JP4719630B2 - Method for manufacturing transfer substrate - Google Patents

Description

  The present invention relates to a method for manufacturing a transfer substrate on which, for example, a floating island-like conductor pattern is transferred with a plate thickness size.

As a circuit board on which a floating island-like conductor pattern is formed, an island part on which a semiconductor element of a lead frame is mounted and resin-sealed (see Patent Document 1), a circuit board having an electronic component mounting part or a heat sink, etc. (See Patent Document 2).
JP-A-6-104371 JP-A-6-29632

  In recent years, miniaturization and high-density mounting of semiconductor devices have progressed, and POP (Package / On / Package) type semiconductor devices have been manufactured. In this semiconductor device, since the substrates on which the semiconductor chips are mounted are stacked to be electrically connected, there is a need to form the resin mold portion as thin as possible considering the connection between the terminals. In addition, there is a need to reduce the thickness of a circuit board on which a power feeding semiconductor element or electronic component is mounted in order to achieve heat dissipation and low resistance.

  An object of the present invention is to provide a method for manufacturing a transfer substrate on which a floating island-shaped conductor pattern is transferred in a plate thickness size.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, a first pressing process in which a metal plate material is carried into the first press apparatus and half-cutting is performed according to the conductor pattern, and an adhesive support material having an adhesive layer formed on the surface is carried into the second press apparatus. A second pressing step of cutting the semi-punched conductor pattern by adhering the metal plate material and adhering it onto the adhesive support material; and bringing the adhesive support material into the mold die together with the sealing resin to form the conductor pattern A resin sealing process for resin-sealing the grooves between the circuit board, and the adhesive support material is peeled off from the resin-sealed molded product, and floating island-like conductor patterns are exposed on both sides in a plate thickness size from the sealing resin And a substrate separation step for forming the substrate.
In the resin sealing step, the resin mold region of the mold clamping surface is covered with a release film, and a cavity plate having a cavity hole for defining the outer shape and thickness of the resin sealing portion is stacked on the adhesive support material. In addition, the groove between the conductor patterns is resin-sealed.
In addition, as the adhesive support material, any one of a base substrate to which an adhesive sheet is adhered, a base substrate with an adhesive, and an adhesive sheet is used.

If the above-mentioned resin mold apparatus is used, after sticking the conductor pattern half-cut into a metal plate material to the adhesive support material, separating the adhesive support material from the molded product in which the groove portion between the conductor patterns is resin-sealed, A thin transfer substrate with a high flatness can be manufactured, in which an arbitrary floating island-shaped conductor pattern is transferred in a plate thickness size.
In particular, the resin mold area on the clamping surface of the mold is covered with a release film, and a cavity plate with a cavity hole that defines the outer shape and thickness of the resin sealing part is overlapped on the adhesive support material and sealed with resin. By doing so, it is possible to efficiently mass-produce thin substrates with high flatness by exposing the conductor pattern with a simple mold configuration.
Moreover, the adhesive support material can easily handle floating island-like conductor patterns in the manufacturing process by using any one of a base substrate to which the adhesive sheet is adhered, a base substrate with an adhesive, and an adhesive sheet.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a transfer substrate manufacturing method according to the invention will be described in detail with reference to the accompanying drawings.
An example of the transfer substrate will be described with reference to FIG. The transfer substrate 1 is formed in a plate thickness size in which floating island-shaped conductor patterns 2 are sealed with a sealing resin 3 between the patterns. The transfer substrate 1 itself may be a circuit board on which electronic components are mounted, or may be a POP type substrate on which circuit boards are stacked.

Next, a method for manufacturing the transfer substrate will be described with reference to FIGS.
1A to 1C show a first pressing step. That is, a metal plate material (for example, copper plate material) 4 is carried into the first press device 5 and half-cut according to the conductor pattern. The first pressing device 5 is provided with a punch plate 9 provided with punches 8 through the stripper plate 7 so as to be movable up and down with respect to the die 6 provided with a die hole. In the state where the copper plate material 4 is pressed against the die 6 by the stripper plate 7 in FIG. 1A, the punch 8 halves the conductor pattern 2 (see FIG. 4A) (see FIG. 1B). The half-cut copper plate material 4 is conveyed to the second pressing device 10.

  2A to 2D show the second pressing step. In the second pressing device 10, a punch plate 14 provided with a punch 13 through the stripper plate 12 is provided to be movable up and down with respect to the platen 11. An adhesive support material is carried into the platen 11. As the adhesive support material, for example, a base substrate 16 having an adhesive sheet 15 adhered to the surface is used. As the adhesive sheet 15, a sheet material having adhesiveness such as a thermosetting film is preferably used. The base substrate 16 is made of various plate materials such as a metal plate and a resin plate. On this base substrate 16, the copper plate material 4 is carried and overlapped (see FIG. 2A). 2B, the conductor pattern 2 from which the punch 13 is half-cut is cut and adhered to the adhesive sheet 15 in a state where the copper plate material 4 is pressed against the base substrate 16 by the stripper plate 12 (see FIG. 2C). In FIG. 2D, the base substrate 16 (see FIG. 4B) to which the conductor pattern 2 is adhered is conveyed to the resin molding apparatus 18. Instead of the adhesive sheet 15, a base substrate with an adhesive layer in which an adhesive layer (adhesive) is formed (applied) on the surface of the base substrate 16 may be used.

  3A to 3D show the resin sealing process. The resin mold device 18 carries the base substrate 16 together with the sealing resin 3 into the mold, and the grooves between the conductor patterns are resin-sealed. In this embodiment, the transfer molding method is adopted as the resin mold method. An upper mold 19 that is a fixed mold and a lower mold 20 that is a movable mold are included in the mold. The lower mold 20 is moved up and down by a mold clamping mechanism using, for example, an electric motor. A release film 21 covering the resin mold region is adsorbed and supported on the clamp surface of the upper mold 19. As the release film 21, a film material having predetermined heat resistance, peelability from the sealing resin 3, and flexibility is used.

  In the resin mold apparatus, a cavity plate 23 having a cavity hole 22 that defines the outer shape and thickness of the resin sealing portion (package portion) is used. It moves around the track surface substantially parallel to the clamping surface of the mold. A preheating portion, a resin mold portion, a degate portion, and a cleaner portion (not shown) are provided along the track surface.

  In FIG. 3A, the base substrate 16 is carried together with the sealing resin 3 into the lower mold 20 opened. The base substrate 16 is positioned by being sucked and held on, for example, a lower mold placement surface. The sealing resin 3 may be supplied either before the base substrate 16 is carried into the mold or after it is carried. The sealing resin (resin tablet) 3 is loaded in the pot 24. A plunger 25 is movably provided in the pot 24.

  In FIG. 3B, the cavity plate 23 is provided with a pot hole 23 a communicating with the pot 24 and a cavity hole 22 for accommodating the base substrate 16. When the mold is closed, the cavity plate 23 is lifted up to the upper mold clamping surface, and the lower mold 20 on which the base substrate 16 is placed is moved upward and pressed against the cavity plate 23 to be clamped.

  In FIG. 3C, when the mold clamping is completed, the transfer mechanism is operated and the sealing resin 3 loaded in the pot 24 is pushed by the plunger 25. At this time, in FIG. 3D, the melted sealing resin 3 is filled into the cavity hole 22 through the resin path formed between the cavity plate 23 and the release film 21, and the groove between the floating island-shaped conductor patterns 2 is sealed with resin. Stopped.

  The molded product after resin sealing is separated from the release film 21 when the lower mold 20 moves downward to open the mold, and the suction of the base substrate 16 by the lower mold 20 is stopped, so that it is integrated with the cavity plate 23. As it is, it is carried out together with the cavity plate 23 to a degate portion (not shown).

  In the delegation section, the scrap and the molded product are separated from the cavity plate 23 above and below the plate surface. Next, the process proceeds to a substrate separation step, and the base substrate 16 is peeled off from the molded product separated in FIG. 4C. For example, when a thermosetting film is used as the pressure-sensitive adhesive sheet 15, since the adhesiveness is weakened by thermosetting, it can be easily separated by suction or the like on the base substrate 16 side (see FIG. 4D). As a result, in FIG. 5, the transfer substrate 1 in which the conductor pattern 2 is exposed from the sealing resin 3 is obtained. As described above, the thin transfer substrate 1 having a high flatness in which the floating island-like arbitrary conductor pattern 2 is transferred in the plate thickness size can be efficiently manufactured.

  In the above-described resin sealing step, the transfer molding method is used as the resin mold apparatus, but the compression molding method can also be used in FIGS. 6A and 6B. A release film 21 covering the resin mold region is adsorbed and supported on the clamp surface of the upper mold 19. Further, the base substrate 16 is attracted and held on the lower mold 20 and positioned. In FIG. 6A, a cavity plate 23 in which cavity holes 22 defining the outer shape and thickness of the transfer substrate 1 are formed is overlaid on the base substrate 16. 6B, a sealing resin 3 such as a liquid resin, a powdery resin, or a granular resin is supplied onto the base substrate 16 (an area other than the conductor pattern 2). The grooves between the conductor patterns 2 may be resin-sealed by clamping and molding the mold in this state.

In the embodiment described above, the transfer substrate 1 has been described with respect to the case where only the conductor pattern 2 is sealed with the sealing resin 3. However, the transfer substrate 1 may be a substrate on which a semiconductor chip or an electronic component is sealed. Further, the metal plate material is not limited to the copper plate material 4 but may be a metal plate material having other conductivity.
Moreover, in FIG. 7A and B, the adhesiveness with the sealing resin 3 after shaping | molding can increase by making the cross section of the conductor pattern 2 into the convex surface 2a or the concave surface 2b. Furthermore, the base substrate 16 made of a plate material is used as the adhesive support material for ease of handling, but the base substrate 16 can be omitted if the adhesive sheet 15 has rigidity.

It is explanatory drawing of a 1st press process. It is explanatory drawing of a 2nd press process. It is explanatory drawing of a resin sealing process. It is the top view and front view of the workpiece | work in each process. It is a top view of a transfer substrate. It is the lower mold top view and metal mold sectional view of the resin mold device concerning other examples. It is sectional drawing of the conductor pattern which concerns on another example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer substrate 2 Conductive pattern 3 Sealing resin 4 Copper plate material 5 1st press apparatus 6 Die 7, 12 Stripper plate 8, 13 Punch 9, 14 Punch plate 10 2nd press apparatus 11 Platen 15 Adhesive sheet (adhesive)
16 Base substrate 18 Resin molding device 19 Upper mold 20 Lower mold 21 Release film 22 Cavity hole 23 Cavity plate 23a Pot hole 24 Pot 25 Plunger

Claims (3)

A first pressing step of carrying the metal plate material into the first pressing device and half-cutting according to the conductor pattern;
A second pressing step in which an adhesive support material having an adhesive layer formed on the surface thereof is carried into a second pressing device, and the metal plate material is overlapped to cut the semi-punched conductor pattern and adhere to the adhesive support material. When,
A resin sealing step of carrying the adhesive support material together with a sealing resin into a mold and resin sealing the grooves between the conductor patterns;
The transfer includes a substrate separation step of peeling a pressure-sensitive adhesive support material from the resin-sealed molded article to form a circuit board in which floating island-like conductor patterns are exposed on both sides with a plate thickness size from the sealing resin. A method for manufacturing a substrate.   In the resin sealing step, a resin mold region on the mold clamping surface is covered with a release film, and a cavity plate having a cavity hole for defining the outer shape and thickness of the resin sealing portion is overlapped on an adhesive support material. 2. The method for manufacturing a transfer substrate according to claim 1, wherein grooves between the conductor patterns are sealed with resin.   The method for manufacturing a transfer substrate according to claim 1, wherein the adhesive support material is any one of a base substrate to which an adhesive sheet is adhered, a base substrate with an adhesive, and an adhesive sheet.

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