JPH11240653A - Slit base material take-up device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a take-up device that takes up multilines of lead frame strips that are slit from a lead-frame base material paged in multilines and subjected to terminal formation by photo-etching, stably or without deteriorating their quality. SOLUTION: A slit base material take-up device comprises a plurality of spools 32 fitted on a driveshaft 31, a power source 41 for rotating the driveshaft 31, a plurality of guide rollers 33 located on the upstream side of the spools 32 to guide multilines of a base material 2 slit toward the spools 32, and feed rollers 20 located on the upstream side of the guide rollers 33 to deliver the slit base material multilines 2. Between the guide rollers 33 and feed rollers 20, a sag space 34 is defined where the base material 2 is allowed to sag down by its deadweight, in which space 34 pairs of detectors 42a, 42b and 43a, 43b are placed to detect any sag of the base material 2. The multilines of the slit base material 2 are wound about the spools 32 through control of the rotational frequency of the power source 41 for driving the spools 32 on the basis of sag detection signals from the detectors 42a, 42b, 43a and 43b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a lead frame, and more particularly, to a method for slitting a long lead frame base material arranged in multiple rows by a slit processing apparatus and then slitting the lead frame base. The present invention relates to a winding device for winding a lead frame base material in a row.

[0002]

2. Description of the Related Art In recent years, the manufacturing technology of semiconductor integrated circuits (ICs) has advanced remarkably, and large-capacity, multifunctional ultra-high-integration ICs have been developed.
Mass production has begun. The lead frame used in this ultra-highly integrated IC has been miniaturized as the number of terminals of the integrated circuit has increased, and therefore, it is often manufactured by a photo-etching technique suitable as a precision processing technique for a thin metal plate.

[0003] When manufacturing this type of lead frame, conventionally, a photoresist is applied to a sheet-like thin metal sheet of a copper alloy or an iron alloy of about 500 x 500 mm,
After forming a multi-sided terminal pattern by a photoengraving method, the terminal pattern is etched, and the terminal end is plated with a noble metal. The lead frame base material manufactured in a sheet shape is generally cut into a strip shape as shown in FIG. 1, and then supplied to a bonding apparatus which is an assembly process of a semiconductor integrated circuit.

However, when a lead frame is manufactured using a sheet-shaped metal sheet, a plating pattern is applied to the handling of the metal sheet, the terminal pattern processed into the metal sheet, and the terminal etched by the terminal pattern. Positioning is not easy, and it has been a problem in automating and speeding up the lead frame manufacturing process. Therefore, as a lead frame base material,
Attempts have been made to use a long strip-shaped rolled-up metal sheet and to continuously and in multiple rows of lead frames to automate the lead frame manufacturing process and save labor.

In such a case, it is necessary to separate and process a long lead frame base material which is imposed in multiple rows by a photoengraving method and subjected to terminal processing by a photo etching technique into a single row of lead frame strips. For example, there is a method of slitting a lead frame base material using a rotary blade. However, in order to keep the width dimension and slit position of the lead frame within the predetermined accuracy, it is necessary to accurately adjust the position of the rotary blade to the imposition position of the lead frame strip. The position of the terminal pattern of the frame may be shifted in the width direction of the base material, and the etching of the wide metal sheet is distorted or bent, so that it is difficult to position the rotary blade.

Therefore, in the photo-etching step for forming the terminals of the lead frame, grooves are formed by half-etching at the boundaries between the leads of the lead frame. Then, by alternately pulling the strips in different directions, the grooves formed by the half-etching process are torn, thereby separating into single-row leadframe strips, which is more accurate than in the case of using a rotary blade. It is now possible to perform single-row separation processing with high accuracy without positioning. Further, since the rotary blade is not used, it is not necessary to consider the wear of the blade, and the lead frame base material can always be stably separated.

Further, a half-etching process is carried out between the lead frame strips at a predetermined interval in the longitudinal direction of the base material at a constant interval in the longitudinal direction of the base material, and at the boundary with the lead frame strip, in parallel with the longitudinal direction of the base material. A horizontal portion having a groove formed therein is provided, and a groove formed at a boundary between the lead frame strip and the horizontal section is torn, thereby forming a horizontal section between the lead frame strip and the lead frame strip. There has been proposed a method of obtaining a single-row lead frame strip by separating the lead frame strip from a substrate.

[0008] Further, between the lead frame strips, a horizontal portion which is bridged at regular intervals in the longitudinal direction of the base material is connected to each other via a connecting strip, and the connecting strip is connected to the lead. By pulling in a different direction from the frame strip,
A method has also been proposed in which a groove formed at the boundary between the lead frame strip and the horizontal portion is torn to obtain a multi-row lead frame strip separated into single rows.

[0009]

The lead frame base material, which is provided in multiple rows using long strip-shaped rolled-up metal sheets and subjected to terminal processing by the photo-etching technique, can be simply formed by the above-described various methods. After being slit into the lead frame strips in a row, they are collectively wound up in spools or reels arranged in multiple rows in row units. At this time, a large number of extremely fine terminals are formed on each of the lead frame strips to be wound, and the terminal shape is easily deformed by a slight external force. Therefore, when winding the slit lead frame base material on a spool or the like, the winding method and the configuration of the winding device are important issues.

For example, when winding a substrate which is weak against external force, it is important to wind the substrate so that no extra tension acts on the substrate. In addition, it is necessary to consider the configuration of the winding device so that the substrate being wound does not rub against the members constituting the winding device, or the substrates rub against each other to cause abrasion or deformation of the substrate. Further, stable operation of the winding device and operability of the device are also important factors.

That is, an object of the present invention is to provide a multi-row imposition in a manufacturing process of a lead frame manufactured by using a long strip-shaped rolled metal sheet in order to automate the manufacturing process of the lead frame and save labor. Then, after slitting the lead frame base material that has been subjected to the terminal processing by photoetching into a single row of lead frame strips, the multi-rowed lead frame strips are wound up stably without deteriorating the quality. To provide a slit substrate winding device for the same.

[0012]

According to the first aspect of the present invention, there is provided an apparatus for winding a slit base material, comprising: a plurality of spools removably inserted into one drive shaft; A power source that rotationally drives a shaft, a plurality of rotatable guide rollers that are arranged upstream of the plurality of spools, and guide the multi-row slit substrates toward each spool, and a plurality of the guide rollers. It is arranged upstream, and comprises a transport roller for nipping and transporting the multi-row slit base material, and between the plurality of guide rollers and the transport roller, the multi-row slit substrate is self-weighted. A take-up device provided with a slack space that can hang down, and the slack space includes a detector that detects a slack amount of the base material. Power to rotate the While controlling the rotational speed, the substrate slit has been multi-row, are configured to wind the spool collectively.

According to the second aspect of the present invention, the spool for winding a multi-row slit substrate is arranged in a line at a wider interval than the slit interval of the substrate. Are arranged.

According to a third aspect of the present invention, the peripheral surface of each of the plurality of guide rollers has a concave shape.

According to a fourth aspect of the present invention, the detector for detecting the amount of slack of the base material provided in the slack space has a minimum length of slack of the base material. It comprises a first detector for detecting the amount and a second detector for detecting the maximum amount of slack of the substrate.

According to a fifth aspect of the present invention, there is provided an interleaf paper supply mechanism for supplying interleaf paper to a spool for winding a multi-row slit substrate. It has.

According to the invention as set forth in claim 6, the apparatus for winding a slit base material of the present invention is provided on a frame movable in a direction orthogonal to the direction of travel of the slit base material. Item 2 includes two sets of the winding devices in series in the moving direction of the gantry.

[0018]

Embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of a lead frame. FIG.
FIG. 3 is a process diagram showing an example of a lead frame manufacturing process. FIG. 3 is a plan view showing an example of processing a lead frame base material. FIG. 4 is an enlarged sectional perspective view of the lead frame base material shown in FIG. FIG. 5 is a side perspective view showing an example of a processing apparatus for slitting a lead frame base material in multiple rows.

(Manufacturing Process of Lead Frame) First, a lead frame for a semiconductor integrated circuit (IC) will be described. The lead frame is, as shown in FIG.
A plurality of inner leads b for bonding metal wires to a large number of terminal pads of the IC bonded to the die mount a, and connecting the inner leads b to the outside, and connected to the inner leads b. A plurality of outer leads c for connecting to wiring terminals of a printed circuit board, and an IC
A frame (not shown) for arranging and fixing the die mount a, the inner lead b, and the outer lead c at predetermined positions during assembly is provided.

The lead frame is made of a thin metal plate such as iron or iron alloy, or copper or copper alloy, or a strip material, and firstly, the base material is subjected to a photo-etching process.
Unnecessary parts are removed to form terminals such as die mounts, inner leads, and outer leads. Next, a mask is applied so that the end of the terminal is exposed, and gold, silver,
Alternatively, a lead metal film such as palladium is applied to the end of the terminal to form a lead frame. This lead frame usually has a plurality of lead frame elements 1 as shown in FIG.
-1 to 1-5 are formed in a strip shape arranged in series.

Next, an example of the manufacturing process of the lead frame using the band-shaped winding base material will be described more specifically. In manufacturing a lead frame, first, a photo-etching process is performed on a base material to form terminals such as a die mount a, an inner lead b, and an outer lead c. In the photo-etching process, as shown in FIG. 2, first, the base material is washed and dried (step S10), and then a photoresist is applied and dried (step S11). Next, on both sides of the base material, die mount, inner lead,
An exposure mask on which a terminal pattern such as an outer lead is formed is brought into close contact with the mask, and the terminal pattern is printed by irradiating ultraviolet rays (step S12). After that, develop the photoresist,
After drying (step S13), a resist film having a terminal pattern is formed on the base material.

Next, an unnecessary part other than the terminal pattern is dissolved by spraying an etching solution from both sides onto the base material on which the resist film of the terminal pattern is formed (Step S14). Next, after the resist film is stripped with a solvent, the base material on which terminals such as die mounts, inner leads, and outer leads are formed is washed (step S15).

FIG. 3 shows the state of the lead frame base material at this stage. In the manufacture of a lead frame using a long strip-shaped metal sheet substrate, terminals of a strip-shaped lead frame 1 formed by a plurality of lead frame elements 1-1 to 1-5 as shown in FIG. The pattern is imposed in multiple rows in the width direction of the base material, and it is repeatedly exposed and baked in the longitudinal direction of the base material at a constant period to form a lead frame base material 2 composed of connected multi-row lead frame strips. I do.

In FIG. 3, reference numeral 2 denotes a lead frame base material, and 2-1 to 2-2 represent lead frames formed in multiple rows (three rows in the figure) in the width direction of the lead frame base material. Indicates the article. Each of the lead frame strips 2-1 to 3 is formed by connecting a large number of unit lead frames in the longitudinal direction of the base material via the connecting portion 3. Further, each of the lead frame strips 2-1 to 3 is connected to each other in the width direction of the base material via the horizontal frame 4 to form the lead frame base material 2. It is preferable that the horizontal portion 4 is not directly connected to the unit lead frame constituting the lead frame strip, but is connected to the connecting portion 3 formed between the unit lead frames as shown in FIG. Also, on both side ends of the lead frame base material 2, the connecting strips 3 of the lead frame strip 2-1 or the lead frame strip 2-3 are connected to the margin strips 2a, 2b.
Are formed. Furthermore, each lead frame strip 2-
1, 2, 2-2, and 2-3 are connected in the longitudinal direction of the base material via connecting strips 4a or 4b, respectively.

FIG. 4 shows a detailed working example of the horizontal section 4 which connects the lead frame strips 2-1 to 2-3 and the blank strips 2a and 2b. In the drawing, 2-1 and 2-2 are lead frame strips, and 2a is a blank strip formed on a side end of the base material. As shown in FIG.
1 to 3 are connected to each other by connecting the connecting portion 3 via the connecting portion 4a or 4b and the connecting portion 3 via the connecting portion 4 connected in the longitudinal direction of the base material 2. Further, the lead frame strip 2-1 and the blank strip 2a are directly connected by the connecting portion 3 of the lead frame strip. The boundary between the margin strip 2a and the connecting portion 3,
A groove 5 formed by half-etching is formed at the boundary between the horizontal portion 4 connecting the lead frame strips and the connecting portion 3 of the lead frame strip, as shown in the figure. The groove 5 is formed such that the shear stress required to tear the groove is as small as possible without any trouble in handling the lead frame base material 2.

In the lead frame manufacturing process, the stress applied to the base material 2 during the mechanical transfer of the base material in the manufacturing process of the lead frame is a direct unit. It is provided to protect the extremely thin terminals constituting the unit lead frame without adding to the lead frame. Then, the connecting portion 3, the horizontal portion 4, and the marginal strips 2a and 2b are finally removed, and are shaped into the unit lead frame 1 shown in FIG.

Next, in step S16 shown in FIG. 2, the lead frame base material 2 replaces the multi-row lead frame strips with the single-row lead frame strips 2-1 and 2-2, respectively.
Separate into 2-3. This is because the subsequent plating process shown in steps S17 to S19 is a single-row process. This is because the plating process on the lead frame base material is performed by a die mount on which an IC is
Is limited to only the tip of the inner lead for bonding the ultrafine metal wire for connecting the terminal pad to the lead frame. In other words, a plating apparatus suitable for a variety of lead frames corresponding to the type of IC to be mounted is usually configured to process a single row of lead frame strips in order to correspond to terminal patterns of various shapes and dimensions. Because it is.

As shown in FIG. 2, the plating process on the lead frame base material includes a washing and drying process in step S17, a plating process in step S18, and a plating process in step S1.
9 cleaning and drying processes. Step S1
The plating process of No. 8 has been conventionally performed by various methods. For example, a plating die having a hole in a required portion of plating is brought into contact with a plating-processed surface of a lead frame base material, and a plating solution is sprayed into the hole of the plating die to form a portion on a required portion of the lead frame of the substrate. There is a method of plating. There is also a method in which a photoresist is applied or transferred to a lead frame base material on which terminals are formed, and then a plating pattern is exposed and baked by a photoengraving method, followed by development and plating on an exposed portion of the base material.

In steps S17 to S19,
After the plating process is performed on the single row of lead frame strips, in step S20, a cutting process is performed to remove unnecessary connection portions 3.
Are cut off and processed into the strip-shaped unit lead frame shown in FIG. 1 to complete the lead frame.

(Slit processing of base material) Next, in the above-described series of lead frame manufacturing steps, step S16 of cutting and separating a multi-row connected lead frame strip into a single row lead frame strip will be described in more detail. I do.
As shown in FIG. 3, multi-row lead frame strips 2-1 and 2
-2, 2-3, connecting part 3, horizontal part 4, margin 2
a, 2b, in order to separate the lead frame base material 2 into a single row of lead frame strips, in advance in the photo-etching process S10 to S15 in the previous process, the horizontal portion 4 of the lead frame base material 2 and each A groove is formed at the boundary with the lead frame by half etching. In this half-etching process, first, in step S12, when the terminal pattern of the lead frame is exposed to ultraviolet light and baked on a photoresist applied to both surfaces of the base material, a groove pattern to be formed by etching is formed on one of the exposure masks. An exposure mask which is formed and has no groove pattern is used as the other exposure mask.

Next, an exposure mask having a groove pattern and an exposure mask having no groove pattern are brought into close contact with both surfaces of the substrate, and are irradiated with ultraviolet rays to print the terminal pattern. Next, in step S13, the pattern is developed, and in step S14, an etching process is performed. Then, as shown in the enlarged sectional perspective view of FIG.
A groove 5 is formed by a half-etching process at a boundary between 1, 2, 2-3 and marginal strips 2a and 2b and a horizontal portion 4 connecting them. In the processing example shown in FIG.
Are fine sections at the boundary between the connecting portion 3 and the transverse portion 4 constituting the lead frame strips 2-1, 2-2, and 2-3, and blank strips formed on both side edges of the lead frame base material 2. 2a,
It is provided in a minute section at the boundary between 2b and the connecting portion 3.

The groove 5 is thinner than other portions of the lead frame base material 2 and can be easily torn with a small force. For example, when the lead frame base material 2 is copper and the thickness is 0.1 mm, if the depth of the groove is 0.05 mm or more, that is, if the remaining thickness of the groove is 0.05 mm or less, the groove is torn. Is less than 2N (Newton). Therefore, by tearing the groove 5, the margin strips 2a and 2b and the horizontal part 4 are separated from the lead frame base material, and thus, the lead frame strips connected in multiple rows can be easily separated into single row strips. Can be processed.

Next, a slit processing apparatus for separating the lead frame base material 2 shown in FIGS. 3 and 4 into a single row of lead frame strips will be described. FIG. 5 is a side perspective view showing an example of a lead frame base material slit processing apparatus. In the figure, reference numeral 10 denotes a slit processing device, and at the entrance side of the processing device 10, a substrate nip roller 11 for transporting the above-described lead frame substrate 2 at a constant speed, and the substrate nip roller A delivery drive source 21 for driving the motor 11 at a constant rotation speed is provided.
As the delivery drive source 21, for example, a synchronous motor with a reduction gear is used. On the other hand, on the outlet side of the slit processing device 10, a pulling nip roller 12a for pulling the lead frame strips 2-1 2-2, 2-3 separated into single rows is provided, and a constant tension is provided. Drive source 2 for pulling the lead frame strip while applying force
2a. As the traction drive source 22a, for example, a torque motor is used.

The slit processing apparatus 10 has a substrate nip roller 11 provided on the entrance side of the processing apparatus 10.
And a lead frame substrate 2 sent out from the substrate nip roller 11 at a substantially intermediate portion between the pulling nip roller 12a provided on the outlet side and a multi-row lead frame strip, a blank strip, and a space between the lead frame strip. A strip separation guide roller 18 for separating into a strip of a transverse portion connected in the longitudinal direction of the base material formed on the base member, and a traction pulling the blank strip separated by the strip separation guide roller 18 A nip roller 12b and a pulling nip roller 12c for pulling the strip of the horizontal portion separated by the strip separation guide roller 18 are provided.

The pulling nip rollers 12b and 12c are
Blank strips 2a, 2 separated from the lead frame base material 2
b, and the connected ridges 4a, 4b of the transverse portion are connected to traction drive sources 22b, 22c for traction while applying a constant tension, respectively. This traction drive source 22
For b and 22c, for example, a torque motor is used.
In addition, upstream of the strip separation guide roller 18, the lead frame base material 2 sent out from the base material nip roller 11 is provided.
Is provided on the base material guide roller 15 for guiding the sheet toward the strip separation guide roller 18. In addition, intermediate between the strip nip rollers 12b and 12c and the strip separation guide roller 18 for pulling the blank strips 2a and 2b separated from the lead frame base material 2 and the connected strips 4a and 4b, respectively. The separated blank strips 2a and 2b and the connected strips 4a and 4b are connected to the pulling nip roller
A strip guide roller 19 is provided for guiding toward b and 12c.

In the slitting apparatus, the strip separating guide roller 18, the pulling nip roller 12b for pulling the multi-row lead frame strip, the pulling nip roller 12b for pulling the blank strip, and the connected strips are pulled. The traction nip roller 12c and the like
Of the slit processing mechanism. That is, the lead frame substrate 2 supplied to the slitting device 10 by the substrate nip roller 11 is guided through the substrate guide roller 15 to the strip separation guide roller 18 composed of two rotating rollers. At the outlet of the strip separation guide roller 18 composed of two rotating rollers, the lead frame strips 2-1 2-2, 2-3 shown in FIGS. 3 and 4 are inclined obliquely upward toward the traction nip roller 12a. Towed. On the other hand, margin strips 2a and 2b formed on both side edges of the lead frame base 2 and the lead frame strips 2-1 and 2-2,
And connecting strips 4a, 2-2 and 2-3, respectively.
The strips of the horizontal portion 4 connected via the 4b are pulled downward toward the pulling nip rollers 12b and 12c, respectively.

At this time, the margin strips 2a and 2b formed on both side ends of the lead frame base material 2 inserted through the strip separation guide roller 18 constituted by two rotating rollers are connected to the lead frame strips 2-1 to 3-1. Is drawn in a direction different from the direction in which the base material 2 is pulled, so that the connecting portions 3 formed at regular intervals in the longitudinal direction of the base material 2 and the half-etching process formed at the boundaries between the margins 2a and 2b. The groove 5 is torn, and the blank strips 2a and 2b are separated from the lead frame substrate 2. Similarly, lead frame strip 2-
The connecting strips 4a and 4b for connecting the horizontal portions 4 formed between the strips 1 to 3 in the longitudinal direction of the base member are formed by the lead frame strip 2
-1 to 3 are pulled in a direction different from the direction in which the base material 2 is pulled, so that the connecting portion 3 formed at regular intervals in the longitudinal direction of the base material 2 and the horizontal portion 4 between the lead frame strips The groove 5 formed by the half-etching process is torn,
The connected strips are separated from the lead frame base material 2.

The blank strips 2a and 2b separated from the lead frame base material as described above, and the linked strip 4
a and 4b are discharged to the outside of the processing apparatus 10 by the pulling nip rollers 12b and 12c through the strip guide roller 19, respectively. On the other hand, the margin strips 2a, 2b and the connected horizontal strips 4a, 4b are separated, and the lead frame strips 2-1, 2-2, 2-2 are slit into a single row.
-3 is the processing device 10 by the traction nip roller 12a.
And wound up on a take-up spool or a take-up reel provided in a lead frame base material take-up device (not shown).

(Structure of Winding Apparatus) Next, the winding apparatus of the lead frame base material which is slit into a single row and processed into a multi-row lead frame strip and discharged by the slit processing apparatus will be described. This will be described in detail with reference to the drawings of the embodiment. FIG. 6 is an external perspective view showing a main part of the winding device. FIG. 7 is a block diagram illustrating a configuration example of a winding device. Further, FIG. 8 is a plan view showing the flow of the base material in the winding device shown in FIGS.

First, regarding the slit substrate winding device,
The configuration will be described. In FIG. 6, reference numeral 30 denotes a winding device. Reference numeral 20 denotes a transport roller for the lead frame base material discharged from the above-described slit processing device. The transport roller 20 is composed of two rollers that sandwich and transport the lead frame base material 2 that has been slit, one of which is covered with hard plastic, the other is covered with hard rubber, and is rotated by a drive source (not shown). Being driven.
The transport roller 20 is driven by a torque motor or the like so that the tension applied to the slit base material discharged from the slit processing device is constant. Therefore, the base material transport speed by the transport roller 20 is not constant. For example,
It varies between 0 and 3 m / min.

In the winding device 30 of this embodiment, the multi-row slit base material 2 conveyed by the conveying roller 20 is
Winding is performed in units of rows on a multi-row winding spool 32 that is inserted into a drive shaft 31 that is rotated and driven by a power source (not shown). In addition, upstream of the winding spool 32,
Each of the multi-slit substrates is wound on a take-up spool 3
A guide roller 33 that guides toward 2 is provided. The guide roller 33 is provided with the slit base material 2 wound by the winding spool 32 without using any power.
Are supported by a fixed shaft (not shown) via a bearing or the like so as to be easily rotated by running friction.

A slack space 34 is provided between the guide roller 33 and the conveying roller 20 so that the lead frame base material 2 slit in multiple rows can hang down by its own weight. This loose space 34
For example, when the distance between the guide roller 33 and the above-described transport roller 20 is 50 to 100 cm, a space in which the amount of sagging of the lead frame base material is about 100 to 150 cm is desirable.

Next, the configurations of the transport roller 20, the guide roller 33, and the take-up spool 32 will be described in more detail. FIG. 8 is a plan view showing the arrangement of the rollers and the like when the winding device is observed from above. As shown in the figure, a base material 2 slit in multiple rows by a slit processing device
Is transported at an interval t in parallel with the traveling direction of the substrate 2 until it reaches the transport roller 20. On the other hand, a multi-row winding spool 32 for winding the slit base material, and a guide roller 33 disposed upstream of the winding spool 32
Has an arrangement interval T larger than an arrangement interval t of the slit base materials 2 at the entrance of the transport roller 20.

The first reason is that the individual take-up spools 3 are arranged so that the end face of the wound slit base material does not inadvertently touch other objects to damage or deform the base material.
2. It is necessary to provide protective disk-shaped covers on both side edges of 2. Second, the winding spool has a sufficient width with respect to the width of the slit base so that the disc-shaped cover does not come into contact with the slit base during winding of the slit base on the winding spool. What you need. So, for example,
When the width of the slit base material (≦ interval t) is 50 mm, the arrangement interval T of the take-up spool is set to 75 mm in order to secure a margin of at least 20 mm between the disk-shaped cover of the take-up spool 32 and the width of the slit base material. It is desirable to make the above.

On the other hand, the slit substrate 2 is wound on the take-up spool 32.
Each guide roller 33 for guiding toward the
Has a function of smoothly guiding the slit base material 2 toward the center of the winding width of the winding spool 32 while eliminating the twist of the multi-row slit base material whose spacing is widened while being twisted at . Further, the guide roller 33
Are formed such that their peripheral surfaces are each formed in a concave shape, and when the slit base material 2 travels along the peripheral surface of the guide roller 33, only the end thereof comes into contact with the guide roller 33. Therefore, even if a large number of terminals having extremely fine dimensions are formed, and the terminal shape is easily deformed by a slight external force, the lead frame base material or the like runs on the peripheral surface of the guide roller 33. There is no abrasion on the substrate surface and no deformation of the terminals.

Next, the configuration of the control mechanism of the winding device of the present embodiment will be described. FIG. 7 is a block diagram illustrating a control mechanism of the winding device. As shown in FIG. 7, a power source 41 such as a motor is connected to the drive shaft 31 that rotationally drives the multi-row take-up spool 32 shown in FIG. on the other hand,
Two sets of detectors 42a-42b and 43a-43b for detecting the amount of slack of the slit base material hanging down by its own weight are provided in the slack space 34 of the slit base material 2 described above.

As the detector, for example, a photoelectric sensor is used, and as shown in FIG. 7, the detectors are arranged so that light beams from the light emitters 42a and 43a are received by the light receivers 42b and 43b, respectively. Here, the light emitter 42a and the light receiver 4
2b detects the minimum slack amount of the slit base material hanging down in the slack space 34,
The second detector composed of the light projector 43a and the light receiver 43b detects the maximum slack amount of the slit base material hanging down in the slack space 34. The substrate slack amount detection signal detected by the first detector and the second detector is transmitted to the controller 4
4 to control the rotation speed of the power source 41.

(Operation of Winding Apparatus) Next, the operation of each section of the winding apparatus 30 when winding the base material 2 slit in multiple rows on the winding spool 32 will be described. As shown in FIGS. 6 to 8, the base material 2 slit in multiple rows is first sandwiched between the transport rollers 20 and sent out to the slack space 34 at an interval t. The slit base material 2 sent to the slack space 34 hangs down by its own weight, and forms a loop between the transport roller 20 and the guide roller 33. A force other than the own weight of the slit base material itself does not act on the slit base material 2 that has formed a loop hanging down from the slack space 34, and an excessive force that causes deformation of the terminal formed on the base material is applied. Does not act on the slit base material. That is, in this state, no power is applied to the power source 41 that rotationally drives the drive shaft 31, and the slit base material is not taken up by the take-up spool 32.

Next, as shown by the solid line in FIG. 7, the loop of the slit base material in the slack space 34 is formed by the first detector 4.
When 2a-42b is blocked, the control device 44 starts the power source 41 at a low speed, and the winding spool 32 starts winding the slit base material via the drive shaft 31. At this time, the winding speed of the slit base material is lower than the average base material transfer speed of the transfer roller 20. In this state, when the transport roller 20 sends the slit base material to the slack space 34, the loop of the slit base material 2 in the slack space 34 gradually increases. Then, as shown by a broken line in FIG. 7, when the second detectors 43a-43b are shut off, the control device 44
And the speed of winding the slit base material by the winding spool is increased. The winding speed at this time is higher than the average base material transport speed of the transport roller 20.

When the above state is continued, the loop of the slit base material in the slack space 34 becomes small, the detection of the loop by the second detectors 43a-43b is canceled, and the control device 44 reduces the rotation speed of the power source 41. Then, a low-speed winding state is established again. As described above, in the steady operation state of the winding device of this embodiment, the slit speed is switched between the low speed and the high speed by the winding spool 32 depending on the detection state of the loop by the second detector 43a-43b. Wind up the substrate. On the other hand, the conveying roller 20 changes the conveying speed of the base material in accordance with the slit processing speed of the lead frame base material in the slit processing device in the previous process and the base material processing speed in the photo etching device in the previous process. In some cases, the transport speed may be extremely reduced.

For example, when the transport speed of the slit base material by the transport roller 20 is lower than the low take-up speed of the take-up spool 32, the loop of the slit base material in the slack space 34 becomes small, and the first detection is performed. The loop detection by the devices 42a-42b is eliminated. In that case, the control device 44
Stops the driving of the power source 41 and interrupts the winding of the slit base material by the winding spool 32. In this state, when the slit base material 2 is sent out to the slack space 34 by the transport roller 20 and a loop is detected again by the first detectors 42a to 42b, the control device 44 drives the power source 41. Then, the winding of the slit base material by the winding spool 32 is restarted.

As described above, in the winding device of the present embodiment, even if the feeding speed of the slit base material 2 by the transport roller 20 is greatly changed, the winding device provided in the slack space 34 is not required.
The set of detectors detects the slack amount of the slit base material formed in the slack space 34 and adjusts the winding speed by the winding spool in a plurality of stages, so that excessive tension is generated in the slit base material to be wound. A stable winding operation is performed without performing. It is desirable that the two sets of detectors detect the loop of the slit base material formed in the slack space 34 with hysteresis. For example, the photoelectric sensors of the respective detectors may be vertically moved at appropriate intervals. May be provided two by two, and the output signals of the two photoelectric sensors may be combined to generate a slack amount detection signal having a large hysteresis.

Next, another embodiment of the winding device of the present invention will be described. FIG. 9 is a side view showing another embodiment of the winding device. When winding a lead frame substrate on which a large number of ultra-fine terminals are formed and the terminal shape is easily deformed by a slight external force onto the take-up spool, the substrates are rubbed against each other. It is also important that the surface is not damaged and the terminal shape is not deformed. Therefore, in the winding device of the present embodiment, as illustrated in FIG. 9, when the slit base material is wound on the winding spool 32, a slip sheet supply mechanism 35 disposed near the winding spool 32. Then, the interleaf paper 36 was supplied, and the interleaf paper 36 was sandwiched between the slit base materials to be wound. This interleaf paper supply mechanism 35 is provided corresponding to each of the take-up spools 32. For example, if the width of the slit base material is 50 mm, the width of the interleaf paper 36 supplied is appropriately wider than about 60 mm. is there.

FIG. 10 is a plan view showing another example of the structure of the winding device. In the figure, reference numeral 37 denotes two sets of take-up spool groups 32a for taking up a base material slit in multiple rows.
32b is a mount for mounting the drive shaft 32b via the drive shafts 31a and 31b, respectively. A bearing 38 extends from substantially the center of the gantry 37. Two guide roller groups 33a, 33b are rotatable on both sides of the bearing 38 in opposition to the take-up spool groups 32a, 32b. It is bearing. The two guide roller groups 33a, 33b and 2
A mount 3 on which a set of take-up spool groups 32a and 32b are placed
7 is provided via wheels (not shown) provided on the bottom surface thereof.
It is placed on two rails 39 and can move in a direction perpendicular to the traveling direction of the base material 2 slit in multiple rows.

In the winding device having the above-described configuration, the winding spool group 32a and the guide roller group 33a constitute a first winding mechanism, and the winding spool group 32b and the guide roller group 3
3b constitutes a second winding mechanism, and the two sets of winding mechanisms are provided on the gantry 37 in series in the moving direction of the gantry. On the other hand, in FIG. 10, reference numeral 10 denotes a slit processing apparatus for slitting a lead frame base material in multiple rows, and a rear end portion of the base material 2 slit in multiple rows.
The conveyance roller 20 which feeds the paper toward the slack space 34 is provided.

When winding up the base material slit in multiple rows on the take-up spool using this take-up device, first, the first take-up spool 32a and guide roller group 33a The gantry 37 is moved so that the mechanism is located at the rear end of the slit processing apparatus 10, and is fixed at the position indicated by the solid line in FIG. In this state, the base material slit in multiple rows is wound around the winding spool group 32a of the first winding mechanism.
When the winding of the slit base material by the first winding mechanism is completed, the second winding mechanism including the winding spool group 32b and the guide roller group 33b is located at the rear end of the slit processing device 10. As described above, the gantry 37 is moved and fixed at the position indicated by the imaginary line in FIG. Next, the winding of the base material slit in multiple rows by the winding spool group 32b of the second winding mechanism is started.

During the winding of the slit base material by the second winding mechanism, the winding spool group 32a of the first winding mechanism is separated from the drive shaft 31a, and the already wound slit base material is removed. It is sequentially loaded into the substrate processing device of the next process in units of a take-up spool. Further, an empty take-up spool prepared in advance is mounted on the drive shaft 31a to prepare for the next take-up spool replacement operation. As described above, by using the winding device having the two sets of winding mechanisms shown in the present embodiment, the winding spool of the other winding mechanism is used while the slit base material is being wound by one winding mechanism. Since the replacement work can be performed, the winding work of the slit base material can be continued without stopping the processing equipment of the lead frame base material in the previous process. Can be improved.

[0058]

As described above in detail, the winding device of the present invention is a winding device for winding slit multi-row base materials onto a spool in row units. A plurality of spools removably inserted into one drive shaft, a power source for rotating and driving the drive shaft, and a plurality of slit rows of base materials arranged upstream of the plurality of spools. A plurality of rotatable guide rollers for guiding toward each spool, and disposed upstream of the plurality of guide rollers,
It is configured with a transport roller that sandwiches and transports the slit multi-row base material, and between the plurality of guide rollers and the transport roller, the slit multi-row base material can hang down by its own weight. A slack space is provided, and the slack space includes a detector for detecting a slack amount of the base material,
While controlling the number of rotations of the power source for rotating the spool by the base material slack amount detection signal of the detector, the slits of the multi-row base material are collectively wound on the spool, so that unnecessary tension is applied. Without applying, multiple rows of slit substrates can be smoothly wound on spools.Since the structure of the winding mechanism is simple, production cost is low, operability is good, reliability and A winding device having excellent durability can be configured.

According to the winding device of the present invention, the spool for winding the slit multi-row substrate is provided as follows.
Since the spools are arranged in a line at intervals wider than the slit interval of the base material, there are few dimensional restrictions in the width direction of the spool, and therefore, a spool having a size with a margin for the width of the slit base material. Can be used to smoothly wind the substrate. Further, since the spools are arranged in a line, the configuration of the drive mechanism for rotating the spool is simplified, so that the manufacturing cost of the winding device can be reduced and the reliability of the operation of the device increases.

In the winding device of the present invention, since the peripheral surfaces of the plurality of guide rollers are respectively concave, the substrate is supported by supporting the end of the slit substrate. Good quality and yield can be ensured without causing abrasion on the surface of the base material. Further, the transport direction of the slit base material can be smoothly displaced at a wider interval than the slit interval of the base material toward the winding direction of the spools arranged in a line.

According to a fourth aspect of the present invention, in the winding device, the detector for detecting the amount of slack of the base material provided in the slack space is configured to detect the minimum amount of slack of the base material. And the second detector that detects the maximum amount of slack in the base material, so that the number of rotations of the power source that rotates the spool in accordance with the amount of slack in the base material can be increased in multiple stages. It is possible to smoothly control the winding speed of the base material of the winding device even when the base material conveying speed of the device in the previous process such as the slit processing device is changed widely.

Since the winding device of the present invention is provided with an interleaf paper supply mechanism for supplying interleaf paper to a spool for winding a multi-row of slit substrates,
The interleaving paper can be superimposed on the slit base material and wound on a spool, and the base materials do not directly rub during winding, without causing scratches on the surface of the wound base material, There is no loss of substrate quality.

According to a sixth aspect of the present invention, the winding device according to the first aspect of the present invention is provided on a platform movable in a direction orthogonal to the direction of travel of the slit substrate. Since two sets of the take-up devices are provided in series in the moving direction of the gantry, the spool for winding the slit substrate can be smoothly and quickly exchanged by moving the gantry. The slits of the multi-rowed base material can be smoothly wound by using the spools of the two winding devices alternately without stopping the apparatus in the previous process such as the slitting apparatus for the material.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a lead frame.

FIG. 2 is a flowchart showing an example of a lead frame manufacturing process.

FIG. 3 is a plan view showing a processing example of a lead frame base material.

4 is an enlarged sectional perspective view of the lead frame base material shown in FIG.

FIG. 5 is a side view showing an example of a slit processing device.

FIG. 6 is an external perspective view showing a main part of the winding device.

FIG. 7 is a block diagram illustrating a configuration example of a winding device.

FIG. 8 is a plan view showing the flow of the base material of the winding device.

FIG. 9 is a side view showing another embodiment of the winding device.

FIG. 10 is a plan view showing another example of the configuration of the winding device.

[Explanation of symbols]

 2 Lead frame base material 10 Slit processing device 20 Conveyance roller 30 Winding device 31, 31a, 31b Drive shaft 32, 32a, 32b Winding spool 33, 33a, 33b Guide roller 34 Slack space 35 Interleaf paper supply mechanism 36 Interleaf paper 37 Moving frame 38 Bearing 39 Rail 41 Power source 42a, 42b First detector 43a, 43b Second detector 44 Controller

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI // H01L 23/50 H01L 23/50 Z

Claims (6)

[Claims] 1. A winding device for winding a multi-row slit base material on a spool in a row unit, comprising: a plurality of spools removably inserted into one drive shaft; A power source for driving, a plurality of rotatable guide rollers disposed upstream of the plurality of spools, and guiding a plurality of slit rows of substrates toward the respective spools in rows, and a plurality of rotatable guide rollers. It is arranged upstream, and comprises a transport roller for nipping and transporting the multi-row slit base material, and between the plurality of guide rollers and the transport roller, the multi-row slit substrate is self-weighted. A slack space that can hang down is provided, and the slack space includes a detector that detects a slack amount of the base material, and a power for rotating the spool by a base material slack amount detection signal of the detector. Controls source speed A winding device, wherein a plurality of slit rows of base material are wound together on a spool while controlling. 2. The winding device according to claim 1, wherein the spools for winding the multi-row slit base material are arranged in a line at intervals wider than the slit interval of the base material. . 3. The winding device according to claim 1, wherein each of the plurality of guide rollers has a concave surface. 4. A detector for detecting the amount of slack of the substrate provided in the slack space, wherein the first detector detects a minimum amount of slack of the substrate and a detector for detecting a maximum amount of slack of the substrate. And a second detector that performs the operation.
The winding device according to any one of the above. 5. The winding according to claim 1, further comprising an interleaving paper supply mechanism for supplying interleaving paper to a spool for winding the multi-row slit base material. Taking device. 6. A set of winding devices according to claim 1, which is movable in a direction perpendicular to the direction of travel of the slit substrate, and two sets of the winding device according to claim 1 connected in series in the moving direction of the platform. A winding device, comprising: