JP2017172008A - Partial plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a partial plating method capable of performing the partial plating of a band plate-shaped material to be plated with high accuracy and productivity.SOLUTION: In a partial plating method, a plurality of positioning holes 10a are formed so as to be arranged in a row on each of peripheral parts on both sides in the width direction of a band plate-shaped material to be plated 10, both ends in the width direction of the material to be plated are cut so that a distance between the positioning holes and each of the side surfaces of the material to be plated becomes a predetermined distance, the material to be plated is then brought into close contact with one surface of a mask member 102 formed by projecting a plurality of positioning pins 102b, fitted into the plurality of positioning holes of the material to be plated, from the one surface, whereby the positioning pins are fitted into the positioning holes of the material to be plated, a part facing a plurality of openings 102 formed in the mask member to be spaced apart from each other so that they are arranged in a row with spaced apart inwardly in the width direction by a predetermined distance from each row of the plurality of positioning pins of the mask member is plated, and the obtained plated material is cut and separated so as to be equidistant from side surfaces on both sides of the plated material.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a partial plating method, and more particularly, to a partial plating method for plating a predetermined portion on a long strip-like material to be plated.

  Conventionally, as a method for plating a predetermined portion of a long strip-shaped plate-like material used as a material for a terminal or the like, a mask member made of a substantially cylindrical non-conductive member that can rotate in the circumferential direction is used. While supplying a long strip-shaped plate-shaped material to the outer peripheral surface, the plating solution is supplied to the material to be plated through each of a plurality of openings formed in the mask member, and the mask member A method is known in which a current is passed between an anode disposed on the inner peripheral surface side of a metal plate and a material to be plated as a cathode, and a portion facing each opening of the mask member on the material to be plated is plated. Yes.

  As a mask member used in such a partial plating method, a plurality of positioning pins are arranged on the outer peripheral portion, and these positioning pins engage with the metal member to convey the metal member along the outer peripheral portion. Is known (see, for example, Patent Document 1). When a metal member is partially plated using such a drum jig, the metal member engages with a positioning pin of the drum jig and is transported, so that a predetermined position on the metal member can be plated with high accuracy. .

JP 2013-100593 (paragraph number 0030)

  However, in the partial plating method using a mask member such as a drum jig of Patent Document 1, partial plating is performed on one long strip-shaped plate-like material in one line by a reel-to-reel plating apparatus. Therefore, the productivity is not always sufficient, and it is desired to partially plate a long strip-like material to be plated with high productivity.

  Therefore, after partially plating a long strip-shaped plate-like material with a width of two in one line, cut in half along the longitudinal direction to produce two strip-shaped plating materials Can be considered.

  However, in the conventional partial plating method, a long strip-shaped plate-like material having a width of two lines is partially plated by a reel-to-reel plating apparatus, and then halved along the longitudinal direction. When cutting and producing two strip-shaped plating materials, the position accuracy of the partial plating film in the width direction on the plating materials may be deteriorated.

  Therefore, in view of such a conventional problem, an object of the present invention is to provide a partial plating method capable of performing partial plating with high accuracy and high productivity on a strip-like material to be plated.

  As a result of earnest research to solve the above-mentioned problems, the inventors of the present invention have arranged in a row at positions spaced in the width direction from the side surfaces of the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the strip-like material to be plated. A plurality of positioning holes penetrating from one surface of the material to be plated to the other surface are formed apart from each other, and these positioning holes and each side surface extending in the longitudinal direction of the material to be plated A part of the peripheral edge portion on both sides in the width direction of the material to be plated is cut along the longitudinal direction so that the distance between the two is in a predetermined distance, and fitted to the plurality of positioning holes of the material to be plated after the cutting. A plating material is brought into close contact with one surface of a mask member formed by projecting a plurality of positioning pins from one surface, and the positioning pins of the mask member are fitted into the positioning holes of the plating material, and a plurality of mask members That of positioning pins A plating solution is applied to the material to be plated through each of the plurality of openings formed in the mask member so as to be spaced apart inward in the width direction by a predetermined distance from each row and spaced from each other in the mask member. In addition to supplying, an electric current is passed between the electrode disposed on the other surface side of the mask member and the material to be plated to plate the portion facing the opening of the mask member on the material to be plated. The plating material is cut and separated so as to be equidistant from the side surfaces on both sides extending in the longitudinal direction of the plating material obtained in this way, so that the plate-like material to be plated is partially plated with high accuracy and high productivity. As a result, the present invention has been completed.

  That is, the partial plating method according to the present invention is arranged in a row so as to be arranged at a position spaced apart in the width direction from the respective side surfaces of the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the strip-plate-like material to be plated. A positioning hole forming step for forming a plurality of positioning holes penetrating from one surface of the plating material to the other surface, and a distance between these positioning holes and each side surface extending in the longitudinal direction of the material to be plated is A peripheral edge cutting step for cutting a part of the peripheral edge on both sides in the width direction of the material to be plated along the longitudinal direction so as to be a predetermined interval, and a plurality of positioning holes of the material to be plated after the cutting are respectively fitted. A plurality of positioning pins to be mated are projected from one surface of the mask member so that the material to be plated is brought into close contact with the mask member and the positioning pins of the mask member are fitted into the positioning holes of the material to be plated. A plurality of positioning pins are plated through each of a plurality of openings formed in the mask member so as to be spaced apart from each other by a predetermined distance inward in the width direction and arranged in a row. The plating solution is supplied to the material, and a current is passed between the electrode disposed on the other surface side of the mask member and the material to be plated, and the portion facing the opening of the mask member on the material to be plated is plated. And a separation step of cutting and separating the plating material so as to be equidistant from the side surfaces on both sides extending in the longitudinal direction of the partially plated plating material.

  In this partial plating method, it is preferable that the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. In this case, the mask member is rotatable in the circumferential direction, and the portion facing the opening of the mask member on the plating material is plated while the material to be plated is transported in close contact with the outer peripheral surface of the mask member. preferable. Moreover, it is preferable that an opening part is a substantially rectangular shape, and it is preferable that a mask member consists of a nonelectroconductive member. Moreover, it is preferable to perform the base plating process which forms a base plating layer in the whole surface of a to-be-plated material between a peripheral part cutting process and a partial plating process. Furthermore, you may form a peripheral part plating layer in the peripheral part of the width direction both sides of a to-be-plated material between a partial plating process and a isolation | separation process. Moreover, it is preferable that a part of peripheral edge part of the width direction both sides of a to-be-plated material is performed by press work.

  ADVANTAGE OF THE INVENTION According to this invention, the partial plating method which can perform partial plating with sufficient precision and high productivity to a strip-shaped to-be-plated material can be provided.

It is a top view which shows a part of elongate strip-shaped plating material manufactured by embodiment of the partial plating method by this invention. It is a figure which shows the side surface of the partial plating apparatus used for embodiment of the partial plating method by this invention. It is sectional drawing which cut | disconnects and shows the partial plating apparatus of FIG. 2 in a horizontal surface. It is an expanded sectional view which cut | disconnects and shows the partial plating apparatus of FIG. 2 by the IV-IV line.

  Hereinafter, with reference to an accompanying drawing, an embodiment of a partial plating method by the present invention is described in detail.

  FIG. 1 shows a part of a strip-shaped plated material (before separation into halves) manufactured by an embodiment of a partial plating method.

  As shown in FIG. 1, each side surface is arranged in a row at a position spaced apart from each side surface of the peripheral edge portion 12 on both sides in the width direction extending in the longitudinal direction of the long strip-like plate-like material 10. A plurality of positioning holes 10a having a predetermined shape (substantially cylindrical in the illustrated embodiment) penetrating from one surface of the material to be plated 10 to the other surface are arranged at predetermined intervals so as to be arranged in parallel with each other. (In the illustrated embodiment, they are spaced apart at substantially equal intervals). In addition, a plurality of substantially V-shaped notches spaced at predetermined intervals (substantially equal intervals in the illustrated embodiment) are provided on the side surfaces of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. Part 10b is formed. In addition, a Ni plating film is formed as a base plating layer 14 on the entire surface of the material to be plated 10. In addition, a central axis (indicated by a dotted line in FIG. 1) extending in the longitudinal direction of the material to be plated 10 (indicated by a dotted line) is formed at the center between the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. Au plating films are formed as a plurality of substantially rectangular partial plating layers 16 so as to be arranged in a row on both sides of the equidistant line) and spaced apart in the longitudinal direction of the material to be plated 10. . In addition, an Sn plating film is formed as a peripheral plating layer on the Ni plating film as the base plating film 14 on the peripheral edge parts 12 on both sides extending in the longitudinal direction of the material to be plated 10.

  Such a plating material can be manufactured by the embodiment of the partial plating method according to the present invention. In the embodiment of the partial plating method according to the present invention, the positioning hole forming step, the peripheral portion cutting step, the base plating step, the partial plating step, the peripheral portion plating step, and the separation step are performed in this order.

(Positioning hole forming process)
In this step, a long strip-shaped plate-like material (workpiece) 10 extending in the longitudinal direction and spaced from each side surface of the peripheral edge 12 on both sides in the width direction is arranged in a row and parallel to each side surface. A plurality of positioning holes 10a penetrating from one surface of the material to be plated to the other surface are formed so as to be spaced apart from each other. The positioning hole 10a can be formed by pressing the material to be plated 10 with a (sequential feed) mold.

(Rim cutting process)
In this step, part of the peripheral portions on both sides in the longitudinal direction of the material to be plated 10 so that the distance between the positioning hole 10a of the material to be plated 10 and each side surface extending in the longitudinal direction becomes a predetermined distance. (Both ends in the width direction) are cut along the longitudinal direction (about 0.5 to 1 mm in width). In addition, a plurality of substantially V-shaped pieces spaced apart at predetermined intervals (approximately equal intervals in the illustrated embodiment) on the side surfaces of the peripheral edge portions 12 on both sides in the width direction extending in the longitudinal direction of the material to be plated 10. A notch 10b is formed. The cutting of the both ends in the width direction of the material to be plated 10 and the formation of the notch portion 10b can be simultaneously performed by pressing the material to be plated 10 with a (sequential feed) mold. In addition, although the cutting | disconnection of the width direction peripheral part of a strip | belt board material is generally performed by the slitter, in order to cut | disconnect the width direction peripheral part of a long strip | belt-plate-shaped to-be-plated material accurately, (sequential feeding) It is preferable to carry out press working with a mold. The dimensional accuracy in the width direction of the material to be plated is required to be ± 30 μm or less (preferably ± 20 μm or less, more preferably ± 15 μm or less) (depending on the type of terminal or the like using the material to be plated). Since the processing accuracy of the slitter is about ± 50 μm or more, it is preferably performed by pressing with a die that can be cut with high accuracy (progressive feeding).

(Under plating process)
In this step, a Ni plating layer is formed as a base plating layer 14 on the entire surface (front and back) of the material 10 to be plated. The Ni plating film as the base plating layer 14 can be formed by performing Ni plating by electroplating.

(Partial plating process)
In this step, partial plating (spot plating) is performed using a partial plating apparatus as shown in FIGS. 2 is a view showing a side surface of a partial plating apparatus used in the embodiment of the partial plating method according to the present invention, FIG. 3 is a sectional view showing the partial plating apparatus of FIG. 2 cut along a horizontal plane, and FIG. It is an expanded sectional view which cut | disconnects and shows the partial plating apparatus of 3 by the IV-IV line. In FIG. 2, a support roll that changes the direction of the material to be plated is shown outside the mask member in order to make it easier to see the material to be plated before and after being arranged on the mask member.

  As shown in FIGS. 2 to 4, after the material to be plated 10 is disposed in close contact with one surface of the mask member 102 of the partial plating apparatus 100, through each of the plurality of openings 102 c of the mask member 102, While supplying a plating solution to the material to be plated 10, a current is passed between the electrode (anode) 104 disposed on the other surface side of the mask member 102 and the material to be plated 10 to mask the material on the material to be plated 10. A portion of each member 102 facing each opening 102c is plated.

  The mask member 102 includes a mask member main body (drum-type mask member main body) made of a substantially cylindrical non-conductive member (such as polyvinyl chloride (PVC) resin) that can rotate in the circumferential direction. On the outer peripheral surface (one surface), a concave portion 102a extending over the entire circumference is formed at a substantially central portion in the vertical direction as a material support portion to be plated, and the material to be plated 10 is disposed in close contact with the bottom surface of the concave portion 102a. It is like that. Each of the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the bottom surface of the concave portion 102a of the mask member 102 is arranged in a line at a predetermined interval (the same interval as the positioning hole 10a) in the circumferential direction. A plurality of positioning pins 102b having a predetermined shape (substantially cylindrical shape slightly smaller than the positioning hole 10a in the illustrated embodiment) protrudes, and the material to be plated 10 is formed on the outer peripheral surface (one surface) of the mask member 102. When placed in close contact with each other, the positioning holes 10a of the material to be plated 10 are sequentially fitted. In addition, the bottom surface of the recess 102a of the mask member 102 corresponds to a region (a central axis extending in the circumferential direction of the recess 102a of the mask member 102) spaced from the positioning pins 102b of each row by a predetermined distance inward in the width direction. A predetermined shape that is arranged in a row and spaced apart at predetermined intervals in the circumferential direction (substantially equal intervals in the illustrated embodiment). A plurality of openings 102 c (substantially rectangular in the illustrated embodiment) are formed through the mask member 102. Note that the positioning holes 10a of the material to be plated 10 that are fitted with the positioning pins 102b of the mask member 102 are accurately arranged at predetermined intervals from the side surfaces on both sides in the width direction of the material 10 to be plated. The portion 102c can also be formed with high accuracy by being spaced apart from the positioning pin 102b inward in the width direction at a predetermined interval.

  When the material to be plated 10 conveyed in the direction indicated by the arrow A in FIG. 3 is changed in direction by the rotatable inlet side support roll 108 and is brought into close contact with the outer peripheral surface of the mask member 102, the positioning holes 10a of the material to be plated 10 are positioned. Is fitted to the positioning pin 102b of the mask member 102 and rotated in the direction indicated by the arrow B, and then the direction is changed by the rotatable outlet side support roll 110 and conveyed in the direction indicated by the arrow A. It has become so.

  In this way, while the material to be plated 10 is disposed in close contact with the outer peripheral surface of the mask member 102, a pair of plating solution jet portions 106 disposed on the other surface (inner peripheral surface) side of the mask member 102. A plating solution is supplied from the slit 106 a to the material to be plated 10 through each opening 102 c in each row of the mask member 102, and an electrode (anode) disposed on the inner peripheral surface side of the mask member 102 When a current flows between 104 and the material to be plated 10 as the cathode, a partial plating layer 16 (such as an Au plating film) is formed on the portion of the mask member 102 on the material to be plated 10 facing each opening 102c. ) A plating film is formed.

  The plating solution jet portion 106 is made of a substantially semi-cylindrical non-conductive member (having a substantially fan-shaped cross section), and is a part of the inner peripheral surface of the mask member 102 (substantially half of the inner peripheral surface of the material support portion 12b to be plated). ). The pair of slits 106a of the plating solution jet 106 penetrates from the inner peripheral surface to the outer peripheral surface of the plating solution jet 106, and the plating solution is supplied from the inner peripheral surface side to the outer peripheral surface side by a plating solution supply unit (not shown). Can be supplied by being injected.

  The anode 104 is made of a conductive member having a fan-shaped cross section, and is attached to the upper and lower surfaces of the inner wall of each slit 106 a of the plating solution jet portion 106. In addition, the current flowing through the anode 104 attached to the inner wall of each slit 106a of the plating solution jet portion 106 is changed by a separate rectifier, thereby forming the mask member 102 through the openings 102c in each row. The thickness of the plating film (such as Au plating film) can be changed.

(Peripheral plating process)
In this step, an Sn plating film is formed on the peripheral portion 12 of the material to be plated 10 as the peripheral portion plating layer. The formation of the Sn plating film as the peripheral plating layer is performed by using a portion having a constant width (peripheral portion on one side surface) from one side surface (side surface disposed on the lower side) of the material to be plated 10 as the Sn plating solution. After immersing and forming an Sn plating film by electroplating, the material to be plated 10 is inverted and the other side surface is placed on the lower side, and a portion with a certain width from the other side surface (periphery of the other side surface side) Part) is immersed in an Sn plating solution, and an Sn plating film is formed by electroplating.
In addition, the formation of the base plating layer, the partial plating layer, and the peripheral plating layer described above can be performed in one line and one pass by a reel-to-reel plating apparatus.

(Separation process)
In this step, by using a slitter along a straight line (longitudinal central axis indicated by a dotted line in FIG. 1) extending in the longitudinal direction at an equal distance from the both side surfaces of the plated material with reference to both side surfaces of the plated material described above. Cut the plating material in half and separate. In addition, the positioning holes 10a of the material to be plated 10 to be fitted with the positioning pins 102b of the mask member 102 are accurately arranged from the side surfaces on both sides in the width direction of the material 10 to be plated, and the opening 102c of the mask member is also formed. Separated by separating the plating material in half along a straight line that is spaced from the positioning pin 102b inward in the width direction at a predetermined interval with high precision and extends from the both sides of the plated material at equal distances in the longitudinal direction. Therefore, partial plating can be accurately performed on each of the two separated plating materials.

  As described above, in the embodiment of the partial plating method according to the present invention, the positions of the plurality of positioning holes 10a formed at the peripheral edge portions on both sides in the width direction extending in the longitudinal direction of the long strip-like plate-like material 10. A plurality of positioning pins 102b of the mask member 102 that are cut along the longitudinal direction of a part of the peripheral edge on both sides in the width direction of the material to be plated 10 and fitted into the plurality of positioning holes 10a of the material 10 to be plated. With reference to the side surfaces on both sides extending in the longitudinal direction of the plating material 10 obtained by plating the portion facing the opening 102c of the mask member of the material to be plated 10 through the opening 102c formed on the basis of Since the plating material is cut and separated, a long strip-shaped plate-like material with a width of two pieces in one line is partially plated by a reel-to-reel plating device, and then along the longitudinal direction. Even if two strip plate-shaped plating materials are produced by cutting in half, the width of the two strip plate-shaped plating materials is one long strip-plate-shaped plated material. It is possible to obtain two strip plate-like plating materials with sufficient accuracy so as to be equal to the dimension in the width direction of the plating material obtained when partial plating is performed, and each of the two strip plate-like plating materials. In addition, the partial plating film can be formed with sufficient positional accuracy in the width direction.

  Hereinafter, examples of the partial plating method according to the present invention will be described in detail.

  First, a rolled sheet made of long strip-shaped Cu having a width of 54.0 mm (-0.1 mm to +0 mm) and a thickness of 0.2 mm was prepared.

  Next, by pressing using a progressive metal mold, each row is arranged in a row and in parallel with the side surface at a position separated from the side surface of one peripheral portion of the peripheral portion on both sides in the width direction extending in the longitudinal direction of the rolled sheet. As described above, a plurality of positioning holes having a diameter of 1.5 mm were punched at equal intervals in the longitudinal direction (interval between the centers of adjacent positioning holes) of 8 mm. In addition, the positioning hole of one peripheral part of the peripheral part of the width direction both sides extended in the longitudinal direction of a rolled sheet is formed so that each center may be spaced apart from the side surface of the peripheral part about 2.1 mm, and the other peripheral part The positioning holes were formed at positions spaced 49 mm from the centers of the positioning holes on one peripheral edge.

  Next, the longitudinal direction of the rolling plate is such that the distance between the center of each positioning hole of the rolled plate and each side surface extending in the longitudinal direction is 1.5 mm by pressing using the progressive die described above. By cutting a part of the peripheral edge on both sides in the width direction along the longitudinal direction, a strip-shaped rolled plate (primary press product) having a width of 52.0 mm (± 0.02 mm) is to be plated 10. Prepared as.

  Next, in a reel-to-reel continuous plating line, while carrying the material to be plated, as a pretreatment, it is alkali degreased, electrolytically degreased, washed with water, pickled with sulfuric acid, and then pickled on the material to be plated. The formation of the base plating layer, the partial plating layer, and the peripheral plating layer was performed in this order by one line and one pass.

In the formation of the base plating layer, by performing electroplating at a current density 9A / dm ^2, to form a Ni plating film as an underlying plated layer on the entire surface of the material to be plated.

In the formation of the partial plating layer (spot-like Au plating film), a partial plating apparatus similar to the partial plating apparatus 100 of FIGS. 2 to 4 is used as the mask member 102 (the length of the mask member in the circumferential direction). Each of the substantially rectangular openings 102c (with a size of 2.0 mm × width 2.5 mm in length) (the center in the width direction is 20 mm away from the side surface of each peripheral edge of the material to be plated 10). By using electroplating at a current density of 25 A / dm ² using mask members made of substantially cylindrical PVC formed apart from each other, each opening 102 c on one surface of the material to be plated 10 is opened. After the Au plating film is formed on the facing portion, a partial plating apparatus similar to the partial plating apparatus 100 of FIGS. 2 to 4 is arranged on the other surface side of the material to be plated 10, Each rectangular opening 102c (the center in the width direction is the side surface of each peripheral portion of the material to be plated 10) having a length of 1.0 mm in the circumferential direction of the material and a length of 2.0 mm in the width direction. The material to be plated is obtained by the same method as described above except that a mask member made of substantially cylindrical PVC formed at a distance of 15 mm from the substrate is used to obtain a current density of 20 A / dm ^2. An Au plating film was formed on a portion of each of the other surfaces facing the openings 102c.

In the formation of the peripheral plating layer, a portion having a width of 10 mm (peripheral peripheral portion on one side) from one side surface (side surface disposed on the lower side) of the material to be plated 10 is immersed in the Sn plating solution to obtain a current density. After forming the Sn plating film by performing electroplating at 12 A / dm ² , the material to be plated 10 is inverted and the other side surface is placed on the lower side, and the portion with the width of 10 mm from the other side surface (the other side) The Sn plating film was formed by immersing the side edge portion in the Sn plating solution and performing electroplating at a current density of 12 A / dm ² .

  Next, with respect to both side surfaces of the material to be plated 10, the material to be plated 10 was cut in half by a slitter along a straight line extending from the both side surfaces of the material to be plated 10 at an equal distance in the longitudinal direction.

  With respect to the two partial plating materials thus obtained, a film at the center of the Au plating film on both surfaces of the two partial plating materials is measured by a fluorescent X-ray film thickness meter (SFT-110A manufactured by Hitachi High-Tech Science Co., Ltd.). When the thickness was measured, the average value of the thickness of the Au plating film of one partial plating material was substantially the same as the average value of the thickness of the Au plating film of the other partial plating material. In addition, the width of the two partial plating materials is 26.0 mm (± 0.02 mm), and the two partial plating materials can be cut and separated with high accuracy, and the width direction of each of the two partial plating materials is It was possible to form the Au plating film with high accuracy.

DESCRIPTION OF SYMBOLS 10 To-be-plated material 10a Positioning hole 10b Notch 12 Peripheral part 14 Base plating layer 16 Partial plating layer 100 Partial plating apparatus 102 Mask member 102a Recessed part (to-be-plated material support part)
102b Positioning Pin 102c Opening 104 Anode 106 Plating Solution Jet 106a Slit 108 Inlet Side Support Roll 110 Outlet Side Support Roll

Claims (8)

One surface of the material to be plated is arranged in a row at a position spaced apart from each side surface of the peripheral edge on both sides in the width direction extending in the longitudinal direction of the strip-shaped material to be plated. Positioning hole forming step of forming a plurality of positioning holes penetrating up to each other and the distance between these positioning holes and each side surface extending in the longitudinal direction of the material to be plated is a predetermined distance A peripheral edge cutting step for cutting a part of the peripheral edge on both sides in the width direction of the material along the longitudinal direction, and a plurality of positioning pins that respectively fit with the plurality of positioning holes of the plated material after cutting The plating material is brought into close contact with one surface of the mask member formed so as to protrude from the mask member, and the positioning pin of the mask member is fitted into the positioning hole of the plating material, and the predetermined number of rows of the plurality of positioning pins of the mask member is set. A plating solution is supplied to the material to be plated through each of a plurality of openings formed in the mask member so as to be spaced apart inward in the width direction and arranged in a row, and the mask member. A partial plating step of plating a portion facing the opening of the mask member on the material to be plated by passing an electric current between the electrode disposed on the other surface side of the material and the material to be plated, A partial plating method comprising: a separation step of cutting and separating the plating material so as to be equidistant from the side surfaces on both sides extending in the longitudinal direction of the material. The partial plating method according to claim 1, wherein the mask member is a substantially cylindrical member, and one surface and the other surface of the mask member are an outer peripheral surface and an inner peripheral surface, respectively. The mask member is rotatable in the circumferential direction, and the portion facing the opening of the mask member on the plating material is plated while the material to be plated is transported in close contact with the outer peripheral surface of the mask member. The partial plating method according to claim 2, wherein: The partial plating method according to claim 1, wherein the opening is substantially rectangular. The partial plating method according to claim 1, wherein the mask member is made of a non-conductive member. 6. The base plating step of forming a base plating layer on the entire surface of the material to be plated is performed between the peripheral edge cutting step and the partial plating step. Partial plating method. The part according to any one of claims 1 to 6, wherein a peripheral plating layer is formed on a peripheral part on both sides in the width direction of the material to be plated between the partial plating process and the separation process. Plating method. The partial plating method according to any one of claims 1 to 7, wherein a part of the peripheral edge portion on both sides in the width direction of the material to be plated is cut by pressing.

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