the plurality of openings 12a of the mask member 12, and the electrode (anode) 16 arranged on the other surface side of the mask member 12 and the object to be covered are also covered. A current is passed between the plating material 14 and the plating material 14 to plate the portion of the mask member 12 that faces the openings 12a of the mask member 12.

  The mask member 12 is provided on a mask member main body (drum-shaped mask member main body) made of a rotatable substantially cylindrical non-conductive member (such as polyvinyl chloride (PVC) resin) in a substantially vertical direction as a member to be plated. A concave portion 12b is formed in the central portion so as to extend over the entire circumference, and the material 14 to be plated is arranged in close contact with the bottom surface of the concave portion 12b. Further, the mask member 12 has a plurality of predetermined shapes (substantially rectangular in the illustrated embodiment) (in the illustrated embodiment, spaced apart at predetermined intervals (substantially equal intervals in the illustrated embodiment) in the circumferential direction). 10 openings 12a are formed penetrating the side surface. Further, on the outer peripheral surface (one surface) of the mask member 12, a predetermined shape (in the illustrated embodiment, a substantially cylindrical shape) is spaced at predetermined intervals (in the illustrated embodiment, approximately equal intervals) in the circumferential direction. When a material 14 to be plated is placed in close contact with the outer peripheral surface of the mask member 12, a predetermined distance (the same as the positioning pin 12c) is provided on the material 14 to be plated. It is adapted to fit into a plurality of through holes 14a having a predetermined shape (substantially cylindrical shape slightly larger than the positioning pin 12c in the illustrated embodiment) formed by penetrating at intervals.

  When the material to be plated 14 conveyed in the direction indicated by the arrow A in FIG. 2 is changed in direction by the rotatable inlet side support roll 20 and adheres to the outer peripheral surface of the mask member 12, the through hole 14a of the material to be plated 14 is formed. Fits with the positioning pin 12c of the mask member 12, rotates the mask member 12 in the direction indicated by the arrow B, and then is rotated in the direction indicated by the arrow A by the rotatable outlet side support roll 22. It has become so.

  While the material to be plated 14 is placed in close contact with the outer peripheral surface of the mask member 12 in this manner, the other surface (inner peripheral surface) of the mask member 12 is passed through each opening 12a of the mask member 12. The plating solution is supplied to the material to be plated 14 from the slit 18a of the plating solution jetting portion 18 arranged on the side, and the electrode (anode) 16 arranged on the inner peripheral surface side of the mask member 12 and the object to be plated as the cathode. When an electric current flows between the material 14 and the material 14, a plating film is formed on a portion of the material to be plated 14 that faces each opening 12a of the mask member 12.

  The plating solution jet part 18 is made of a substantially semi-cylindrical non-conductive member (having a substantially fan-shaped cross section), and is a part of the inner peripheral surface of the mask member 12 (approximately half the inner peripheral surface of the plated material supporting part 12b). ) Are arranged so as to face each other. The slit 18a of the plating solution jetting portion 18 penetrates from the inner peripheral surface to the outer peripheral surface of the plating solution jetting portion 18, and the plating solution is supplied from the inner peripheral surface side to the outer peripheral surface side by a plating solution supply portion (not shown). Can be supplied.

  The anode 16 is made of a conductive member having a fan-shaped cross section, and is attached to the upper and lower surfaces of the inner wall of the slit 18 a of the plating solution jetting portion 18.

  The mask member 12 projects from the inner wall of each opening 12a (preferably at a height of 0.5 to 2 mm) substantially perpendicularly to the inner wall and surrounds the inner wall in the circumferential direction (surrounds the inner wall). The shielding wall 12d extending along the direction (preferably with a width of 0.5 to 2 mm) is separated from one end of each opening 12a (the end on the outer peripheral surface side to which the material to be plated 14 adheres). Are integrally formed. When each opening 12a is substantially rectangular, it is preferable that the shielding wall 12d projects from the four surfaces of the inner wall of the opening 12a and extends in the circumferential direction over the entire circumference of the inner wall. Of the two facing surfaces of the inner wall of 12a, each of a pair of facing surfaces in the circumferential direction of the mask member 12 projects from each of the facing surfaces and extends over the entire length between each of the other pair of surfaces. Good. The height and width of the shielding wall 12d can be appropriately set according to the size of each opening 12a. Although the shielding wall 12d is preferably formed integrally with the mask member 12, it may be attached so as to be in close contact with the inner wall of each opening 12a of the mask member 12. These shielding walls 12d reduce the amount of the plating solution flowing from the slit 18a of the plating solution jetting portion 18 toward the peripheral edge of the portion of the mask member 12 on the material to be plated 14 facing each opening 12a. The amount of electric lines of force between the anode 16 and the material 14 to be plated can be reduced.

  In the embodiment of the partial plating method described above, when the length of the opening 12a in the longitudinal direction (of the material to be plated) is 10 mm or more and is longer than the length in the width direction (of the material to be plated), The thickness of the plating film can be made substantially uniform even when the length in the longitudinal direction / the length in the width direction is 1.5 or more, or even 1.8 or more.

  Examples of the partial plating method and the mask member used therefor according to the present invention will be described in detail below.

[Example 1]
As a raw material (material to be plated 14), a long strip-shaped rolled plate made of oxygen-free copper (C1020-1 / 2H) is prepared, and the material to be plated is degreased as pretreatment, washed with water, and then pickled. did.

  Next, on the entire surface of the pretreated material 14 to be plated, by electroplating, Ni strike plating was performed as a base plating and then Ni plating was performed to form a Ni plating film having a thickness of 1 μm.

  Next, a partial plating apparatus similar to the partial plating apparatus 10 shown in FIGS. 1 to 3 is prepared, and as the mask member 12, (the length of the mask member is 14 mm in the circumferential direction and 8 mm in the width direction). ) A shield wall 12d having a width of 1 mm, which protrudes from the inner wall of each opening 12a having a substantially rectangular shape at a height of 0.5 mm and extends along the circumferential direction over the entire circumference of the inner wall, has an outer peripheral end of each opening 12a. By using a mask member made of substantially cylindrical PVC formed to be separated from the portion by 2 mm, a portion of the material to be plated 14 facing each opening 12a is electroplated to form Ni of the material to be plated 14. Au plating was performed so that an Au plating film having a thickness of 0.7 μm was formed on the plating film (target film thickness was 0.7 μm).

  With respect to the partially plated material thus obtained, a collimator diameter was set to 0.2 mm by means of a fluorescent X-ray film thickness meter (SFT-110A manufactured by Hitachi High-Tech Science Co., Ltd.), and Au at the central portion in the width direction of the partially plated material was used. When the thickness of the plating film was measured at intervals of 0.2 mm in the longitudinal direction of the partial plating material, the average thickness of the Au plating film was 0.726 μm (standard deviation was 0.050 μm), and Au in the longitudinal direction of the partial plating material was measured. The maximum thickness of the end of the plating film is 0.772 μm, the thickness of the central part of the Au plating film in the longitudinal direction of the partial plating material is the minimum thickness of 0.653 μm, and the peripheral part of the Au plating film is thick. The thickness of the Au plating film was substantially uniform.

[Example 2]
Regarding the partially plated material obtained by the same method as in Example 1, except that the height of the shielding wall 12d was 1.0 mm and Au plating was performed so as to form an Au plating film having a thickness of 0.65 μm, When the film thickness of the Au plating film at the central portion in the width direction of the partial plating material was measured by the same method as in Example 1, the average thickness of the Au plating film was 0.646 μm (standard deviation was 0.069 μm), and the partial plating was performed. The end portion of the Au plating film in the longitudinal direction of the material has a minimum thickness of 0.418 μm, and the central portion of the Au plating film in the longitudinal direction of the partial plating material has a maximum thickness of 0.691 μm. The peripheral portion of the coating did not become thick, and the thickness of the Au plating coating was substantially uniform.

[Comparative example]
A partially plated material obtained by the same method as that of Example 1 except that the shielding wall 12d was not provided and Au plating was performed so as to form an Au plated film having a thickness of 0.6 μm. When the film thickness distribution of the Au plating film in the central portion in the width direction of the partial plating material was measured by the same method, the average thickness of the Au plating film was 0.591 μm (standard deviation was 0.118 μm), and the length of the partial plating material was long. The maximum thickness of the end of the Au plating film in the horizontal direction is 0.837 μm, the thickness of the central portion of the Au plating film in the longitudinal direction of the partial plating material is the minimum thickness of 0.461 μm, and the peripheral edge of the Au plating film is The portion became thicker, and the thickness of the Au plating film was not substantially uniform.

10 Partial Plating Device 12 Mask Member 12a Opening 12b Recess (Support for Plated Material)
12c Positioning pin 12d Shielding wall 14 Plated material 14a Through hole 16 Anode 18 Plating solution jet part 18a Slit 20 Inlet side support roll 22 Outlet side support roll

Claims (17)

After placing the strip-shaped material to be plated in close contact with the outer peripheral surface of the substantially cylindrical mask member having a plurality of openings, the plating solution is supplied to the material to be plated through each opening of the mask member. In addition, a method of applying a current between the electrode arranged on the inner peripheral surface side of the mask member and the material to be plated to plate a portion of the material to be plated facing the opening of the mask member, Between the electrode and the peripheral portion of the portion of the mask member on the material to be plated facing the respective openings by the shielding wall protruding from the inner wall of each of the openings and separated from the material to be plated. A partial plating method characterized by reducing the amount of lines of electric force. The partial plating method according to claim 1, wherein the shielding wall extends along a circumferential direction of an inner wall of each opening of the mask member. 3. The partial plating method according to claim 1, wherein the shielding wall extends over the entire circumference of the inner wall of each opening of the mask member. The mask member is rotatable in the circumferential direction, and the portion of the plating material facing the opening of the mask member is plated while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed. The partial plating method according to any one of claims 1 to 3, wherein The opening is substantially rectangular, and the shielding wall protrudes from each of a pair of surfaces of the inner wall of the opening facing each other in the circumferential direction of the mask member, of the two surfaces facing each other. The partial plating method according to any one of claims 1 to 4 , wherein the partial plating method extends over the entire length between each of the pair of surfaces. The said opening part is substantially rectangular shape, The said shielding wall protrudes from four surfaces of the inner wall of the said opening part, and is extended in the circumferential direction over the perimeter of the inner wall, The said 1 thru | or 5 characterized by the above-mentioned. Partial plating method according to any one . The shielding wall, characterized in that projecting substantially perpendicular to the inner wall of the opening, partial plating method according to any one of claims 1 to 6. Characterized in that said mask member comprises a non-conductive member, partial plating method according to any one of claims 1 to 7. Wherein the height of the shielding wall that protrudes from the inner wall of the opening of the mask member is 0.5 to 2 mm, partial plating method according to any one of claims 1 to 8. A plurality of openings that are spaced apart from each other in the circumferential direction of the mask member main body are formed in the substantially cylindrical mask member main body, and the shielding wall protruding from the inner wall of each of these openings is the outer peripheral surface of the opening. A mask member, wherein the mask member is arranged apart from the end portion on the side . The mask member according to claim 10 , wherein the shielding wall extends along the circumferential direction of the inner wall of each of the openings. The shielding wall, characterized in that it extends over the entire circumference of each of the inner wall of the opening, the mask member according to claim 10 or 11. The opening is substantially rectangular, and the shielding wall protrudes from each of a pair of surfaces of the inner wall of the opening facing each other in the circumferential direction of the mask member, of the two surfaces facing each other. The mask member according to claim 10 , wherein the mask member extends over the entire length between each of the pair of surfaces. 11. The opening according to claim 10 , wherein the opening has a substantially rectangular shape, and the shielding wall projects from four surfaces of the inner wall of the opening and extends in the circumferential direction over the entire circumference of the inner wall. Mask member. The shielding wall, characterized in that projecting substantially perpendicular to the inner wall of the opening, the mask member according to any one of claims 10 to 14. Characterized in that said mask member comprises a non-conductive member, the mask member according to any one of claims 10 to 15. The mask member according to any one of claims 10 to 16 , wherein the height of the shielding wall protruding from the inner wall of the opening of the mask member is 0.5 to 2 mm.

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