JP2014192470A - Manufacturing method of shield case and electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a shield case and an electronic component module capable of affixing insulating tapes for many shield cases faster in comparison with a method of affixing the insulating tape to each shield case one by one.SOLUTION: A hoop-shaped metal material 7 is fed out, and primary pressing is performed on the metal material 7. In the primary pressing, a pilot hole 8 and a slit 9 are formed in the metal material 7. The slit 9 is provided while leaving a connection part 10 around a line that becomes a contour of a shield case. At positions to be a ceiling surface of the shield case, insulating tapes 6 are collectively affixed. Thereafter, plating is applied as needed, secondary pressing (bending and separation into individuals) is performed on the metal material 7, and the individual shield case is obtained.

Description

  The present invention relates to a method for manufacturing a shield case that covers a substrate on which an electronic component is mounted, and a method for manufacturing an electronic component module having a shield case.

  It is conventionally known to provide a shield case made of a metal material so as to cover an electronic component on a substrate on which the electronic component is mounted. The shield case serves to shield electromagnetic noise and protect electronic components. In Patent Document 1 below, in a box-shaped shield case (shield cap) without a flange, an insulator is provided on the inner surface of the shield case in order to prevent a short circuit between the shield case and the electronic component due to deformation caused by external stress. The formation of a layer (polyimide resin or epoxy resin) is disclosed. However, Patent Document 1 does not disclose a specific procedure for forming the insulator layer.

JP 2003-249789 A

  As a method for forming the insulating layer on each shield case, for example, a method of sequentially sticking insulating tapes one by one to the inner surface of each shield case manually or by a robot is conceivable. However, the work of attaching the insulating tape to the inner surface of the shield case having a dent at the height of the bent portion has a problem that the process time becomes long even with a robot, and it cannot be applied at a high speed.

  The present invention has been made in recognition of such a situation, and its purpose is to apply a large number of insulating tapes at a high speed as compared with a method in which an insulating tape is applied to each shield case one by one. An object of the present invention is to provide a shield case and an electronic component module manufacturing method that can be attached.

One embodiment of the present invention is a method for manufacturing a shield case. This method
A method of manufacturing a shield case that covers a board on which electronic components are mounted,
A tape application process for applying an insulating tape to a flat metal material;
A pressing step of processing the metal material to obtain a plurality of shield cases,
In the tape applying step, a plurality of insulating tapes having arbitrary shapes corresponding to the shield cases are attached to the metal material.

  In the tape sticking step, the insulating tape may be stuck so as not to extend to a position in the vicinity of the edge contacting the substrate on the inner side surface of each shield case.

  In the tape applying step, the insulating tape may be processed into an arbitrary shape and then applied to the metal material.

  In the tape applying step, the insulating tape may be applied to the metal material and then processed into an arbitrary shape.

  A plating process for plating the metal material may be included. Moreover, you may have a reflow process implemented after the said plating process.

  The tape applying step may be performed before the plating step.

  The pressing step includes a primary pressing step of punching the periphery of each shield case, leaving a part of the periphery, and a secondary pressing step of punching the remaining portion and bending it to an arbitrary shape. And the plating step may be performed before the secondary pressing step and after the primary pressing step. Moreover, you may implement a pre-plating process after a secondary press process.

  Another aspect of the present invention is a method for manufacturing an electronic component module, in which the shield case manufactured by the above method is attached to a substrate on which the electronic component is mounted.

  It should be noted that any combination of the above-described constituent elements and a representation obtained by converting the expression of the present invention between apparatuses and systems are also effective as an aspect of the present invention.

  According to the present invention, the shield case and the electronic component module capable of attaching a large number of insulating tapes at a high speed as compared with the method of attaching insulating tapes to individual shield cases one by one. A manufacturing method can be provided.

1 is an exemplary perspective view of an electronic component module 1 manufactured in an embodiment of the present invention. The perspective view which turned up and down the shield case 4 covered on the electronic component module 1 shown in FIG. Process explanatory drawing 1 of the 1st manufacturing method of the shield case 4 shown in FIG. FIG. The flowchart of the method. Process explanatory drawing of the 2nd manufacturing method of the shield case 4 shown in FIG. The flowchart of the method.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, process, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

  FIG. 1 is an exemplary perspective view of an electronic component module 1 manufactured in an embodiment of the present invention. FIG. 2 is a perspective view of the shield case 4 placed on the electronic component module 1 shown in FIG. An electronic component module 1 shown in FIG. 1 includes a substrate 3 on which an electronic component 2 such as a chip capacitor or a chip resistor is mounted, and a shield case 4 that is fixed so as to cover the electronic component 2. Terminals (not shown) are arranged on the back surface of the substrate 3. The substrate 3 is a multi-layer substrate and may incorporate an IC. The shield case 4 has a structure in which a metal plate such as white, copper, aluminum, iron, or the like is processed into a substantially rectangular parallelepiped shape (a box shape without a lid) with one surface opened. Irregularities are formed on the opening edge of the bent portion 4 a of the shield case 4. The shield case 4 has a role of shielding electromagnetic noise and protecting the electronic component 2. An insulating tape 6 is affixed almost entirely on the ceiling surface of the shield case 4 (the surface facing the electronic component 2). The insulating tape 6 is, for example, a polyimide tape, and the adhesive material is silicon or acrylic. The insulating tape 6 ensures insulation between the electronic component 2 and the shield case 4. The insulating tape 6 is not attached to the inner side surface (bending portion 4a) of the shield case 4.

  FIG. 3 is a process explanatory diagram 1 of the first manufacturing method of the shield case 4 shown in FIG. FIG. 4 is an explanatory diagram 2 of the process. FIG. 5 is a flowchart of the method.

  In this method, a roll-shaped insulating tape 6 (for example, polyimide tape) is supplied (S1 in FIG. 5), and then a substrate 11 (for example, a slightly adhesive separator such as PET or PP) to which the insulating tape 6 is temporarily attached is supplied. (S2 in FIG. 5). The base material 11 has adhesiveness weaker than the adhesive force of the insulating tape 6 on one side so that the temporarily attached insulating tape 6 can be easily attached to the metal material 7. As shown in FIG. 3A, the non-adhesive surface (surface without the adhesive layer) of the insulating tape 6 is attached to the adhesive surface of the substrate 11 (S3 in FIG. 5). Then, the insulating tape 6 is cut into an arbitrary shape (for example, a rectangle) from the adhesive surface side of the substrate 11 (S4 in FIG. 5), and unnecessary portions of the insulating tape 6 are peeled off as shown in FIG. S5 in FIG. In the cutting process, the die blade punches only the insulating tape 6 and leaves the base material 11 (half-cut so that only the insulating tape 6 is cut). Alternatively, the insulating tape 6 with a separator may be cut into an arbitrary shape so that only the insulating tape 6 is cut, and then attached to the substrate 11 to peel off unnecessary portions of the insulating tape 6. A pilot hole is formed in the base material 11 in accordance with an arbitrary shape of the insulating tape 6.

  On the other hand, as shown in FIG. 4A, for example, the metal material 7 wound in a hoop shape (roll shape) is fed to a processing machine (pressing machine) (not shown), and the metal material 7 is subjected to primary press processing (punching processing). )I do. In the primary press working, pilot holes 8 (guide holes) and slits 9 are formed in the metal material 7 as shown in FIG. The pilot hole 8 is used for alignment when the insulating tape 6 is attached. The slit 9 is provided leaving the connection portion 10 around the line that is the outline of the shield case 4 shown in FIG. In the example of FIG. 4B, four slits 9 are provided for one outline, and the connecting portions 10 exist between the adjacent slits 9 (four places). The shape of the metal material 7 at the end of the primary press working is a flat plate shape without the bent portion 4a (FIG. 2) so that the insulating tape 6 can be easily attached.

After that, as shown in FIG. 3C, the metal material 7 that has undergone primary press processing is supplied onto the base material 11 from which unnecessary portions of the insulating tape 6 have been removed (S6 in FIG. 5). Then, the metal material 7 and the base material 11 are bonded to each other with the insulating tape 6 interposed therebetween, and the base material 11 is peeled off, so that the ceiling of the shield case 4 is obtained as shown in FIGS. 3 (D) and 4 (C). The insulating tape 6 is pasted to each of the positions (the center of the region surrounded by the four slits 9) in a lump or continuously by roll feeding (S7 in FIG. 5). The alignment of the metal material 7 and the base material 11 is performed using pilot holes 8 of the metal material 7 and pilot holes (guide holes) (not shown) of the base material 11. Thereafter, the metal material 7 is washed (S8 in FIG. 5), and the metal material 7 is plated (S9 in FIG. 5).
The cleaning process may be performed in the plating process.

  In the plating process, a series of treatment processes such as degreasing, activation, undercoat Ni plating, activation, electrotin plating, and discoloration prevention are continuously performed, and then reflow treatment is performed inline or outline, thereby improving the quality of electrotin plating. To improve the uniformity. In the reflow process, the electrotin plating is rapidly reflowed at, for example, 270 to 450 ° C. (conditions can be changed depending on the material shape and plate thickness), and the electrotin plating with a stable and glossy appearance is efficiently produced. In addition, since the discoloration preventing agent is used for the surface treatment of electrotin plating, yellow discoloration (oxidation) of the reflow tin plating surface can be prevented even if a thermal shock is applied. The plating process may be hot-dip plating or electroless plating, and the plating material may be Ni, Cu, Pd, Au, Ag, etc. in addition to Sn (tin).

  Finally, secondary press processing (bending and separation into individual products) is performed on the plated metal material 7 (S10 in FIG. 5) to obtain individual shield cases 4 (FIG. 2). You may wash | clean as needed after a secondary press process. The shield case 4 is attached to the substrate 3 (FIG. 1) by, for example, reflow soldering.

  FIG. 6 is a process explanatory diagram of the second manufacturing method of the shield case 4 shown in FIG. FIG. 7 is a flowchart of the method. Compared with the first method described above with reference to FIGS. 3 to 5, this method has a pilot hole 8 (guide hole) formed in advance while a slit 9 is not formed. 7 is supplied onto the base material 11 from which unnecessary portions of the insulating tape 6 are removed (S6 ′ in FIG. 7), and the insulating tape 6 is affixed to the metal material 7 without the slit 9, as shown in FIG. 6B. And the point that individual shield cases 4 (FIG. 2) are obtained from the metal material 7 without the slit 9 by press working after the plating process (S10 ′ in FIG. 7) by bending and bending. Match in terms of. In addition, you may implement the primary press work (punching process) which forms the slit 9 after affixing the insulating tape 6 to the metal material 7 and before a washing | cleaning and plating process. In this case, the opening edge of the shield case 4 can be plated. After pressing, you may wash | clean as needed.

  According to the present embodiment, the following effects can be achieved.

(1) Since a large number of insulating tapes 6 are attached to the flat metal material 7 all at once or continuously by roll feed, the insulating tapes 6 are individually attached to the individual shield cases 4 by hand or by robot. Compared with the method of affixing, many insulating tapes 6 can be affixed at high speed.

(2) Since the insulating tape 6 is applied before the plating process, that is, there is no tin plating on the tape application surface, even if the temperature reaches the temperature at which the tin plating melts in the subsequent reflow process, the tape application surface is affected. The insulation tape 6 is unlikely to peel off or peel off. Further, since the periphery of the insulating tape 6 is increased by the thickness of the tin plating, the insulating tape 6 is not easily peeled off by hooking.

(3) By changing the shape of the mold that cuts the insulating tape 6, it is possible to affix the insulating tape 6 in a different shape (for example, trapezoid or triangle) to the shield case 4, and avoiding over specific electronic parts. This can also be handled (when the insulating tape 6 is not attached to any part of the ceiling surface).

(4) Since the insulating tape 6 does not extend to the opening edge of the shield case 4 and the inner side surface in the vicinity thereof, when the shield case 4 and the substrate 3 are fixed (fixed) to each other by reflow soldering, the insulating tape 6 However, the formation of a solder fillet between the shield case 4 and the substrate 3 is not hindered, and high strength soldering is possible. In particular, in this embodiment, a solder fillet can be formed on the entire inner periphery of the shield case 4, and the shield case 4 and the substrate 3 can be strongly soldered.

(5) Compared with the case where the insulating tape 6 is affixed to the electronic component 2 of the substrate 3, the variation in the affixing position is small and a large bonding area can be secured.

(6) If the insulating tape 6 having a width larger than the necessary width is prepared, the necessary portion can be attached to the metal material 7 at a high speed while peeling the unnecessary portions. On the other hand, if the insulating tape 6 having a width that matches the required width is prepared, unnecessary portions can be minimized and the tape cost can be saved.

  The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

  The insulating tape 6 may be attached to the metal material 7 and then cut (half cut) according to the shape of each shield case 4 to remove unnecessary portions. The insulating tape 6 may be affixed after tin plating, as long as the wrinkles are not a problem. The insulating tape 6 may extend on the inner surface of the shield case 4. In this case, the insulating tape 6 does not interfere with the formation of a solder fillet between the shield case 4 and the substrate 3 (for example, less than half the height of the shield case 4 or 1 or less). It is preferable that it does not extend to a region of / 3 or less. The opening edge of the shield case 4 may have a linear shape without unevenness. The metal material 7 is not limited to a hoop shape, and may be a rectangular sheet or a strip.

DESCRIPTION OF SYMBOLS 1 Electronic component module, 2 Electronic components, 3 Substrate, 4 Shield case, 4a Bending part, 6 Insulating tape, 7 Metal material, 8 Pilot hole, 9 Slit, 10 Connection part, 11 Base material

Claims (9)

A method of manufacturing a shield case that covers a board on which electronic components are mounted,
A tape application process for applying an insulating tape to a flat metal material;
A pressing step of processing the metal material to obtain a plurality of shield cases,
The said tape sticking process is a manufacturing method of a shield case which sticks the some insulating tape of arbitrary shapes corresponding to each shield case to the said metal material.   The said tape sticking process is a manufacturing method of the shield case of Claim 1 which affixes the said insulating tape so that it may not extend to the position used as the vicinity of the edge which contacts a board | substrate among the inner surfaces of each shield case.   The said tape sticking process is a manufacturing method of the shield case of Claim 1 or 2 which affixes on the said metal material after processing an insulating tape in arbitrary shapes.   The said tape sticking process is a manufacturing method of the shield case of Claim 1 or 2 which processes an arbitrary shape after affixing an insulating tape on the said metal material.   The manufacturing method of the shield case as described in any one of Claim 1 to 4 which has a plating process which plates the said metal material.   The manufacturing method of the shield case of Claim 5 which has the reflow process implemented after the said plating process.   The method for manufacturing a shield case according to claim 5, wherein the tape attaching step is performed before the plating step.   The pressing step includes a primary pressing step of punching the periphery of each shield case, leaving a part of the periphery, and a secondary pressing step of punching the remaining portion and bending it to an arbitrary shape. The method for manufacturing a shield case according to claim 5, wherein the plating step is performed before the secondary pressing step and after the primary pressing step.   The manufacturing method of an electronic component module which covers and attaches the shield case manufactured by the method as described in any one of Claims 1-8 on the board | substrate which mounted the electronic component.

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