JP6687437B2 - Partial plating method - Google Patents

Description

  The present invention relates to a partial plating method, and more particularly to a partial plating method for plating a predetermined portion on a long strip-shaped material to be plated.

  Conventionally, as a method of plating a predetermined portion of a long strip plate-shaped material to be plated used as a material for terminals and the like, a mask member made of a substantially cylindrical non-conductive member rotatable in a circumferential direction is used. While the long strip-shaped plate-shaped material to be plated is brought into close contact with the outer peripheral surface and conveyed, the plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member, and the mask member is also provided. There is known a method in which a current is passed between an anode arranged on the inner peripheral surface side and a material to be plated as a cathode to plate a portion of the material to be masked facing each opening of the mask member. There is.

  As a mask member used in such a partial plating method, a plurality of positioning pins are arranged on the outer peripheral portion, and the positioning pins engage with the metal member to convey the metal member along the outer peripheral portion. Is known (for example, refer to Patent Document 1). When the metal member is partially plated using such a drum jig, the metal member engages with the positioning pins of the drum jig and is conveyed, so that it is possible to plate at a predetermined position on the metal member with high precision. .

Japanese Unexamined Patent Application Publication No. 2013-100593 (paragraph number 0030)

  However, in the partial plating method that uses a mask member such as the drum jig of Patent Document 1, a reel-to-reel plating apparatus performs partial plating on one long strip-shaped material to be plated in one line. Therefore, it cannot be said that the productivity is necessarily sufficient, and it is desired to partially plate a long strip-shaped material to be plated with high productivity.

  Therefore, two strips of plating material are produced by partially plating a long strip of plating material with a width of two lines in one line, and then cutting it in half along the longitudinal direction. Can be considered.

  However, according to the conventional partial plating method, a reel-to-reel plating device is used to partially plate a long strip-shaped material to be plated with a width of two lines in one line and then halve it in the longitudinal direction. When the two strip-shaped plating materials are produced by cutting, the positional accuracy of the partial plating film in the width direction on the plating material may be deteriorated.

  Therefore, in view of such conventional problems, it is an object of the present invention to provide a partial plating method capable of performing partial plating on a strip-shaped material to be plated with high accuracy and high productivity.

  As a result of intensive studies to solve the above problems, the present inventors have arranged a row at positions spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the strip-shaped material to be plated. A plurality of positioning holes penetrating from one surface of the material to be plated to the other surface so as to be spaced apart from each other, and these positioning holes and respective side surfaces extending in the longitudinal direction of the material to be plated. A part of the peripheral edge portions on both sides in the width direction of the material to be plated is cut along the longitudinal direction so that the distance between them becomes a predetermined distance, and the cutting material is fitted with a plurality of positioning holes of the material to be plated after cutting. A plurality of positioning pins are formed by projecting from one surface of the mask member. One surface of the mask member is brought into close contact with the plating target material so that the positioning pins of the mask member fit into the positioning holes of the plating target material. That of the locating pin The plating solution is applied to the material to be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row at a predetermined distance inward from each row in the width direction. While supplying, a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated, and the portion of the material to be plated facing the opening of the mask member is plated. The plating material is obtained by cutting the plating material so that it is equidistant from both side surfaces extending in the longitudinal direction, and separating the plating material so that the plate-shaped material to be plated is plated with high precision and high productivity. They have found that they can be achieved and have completed the present invention.

  That is, the partial plating method according to the present invention, the strip plate-shaped material to be plated, so as to be arranged in a row in a position spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction, Positioning hole forming step of forming a plurality of positioning holes penetrating from one surface of the plated material to the other surface are separated from each other, and the distance between these positioning holes and each side surface extending in the longitudinal direction of the plated material is A peripheral edge cutting step of cutting a part of the peripheral edge portions on both sides in the width direction of the plated material along the longitudinal direction so as to have a predetermined interval, and a plurality of positioning holes of the plated material after the cutting are respectively fitted. A plurality of matching positioning pins are formed by projecting from one surface of the mask member, and the plating target material is brought into close contact with the one surface of the mask member to fit the positioning pins of the mask member into the positioning holes of the plating target material. To be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row at a predetermined distance inward from each row of the plurality of positioning pins. The plating solution is supplied to the material, and a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated to plate the portion of the material to be opposed to the opening of the mask member. And a separating step of cutting and separating the plating material so as to be equidistant from both side surfaces extending in the longitudinal direction of the partially plated plating material.

  In this partial plating method, it is preferable that the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. In this case, the mask member is rotatable in the circumferential direction, and while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed, it is possible to plate the portion of the plated material facing the opening of the mask member. preferable. The opening is preferably substantially rectangular, and the mask member is preferably made of a non-conductive member. Further, it is preferable to perform a base plating step of forming a base plating layer on the entire surface of the material to be plated between the peripheral edge cutting step and the partial plating step. Further, between the partial plating step and the separation step, peripheral edge plating layers may be formed on the peripheral edges on both sides in the width direction of the material to be plated. Further, it is preferable that a part of the peripheral portions on both sides in the width direction of the material to be plated be cut by press working.

  According to the present invention, it is possible to provide a partial plating method capable of accurately and partially plating a strip-shaped material to be plated with high productivity.

FIG. 3 is a plan view showing a part of a long strip plate-shaped plated material manufactured by the embodiment of the partial plating method according to the present invention. It is a figure which shows the side surface of the partial plating apparatus used for embodiment of the partial plating method by this invention. It is sectional drawing which cut | disconnects and shows the partial plating apparatus of FIG. 2 by a horizontal surface. FIG. 4 is an enlarged cross-sectional view showing the partial plating apparatus of FIG. 2 taken along line IV-IV.

  Hereinafter, embodiments of a partial plating method according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows a part of a strip-shaped plated material (before being divided into halves) manufactured by an embodiment of the partial plating method.

  As shown in FIG. 1, each of the side surfaces of the long strip-shaped plate-shaped material 10 to be plated extends in the longitudinal direction and is spaced in the width direction from each side surface of the peripheral edge portions 12 on both sides in the width direction. A plurality of positioning holes 10a having a predetermined shape (substantially cylindrical in the illustrated embodiment) penetrating from one surface of the material to be plated 10 to the other surface thereof are arranged so as to be parallel to each other. (In the illustrated embodiment, they are formed at substantially equal intervals). In addition, a plurality of substantially V-shaped notches that are spaced at predetermined intervals (substantially equal intervals in the illustrated embodiment) on each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. The portion 10b is formed. A Ni plating film is formed as the base plating layer 14 on the entire surface of the material 10 to be plated. In addition, a central axis line (indicated by a dotted line in FIG. 1) extending in the longitudinal direction of the material to be plated 10 (from each side surface) is provided in a central portion between the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. Au plating films are formed as a plurality of substantially rectangular partial plating layers 16 so as to be arranged in a row on both sides of (equal distance line) and spaced apart in the longitudinal direction of the material to be plated 10. . Further, Sn plating films are formed as peripheral edge plating layers on the Ni plating films as the base plating films 14 at the peripheral edge parts 12 on both sides extending in the longitudinal direction of the plated material 10.

  Such a plated material can be manufactured by the embodiment of the partial plating method according to the present invention. In the embodiment of the partial plating method according to the present invention, the positioning hole forming step, the peripheral edge cutting step, the base plating step, the partial plating step, the peripheral edge plating step, and the separating step are performed in this order.

(Positioning hole forming process)
In this step, at a position separated from each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the long strip-shaped material (work) 10 to be plated, each in a row and in parallel with each side surface. A plurality of positioning holes 10a penetrating from one surface to the other surface of the material to be plated are formed so as to be spaced from each other so as to be arranged. The positioning hole 10a can be formed by pressing the plated material 10 with a (progressive) die.

(Periphery cutting process)
In this step, a part of the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the material to be plated 10 are arranged so that the spacing between the positioning hole 10a of the material to be plated 10 and each side surface extending in the longitudinal direction becomes a predetermined distance. The (widthwise both ends) is cut along the longitudinal direction (width 0.5 to 1 mm). In addition, a plurality of substantially V-shaped members that are spaced apart at a predetermined interval in the longitudinal direction (substantially equal intervals in the illustrated embodiment) are provided on each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the plated material 10. The cutout portion 10b is formed. The cutting of both end portions in the width direction of the material 10 to be plated and the formation of the notches 10b can be performed simultaneously by pressing the material 10 to be plated with a (progressive) die. The widthwise peripheral edge of the strip plate material is generally cut by a slitter, but in order to accurately cut the widthwise peripheral edge portion of the long strip-shaped material to be plated, (progress) It is preferable to perform pressing by a die. The dimensional accuracy of the material to be plated in the width direction is required to be ± 30 μm or less (depending on the type of terminal using the material to be plated, etc.) (preferably ± 20 μm or less, more preferably ± 15 μm or less). In some cases, the slitter processing accuracy is about ± 50 μm or more, so it is preferable to perform press processing with a die that can cut with high precision (progressive).

(Undercoating process)
In this step, a Ni plating layer is formed as the base plating layer 14 on the entire surface (front and back) of the material to be plated 10. The Ni plating film as the base plating layer 14 can be formed by performing Ni plating by electroplating.

(Partial plating process)
In this step, partial plating (spot plating) is performed using a partial plating apparatus as shown in FIGS. 2 is a view showing a side surface of a partial plating apparatus used in the embodiment of the partial plating method according to the present invention, FIG. 3 is a sectional view showing the partial plating apparatus of FIG. 2 taken along a horizontal plane, and FIG. It is an expanded sectional view which cuts and shows the partial plating equipment of No. 3 by the IV-IV line. In addition, in FIG. 2, in order to make it easy to see the material to be plated before and after being placed on the mask member, a support roll that changes the direction of the material to be plated is shown outside the mask member.

  As shown in FIGS. 2 to 4, after the material 10 to be plated is placed in close contact with one surface of the mask member 102 of the partial plating apparatus 100, each of the plurality of openings 102c of the mask member 102 is inserted. The plating solution is supplied to the material 10 to be plated, and a current is passed between the electrode (anode) 104 arranged on the other surface side of the mask member 102 and the material 10 to be plated to form a mask on the material 10 to be plated. A portion of the member 102 facing each opening 102c is plated.

  The mask member 102 is composed of a mask member main body (drum-shaped mask member main body) made of a substantially cylindrical non-conductive member (such as polyvinyl chloride (PVC) resin) rotatable in the circumferential direction. On the outer peripheral surface (one surface), a recess 102a extending over the entire circumference is formed at a substantially central portion in the up-down direction as a material-supporting portion for plating, and the material 10 to be plated is arranged in close contact with the bottom surface of the recess 102a. It is like this. The mask member 102 is arranged in a row in the circumferential direction at predetermined intervals (the same interval as the positioning holes 10a) on each of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the bottom surface of the recess 102a of the mask member 102. A plurality of positioning pins 102b having a predetermined shape (substantially cylindrical shape slightly smaller than the positioning hole 10a in the illustrated embodiment) are projected, and the material 10 to be plated is placed on the outer peripheral surface (one surface) of the mask member 102. When they are arranged in close contact with each other, they are sequentially fitted into the positioning holes 10a of the plated material 10. Further, on the bottom surface of the recess 102a of the mask member 102, a region (corresponding to a central axis line extending in the circumferential direction of the recess 102a of the mask member 102 is spaced from the positioning pins 102b in each row by a predetermined distance inward in the width direction. Predetermined shapes, which are arranged in a row in a region spaced apart from the line on both sides in the width direction by a predetermined distance, and are arranged in the circumferential direction at predetermined intervals (substantially equal intervals in the illustrated embodiment). A plurality of openings 102c (substantially rectangular in the illustrated embodiment) are formed through the mask member 102. The positioning holes 10a of the material 10 to be plated that fit with the positioning pins 102b of the mask member 102 are accurately arranged at predetermined intervals from the side surfaces on both sides in the width direction of the material 10 to be plated, and the openings of the mask member 102 are formed. The portion 102c can also be accurately formed by being spaced from the positioning pin 102b inward in the width direction at a predetermined interval.

  When the material 10 to be plated conveyed in the direction indicated by the arrow A in FIG. 3 is changed in direction by a rotatable inlet side support roll 108 and comes into close contact with the outer peripheral surface of the mask member 102, a positioning hole 10a for the material 10 to be plated is formed. Engages with the positioning pin 102b of the mask member 102, rotates the mask member 102 in the direction indicated by the arrow B, and then is rotated in the direction indicated by the arrow A by the rotatable outlet side support roll 110. It has become so.

  As described above, while the material to be plated 10 is arranged in close contact with the outer peripheral surface of the mask member 102, the pair of plating solution jetting portions 106 arranged on the other surface (inner peripheral surface) side of the mask member 102 are disposed. The plating solution is supplied from the slits 106a to the material 10 to be plated through the openings 102c of the respective rows of the mask member 102, and the electrodes (anode) arranged on the inner peripheral surface side of the mask member 102. When an electric current flows between the material 104 to be plated and the material 10 to be plated as the cathode, a portion of the mask material 102 on the material to be plated 10 facing each opening 102c is formed as a partial plating layer 16 (such as Au plating film). ) A plating film is formed.

  The plating solution jetting portion 106 is made of a substantially semi-cylindrical non-conductive member (having a substantially fan-shaped cross section), and is part of the inner peripheral surface of the mask member 102 (approximately half the inner peripheral surface of the material-supported portion 12b to be plated). ) Are arranged so as to face each other. The pair of slits 106a of the plating solution jetting section 106 penetrates from the inner peripheral surface to the outer peripheral surface of the plating solution jetting section 106, and the plating solution supplying section (not shown) moves the plating solution from the inner peripheral surface side to the outer peripheral surface side. Can be injected and supplied.

  The anode 104 is made of a conductive member having a fan-shaped cross section, and is attached to the upper and lower surfaces of the inner wall of each slit 106 a of the plating solution jetting section 106. It should be noted that the currents flowing through the anodes 104 attached to the inner walls of the respective slits 106a of the plating solution jetting portion 106 are changed by different rectifiers to form the mask members 102 through the openings 102c of the respective rows. The thickness of the plating film (such as Au plating film) can be changed.

(Periphery part plating process)
In this step, an Sn plating film is formed as a peripheral edge plating layer on the peripheral edge 12 of the material 10 to be plated. The Sn plating film as the peripheral edge plating layer is formed by using a Sn plating solution from a side surface (a side surface arranged on the lower side) of the material to be plated 10 to a portion having a constant width (a peripheral edge portion on one side surface side). After immersing and forming an Sn plating film by electroplating, the material 10 to be plated is inverted to arrange the other side surface on the lower side, and a portion having a constant width from the other side surface (periphery of the other side surface side). Part) is immersed in a Sn plating solution, and an Sn plating film is formed by electroplating.
The formation of the base plating layer, the partial plating layer and the peripheral edge plating layer described above can be performed in one line and one pass by a reel-to-reel plating apparatus.

(Separation process)
In this step, the slitter is used along the straight lines (the central axis of the longitudinal direction shown by the dotted line in FIG. 1) extending in the longitudinal direction at equal distances from the both sides of the plated material, with reference to the both sides of the plated material after the plating. Cut the plated material in half and separate. Note that the positioning holes 10a of the plated material 10 that fit with the positioning pins 102b of the mask member 102 are accurately arranged at predetermined intervals from the side surfaces on both sides in the width direction of the plated material 10, and the opening 102c of the mask member is also formed. The plated material is accurately separated from the positioning pin 102b at a predetermined distance inward in the width direction, and the plated material is cut in half along a straight line extending in the longitudinal direction at equal distances from both side surfaces of the plated material after plating. Therefore, it is possible to accurately perform partial plating on each of the two separated plating materials.

  As described above, in the embodiment of the partial plating method according to the present invention, the positions of the plurality of positioning holes 10a formed in the peripheral portions on both sides in the width direction extending in the longitudinal direction of the long strip-shaped material 10 to be plated. Based on the above, a plurality of positioning pins 102b of the mask member 102 are cut along the longitudinal direction at a part of the peripheral edge portions on both sides in the width direction of the material to be plated 10 and fitted into the plurality of positioning holes 10a of the material to be plated 10. With reference to the side faces on both sides extending in the longitudinal direction of the plated material 10 obtained by plating the portion of the plated member 10 that faces the opening 102c of the mask member through the opening 102c formed as a reference, Since the plated material is cut and separated, a reel-to-reel plating device partially plates a long strip-shaped material to be plated with a width of two lines in one line, and then runs in the longitudinal direction. Even if two strip-shaped plated materials are produced by cutting into two halves, the widthwise dimension of the two strip-shaped plated materials is equal to one long strip-shaped plated material. It is possible to obtain two strip plate-shaped plating materials with sufficient accuracy so that the widthwise dimension of the plated material obtained when partial plating is performed, and each of the two strip plate-shaped plating materials can be obtained. Further, the partial plating film can be formed with sufficient positional accuracy in the width direction.

  Hereinafter, examples of the partial plating method according to the present invention will be described in detail.

  First, a long strip-shaped rolled plate made of Cu having a width of 54.0 mm (-0.1 mm to +0 mm) and a thickness of 0.2 mm was prepared.

  Next, by pressing using a progressive die, the rolling plates are arranged in a row and in parallel with the side faces of one of the peripheral portions on both sides in the width direction extending in the longitudinal direction. As described above, a plurality of positioning holes each having a diameter of 1.5 mm were punched out at equal intervals with a longitudinal pitch (a distance between the centers of adjacent positioning holes) of 8 mm. It should be noted that the positioning holes in one of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the rolled plate are formed such that their centers are separated from the side surface of the peripheral portion by about 2.1 mm, and the other peripheral portion. The positioning hole was formed at a position separated by 49 mm from the center of each of the positioning holes at the one peripheral edge.

  Next, by press working using the progressive die described above, the longitudinal direction of the rolling plate was adjusted so that the distance between the center of each positioning hole of the rolled plate and each side surface extending in the longitudinal direction was 1.5 mm. A strip-shaped rolled plate (primary pressed product) having a width of 52.0 mm (± 0.02 mm) is cut by cutting a part of peripheral portions on both sides in the width direction extending in the longitudinal direction along the longitudinal direction. Prepared as

  Next, in a reel-to-reel continuous plating line, while carrying the material to be plated, as a pretreatment, alkali degreasing, electrolytic degreasing, water washing, and acid pickling with sulfuric acid, and then onto the material to be plated The base plating layer, the partial plating layer, and the peripheral edge plating layer were formed in this order by one line and one pass.

In forming the undercoat layer, electroplating was performed at a current density of 9 A / dm ² to form a Ni plating film as the undercoat layer on the entire surface of the material to be plated.

In the formation of the partial plating layer (spot-shaped Au plating film), the same partial plating apparatus as the partial plating apparatus 100 of FIGS. 2 to 4 is used, and as the mask member 102, the length of the mask member in the circumferential direction is set. Each of the substantially rectangular openings 102c (having a size of 2.0 mm and a length of 2.5 mm in the width direction) has a center in the width direction at a position 20 mm apart from the side surface of each peripheral edge of the plated material 10. By performing electroplating at a current density of 25 A / dm ² using mask members made of substantially cylindrical PVC that are formed so as to be separated from each other, the openings 102c are formed in the respective openings 102c on one surface of the material 10 to be plated. After forming the Au plating film on the facing portion, a partial plating apparatus similar to the partial plating apparatus 100 of FIGS. 2 to 4 is arranged on the other surface side of the material 10 to be plated, and as the mask member 102, (mask Each of the substantially rectangular openings 102c (having a length of 1.0 mm in the circumferential direction of the material and a length of 2.0 mm in the width direction) (the center in the width direction is the side surface of each peripheral portion of the material 10 to be plated). The material to be plated was prepared by the same method as described above except that a mask member made of substantially cylindrical PVC formed so as to be separated from each other (at a position separated by 15 mm from) was used and the current density was 20 A / dm ^2. An Au plating film was formed on a portion of the other surface of No. 10 facing each opening 102c.

In forming the peripheral edge plating layer, a portion having a width of 10 mm (a peripheral edge portion on one side surface side) from one side surface (side surface arranged on the lower side) of the material to be plated 10 is immersed in the Sn plating solution to obtain a current density. After forming the Sn plating film by performing electroplating at 12 A / dm ² , the material 10 to be plated is inverted and the other side surface is arranged on the lower side, and a portion having a width of 10 mm from the other side surface (the other side surface). The peripheral portion on the side surface side) was immersed in an Sn plating solution, and electroplating was performed at a current density of 12 A / dm ² to form a Sn plating film.

  Next, with reference to both side surfaces of the material 10 to be plated, the material 10 to be plated was cut in half along a straight line extending in the longitudinal direction at equal distances from both sides of the material 10 to be plated.

  With respect to the two partial plating materials thus obtained, a film at the central portion of the Au plating film on both sides of the two partial plating materials was measured with a fluorescent X-ray film thickness meter (SFT-110A manufactured by Hitachi High-Tech Science Co., Ltd.). When the thickness was measured, the average value of the thicknesses of the Au plating films of the one partial plating material was substantially the same as the average value of the thicknesses of the Au plating film of the other partial plating material. In addition, the width of the two partial plating materials is 26.0 mm (± 0.02 mm), so that the two partial plating materials can be accurately cut and separated, and the two partial plating materials can be separated in the width direction. The Au plating film could be formed with high accuracy.

DESCRIPTION OF SYMBOLS 10 Plated material 10a Positioning hole 10b Notch 12 Peripheral part 14 Base plating layer 16 Partial plating layer 100 Partial plating apparatus 102 Mask member 102a Recessed part (supporting part for plated material)
102b Positioning pin 102c Opening 104 Anode 106 Plating solution jetting section 106a Slit 108 Inlet side support roll 110 Outlet side support roll

Claims (8)

From one surface of the material to be plated to be arranged in a row at positions spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the material to be plated in the strip shape. Positioning hole forming step of forming a plurality of positioning holes penetrating up to each other with a distance from each other, and so that the distance between these positioning holes and each side surface extending in the longitudinal direction of the plated material becomes a predetermined distance. A peripheral edge cutting step of cutting a part of the peripheral edges on both sides in the width direction of the material along the longitudinal direction, and a plurality of positioning pins that respectively fit with the plurality of positioning holes of the plated material after the cutting are provided on one surface. The plating target material is brought into close contact with one surface of the mask member formed so as to protrude from the mask member, and the positioning pin of the mask member is fitted into the positioning hole of the plating target material, and a predetermined number is provided from each row of the plurality of positioning pins of the mask member. The plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row and spaced inward in the width direction. Partial plating step of applying a current between the electrode arranged on the other surface side of the substrate and the material to be plated to plate the portion of the material to be plated that faces the opening of the mask member, and this partially plated plating And a separation step of cutting and separating the plated material so as to be equidistant from both side surfaces extending in the longitudinal direction of the material. It said mask member is a member of a circle cylindrical, and wherein the one surface and the other surface of the mask member is an outer peripheral surface and inner peripheral surface, respectively, partial plating method according to claim 1. The mask member is rotatable in the circumferential direction, and the portion of the plating material facing the opening of the mask member is plated while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed. The partial plating method according to claim 2, wherein: Characterized in that the opening is a rectangle, partial plating method according to any one of claims 1 to 3. The partial plating method according to claim 1, wherein the mask member is made of a non-conductive member. The base plating step of forming a base plating layer on the entire surface of the material to be plated is performed between the peripheral edge cutting step and the partial plating step. Partial plating method. 7. The portion according to claim 1, wherein a peripheral edge plating layer is formed on both peripheral edge portions in the width direction of the material to be plated between the partial plating step and the separating step. Plating method. The partial plating method according to any one of claims 1 to 7, wherein a part of the peripheral edge portions on both sides in the width direction of the material to be plated is cut by press working.

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