TWI768682B - Metal circuit pattern and method of producing metal circuit pettern - Google Patents
Metal circuit pattern and method of producing metal circuit pettern Download PDFInfo
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- TWI768682B TWI768682B TW110102755A TW110102755A TWI768682B TW I768682 B TWI768682 B TW I768682B TW 110102755 A TW110102755 A TW 110102755A TW 110102755 A TW110102755 A TW 110102755A TW I768682 B TWI768682 B TW I768682B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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Abstract
本發明之課題,在於提供可有效率地製造電路基板的技術。本發明之金屬電路圖案係於絕緣基板上接合有要形成電路圖案之金屬板之電路基板製造用的金屬電路圖案;其具備有:要形成電路圖案之各自獨立的複數個金屬單片;及在保持有電路圖案之狀態下可供複數個金屬單片黏貼的載帶;且複數個金屬單片之至少任一側面具有破斷面及剪斷面,並進一步具有與剪斷面之剪斷傷痕不同的摩擦痕。The subject of this invention is to provide the technique which can manufacture a circuit board efficiently. The metal circuit pattern of the present invention is a metal circuit pattern for the manufacture of a circuit substrate in which a metal plate to form a circuit pattern is bonded to an insulating substrate; it is provided with: a plurality of independent metal sheets for forming the circuit pattern; and A carrier tape that can be pasted with a plurality of metal monoliths while maintaining a circuit pattern; and at least any side of the plurality of metal monoliths has a fracture surface and a shear surface, and further has a shear scar with the shear surface. Different friction marks.
Description
本發明係關於金屬電路圖案及金屬電路圖案之製造方法。The present invention relates to a metal circuit pattern and a method for manufacturing the metal circuit pattern.
作為電源模組用基板,於絕緣基板上接合有要形成電路圖案之金屬板的電路基板被廣泛地使用。例如,於專利文獻1提案有在氧化鋁板之上接合有銅板的陶瓷電路基板。又,作為絕緣基板,亦存在使用包含樹脂材料及導熱性填料之高散熱樹脂基板的情形。 [先前技術文獻] [專利文獻] As a board|substrate for a power supply module, the circuit board which joined the metal plate to form a circuit pattern to an insulating board|substrate is widely used. For example, Patent Document 1 proposes a ceramic circuit board in which a copper plate is bonded to an alumina plate. Moreover, as an insulating substrate, there is a case where a high heat dissipation resin substrate containing a resin material and a thermal conductive filler is used. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本專利特開平3-145748號公報[Patent Document 1] Japanese Patent Laid-Open No. 3-145748
(發明所欲解決之問題)(The problem that the invention intends to solve)
本發明之目的,係提供可有效率地製造電路基板的技術。 (解決問題之技術手段) The objective of this invention is to provide the technique which can manufacture a circuit board efficiently. (Technical means to solve problems)
根據本發明一態樣,提供一種金屬電路圖案,係於絕緣基板上接合有要形成電路圖案之金屬板之電路基板製造用的金屬電路圖案;其具備有:要形成上述電路圖案之各自獨立的複數個金屬單片;及在保持有上述電路圖案之狀態下可供上述複數個金屬單片黏貼的載帶;且上述複數個金屬單片之至少任一側面具有破斷面及剪斷面,並進一步具有與上述剪斷面之剪斷傷痕不同的摩擦痕。According to one aspect of the present invention, there is provided a metal circuit pattern, which is a metal circuit pattern for manufacturing a circuit substrate in which a metal plate for forming a circuit pattern is bonded to an insulating substrate; A plurality of metal monoliths; and a carrier tape that can be pasted with the plurality of metal monoliths while maintaining the above-mentioned circuit pattern; and at least any side surface of the plurality of metal monoliths has a broken surface and a shearing surface, Furthermore, it has friction marks different from the shearing marks on the above-mentioned shearing surface.
根據本發明另一態樣,提供一種金屬電路圖案之製造方法,於包含樹脂材料及導熱性填料之高散熱樹脂基板上接合有金屬板之電路基板製造用之金屬電路圖案之製造方法;其具備有:對金屬原料板進行沖裁而形成各自獨立之複數個金屬單片的沖壓步驟;及將載帶黏貼於上述複數個金屬單片的黏貼步驟;在上述沖壓步驟中,藉由將已沖裁出之上述複數個金屬單片推回上述金屬原料板的沖裁孔,而在上述複數個金屬單片的側面形成摩擦痕;在上述黏貼步驟中,從上述金屬原料板的上述沖裁孔將上述複數個金屬單片加以拆卸,並在保持有上述複數個金屬單片之電路圖案的狀態下黏貼上述載帶。 (對照先前技術之功效) According to another aspect of the present invention, there is provided a method for manufacturing a metal circuit pattern, comprising: a method for manufacturing a metal circuit pattern for manufacturing a circuit substrate in which a metal plate is bonded to a highly heat-dissipating resin substrate comprising a resin material and a thermally conductive filler; There are: a punching step of punching a metal raw material plate to form a plurality of independent metal single sheets; and a sticking step of pasting the carrier tape on the above-mentioned plurality of metal single sheets; in the above-mentioned punching step, by punching The plurality of metal single pieces cut out are pushed back to the punching holes of the metal raw material plate, and friction marks are formed on the side surfaces of the plurality of metal single pieces; The plurality of metal single pieces are disassembled, and the carrier tape is pasted in a state where the circuit patterns of the plurality of metal single pieces are retained. (Compared to the efficacy of the prior art)
根據本發明,可有效率地製造電路基板。According to the present invention, a circuit board can be efficiently manufactured.
[本發明之實施形態的說明] <本發明人所得到的研究結果> 首先,對本發明人等所得到的研究結果進行說明。 [Description of Embodiments of the Present Invention] <Results of research obtained by the inventors> First, the research results obtained by the present inventors will be described.
作為用於電路基板的金屬板,就散熱性與導電性的觀點而言,例如銅板被廣泛地使用。又,作為用於電路基板的絕緣基板,被使用陶瓷基板或高散熱樹脂基板。作為將銅板接合於陶瓷基板上的方法,已知有例如直接接合法與活性金屬法。直接接合法例如有如下之方法:將銅板接觸配置於陶瓷基板上並進行加熱,生成Cu-O等之共晶液相,其次,藉由將該共晶液相冷卻固化,而將陶瓷基板與銅板直接接合。另一方面,活性金屬法例如有如下之方法:經由含有Ti等之活性金屬的焊接填料金屬層將陶瓷基板與銅板接合。As a metal plate used for a circuit board, from the viewpoint of heat dissipation and electrical conductivity, for example, a copper plate is widely used. Moreover, as an insulating substrate used for a circuit board, a ceramic substrate or a high heat dissipation resin substrate is used. As a method of bonding a copper plate to a ceramic substrate, for example, a direct bonding method and an active metal method are known. The direct bonding method includes, for example, a method in which a copper plate is placed in contact with a ceramic substrate and heated to generate a eutectic liquid phase such as Cu-O, and then the eutectic liquid phase is cooled and solidified, so that the ceramic substrate and the eutectic liquid phase are cooled and solidified. Copper plates are directly bonded. On the other hand, the active metal method includes, for example, a method in which a ceramic substrate and a copper plate are joined via a solder filler metal layer containing an active metal such as Ti.
又,作為電路基板之電路圖案的形成方法,例如已知有預先利用沖壓加工對銅板進行沖裁來形成電路圖案的方法、與在將銅板全面接合後利用蝕刻來形成電路圖案的方法等。Moreover, as a method of forming a circuit pattern of a circuit board, for example, a method of forming a circuit pattern by punching a copper plate by pressing in advance, and a method of forming a circuit pattern by etching after the entire surface of the copper plate are joined are known.
近年來,使用電路基板之半導體元件的高輸出化持續發展,電路基板被要求更高的散熱性。因此,作為用於電路基板的銅板,較佳為具有例如0.5mm以上的厚度。In recent years, the increase in output of semiconductor elements using circuit boards has continued, and higher heat dissipation properties of the circuit boards have been required. Therefore, as a copper plate used for a circuit board, it is preferable to have a thickness of 0.5 mm or more, for example.
在銅板具有0.5mm以上之厚度的情形時,難以藉由蝕刻來形成電路圖案。另一方面,在預先利用沖壓加工來形成電路圖案的情形時,難以進行沖裁後之獨立之金屬單片的操控(handling)。具體而言,例如,難以進行當要將金屬電路圖案接合於絕緣基板上時的定位。又,在預先利用沖壓加工來形成電路圖案的情形時,存在有會發生毛邊的問題。When the copper plate has a thickness of 0.5 mm or more, it is difficult to form a circuit pattern by etching. On the other hand, when the circuit pattern is formed by punching in advance, it is difficult to handle the individual metal pieces after punching. Specifically, for example, it is difficult to perform positioning when bonding a metal circuit pattern to an insulating substrate. Moreover, when forming a circuit pattern by a press process in advance, there exists a problem that a burr may generate|occur|produce.
本案發明人等對如上述般的現象進行深入研究。其結果,發現藉由在沖壓步驟中採用回推(push back)法,並在保持有電路圖案之狀態下將金屬單片黏貼於載帶,可使獨立之金屬單片的操控變容易,而有效率地製造電路基板。又,其發現可抑制毛邊的發生。The inventors of the present application have intensively studied the above-mentioned phenomenon. As a result, it was found that by adopting the push back method in the stamping step and sticking the metal single piece to the carrier tape while maintaining the circuit pattern, the handling of the independent metal single piece can be made easier, and Efficiently manufacture circuit boards. In addition, it was found that the occurrence of burrs can be suppressed.
本發明係根據本發明人等發現的上述研究結果所完成者。 [本發明之實施形態的細節] The present invention has been completed based on the above-mentioned research results found by the present inventors. [Details of Embodiments of the Present Invention]
其次,以下一邊參照附圖,一邊對本發明一實施形態進行說明。再者,本發明並非被限定於該等例示者,其為由申請專利範圍所揭示,包含所有在與申請專利範圍同等之意思及範圍內的變更。Next, an embodiment of the present invention will be described below with reference to the accompanying drawings. It should be noted that the present invention is not limited to these examples, but is disclosed by the scope of the patent application, and includes all modifications within the meaning and scope equivalent to the scope of the patent application.
<本發明的第1實施形態>
(1)金屬電路圖案的構成
本實施形態之金屬電路圖案10係被使用於電源模組之電路基板之構成元件的一部分。藉由將本實施形態的金屬電路圖案10接合於絕緣基板,可製造電路基板。作為絕緣基板,可使用例如由氧化鋁或氮化鋁所構成的陶瓷基板、或包含樹脂材料及導熱性填料的高散熱樹脂基板。再者,在本說明書中,所謂高散熱樹脂基板不僅為剛性(硬質)基板,亦包含撓性基板、或一般被稱為散熱絕緣片材、散熱潤滑油、散熱帶、及散熱黏著劑者。以下,對本實施形態之金屬電路圖案10的構成進行說明。
<The first embodiment of the present invention>
(1) Composition of metal circuit pattern
The
圖1A係本實施形態之金屬電路圖案10的俯視圖。圖1B係本實施形態之金屬電路圖案10的側視圖。圖1C係金屬單片12之側面的放大圖。如圖1A及圖1B所示,本實施形態之金屬電路圖案10具有載帶11及複數個金屬單片12。FIG. 1A is a plan view of the
載帶11被構成為,在保持有電路圖案之狀態下可供複數個金屬單片12黏貼。作為如此之載帶11,例如可使用將合成樹脂系的黏著劑塗佈於PET(聚對苯二甲酸乙二醇酯)、聚酯、聚丙烯等之塑膠薄膜而成的帶。The
複數個金屬單片12各自獨立地被黏貼於載帶11上,而形成電路圖案。作為複數個金屬單片12的材質,可例示例如銅或銅合金。複數個金屬單片12的厚度,較佳例如係0.5mm以上且4.0mm以下。在複數個金屬單片12的厚度未滿0.5mm時,存在有無法得到電源模組用基板所要求量之充分之散熱性的可能性。相對於此,藉由將複數個金屬單片12的厚度設為0.5mm以上,可得到電源模組用基板所要求量之充分的散熱性。另一方面,若複數個金屬單片12的厚度超過4.0mm,生產性便會變差。相對於此,藉由將複數個金屬單片12的厚度設為4.0mm以下,可使生產性提升。再者,若考慮散熱性與生產性的平衡,複數個金屬單片12的厚度更佳係0.7mm以上且3.0mm以下。A plurality of metal
本實施形態之金屬電路圖案10由於電路圖案由載帶11所保持,因此可容易地進行複數個金屬單片12的操控。具體而言,例如可容易地進行當要將金屬電路圖案10接合於絕緣基板時的定位。藉此,可有效率地製造電路基板。In the
又,如圖1B所示,複數個金屬單片12之側面具有摩擦痕13。再者,於本說明書中,所謂「摩擦痕」,例如意指金屬彼此摩擦而形成的痕跡。摩擦痕13例如沿著複數個金屬單片12的厚度方向延伸,且於既定的位置中斷。再者,並非複數個金屬單片12的所有側面皆一定有具有摩擦痕13的必要,亦可存在不具有摩擦痕13的側面。複數個金屬單片12之至少任一側面具有摩擦痕13,而在金屬電路圖案10所具有的複數個金屬單片12中,較佳係超過50%之金屬單片12的側面具有摩擦痕13,更佳係超過70%之金屬單片12的側面具有摩擦痕13,而進一步更佳係超過90%之金屬單片12的側面具有摩擦痕13。Moreover, as shown in FIG. 1B , the side surfaces of the plurality of metal
此處,於一般的電源模組中,將半導體元件焊接於電路基板上,並在以焊線連接金屬電路圖案及半導體元件、與外部端子後,為了絕緣性的確保,例如利用矽膠等之樹脂(以下,稱為密封樹脂)來密封。如此之電源模組亦被稱為盒體模組(case module)。在將本實施形態的金屬電路圖案10用於上述般之盒體模組的情形時,由於複數個金屬單片12的側面具有摩擦痕13,因此可使電路基板與密封樹脂的密合性提升。藉此,例如當振動被施加於盒體模組時,可抑制電路基板的振動。作為結果,可抑制焊線的斷裂等,而使半導體元件的信賴性提升。Here, in a general power supply module, the semiconductor element is soldered on the circuit board, and after the metal circuit pattern, the semiconductor element, and the external terminal are connected by bonding wires, in order to ensure the insulation, for example, a resin such as silicone is used. (hereinafter, referred to as sealing resin) to seal. Such a power module is also called a case module. When the
又,在將本實施形態之金屬電路圖案10用於上述般之盒體模組的情形時,由於複數個金屬單片12的側面具有摩擦痕13,因此複數個金屬單片12之側面的焊錫濕潤性會變小。藉此,例如當要將半導體元件焊接於電路基板上時,可降低剩餘的焊料溢出而流出的危險。In addition, when the
本實施形態之金屬電路圖案10如圖1B所示般,複數個金屬單片12之接近摩擦痕13側的主面14被黏貼於載帶11。另一方面,複數個金屬單片12之離摩擦痕13較遠側的主面15露出。又,如圖1C所示,離摩擦痕13較遠側的主面15,係周邊部具有平滑之R(圓弧)形狀之所謂的模輥面。離摩擦痕13較遠側之主面15之周緣部的最大高度Rz
2,較接近摩擦痕13側之主面14之周緣部的最大高度Rz
1小。再者,最大高度Rz係由JIS(日本工業標準)B0601-2001所規定。再者,於本說明書中,所謂模輥意指當對平板進行剪斷加工時在其破斷面產生之平滑的R形狀。又,將產生模輥側的主面稱為模輥面。
In the
如圖1C所示,複數個金屬單片12的側面具有破斷面16及剪斷面17。破斷面16係位於主面14側之凹凸劇烈的面,剪斷面17係位於主面15側之平滑的面。再者,並非複數個金屬單片12的所有側面皆一定有具有破斷面16及剪斷面17的必要,亦可存在不具有破斷面16及剪斷面17的側面。複數個金屬單片12之至少任一側面具有破斷面16及剪斷面17,在金屬電路圖案10所具有之複數個金屬單片12中,較佳係超過50%之金屬單片12的側面具有破斷面16及剪斷面17,更佳係超過70%之金屬單片12的側面具有破斷面16及剪斷面17,進一步更佳係超過90%之金屬單片12的側面具有破斷面16及剪斷面17。As shown in FIG. 1C , the side surfaces of the plurality of metal
如圖1C所示,雖存在有在剪斷面17,因剪斷加工所產生的傷痕(以下,稱為剪斷傷痕19)被形成於金屬單片12之厚度方向上的情形,但本實施形態之金屬電路圖案10的摩擦痕13係與如此之剪斷傷痕19為不同者。亦即,複數個金屬單片12之側面具有與剪斷面17之剪斷傷痕19不同的摩擦痕13。具體而言,例如摩擦痕13相較於剪斷傷痕19,長度較短。相較於剪斷傷痕19係與剪斷面17的厚度為大致相同的長度,摩擦痕13則較剪斷面17的厚度短。摩擦痕13較佳係較剪斷面17之一半厚度短。藉此,當製造金屬電路圖案10時,容易抑制毛邊的發生。As shown in FIG. 1C , flaws (hereinafter, referred to as shear flaws 19 ) generated by the shearing process may be formed in the thickness direction of the
對於本實施形態之金屬電路圖案10,摩擦痕13較佳係被形成於破斷面16與剪斷面17的交界18附近,更佳係被形成於從交界18起的剪斷面17側。在複數個金屬單片12的側面,由於表面粗糙度從破斷面16至剪斷面17會急劇地下降,因此交界18附近係電路基板與密封樹脂的密合性容易下降的位置。藉由在如此之位置形成摩擦痕13,可抑制複數個金屬單片12之側面之表面粗糙度的下降,而使電路基板與密封樹脂的密合性提升。In the
在將本實施形態之金屬電路圖案10接合於絕緣基板上的情形時,藉由將離摩擦痕13較遠側的主面15接合於絕緣基板,可在保持有電路圖案之狀態下進行接合。亦即,藉由將未被黏貼於載帶11側的主面15接合於絕緣基板,可藉由載帶11在保持有電路圖案之狀態下進行接合。於該情形時,由於離摩擦痕13較遠側之主面15的周緣部為模輥面,因此主面15與絕緣基板的接觸面會成為平坦。亦即,由於離摩擦痕13較遠側之主面15的周緣部不具有會阻礙與絕緣基板之接觸般的突起等,因此可將與絕緣基板之接觸面設為平坦。藉此,例如在將金屬電路圖案10接合於陶瓷基板上之情形時,可使金屬電路圖案10與陶瓷基板的接合性提升。When bonding the
又,如上述般,在將離摩擦痕13較遠側的主面15接合於陶瓷基板的情形時,會將半導體元件焊接於接近摩擦痕13側的主面14之上。於該情形時,由於摩擦痕13存在於接近進行焊接之面的位置,因此可降低剩餘之焊料溢出而流出的危險。Moreover, when bonding the
在將本實施形態之金屬電路圖案10接合於高散熱樹脂基板上的情形時,較佳係將複數個金屬單片12之至少一者的主面(較佳係未被黏貼於載帶11側的主面,於本實施形態中為主面15)設為粗糙化面。於該情形時,藉由將粗糙化面接合於高散熱樹脂基板,可使金屬電路圖案10與高散熱樹脂基板的接合性提升。又,粗糙化面的算數平均粗糙度Ra(JIS(日本工業標準)B0601-2001),較佳係0.15μm以上且5μm以下。In the case of bonding the
(2)金屬電路圖案之製造方法
其次,對本實施形態之金屬電路圖案10之製造方法進行說明。
(2) Manufacturing method of metal circuit pattern
Next, the manufacturing method of the
圖2係表示本實施形態之金屬電路圖案10之製造方法之一例的流程圖。本實施形態之金屬電路圖案10之製造方法,例如具有粗糙化處理步驟S1、沖壓步驟S2、黏貼步驟S3、及檢查、包裝步驟S4。FIG. 2 is a flowchart showing an example of a method of manufacturing the
(粗糙化處理步驟S1)
在粗糙化處理步驟S1中,對金屬原料板20之至少一者的主面進行粗糙化處理。金屬原料板20可使用具有與要被搭載於電路基板之半導體元件之特性相應之既定之導熱率及既定之導電率的金屬材料,例如銅或銅合金。又,為了使金屬電路圖案10具有既定的強度或耐熱性等的特性,亦可於上述之金屬材料中添加既定量之鐵、鋅、磷、錫、鎳等的添加元素。
(roughening process step S1)
In roughening processing step S1, roughening processing is performed on the main surface of at least one of the metal
在粗糙化處理步驟S1中,例如使用硫酸系蝕刻液對金屬原料板20之至少一者的主面進行粗糙化處理,來形成粗糙化面。在粗糙化處理步驟S1中,較佳係以粗糙化面的算數平均粗糙度Ra成為0.15μm以上且5μm以下之方式來進行粗糙化處理。藉此,藉由將粗糙化面接合於高散熱樹脂基板,可使金屬電路圖案10與高散熱樹脂基板的接合性提升。再者,亦可省略粗糙化處理步驟S1。In the roughening treatment step S1, for example, a main surface of at least one of the metal
(沖壓步驟S2)
於沖壓步驟S2中,對金屬原料板20進行沖裁來形成要形成電路圖案之各自獨立的複數個金屬單片12。
(pressing step S2)
In the punching step S2, the metal
圖3A、圖3B及圖3C係表示沖壓步驟S2之一部分的概略剖視圖。於沖壓步驟S2中,首先,將金屬原料板20送入沖壓機。如圖3A所示,於沖壓機例如設置有衝模(die)21、衝頭(punch)22、頂出件(knock out)23、及脫模件(stripper)24。3A, 3B and 3C are schematic cross-sectional views showing a part of the pressing step S2. In the punching step S2, first, the metal
衝模21具有用以將金屬原料板20成形為既定之電路圖案之形狀的成形孔25。然後,在將金屬原料板20送入衝模21與衝頭22之間後,如圖3B所示般,使衝頭22下降,一邊壓下成形孔25內的頂出件23,一邊從金屬原料板20朝成形孔25內沖裁複數個金屬單片12。此時,脫模件24會發揮壓抵金屬原料板20之板壓抵件的作用。若對金屬單片12進行沖裁,在金屬單片12的側面便會形成破斷面16及剪斷面17。破斷面16會被形成於沖頭22側,而剪斷面17會被形成於頂出件23側。The
在從金屬原料板20沖裁出複數個金屬單片12後,如圖3C所示般,使頂出件23上升,一邊將衝頭22上推,一邊將已沖裁出之複數個金屬單片12之原本之金屬原料板20的沖裁孔26內推回。如此之成形法被稱為回推(push back)法。藉由採用回推法,可抑制毛邊的發生。又,可在保持有電路圖案之狀態下進行下一個步驟。After the plurality of
又,當要將沖裁出的複數個金屬單片12朝沖裁孔26內推回時,例如藉由適當地控制衝模21與衝頭22之間隙,可使金屬原料板20之沖裁孔26的內周面與沖裁出之複數個金屬單片12的外周面相摩擦。藉此,可在複數個金屬單片12的側面形成摩擦痕13。更具體而言,可在複數個金屬單片12之側面之接近衝頭22的區域形成摩擦痕13。摩擦痕13會沿著沖壓機的沖裁方向、即沿著複數個金屬單片12的厚度方向形成。In addition, when the punched metal
摩擦痕13較佳係形成為較剪斷面17的一半厚度短。藉由如此形成摩擦痕13,可抑制毛邊的發生。又,摩擦痕13較佳係形成於複數個金屬單片12之側面之破斷面16與剪斷面17的交界18附近,更佳係形成於從交界18起的剪斷面17側。藉此,可使電路基板與密封樹脂的密合性提升。The friction marks 13 are preferably formed to be shorter than half the thickness of the
又,當要將沖裁出的複數個金屬單片12朝沖裁孔26內推回時,例如以複數個金屬單片12之厚度的一部分會嵌合於沖裁孔26的方式推回。藉由以複數個金屬單片12之厚度的一部分會嵌合於沖裁孔26的方式推回,將摩擦痕13以在既定的位置中斷之方式形成。Furthermore, when the plurality of metal
複數個金屬單片12之接近摩擦痕13側(衝頭22側)之主面14的周緣部,係毛邊容易發生的區域。另一方面,複數個金屬單片12之離摩擦痕13較遠側(頂出件23側)之主面15係周緣部具有平滑之R形狀之所謂的模輥面。於沖壓步驟S2中,以離摩擦痕13較遠側之主面15之周緣部的最大高度Rz
2較接近摩擦痕13側之主面14之周緣部之最大高度Rz
1小的方式來形成複數個金屬單片12。
The peripheral edge portion of the
再者,較佳係當從金屬原料板20沖裁複數個金屬單片12時,在衝頭22的前端未到達衝模21之成形孔25之開口端的階段停止衝頭22的下降,並在該狀態下開始推回。藉此,可抑制毛邊的發生。Furthermore, it is preferable to stop the descending of the
(黏貼步驟S3)
於黏貼步驟S3中,將載帶11黏貼於複數個金屬單片12。首先,將複數個金屬單片12在使其嵌合於金屬原料板20之沖裁孔26的狀態下,以保持有電路圖案的狀態送入黏貼裝置。
(Paste step S3)
In the pasting step S3 , the
圖4A及圖4B係表示黏貼步驟S3之一部分的概略剖視圖。如圖4A及圖4B所示,例如,於黏貼裝置設置有桿30、第1頭31、及第2頭32。4A and 4B are schematic cross-sectional views showing a part of the sticking step S3. As shown in FIGS. 4A and 4B , for example, the sticking device is provided with a
如圖4A所示,於桿30設置有用以保持複數個金屬單片12的凹部33。以凹部33位於複數個金屬單片12之下方的方式,來調整桿30的位置。其後,使第1頭31下降,將嵌合於沖裁孔26的複數個金屬單片12拆卸。所拆卸之複數個金屬單片12,可藉由桿30的凹部33而在保持有電路圖案之狀態下移動。As shown in FIG. 4A , the
其次,將桿30朝第2頭32的下方移動,而將載帶11朝第2頭32與桿30之間送出。其後,使第2頭32下降,將載帶11一邊沖裁成既定的大小,一邊黏貼於複數個金屬單片12。亦即,在保持有複數個金屬單片12之電路圖案的狀態下黏貼載帶11。藉此,可容易地進行複數個金屬單片12的操控。其結果,可有效率地製造電路基板。Next, the
又,如上述般,複數個金屬單片12之接近摩擦痕13側之主面14的周緣部,係毛邊容易發生的區域。在複數個金屬單片12之接近摩擦痕13側之主面14的周緣部有毛邊發生的情形時,藉由當要黏貼載帶11時調整第2頭32的荷重,可將毛邊壓扁而使其變小。In addition, as described above, the peripheral edge portion of the
於黏貼步驟S3中,將載帶11黏貼於複數個金屬單片12之接近摩擦痕13側的主面14。藉此,可將未被黏貼於載帶11側的主面15,在保持有電路圖案之狀態下接合於絕緣基板。又,於該情形時,由於離摩擦痕13較遠側的主面15為模輥面,因此主面15與絕緣基板的接觸面會成為平坦。藉此,例如在將金屬電路圖案10接合於陶瓷基板上的情形時,可使金屬電路圖案10與陶瓷基板的接合性提升。In the sticking step S3 , the
(檢查、包裝步驟S4)
於檢查、包裝步驟S4中,首先,實施黏貼有載帶11之金屬電路圖案10的外觀檢查。於外觀檢查中,例如,對金屬電路圖案10是否存在傷痕或變形、凹陷等進行檢查。其次,實施金屬電路圖案10的包裝。金屬電路圖案10的包裝係藉由將在外觀檢查中判斷為良品之金屬電路圖案10,例如以每既定的個數收納於包裝用的容器來進行。
(Inspecting and packing step S4)
In the inspection and packaging step S4, first, the appearance inspection of the
藉由以上的步驟,完成品的金屬電路圖案10可被製造。Through the above steps, the finished
於本實施形態之金屬電路圖案10之製造方法中,如上述般,藉由於沖壓步驟S2中採用回推法,並於黏貼步驟S3中在保持有複數個金屬單片12之電路圖案之狀態下黏貼載帶11,而可容易地進行複數個金屬單片12的操控。其結果,可有效率地製造電路基板。In the manufacturing method of the
又,於本實施形態之金屬電路圖案10之製造方法中,如上述般,藉由在沖壓步驟S2中適當地控制衝模21與衝頭22的間隙,可在複數個金屬單片12的側面形成摩擦痕13。藉此,例如可使電路基板與密封樹脂的密合性提升。Furthermore, in the method of manufacturing the
(3)本實施形態的效果 根據本實施形態,可發揮以下所示之1個或複數個效果。 (3) Effects of the present embodiment According to this embodiment, one or a plurality of effects shown below can be exhibited.
(a)本實施形態之金屬電路圖案10由於電路圖案由載帶11所保持,因此可容易地進行複數個金屬單片12的操控。具體而言,例如,可容易地進行當要將絕緣基板接合於金屬電路圖案10時的定位。(a) In the
此處,於習知的電路基板中,由於當要將金屬電路圖案接合於絕緣基板時,例如必須將沖裁成電路圖案之形狀之板狀的治具放置在絕緣基板上,並1個1個地排列金屬單片,因此作業性很差。又,存在有電路圖案的精準度會因當拆卸治具時或搬送至加熱爐時之振動而降低的可能性。又,在藉由沖壓加工來形成金屬電路圖案的情形時,存在有毛邊會發生的問題。Here, in the conventional circuit board, when the metal circuit pattern is to be bonded to the insulating board, for example, a plate-shaped jig punched into the shape of the circuit pattern must be placed on the insulating board, and one jig must be placed on the insulating board. The metal monoliths are arranged individually, so workability is poor. In addition, there is a possibility that the accuracy of the circuit pattern may be lowered due to vibration when the jig is removed or when it is transported to a heating furnace. Moreover, when forming a metal circuit pattern by press work, there exists a problem that a burr may generate|occur|produce.
相對於此,本實施形態之金屬電路圖案10當要接合於絕緣基板時,由於可針對每個載帶11個別地將金屬電路圖案10積層於絕緣基板上,因此相較於習知的方法,可使作業性大幅地提升。又,可使電路圖案的精準度提升。此外,由於採用回推法,因此可抑制毛邊的發生。因此,可有效率地製造電路基板。On the other hand, when the
(b)在將本實施形態之金屬電路圖案10用於如上述般之盒體模組的情形時,由於複數個金屬單片12的側面具有摩擦痕13,因此可使電路基板與密封樹脂的密合性提升。藉此,例如當振動被施加於盒體模組時,可抑制電路基板的振動。作為結果,可抑制焊線的斷裂等,而使半導體元件的信賴性提升。(b) When the
(c)在將本實施形態之金屬電路圖案10用於如上述般之盒體模組的情形時,由於複數個金屬單片12的側面具有摩擦痕13,因此複數個金屬單片12之側面的焊接潤濕性會變小。藉此,例如當要將半導體元件焊接於電路基板上時,可降低剩餘之焊料溢出而流出的危險。(c) When the
(d)於本實施形態之金屬電路圖案10中,摩擦痕13相較於剪斷傷痕19長度較短,且較佳係較剪斷面17的一半厚度更短。藉此,可抑制毛邊的發生。(d) In the
(e)於本實施形態的金屬電路圖案10中,摩擦痕13較佳係被形成於破斷面16與剪斷面17的交界18附近,更佳係形成於從交界18起之剪斷面17側。藉此,可使複數個金屬單片12之側面之表面粗糙度的變化變平緩,而使電路基板與密封樹脂的密合性提升。(e) In the
(f)在要將本實施形態之金屬電路圖案10接合於絕緣基板上的情形時,藉由將離摩擦痕13較遠側的主面15接合於絕緣基板,可在保持有電路圖案之狀態下進行接合。亦即,藉由將未被黏貼於載帶11側的主面15接合於絕緣基板,可藉由載帶11在保持有電路圖案之狀態下進行接合。又,於該情形時,由於離摩擦痕13較遠側之主面15係圓角面,因此主面15與陶瓷基板的接觸面會成為平坦。藉此,例如在要將金屬電路圖案10接合於陶瓷基板上的情形時,可使金屬電路圖案10與陶瓷基板的接合性提升。因此,本實施形態之金屬電路圖案10可適當地使用於,例如利用將銅板直接接合於陶瓷基板上之直接接合法所生產的陶瓷電路基板。(f) When the
(g)在要將本實施形態的金屬電路圖案10接合於高散熱樹脂基板上的情形時,較佳係將複數個金屬單片12之至少一主面(較佳係未被黏貼於載帶11側的主面,於本實施形態中係主面15)設為粗糙化面。於該情形時,藉由將粗糙化面接合於高散熱樹脂基板,可使金屬電路圖案10與高散熱樹脂基板之接合性提升。因此,本實施形態之金屬電路圖案10亦可適當地使用於在高散熱樹脂基板上接合有金屬板的電路基板。(g) When the
(h)在本實施形態之金屬電路圖案10之製造方法中,藉由於沖壓步驟S2中採用回推法,並於黏貼步驟S3中在保持有複數個金屬單片12之電路圖案之狀態下黏貼載帶11,可容易地進行複數個金屬單片12的操控。其結果,可有效率地製造電路基板。(h) In the manufacturing method of the
(i)在本實施形態之金屬電路圖案10之製造方法中,藉由於沖壓步驟S2中適當地控制衝模21與衝頭22之間隙,可在複數個金屬單片12的側面形成摩擦痕13。藉此,例如可使電路基板與密封樹脂的密合性提升。(i) In the manufacturing method of the
(4)第1實施形態的變形例 上述之實施形態可視需要,如以下所示之變形例般進行變化。以下,僅對與上述之實施形態不同的元件進行說明,而對與在上述之實施形態中所說明之元件實質上相同的元件標示相同的元件符號並省略其說明。 (4) Modification of the first embodiment The above-described embodiment can be changed as necessary, as in the following modifications. Hereinafter, only the elements different from the above-mentioned embodiments will be described, and the elements that are substantially the same as the elements described in the above-mentioned embodiments will be denoted by the same reference numerals, and the description thereof will be omitted.
圖5A係本變形例之金屬電路圖案40的俯視圖。圖5B係本變形例之金屬電路圖案40的縱剖視圖。如圖5A及圖5B所示,本變形例之金屬電路圖案40在具有金屬外框41的部分,與第1實施形態的金屬電路圖案10不同。FIG. 5A is a plan view of the
金屬外框41為了保護電路圖案而被設置,例如被黏貼於載帶11的外周部。金屬外框41在將金屬電路圖案40接合於絕緣基板上之前,可在任意的時間點從載帶11拆卸。The
本變形例之金屬電路圖案40由於具有金屬外框41,因此可容易地進行複數個金屬單片12的操控。又,例如,可從包裝時或搬送時的振動保護電路圖案,而使電路圖案的精準度提升。Since the
<本發明的第2實施形態> 接著,對本發明的第2實施形態,以與第1實施形態的不同點為中心進行說明。 <Second embodiment of the present invention> Next, the second embodiment of the present invention will be described focusing on the differences from the first embodiment.
圖6A係本實施形態之金屬電路圖案50的俯視圖。圖6B係本實施形態之金屬電路圖案50的側視圖。如圖6B所示,本實施形態之金屬電路圖案50其複數個金屬單片12之離摩擦痕13較遠側的主面15,被黏貼於載帶11。亦即,被黏貼於載帶11的面與第1實施形態相反。FIG. 6A is a plan view of the
本實施形態之金屬電路圖案50例如可藉由於黏貼步驟S3中,當要將嵌合於沖裁孔26的複數個金屬單片12拆卸時,預先將載帶11配置於桿30之上來製造。The
在要將本實施形態之金屬電路圖案50接合於絕緣基板上的情形時,藉由將接近摩擦痕13側的主面14接合於絕緣基板,可在保持有電路圖案之狀態下進行接合。亦即,藉由將未被黏貼於載帶11側的主面14接合於絕緣基板,可藉由載帶11在保持有電路圖案之狀態下進行接合。於該情形時,由於離摩擦痕13較遠側之主面15的周緣部係圓角面,因此當要將半導體元件搭載於主面15上時,可降低半導體元件受到損傷等的危險。When the
又,接近摩擦痕13側之主面14的周緣部,係毛邊容易發生的區域。在將本實施形態之金屬電路圖案50使用於例如利用經由焊接填料金屬層將銅板接合於陶瓷基板上之活性金屬法所生產之陶瓷電路基板的情形時,主面14之周緣部的毛邊會與焊接填料金屬層接觸或接近。藉此,毛邊會成為牆壁,可抑制焊接填料金屬朝向電路圖案表面的滲出。因此,本實施形態之金屬電路圖案50可適當地使用於,例如利用活性金屬法所生產的陶瓷電路基板。In addition, the peripheral edge portion of the
又,在要將本實施形態之金屬電路圖案50接合於高散熱樹脂基板上的情形時,主面14之周緣部的毛邊會與高散熱樹脂基板接觸,而發揮錨固(anchor)效果。藉此,可使金屬電路圖案10與高散熱樹脂基板的接合性提升。因此,本實施形態之金屬電路圖案10亦可適當地使用於在高散熱樹脂基板上接合有金屬板的電路基板。Furthermore, when the
<本發明的其他實施形態> 以上,雖已對本發明之實施形態具體地說明,但本發明並非被限定於上述之實施形態者,其可在不脫離本發明主旨的範圍內進行各種變更。 <Other Embodiments of the Present Invention> Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
例如,於上述之實施形態中,雖已對在沖壓步驟S2中,當要將所沖裁出的複數個金屬單片12朝沖裁孔26內推回時,以複數個金屬單片12之一部分厚度嵌合於沖裁孔26的方式推回之情形進行說明,但亦可以複數個金屬單片12之整個厚度嵌合於沖裁孔26的方式推回。For example, in the above-mentioned embodiment, although in the punching step S2, when the punched out plurality of metal
例如,於上述之實施形態中,雖已對在沖壓步驟S2中,當要從金屬原料板20沖裁複數個金屬單片12時,在衝頭22的前端未到達衝模21之成形孔25之開口端的階段停止衝頭22的下降,並在該狀態下開始推回之情形進行說明,但亦可在將複數個金屬單片12完全地沖裁之後再開始推回。For example, in the above-described embodiment, in the punching step S2, when a plurality of
<本發明的較佳態樣> 以下,記載本發明的較佳態樣。 <Preferable aspect of the present invention> Hereinafter, preferred aspects of the present invention will be described.
(記載1) 根據本發明一態樣,可提供一種金屬電路圖案,係於絕緣基板上接合有要形成電路圖案之金屬板之電路基板製造用的金屬電路圖案;其具備有:要形成上述電路圖案之各自獨立的複數個金屬單片;及在保持有上述電路圖案之狀態下可供上述複數個金屬單片黏貼的載帶;且上述複數個金屬單片之至少任一側面具有破斷面及剪斷面,並進一步具有與上述剪斷面之剪斷傷痕不同的摩擦痕。 (Record 1) According to an aspect of the present invention, a metal circuit pattern can be provided, which is a metal circuit pattern for manufacturing a circuit substrate in which a metal plate for forming a circuit pattern is bonded to an insulating substrate; A plurality of metal monoliths; and a carrier tape that can be pasted to the above-mentioned plurality of metal monoliths in a state where the above-mentioned circuit pattern is maintained; , and further has friction marks different from the shear marks of the above-mentioned shearing surface.
(記載2) 如記載1之金屬電路圖案,其中,上述摩擦痕相較於上述剪斷傷痕,長度較短。較佳係上述摩擦痕相較於上述剪斷傷痕之一半厚度,長度較短。 (Record 2) The metal circuit pattern according to description 1, wherein the friction marks are shorter in length than the shearing marks. Preferably, the friction marks are shorter in length than half the thickness of the shear marks.
(記載3) 如記載1或2之金屬電路圖案,其中,上述摩擦痕被形成於上述複數個金屬單片之破斷面與剪斷面的交界附近。較佳係上述摩擦痕被形成於從上述交界起之上述剪斷面側。 (Record 3) The metal circuit pattern according to the description 1 or 2, wherein the friction marks are formed in the vicinity of the boundary between the broken surfaces and the sheared surfaces of the plurality of metal single pieces. It is preferable that the said friction mark is formed in the said shearing surface side from the said boundary.
(記載4) 如記載1至記載3中任一者之金屬電路圖案,其中,上述絕緣基板係包含樹脂材料及導熱性填料的高散熱樹脂基板。 (Record 4) The metal circuit pattern according to any one of descriptions 1 to 3, wherein the insulating substrate is a highly heat-dissipating resin substrate containing a resin material and a thermally conductive filler.
(記載5) 如記載4之金屬電路圖案,其中,上述複數個金屬單片之至少一主面係粗糙化面。較佳係上述複數個金屬單片之未被黏貼於上述載帶側的主面為粗糙化面。較佳係上述粗化面之算數平均粗糙度Ra為0.15μm以上且5μm以下。 (Record 5) The metal circuit pattern according to description 4, wherein at least one main surface of the plurality of metal single pieces is a roughened surface. Preferably, the main surface of the plurality of metal single sheets that is not adhered to the carrier tape side is a roughened surface. Preferably, the arithmetic mean roughness Ra of the roughened surface is 0.15 μm or more and 5 μm or less.
(記載6) 如記載1至記載5中任一者之金屬電路圖案,其中,上述複數個金屬單片之接近上述摩擦痕側的主面被黏貼於上述載帶。 (Record 6) The metal circuit pattern according to any one of descriptions 1 to 5, wherein the main surfaces of the plurality of metal single pieces on the side close to the friction marks are adhered to the carrier tape.
(記載7) 如記載1至記載5中任一者之金屬電路圖案,其中,上述複數個金屬單片之離上述摩擦痕較遠側的主面被黏貼於上述載帶。 (Record 7) The metal circuit pattern according to any one of descriptions 1 to 5, wherein the main surfaces of the plurality of metal single pieces that are farther from the friction marks are adhered to the carrier tape.
(記載8) 如記載1至記載7中任一者之金屬電路圖案,其中,上述摩擦痕沿著上述複數個金屬單片的厚度方向延伸。 (Record 8) The metal circuit pattern according to any one of descriptions 1 to 7, wherein the friction marks extend along the thickness direction of the plurality of metal single pieces.
(記載9) 如記載1至記載8中任一者之金屬電路圖案,其中,上述摩擦痕在既定的位置中斷。 (Record 9) The metal circuit pattern according to any one of descriptions 1 to 8, wherein the friction marks are interrupted at predetermined positions.
(記載10) 如記載1至記載9中任一者之金屬電路圖案,其中,上述複數個金屬單片由銅或銅合金所構成,厚度係0.5mm以上且4.0mm以下。較佳係上述複數個金屬單片的厚度為0.7mm以上且3.0mm以下。 (Record 10) The metal circuit pattern according to any one of descriptions 1 to 9, wherein the plurality of metal single pieces are made of copper or a copper alloy, and have a thickness of 0.5 mm or more and 4.0 mm or less. Preferably, the thickness of the plurality of metal single pieces is 0.7 mm or more and 3.0 mm or less.
(記載11) 如記載1至記載10中任一者之金屬電路圖案,其中,其進一步具有被黏貼於上述載帶之外周部的金屬外框。 (Record 11) The metal circuit pattern according to any one of descriptions 1 to 10, further comprising a metal outer frame attached to the outer peripheral portion of the carrier tape.
(記載12) 根據本發明另一態樣,可提供一種金屬電路圖案之製造方法,係於包含樹脂材料及導熱性填料之高散熱樹脂基板上接合有金屬板之電路基板製造用之金屬電路圖案之製造方法;其具備有:對金屬原料板進行沖裁而形成各自獨立之複數個金屬單片的沖壓步驟;及將載帶黏貼於上述複數個金屬單片的黏貼步驟;在上述沖壓步驟中,藉由將已沖裁出之上述複數個金屬單片推回上述金屬原料板的沖裁孔,而在上述複數個金屬單片的側面形成摩擦痕;在上述黏貼步驟中,從上述金屬原料板的上述沖裁孔將上述複數個金屬單片加以拆卸,並在保持有上述複數個金屬單片之電路圖案的狀態下黏貼上述載帶。 (Record 12) According to another aspect of the present invention, there can be provided a method for manufacturing a metal circuit pattern, which is a method for manufacturing a metal circuit pattern for manufacturing a circuit substrate in which a metal plate is bonded to a highly heat-dissipating resin substrate comprising a resin material and a thermal conductive filler; It is provided with: a punching step of punching a metal raw material plate to form a plurality of independent metal single sheets; and a pasting step of pasting the carrier tape on the plurality of metal single sheets; in the above-mentioned punching step, by The plurality of metal single sheets that have been punched out are pushed back into the punching holes of the metal raw material plate, and friction marks are formed on the side surfaces of the plurality of metal single sheets; The above-mentioned plurality of metal single pieces are disassembled by cutting holes, and the above-mentioned carrier tape is pasted in a state where the circuit patterns of the above-mentioned plurality of metal single pieces are maintained.
(記載13)
如記載12之金屬電路圖案之製造方法,其中,其進一步具有對上述金屬原料板之至少一主面進行粗糙化處理的粗糙化處理步驟。
(Record 13)
The method for producing a metal circuit pattern according to
10:金屬電路圖案 11 :載帶 12:金屬單片 13:摩擦痕 14:主面 15:主面 16:破斷面 17:剪斷面 18:交界 19:剪斷傷痕 20:金屬原料板 21:衝模 22:衝頭 23:頂出件 24:脫模件 25:成形孔 26:沖裁孔 30:桿 31:第1頭 32:第2頭 33:凹部 40:金屬電路圖案 41:金屬外框 50:金屬電路圖案 S1:粗糙化處理步驟 S2:沖壓步驟 S3:黏貼步驟 S4:檢查、包裝步驟 10: Metal circuit pattern 11 : Carrier tape 12: Metal Monolithic 13: Friction marks 14: Main side 15: Main side 16: Broken Section 17: Shear section 18: Junction 19: Cut Scars 20: Metal raw material board 21: Die 22: Punch 23: ejector 24: Release parts 25: Forming holes 26: Punching holes 30: Rod 31: Head 1 32: Head 2 33: Recess 40: Metal circuit pattern 41: Metal frame 50: Metal circuit pattern S1: Roughening treatment step S2: Stamping step S3: Paste Step S4: Inspection and packaging steps
圖1A係本發明之第1實施形態之金屬電路圖案10的俯視圖。
圖1B係本發明之第1實施形態之金屬電路圖案10的側視圖。
圖1C係本發明之第1實施形態之金屬單片12的側面的放大圖。
圖2係表示本發明之第1實施形態之金屬電路圖案10之製造方法之一例的流程圖。
圖3A係表示本發明之第1實施形態之沖壓步驟S2的一部分的概略剖視圖。
圖3B係表示本發明之第1實施形態之沖壓步驟S2的一部分的概略剖視圖。
圖3C係表示本發明之第1實施形態之沖壓步驟S2的一部分的概略剖視圖。
圖4A係表示本發明之第1實施形態之黏貼步驟S3的一部分的概略剖視圖。
圖4B係表示本發明之第1實施形態之黏貼步驟S3的一部分的概略剖視圖。
圖5A係本發明之第1實施形態之變形例的金屬電路圖案40的俯視圖。
圖5B係本發明之第1實施形態之變形例的金屬電路圖案40的縱剖視圖。
圖6A係本發明之第2實施形態之金屬電路圖案50的俯視圖。
圖6B係本發明之第2實施形態之金屬電路圖案50的側視圖。
FIG. 1A is a plan view of the
10:金屬電路圖案 11 :載帶 12:金屬單片 13:摩擦痕 14:主面 15:主面 16:破斷面 17:剪斷面 18:交界 19:剪斷傷痕 10: Metal circuit pattern 11 : Carrier tape 12: Metal Monolithic 13: Friction marks 14: Main side 15: Main side 16: Broken Section 17: Shear section 18: Junction 19: Cut Scars
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- 2021-01-26 TW TW110102755A patent/TWI768682B/en active
- 2021-02-07 CN CN202110177694.6A patent/CN114375088A/en active Pending
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TW201434360A (en) * | 2013-02-18 | 2014-09-01 | King Shing Ind Co Ltd | An electric circuit board using metal plates and packaging module thereof |
US20160165715A1 (en) * | 2014-12-05 | 2016-06-09 | Infineon Technologies Austria Ag | Device including a printed circuit board and a metal workpiece |
Also Published As
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CN114375088A (en) | 2022-04-19 |
JP2022065938A (en) | 2022-04-28 |
TW202218493A (en) | 2022-05-01 |
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