JP6687437B2 - Partial plating method - Google Patents

Partial plating method Download PDF

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JP6687437B2
JP6687437B2 JP2016060489A JP2016060489A JP6687437B2 JP 6687437 B2 JP6687437 B2 JP 6687437B2 JP 2016060489 A JP2016060489 A JP 2016060489A JP 2016060489 A JP2016060489 A JP 2016060489A JP 6687437 B2 JP6687437 B2 JP 6687437B2
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plated
plating
mask member
width direction
partial plating
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JP2017172008A (en
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俊祐 足達
俊祐 足達
秀人 堤
秀人 堤
健太郎 荒井
健太郎 荒井
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Dowa Metaltech Co Ltd
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Description

本発明は、部分めっき方法に関し、特に、長尺の帯板状の被めっき材上の所定の部分をめっきする、部分めっき方法に関する。   The present invention relates to a partial plating method, and more particularly to a partial plating method for plating a predetermined portion on a long strip-shaped material to be plated.

従来、端子などの材料として使用される長尺の帯板状の被めっき材の所定の部分をめっきする方法として、円周方向に回転可能な略円筒形の非導電性部材からなるマスク部材の外周面に長尺の帯板状の被めっき材を密着させて搬送しながら、マスク部材に形成された複数の開口部の各々を介して、被めっき材にめっき液を供給するとともに、マスク部材の内周面側に配置されたアノードとカソードとしての被めっき材との間に電流を流して、被めっき材上のマスク部材の各々の開口部に対向する部分をめっきする方法が知られている。   Conventionally, as a method of plating a predetermined portion of a long strip plate-shaped material to be plated used as a material for terminals and the like, a mask member made of a substantially cylindrical non-conductive member rotatable in a circumferential direction is used. While the long strip-shaped plate-shaped material to be plated is brought into close contact with the outer peripheral surface and conveyed, the plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member, and the mask member is also provided. There is known a method in which a current is passed between an anode arranged on the inner peripheral surface side and a material to be plated as a cathode to plate a portion of the material to be masked facing each opening of the mask member. There is.

このような部分めっき方法に使用するマスク部材として、外周部に複数の位置決めピンが配置され、これらの位置決めピンが金属部材と係合して、金属部材を外周部に沿って搬送するドラム治具が知られている(例えば、特許文献1参照)。このようなドラム治具を使用して金属部材を部分めっきすると、金属部材がドラム治具の位置決めピンと係合して搬送されるので、金属部材上の所定の位置に精度良くめっきすることができる。   As a mask member used in such a partial plating method, a plurality of positioning pins are arranged on the outer peripheral portion, and the positioning pins engage with the metal member to convey the metal member along the outer peripheral portion. Is known (for example, refer to Patent Document 1). When the metal member is partially plated using such a drum jig, the metal member engages with the positioning pins of the drum jig and is conveyed, so that it is possible to plate at a predetermined position on the metal member with high precision. .

特開2013−100593号公報(段落番号0030)Japanese Unexamined Patent Application Publication No. 2013-100593 (paragraph number 0030)

しかし、特許文献1のドラム治具のようなマスク部材を使用する部分めっき方法では、リール・ツー・リールめっき装置により、1ラインで1本の長尺の帯板状の被めっき材に部分めっきしているため、生産性が必ずしも十分であるとはいえず、長尺の帯板状の被めっき材を高い生産性で部分めっきすることが望まれている。   However, in the partial plating method that uses a mask member such as the drum jig of Patent Document 1, a reel-to-reel plating apparatus performs partial plating on one long strip-shaped material to be plated in one line. Therefore, it cannot be said that the productivity is necessarily sufficient, and it is desired to partially plate a long strip-shaped material to be plated with high productivity.

そのため、1ラインで2本分の幅の長尺の帯板状の被めっき材を部分めっきした後に、長手方向に沿って半分に切断して、2つの帯板状のめっき材を作製することが考えられる。   Therefore, two strips of plating material are produced by partially plating a long strip of plating material with a width of two lines in one line, and then cutting it in half along the longitudinal direction. Can be considered.

しかし、従来の部分めっき方法では、リール・ツー・リールめっき装置により、1ラインで2本分の幅の長尺の帯板状の被めっき材を部分めっきした後、長手方向に沿って半分に切断して、2つの帯板状のめっき材を作製すると、めっき材上の幅方向の部分めっき皮膜の位置精度が悪くなるおそれがある。   However, according to the conventional partial plating method, a reel-to-reel plating device is used to partially plate a long strip-shaped material to be plated with a width of two lines in one line and then halve it in the longitudinal direction. When the two strip-shaped plating materials are produced by cutting, the positional accuracy of the partial plating film in the width direction on the plating material may be deteriorated.

したがって、本発明は、このような従来の問題点に鑑み、帯板状の被めっき材に精度良く且つ高い生産性で部分めっきすることができる、部分めっき方法を提供することを目的とする。   Therefore, in view of such conventional problems, it is an object of the present invention to provide a partial plating method capable of performing partial plating on a strip-shaped material to be plated with high accuracy and high productivity.

本発明者らは、上記課題を解決するために鋭意研究した結果、帯板状の被めっき材の長手方向に延びる幅方向両側の周縁部の各々の側面から幅方向に離間した位置にそれぞれ一列に配置されるように、被めっき材の一方の面から他方の面まで貫通する複数の位置決め穴を互いに離間して形成し、これらの位置決め穴と被めっき材の長手方向に延びる各々の側面との間隔が所定の間隔になるように、被めっき材の幅方向両側の周縁部の一部を長手方向に沿って切断し、この切断後の被めっき材の複数の位置決め穴とそれぞれ嵌合する複数の位置決めピンが一方の面から突出して形成されたマスク部材の一方の面に被めっき材を密着させてマスク部材の位置決めピンを被めっき材の位置決め穴に嵌合させ、マスク部材の複数の位置決めピンのそれぞれの列から所定の間隔だけ幅方向内側に離間してそれぞれ一列に配置されるようにマスク部材に互いに離間して形成された複数の開口部の各々を介して、被めっき材にめっき液を供給するとともに、マスク部材の他方の面側に配置された電極と被めっき材との間に電流を流して、被めっき材上のマスク部材の開口部に対向する部分をめっきし、このようにして得られためっき材の長手方向に延びる両側の側面から等距離になるようにめっき材を切断して分離することにより、帯板状の被めっき材に精度良く且つ高い生産性で部分めっきすることができることを見出し、本発明を完成するに至った。   As a result of intensive studies to solve the above problems, the present inventors have arranged a row at positions spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the strip-shaped material to be plated. A plurality of positioning holes penetrating from one surface of the material to be plated to the other surface so as to be spaced apart from each other, and these positioning holes and respective side surfaces extending in the longitudinal direction of the material to be plated. A part of the peripheral edge portions on both sides in the width direction of the material to be plated is cut along the longitudinal direction so that the distance between them becomes a predetermined distance, and the cutting material is fitted with a plurality of positioning holes of the material to be plated after cutting. A plurality of positioning pins are formed by projecting from one surface of the mask member. One surface of the mask member is brought into close contact with the plating target material so that the positioning pins of the mask member fit into the positioning holes of the plating target material. That of the locating pin The plating solution is applied to the material to be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row at a predetermined distance inward from each row in the width direction. While supplying, a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated, and the portion of the material to be plated facing the opening of the mask member is plated. The plating material is obtained by cutting the plating material so that it is equidistant from both side surfaces extending in the longitudinal direction, and separating the plating material so that the plate-shaped material to be plated is plated with high precision and high productivity. They have found that they can be achieved and have completed the present invention.

すなわち、本発明による部分めっき方法は、帯板状の被めっき材の長手方向に延びる幅方向両側の周縁部の各々の側面から幅方向に離間した位置にそれぞれ一列に配置されるように、被めっき材の一方の面から他方の面まで貫通する複数の位置決め穴を互いに離間して形成する位置決め穴形成工程と、これらの位置決め穴と被めっき材の長手方向に延びる各々の側面との間隔が所定の間隔になるように、被めっき材の幅方向両側の周縁部の一部を長手方向に沿って切断する周縁部切断工程と、この切断後の被めっき材の複数の位置決め穴とそれぞれ嵌合する複数の位置決めピンが一方の面から突出して形成されたマスク部材の一方の面に被めっき材を密着させてマスク部材の位置決めピンを被めっき材の位置決め穴に嵌合させ、マスク部材の複数の位置決めピンのそれぞれの列から所定の間隔だけ幅方向内側に離間してそれぞれ一列に配置されるようにマスク部材に互いに離間して形成された複数の開口部の各々を介して、被めっき材にめっき液を供給するとともに、マスク部材の他方の面側に配置された電極と被めっき材との間に電流を流して、被めっき材上のマスク部材の開口部に対向する部分をめっきする部分めっき工程と、この部分めっきしためっき材の長手方向に延びる両側の側面から等距離になるようにめっき材を切断して分離する分離工程とを備えたことを特徴とする。   That is, the partial plating method according to the present invention, the strip plate-shaped material to be plated, so as to be arranged in a row in a position spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction, Positioning hole forming step of forming a plurality of positioning holes penetrating from one surface of the plated material to the other surface are separated from each other, and the distance between these positioning holes and each side surface extending in the longitudinal direction of the plated material is A peripheral edge cutting step of cutting a part of the peripheral edge portions on both sides in the width direction of the plated material along the longitudinal direction so as to have a predetermined interval, and a plurality of positioning holes of the plated material after the cutting are respectively fitted. A plurality of matching positioning pins are formed by projecting from one surface of the mask member, and the plating target material is brought into close contact with the one surface of the mask member to fit the positioning pins of the mask member into the positioning holes of the plating target material. To be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row at a predetermined distance inward from each row of the plurality of positioning pins. The plating solution is supplied to the material, and a current is passed between the electrode arranged on the other surface side of the mask member and the material to be plated to plate the portion of the material to be opposed to the opening of the mask member. And a separating step of cutting and separating the plating material so as to be equidistant from both side surfaces extending in the longitudinal direction of the partially plated plating material.

この部分めっき方法において、マスク部材が略円筒形の部材であり、マスク部材の一方の面および他方の面がそれぞれ外周面および内周面であるのが好ましい。この場合、マスク部材が円周方向に回転可能であり、被めっき材をマスク部材の外周面に密着させて搬送しながら、めっき材上のマスク部材の開口部に対向する部分をめっきするのが好ましい。また、開口部が略矩形であるのが好ましく、マスク部材が非導電性部材からなるのが好ましい。また、周縁部切断工程と部分めっき工程との間に、被めっき材の全面に下地めっき層を形成する下地めっき工程を行うのが好ましい。さらに、部分めっき工程と分離工程との間に、被めっき材の幅方向両側の周縁部に周縁部めっき層を形成してもよい。また、被めっき材の幅方向両側の周縁部の一部の切断は、プレス加工によって行われるのが好ましい。   In this partial plating method, it is preferable that the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. In this case, the mask member is rotatable in the circumferential direction, and while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed, it is possible to plate the portion of the plated material facing the opening of the mask member. preferable. The opening is preferably substantially rectangular, and the mask member is preferably made of a non-conductive member. Further, it is preferable to perform a base plating step of forming a base plating layer on the entire surface of the material to be plated between the peripheral edge cutting step and the partial plating step. Further, between the partial plating step and the separation step, peripheral edge plating layers may be formed on the peripheral edges on both sides in the width direction of the material to be plated. Further, it is preferable that a part of the peripheral portions on both sides in the width direction of the material to be plated be cut by press working.

本発明によれば、帯板状の被めっき材に精度良く且つ高い生産性で部分めっきすることができる、部分めっき方法を提供することができる。   According to the present invention, it is possible to provide a partial plating method capable of accurately and partially plating a strip-shaped material to be plated with high productivity.

本発明による部分めっき方法の実施の形態により製造される長尺の帯板状のめっき材の一部を示す平面図である。FIG. 3 is a plan view showing a part of a long strip plate-shaped plated material manufactured by the embodiment of the partial plating method according to the present invention. 本発明による部分めっき方法の実施の形態に使用する部分めっき装置の側面を示す図である。It is a figure which shows the side surface of the partial plating apparatus used for embodiment of the partial plating method by this invention. 図2の部分めっき装置を水平面で切断して示す断面図である。It is sectional drawing which cut | disconnects and shows the partial plating apparatus of FIG. 2 by a horizontal surface. 図2の部分めっき装置をIV−IV線で切断して示す拡大断面図である。FIG. 4 is an enlarged cross-sectional view showing the partial plating apparatus of FIG. 2 taken along line IV-IV.

以下、添付図面を参照して、本発明による部分めっき方法の実施の形態について詳細に説明する。   Hereinafter, embodiments of a partial plating method according to the present invention will be described in detail with reference to the accompanying drawings.

図1は、部分めっき方法の実施の形態により製造される(半分に分離する前の)帯板状のめっき材の一部を示している。   FIG. 1 shows a part of a strip-shaped plated material (before being divided into halves) manufactured by an embodiment of the partial plating method.

図1に示すように、長尺の帯板状の被めっき材10の長手方向に延びる幅方向両側の周縁部12の各々の側面から幅方向に離間した位置に、それぞれ一列に且つ各々の側面と平行に配置されるように、被めっき材10の一方の面から他方の面まで貫通する所定の形状(図示した実施の形態では略円柱形)の複数の位置決め穴10aが、互いに所定の間隔(図示した実施の形態では略等間隔)で離間して形成されている。また、被めっき材10の長手方向に延びる幅方向両側の周縁部12の各々の側面には、所定の間隔(図示した実施の形態では略等間隔)で離間した略V字形の複数の切欠き部10bが形成されている。また、被めっき材10の全面には、下地めっき層14としてNiめっき皮膜が形成されている。また、被めっき材10の長手方向に延びる幅方向両側の周縁部12の間の中心部には、被めっき材10の長手方向に延びる(図1において点線で示す)中心軸線(各々の側面から等距離の線)の両側に、それぞれ一列に配置され且つ被めっき材10の長手方向に離間して配置されるように、略矩形の複数の部分めっき層16としてAuめっき皮膜が形成されている。また、被めっき材10の長手方向に延びる両側の周縁部12には、下地めっき皮膜14としてのNiめっき皮膜の上に、周縁部めっき層としてSnめっき皮膜が形成されている。   As shown in FIG. 1, each of the side surfaces of the long strip-shaped plate-shaped material 10 to be plated extends in the longitudinal direction and is spaced in the width direction from each side surface of the peripheral edge portions 12 on both sides in the width direction. A plurality of positioning holes 10a having a predetermined shape (substantially cylindrical in the illustrated embodiment) penetrating from one surface of the material to be plated 10 to the other surface thereof are arranged so as to be parallel to each other. (In the illustrated embodiment, they are formed at substantially equal intervals). In addition, a plurality of substantially V-shaped notches that are spaced at predetermined intervals (substantially equal intervals in the illustrated embodiment) on each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. The portion 10b is formed. A Ni plating film is formed as the base plating layer 14 on the entire surface of the material 10 to be plated. In addition, a central axis line (indicated by a dotted line in FIG. 1) extending in the longitudinal direction of the material to be plated 10 (from each side surface) is provided in a central portion between the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. Au plating films are formed as a plurality of substantially rectangular partial plating layers 16 so as to be arranged in a row on both sides of (equal distance line) and spaced apart in the longitudinal direction of the material to be plated 10. . Further, Sn plating films are formed as peripheral edge plating layers on the Ni plating films as the base plating films 14 at the peripheral edge parts 12 on both sides extending in the longitudinal direction of the plated material 10.

このようなめっき材は、本発明による部分めっき方法の実施の形態により製造することができる。本発明による部分めっき方法の実施の形態では、位置決め穴形成工程と、周縁部切断工程と、下地めっき工程と、部分めっき工程と、周縁部めっき工程と、分離工程とをこの順で行う。   Such a plated material can be manufactured by the embodiment of the partial plating method according to the present invention. In the embodiment of the partial plating method according to the present invention, the positioning hole forming step, the peripheral edge cutting step, the base plating step, the partial plating step, the peripheral edge plating step, and the separating step are performed in this order.

(位置決め穴形成工程)
この工程では、長尺の帯板状の被めっき材(ワーク)10の長手方向に延びる幅方向両側の周縁部12の各々の側面から離間した位置に、それぞれ一列に且つ各々の側面と平行に配置されるように、被めっき材の一方の面から他方の面まで貫通する複数の位置決め穴10aを互いに離間して形成する。この位置決め穴10aの形成は、被めっき材10を(順送)金型によりプレス加工して行うことができる。
(Positioning hole forming process)
In this step, at a position separated from each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the long strip-shaped material (work) 10 to be plated, each in a row and in parallel with each side surface. A plurality of positioning holes 10a penetrating from one surface to the other surface of the material to be plated are formed so as to be spaced from each other so as to be arranged. The positioning hole 10a can be formed by pressing the plated material 10 with a (progressive) die.

(周縁部切断工程)
この工程では、被めっき材10の位置決め穴10aと長手方向に延びる各々の側面との間隔が所定の間隔になるように、被めっき材10の長手方向に延びる幅方向両側の周縁部の一部(幅方向両端部)を長手方向に沿って(幅0.5〜1mm程度)切断する。また、被めっき材10の長手方向に延びる幅方向両側の周縁部12の各々の側面に、長手方向に所定の間隔(図示した実施の形態では略等間隔)で離間した略V字形の複数の切欠き部10bを形成する。この被めっき材10の幅方向両端部の切断と切欠き部10bの形成は、被めっき材10を(順送)金型によりプレス加工して同時に行うことができる。なお、帯板材の幅方向周縁部の切断は、一般にスリッタにより行われているが、長尺の帯板状の被めっき材の幅方向周縁部を精度良く切断するためには、(順送)金型によりプレス加工して行うのが好ましい。被めっき材の幅方向の寸法精度は、(被めっき材を材料として使用する端子などの種類によるが)±30μm以下(好ましくは±20μm以下、さらに好ましくは±15μm以下)であることが要求される場合があり、スリッタの加工精度は±50μm以上程度であるため、精度良く切断することができる(順送)金型によりプレス加工して行うのが好ましい。
(Periphery cutting process)
In this step, a part of the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the material to be plated 10 are arranged so that the spacing between the positioning hole 10a of the material to be plated 10 and each side surface extending in the longitudinal direction becomes a predetermined distance. The (widthwise both ends) is cut along the longitudinal direction (width 0.5 to 1 mm). In addition, a plurality of substantially V-shaped members that are spaced apart at a predetermined interval in the longitudinal direction (substantially equal intervals in the illustrated embodiment) are provided on each side surface of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the plated material 10. The cutout portion 10b is formed. The cutting of both end portions in the width direction of the material 10 to be plated and the formation of the notches 10b can be performed simultaneously by pressing the material 10 to be plated with a (progressive) die. The widthwise peripheral edge of the strip plate material is generally cut by a slitter, but in order to accurately cut the widthwise peripheral edge portion of the long strip-shaped material to be plated, (progress) It is preferable to perform pressing by a die. The dimensional accuracy of the material to be plated in the width direction is required to be ± 30 μm or less (depending on the type of terminal using the material to be plated, etc.) (preferably ± 20 μm or less, more preferably ± 15 μm or less). In some cases, the slitter processing accuracy is about ± 50 μm or more, so it is preferable to perform press processing with a die that can cut with high precision (progressive).

(下地めっき工程)
この工程では、被めっき材10の(表裏の)全面に下地めっき層14としてNiめっき層を形成する。この下地めっき層14としてのNiめっき皮膜は、電気めっきにより、Niめっきを行うことによって形成することができる。
(Undercoating process)
In this step, a Ni plating layer is formed as the base plating layer 14 on the entire surface (front and back) of the material to be plated 10. The Ni plating film as the base plating layer 14 can be formed by performing Ni plating by electroplating.

(部分めっき工程)
この工程では、図2〜図4に示すような部分めっき装置を使用して部分めっき(スポットめっき)を行う。図2は本発明による部分めっき方法の実施の形態に使用する部分めっき装置の側面を示す図であり、図3は図2の部分めっき装置を水平面で切断して示す断面図、図4は図3の部分めっき装置をIV−IV線で切断して示す拡大断面図である。なお、図2において、マスク部材上に配置される前後の被めっき材を見易くするために、被めっき材の方向を変える支持ロールをマスク部材の外側に示している。
(Partial plating process)
In this step, partial plating (spot plating) is performed using a partial plating apparatus as shown in FIGS. 2 is a view showing a side surface of a partial plating apparatus used in the embodiment of the partial plating method according to the present invention, FIG. 3 is a sectional view showing the partial plating apparatus of FIG. 2 taken along a horizontal plane, and FIG. It is an expanded sectional view which cuts and shows the partial plating equipment of No. 3 by the IV-IV line. In addition, in FIG. 2, in order to make it easy to see the material to be plated before and after being placed on the mask member, a support roll that changes the direction of the material to be plated is shown outside the mask member.

図2〜図4に示すように、部分めっき装置100のマスク部材102の一方の面に被めっき材10を密着させて配置した後、マスク部材102の複数の開口部102cの各々を介して、被めっき材10にめっき液を供給するとともに、マスク部材102の他方の面側に配置された電極(アノード)104と被めっき材10との間に電流を流して、被めっき材10上のマスク部材102の各々の開口部102cに対向する部分をめっきするようになっている。   As shown in FIGS. 2 to 4, after the material 10 to be plated is placed in close contact with one surface of the mask member 102 of the partial plating apparatus 100, each of the plurality of openings 102c of the mask member 102 is inserted. The plating solution is supplied to the material 10 to be plated, and a current is passed between the electrode (anode) 104 arranged on the other surface side of the mask member 102 and the material 10 to be plated to form a mask on the material 10 to be plated. A portion of the member 102 facing each opening 102c is plated.

マスク部材102は、円周方向に回転可能な略円筒形の(ポリ塩化ビニル(PVC)樹脂などの)非導電性部材からなるマスク部材本体(ドラム形マスク部材本体)からなり、このマスク部材本体の外周面(一方の面)には、被めっき材支持部として上下方向略中央部に全周にわたって延びる凹部102aが形成され、この凹部102aの底面に被めっき材10が密着して配置されるようになっている。このマスク部材102の凹部102aの底面の長手方向に延びる幅方向両側の周縁部の各々には、円周方向に所定の間隔(位置決め穴10aと同一の間隔)で離間して一列に配置された所定の形状(図示した実施の形態では位置決め穴10aより僅かに小さい略円柱形)の複数の位置決めピン102bが突起しており、マスク部材102の外周面(一方の面)に被めっき材10が密着して配置される際に、被めっき材10の位置決め穴10aと順次嵌合するようになっている。また、マスク部材102の凹部102aの底面には、それぞれの列の位置決めピン102bから幅方向内側に所定の間隔だけ離間した領域(マスク部材102の凹部102aの円周方向に延びる中心軸線に対応する線から幅方向両側に所定の間隔だけ離間した領域)に、それぞれ一列に配置され且つ円周方向に所定の間隔(図示した実施の形態では略等間隔)で離間して配置された所定の形状(図示した実施の形態では略矩形)の複数の開口部102cがマスク部材102を貫通して形成されている。なお、マスク部材102の位置決めピン102bと嵌合する被めっき材10の位置決め穴10aは、被めっき材10の幅方向両側の側面から所定の間隔で精度良く配置されており、マスク部材102の開口部102cも位置決めピン102bから幅方向内側に所定の間隔で離間して精度良く形成することができる。   The mask member 102 is composed of a mask member main body (drum-shaped mask member main body) made of a substantially cylindrical non-conductive member (such as polyvinyl chloride (PVC) resin) rotatable in the circumferential direction. On the outer peripheral surface (one surface), a recess 102a extending over the entire circumference is formed at a substantially central portion in the up-down direction as a material-supporting portion for plating, and the material 10 to be plated is arranged in close contact with the bottom surface of the recess 102a. It is like this. The mask member 102 is arranged in a row in the circumferential direction at predetermined intervals (the same interval as the positioning holes 10a) on each of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the bottom surface of the recess 102a of the mask member 102. A plurality of positioning pins 102b having a predetermined shape (substantially cylindrical shape slightly smaller than the positioning hole 10a in the illustrated embodiment) are projected, and the material 10 to be plated is placed on the outer peripheral surface (one surface) of the mask member 102. When they are arranged in close contact with each other, they are sequentially fitted into the positioning holes 10a of the plated material 10. Further, on the bottom surface of the recess 102a of the mask member 102, a region (corresponding to a central axis line extending in the circumferential direction of the recess 102a of the mask member 102 is spaced from the positioning pins 102b in each row by a predetermined distance inward in the width direction. Predetermined shapes, which are arranged in a row in a region spaced apart from the line on both sides in the width direction by a predetermined distance, and are arranged in the circumferential direction at predetermined intervals (substantially equal intervals in the illustrated embodiment). A plurality of openings 102c (substantially rectangular in the illustrated embodiment) are formed through the mask member 102. The positioning holes 10a of the material 10 to be plated that fit with the positioning pins 102b of the mask member 102 are accurately arranged at predetermined intervals from the side surfaces on both sides in the width direction of the material 10 to be plated, and the openings of the mask member 102 are formed. The portion 102c can also be accurately formed by being spaced from the positioning pin 102b inward in the width direction at a predetermined interval.

図3において矢印Aで示す方向に搬送された被めっき材10は、回転可能な入口側支持ロール108により方向を変えて、マスク部材102の外周面に密着すると、被めっき材10の位置決め穴10aがマスク部材102の位置決めピン102bと嵌合して、マスク部材102を矢印Bで示す方向に回転させた後、回転可能な出口側支持ロール110により方向を変えて矢印Aで示す方向に搬送されるようになっている。   When the material 10 to be plated conveyed in the direction indicated by the arrow A in FIG. 3 is changed in direction by a rotatable inlet side support roll 108 and comes into close contact with the outer peripheral surface of the mask member 102, a positioning hole 10a for the material 10 to be plated is formed. Engages with the positioning pin 102b of the mask member 102, rotates the mask member 102 in the direction indicated by the arrow B, and then is rotated in the direction indicated by the arrow A by the rotatable outlet side support roll 110. It has become so.

このようにマスク部材102の外周面に被めっき材10を密着させて配置している間に、マスク部材102の他方の面(内周面)側に配置されためっき液噴流部106の一対のスリット106aから、マスク部材102のそれぞれの列の各々の開口部102cを介して、被めっき材10にめっき液が供給されるとともに、マスク部材102の内周面側に配置された電極(アノード)104とカソードとしての被めっき材10との間に電流が流れると、被めっき材10上のマスク部材102の各々の開口部102cに対向する部分に、部分めっき層16として(Auめっき皮膜などの)めっき皮膜が形成されるようになっている。   As described above, while the material to be plated 10 is arranged in close contact with the outer peripheral surface of the mask member 102, the pair of plating solution jetting portions 106 arranged on the other surface (inner peripheral surface) side of the mask member 102 are disposed. The plating solution is supplied from the slits 106a to the material 10 to be plated through the openings 102c of the respective rows of the mask member 102, and the electrodes (anode) arranged on the inner peripheral surface side of the mask member 102. When an electric current flows between the material 104 to be plated and the material 10 to be plated as the cathode, a portion of the mask material 102 on the material to be plated 10 facing each opening 102c is formed as a partial plating layer 16 (such as Au plating film). ) A plating film is formed.

めっき液噴流部106は、(断面が略扇形の)略半円筒形の非導電性部材からなり、マスク部材102の内周面の一部(被めっき材支持部12bの内周面の略半分)に対向するように配置されている。めっき液噴流部106の一対のスリット106aは、めっき液噴流部106の内周面から外周面まで貫通しており、(図示しない)めっき液供給部により内周面側から外周面側にめっき液を噴射して供給することができるようになっている。   The plating solution jetting portion 106 is made of a substantially semi-cylindrical non-conductive member (having a substantially fan-shaped cross section), and is part of the inner peripheral surface of the mask member 102 (approximately half the inner peripheral surface of the material-supported portion 12b to be plated). ) Are arranged so as to face each other. The pair of slits 106a of the plating solution jetting section 106 penetrates from the inner peripheral surface to the outer peripheral surface of the plating solution jetting section 106, and the plating solution supplying section (not shown) moves the plating solution from the inner peripheral surface side to the outer peripheral surface side. Can be injected and supplied.

アノード104は、断面が扇形の導電性部材からなり、めっき液噴流部106のそれぞれのスリット106aの内壁の上下の面に取り付けられている。なお、めっき液噴流部106のそれぞれのスリット106aの内壁に取り付けられたアノード104に流れる電流をそれぞれ別個の整流器で変化させることにより、マスク部材102のそれぞれの列の開口部102cを介して形成される(Auめっき皮膜などの)めっき皮膜の厚さを変えることができる。   The anode 104 is made of a conductive member having a fan-shaped cross section, and is attached to the upper and lower surfaces of the inner wall of each slit 106 a of the plating solution jetting section 106. It should be noted that the currents flowing through the anodes 104 attached to the inner walls of the respective slits 106a of the plating solution jetting portion 106 are changed by different rectifiers to form the mask members 102 through the openings 102c of the respective rows. The thickness of the plating film (such as Au plating film) can be changed.

(周縁部めっき工程)
この工程では、被めっき材10の周縁部12に周縁部めっき層としてSnめっき皮膜を形成する。この周縁部めっき層としてのSnめっき皮膜の形成は、被めっき材10の一方の側面(下側に配置した側面)から一定の幅の部分(一方の側面側の周縁部)をSnめっき液に浸漬して、電気めっきによりSnめっき皮膜を形成した後、被めっき材10を反転させて他方の側面を下側に配置させ、その他方の側面から一定の幅の部分(他方の側面側の周縁部)をSnめっき液に浸漬して、電気めっきによりSnめっき皮膜を形成することによって行うことができる。
なお、上述した下地めっき層、部分めっき層および周縁部めっき層の形成は、リール・ツー・リールめっき装置により、1ライン、1パスで行うことができる。
(Periphery part plating process)
In this step, an Sn plating film is formed as a peripheral edge plating layer on the peripheral edge 12 of the material 10 to be plated. The Sn plating film as the peripheral edge plating layer is formed by using a Sn plating solution from a side surface (a side surface arranged on the lower side) of the material to be plated 10 to a portion having a constant width (a peripheral edge portion on one side surface side). After immersing and forming an Sn plating film by electroplating, the material 10 to be plated is inverted to arrange the other side surface on the lower side, and a portion having a constant width from the other side surface (periphery of the other side surface side). Part) is immersed in a Sn plating solution, and an Sn plating film is formed by electroplating.
The formation of the base plating layer, the partial plating layer and the peripheral edge plating layer described above can be performed in one line and one pass by a reel-to-reel plating apparatus.

(分離工程)
この工程では、上記のめっき後のめっき材の両側面を基準として、めっき材の両側面から等距離で長手方向に延びる直線(図1において点線で示す長手方向の中心軸線)に沿ってスリッタによりめっき材を半分に切断して分離する。なお、マスク部材102の位置決めピン102bと嵌合する被めっき材10の位置決め穴10aが、被めっき材10の幅方向両側の側面から所定の間隔で精度良く配置され、マスク部材の開口部102cも位置決めピン102bから幅方向内側に所定の間隔で離間して精度良く形成され、めっき後のめっき材の両側面から等距離で長手方向に延びる直線に沿ってめっき材を半分に切断して分離しているので、分離した2つのめっき材の各々に精度良く部分めっきすることができる。
(Separation process)
In this step, the slitter is used along the straight lines (the central axis of the longitudinal direction shown by the dotted line in FIG. 1) extending in the longitudinal direction at equal distances from the both sides of the plated material, with reference to the both sides of the plated material after the plating. Cut the plated material in half and separate. Note that the positioning holes 10a of the plated material 10 that fit with the positioning pins 102b of the mask member 102 are accurately arranged at predetermined intervals from the side surfaces on both sides in the width direction of the plated material 10, and the opening 102c of the mask member is also formed. The plated material is accurately separated from the positioning pin 102b at a predetermined distance inward in the width direction, and the plated material is cut in half along a straight line extending in the longitudinal direction at equal distances from both side surfaces of the plated material after plating. Therefore, it is possible to accurately perform partial plating on each of the two separated plating materials.

上述したように、本発明による部分めっき方法の実施の形態では、長尺の帯板状の被めっき材10の長手方向に延びる幅方向両側の周縁部に形成された複数の位置決め穴10aの位置を基準として、被めっき材10の幅方向両側の周縁部の一部を長手方向に沿って切断し、被めっき材10の複数の位置決め穴10aに嵌合するマスク部材102の複数の位置決めピン102bを基準として形成された開口部102cを介して、被めっき材10のマスク部材の開口部102cに対向する部分をめっきして得られためっき材10の長手方向に延びる両側の側面を基準として、めっき材を切断して分離しているので、リール・ツー・リールめっき装置により、1ラインで2本分の幅の長尺の帯板状の被めっき材を部分めっきした後に、長手方向に沿って半分に切断して、2つの帯板状のめっき材を作製しても、2つの帯板状のめっき材の幅方向の寸法が、1本の長尺の帯板状の被めっき材を部分めっきした場合に得られるめっき材の幅方向の寸法と同等になるように、2つの帯板状のめっき材を十分な精度で得ることができるとともに、2つの帯板状のめっき材の各々に幅方向に十分な位置精度で部分めっき皮膜を形成することができる。   As described above, in the embodiment of the partial plating method according to the present invention, the positions of the plurality of positioning holes 10a formed in the peripheral portions on both sides in the width direction extending in the longitudinal direction of the long strip-shaped material 10 to be plated. Based on the above, a plurality of positioning pins 102b of the mask member 102 are cut along the longitudinal direction at a part of the peripheral edge portions on both sides in the width direction of the material to be plated 10 and fitted into the plurality of positioning holes 10a of the material to be plated 10. With reference to the side faces on both sides extending in the longitudinal direction of the plated material 10 obtained by plating the portion of the plated member 10 that faces the opening 102c of the mask member through the opening 102c formed as a reference, Since the plated material is cut and separated, a reel-to-reel plating device partially plates a long strip-shaped material to be plated with a width of two lines in one line, and then runs in the longitudinal direction. Even if two strip-shaped plated materials are produced by cutting into two halves, the widthwise dimension of the two strip-shaped plated materials is equal to one long strip-shaped plated material. It is possible to obtain two strip plate-shaped plating materials with sufficient accuracy so that the widthwise dimension of the plated material obtained when partial plating is performed, and each of the two strip plate-shaped plating materials can be obtained. Further, the partial plating film can be formed with sufficient positional accuracy in the width direction.

以下、本発明による部分めっき方法の実施例について詳細に説明する。   Hereinafter, examples of the partial plating method according to the present invention will be described in detail.

まず、幅54.0mm(−0.1mm〜+0mm)、厚さ0.2mmの長尺の帯板状のCuからなる圧延板を用意した。   First, a long strip-shaped rolled plate made of Cu having a width of 54.0 mm (-0.1 mm to +0 mm) and a thickness of 0.2 mm was prepared.

次に、順送金型を使用したプレス加工により、この圧延板の長手方向に延びる幅方向両側の周縁部の一方の周縁部の側面から離間した位置に、それぞれ一列に且つその側面と平行に配置されるように、直径1.5mmの複数の位置決め穴を長手方向のピッチ(隣接する位置決め穴の中心の間隔)8mmで等間隔に打ち抜いた。なお、圧延板の長手方向に延びる幅方向両側の周縁部の一方の周縁部の位置決め穴は、それぞれの中心がその周縁部の側面から約2.1mm離間するように形成し、他方の周縁部の位置決め穴は、一方の周縁部の位置決め穴のそれぞれの中心から49mm離間した位置に形成した。   Next, by pressing using a progressive die, the rolling plates are arranged in a row and in parallel with the side faces of one of the peripheral portions on both sides in the width direction extending in the longitudinal direction. As described above, a plurality of positioning holes each having a diameter of 1.5 mm were punched out at equal intervals with a longitudinal pitch (a distance between the centers of adjacent positioning holes) of 8 mm. It should be noted that the positioning holes in one of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the rolled plate are formed such that their centers are separated from the side surface of the peripheral portion by about 2.1 mm, and the other peripheral portion. The positioning hole was formed at a position separated by 49 mm from the center of each of the positioning holes at the one peripheral edge.

次に、上記の順送金型を使用したプレス加工により、圧延板のそれぞれの位置決め穴の中心と長手方向に延びる各々の側面との間隔がそれぞれ1.5mmになるように、圧延版の長手方向に延びる幅方向両側の周縁部の一部を長手方向に沿って切断することにより、幅52.0mm(±0.02mm)の帯板状の圧延板(1次プレス品)を被めっき材10として用意した。   Next, by press working using the progressive die described above, the longitudinal direction of the rolling plate was adjusted so that the distance between the center of each positioning hole of the rolled plate and each side surface extending in the longitudinal direction was 1.5 mm. A strip-shaped rolled plate (primary pressed product) having a width of 52.0 mm (± 0.02 mm) is cut by cutting a part of peripheral portions on both sides in the width direction extending in the longitudinal direction along the longitudinal direction. Prepared as

次に、リール・ツー・リール方式の連続めっきラインにおいて、被めっき材を搬送しながら、前処理として、アルカリ脱脂し、電解脱脂し、水洗し、硫酸で酸洗した後、被めっき材上に下地めっき層、部分めっき層および周縁部めっき層の形成をこの順で1ライン、1パスで行った。   Next, in a reel-to-reel continuous plating line, while carrying the material to be plated, as a pretreatment, alkali degreasing, electrolytic degreasing, water washing, and acid pickling with sulfuric acid, and then onto the material to be plated The base plating layer, the partial plating layer, and the peripheral edge plating layer were formed in this order by one line and one pass.

下地めっき層の形成では、電流密度9A/dmで電気めっきを行うことにより、被めっき材の全面に下地めっき層としてNiめっき皮膜を形成した。 In forming the undercoat layer, electroplating was performed at a current density of 9 A / dm 2 to form a Ni plating film as the undercoat layer on the entire surface of the material to be plated.

部分めっき層(スポット状のAuめっき皮膜)の形成では、図2〜図4の部分めっき装置100と同様の部分めっき装置を使用し、マスク部材102として、(マスク部材の円周方向の長さ2.0mm×幅方向の長さ2.5mmの大きさの)略矩形の各々の開口部102cが(幅方向の中心が被めっき材10のそれぞれの周縁部の側面から20mm離間した位置に)互いに離間して形成された略円筒形のPVCからなるマスク部材を使用して、電流密度25A/dmで電気めっきを行うことにより、被めっき材10の一方の面の各々の開口部102cに対向する部分にAuめっき皮膜を形成した後、図2〜図4の部分めっき装置100と同様の部分めっき装置を被めっき材10の他方の面側に配置させ、マスク部材102として、(マスク部材の円周方向の長さ1.0mm×幅方向の長さ2.0mmの大きさの)略矩形の各々の開口部102c(幅方向の中心が被めっき材10のそれぞれの周縁部の側面から15mm離間した位置に)互いにが離間して形成された略円筒形のPVCからなるマスク部材を使用して、電流密度20A/dmとした以外は、上記と同様の方法により、被めっき材10の他方の面の各々の開口部102cに対向する部分にAuめっき皮膜を形成した。 In the formation of the partial plating layer (spot-shaped Au plating film), the same partial plating apparatus as the partial plating apparatus 100 of FIGS. 2 to 4 is used, and as the mask member 102, the length of the mask member in the circumferential direction is set. Each of the substantially rectangular openings 102c (having a size of 2.0 mm and a length of 2.5 mm in the width direction) has a center in the width direction at a position 20 mm apart from the side surface of each peripheral edge of the plated material 10. By performing electroplating at a current density of 25 A / dm 2 using mask members made of substantially cylindrical PVC that are formed so as to be separated from each other, the openings 102c are formed in the respective openings 102c on one surface of the material 10 to be plated. After forming the Au plating film on the facing portion, a partial plating apparatus similar to the partial plating apparatus 100 of FIGS. 2 to 4 is arranged on the other surface side of the material 10 to be plated, and as the mask member 102, (mask Each of the substantially rectangular openings 102c (having a length of 1.0 mm in the circumferential direction of the material and a length of 2.0 mm in the width direction) (the center in the width direction is the side surface of each peripheral portion of the material 10 to be plated). The material to be plated was prepared by the same method as described above except that a mask member made of substantially cylindrical PVC formed so as to be separated from each other (at a position separated by 15 mm from) was used and the current density was 20 A / dm 2. An Au plating film was formed on a portion of the other surface of No. 10 facing each opening 102c.

周縁部めっき層の形成では、被めっき材10の一方の側面(下側に配置した側面)から10mmの幅の部分(一方の側面側の周縁部)をSnめっき液に浸漬して、電流密度12A/dmで電気めっきを行うことによってSnめっき皮膜を形成した後、被めっき材10を反転させて他方の側面を下側に配置させ、その他方の側面から10mmの幅の部分(他方の側面側の周縁部)をSnめっき液に浸漬して、電流密度12A/dmで電気めっきを行うことによってSnめっき皮膜を形成した。 In forming the peripheral edge plating layer, a portion having a width of 10 mm (a peripheral edge portion on one side surface side) from one side surface (side surface arranged on the lower side) of the material to be plated 10 is immersed in the Sn plating solution to obtain a current density. After forming the Sn plating film by performing electroplating at 12 A / dm 2 , the material 10 to be plated is inverted and the other side surface is arranged on the lower side, and a portion having a width of 10 mm from the other side surface (the other side surface). The peripheral portion on the side surface side) was immersed in an Sn plating solution, and electroplating was performed at a current density of 12 A / dm 2 to form a Sn plating film.

次に、被めっき材10の両側面を基準として、被めっき材10の両側面から等距離で長手方向に延びる直線に沿って、スリッタにより被めっき材10を半分に切断した。   Next, with reference to both side surfaces of the material 10 to be plated, the material 10 to be plated was cut in half along a straight line extending in the longitudinal direction at equal distances from both sides of the material 10 to be plated.

このようにして得られた2つの部分めっき材について、蛍光X線膜厚計(株式会社日立ハイテクサイエンス製のSFT−110A)により、2つの部分めっき材の両面のAuめっき皮膜の中央部の膜厚を測定したところ、一方の部分めっき材のAuめっき皮膜の厚さの平均値は、他方の部分めっき材のAuめっき皮膜の厚さの平均値と略同一であった。また、2つの部分めっき材の幅は26.0mm(±0.02mm)であり、2つの部分めっき材を精度良く切断して分離することができるとともに、2つの部分めっき材の各々に幅方向に精度良くAuめっき皮膜を形成することができた。   With respect to the two partial plating materials thus obtained, a film at the central portion of the Au plating film on both sides of the two partial plating materials was measured with a fluorescent X-ray film thickness meter (SFT-110A manufactured by Hitachi High-Tech Science Co., Ltd.). When the thickness was measured, the average value of the thicknesses of the Au plating films of the one partial plating material was substantially the same as the average value of the thicknesses of the Au plating film of the other partial plating material. In addition, the width of the two partial plating materials is 26.0 mm (± 0.02 mm), so that the two partial plating materials can be accurately cut and separated, and the two partial plating materials can be separated in the width direction. The Au plating film could be formed with high accuracy.

10 被めっき材
10a 位置決め穴
10b 切欠き
12 周縁部
14 下地めっき層
16 部分めっき層
100 部分めっき装置
102 マスク部材
102a 凹部(被めっき材支持部)
102b 位置決めピン
102c 開口部
104 アノード
106 めっき液噴流部
106a スリット
108 入口側支持ロール
110 出口側支持ロール
DESCRIPTION OF SYMBOLS 10 Plated material 10a Positioning hole 10b Notch 12 Peripheral part 14 Base plating layer 16 Partial plating layer 100 Partial plating apparatus 102 Mask member 102a Recessed part (supporting part for plated material)
102b Positioning pin 102c Opening 104 Anode 106 Plating solution jetting section 106a Slit 108 Inlet side support roll 110 Outlet side support roll

Claims (8)

帯板状の被めっき材の長手方向に延びる幅方向両側の周縁部の各々の側面から幅方向に離間した位置にそれぞれ一列に配置されるように、被めっき材の一方の面から他方の面まで貫通する複数の位置決め穴を互いに離間して形成する位置決め穴形成工程と、これらの位置決め穴と被めっき材の長手方向に延びる各々の側面との間隔が所定の間隔になるように、被めっき材の幅方向両側の周縁部の一部を長手方向に沿って切断する周縁部切断工程と、この切断後の被めっき材の複数の位置決め穴とそれぞれ嵌合する複数の位置決めピンが一方の面から突出して形成されたマスク部材の一方の面に被めっき材を密着させてマスク部材の位置決めピンを被めっき材の位置決め穴に嵌合させ、マスク部材の複数の位置決めピンのそれぞれの列から所定の間隔だけ幅方向内側に離間してそれぞれ一列に配置されるようにマスク部材に互いに離間して形成された複数の開口部の各々を介して、被めっき材にめっき液を供給するとともに、マスク部材の他方の面側に配置された電極と被めっき材との間に電流を流して、被めっき材上のマスク部材の開口部に対向する部分をめっきする部分めっき工程と、この部分めっきしためっき材の長手方向に延びる両側の側面から等距離になるようにめっき材を切断して分離する分離工程とを備えたことを特徴とする、部分めっき方法。 From one surface of the material to be plated to be arranged in a row at positions spaced apart in the width direction from the respective side surfaces of the peripheral portions on both sides in the width direction extending in the longitudinal direction of the material to be plated in the strip shape. Positioning hole forming step of forming a plurality of positioning holes penetrating up to each other with a distance from each other, and so that the distance between these positioning holes and each side surface extending in the longitudinal direction of the plated material becomes a predetermined distance. A peripheral edge cutting step of cutting a part of the peripheral edges on both sides in the width direction of the material along the longitudinal direction, and a plurality of positioning pins that respectively fit with the plurality of positioning holes of the plated material after the cutting are provided on one surface. The plating target material is brought into close contact with one surface of the mask member formed so as to protrude from the mask member, and the positioning pin of the mask member is fitted into the positioning hole of the plating target material, and a predetermined number is provided from each row of the plurality of positioning pins of the mask member. The plating solution is supplied to the material to be plated through each of the plurality of openings formed in the mask member so as to be arranged in a row and spaced inward in the width direction. Partial plating step of applying a current between the electrode arranged on the other surface side of the substrate and the material to be plated to plate the portion of the material to be plated that faces the opening of the mask member, and this partially plated plating And a separation step of cutting and separating the plated material so as to be equidistant from both side surfaces extending in the longitudinal direction of the material. 前記マスク部材が円筒形の部材であり、前記マスク部材の一方の面および他方の面がそれぞれ外周面および内周面であることを特徴とする、請求項1に記載の部分めっき方法。 It said mask member is a member of a circle cylindrical, and wherein the one surface and the other surface of the mask member is an outer peripheral surface and inner peripheral surface, respectively, partial plating method according to claim 1. 前記マスク部材が円周方向に回転可能であり、前記被めっき材を前記マスク部材の外周面に密着させて搬送しながら、前記めっき材上の前記マスク部材の開口部に対向する部分をめっきすることを特徴とする、請求項2に記載の部分めっき方法。 The mask member is rotatable in the circumferential direction, and the portion of the plating material facing the opening of the mask member is plated while the material to be plated is brought into close contact with the outer peripheral surface of the mask member and conveyed. The partial plating method according to claim 2, wherein: 前記開口部が矩形であることを特徴とする、請求項1乃至3のいずれかに記載の部分めっき方法。 Characterized in that the opening is a rectangle, partial plating method according to any one of claims 1 to 3. 前記マスク部材が非導電性部材からなることを特徴とする、請求項1乃至4のいずれかに記載の部分めっき方法。 The partial plating method according to claim 1, wherein the mask member is made of a non-conductive member. 前記周縁部切断工程と前記部分めっき工程との間に、前記被めっき材の全面に下地めっき層を形成する下地めっき工程を行うことを特徴とする、請求項1乃至5のいずれかに記載の部分めっき方法。 The base plating step of forming a base plating layer on the entire surface of the material to be plated is performed between the peripheral edge cutting step and the partial plating step. Partial plating method. 前記部分めっき工程と前記分離工程との間に、前記被めっき材の幅方向両側の周縁部に周縁部めっき層を形成することを特徴とする、請求項1乃至6のいずれかに記載の部分めっき方法。 7. The portion according to claim 1, wherein a peripheral edge plating layer is formed on both peripheral edge portions in the width direction of the material to be plated between the partial plating step and the separating step. Plating method. 前記被めっき材の幅方向両側の周縁部の一部の切断が、プレス加工によって行われることを特徴とする、請求項1乃至7のいずれかに記載の部分めっき方法。 The partial plating method according to any one of claims 1 to 7, wherein a part of the peripheral edge portions on both sides in the width direction of the material to be plated is cut by press working.
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