JP2018041973A - Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module - Google Patents
Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module Download PDFInfo
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Abstract
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この発明は、回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュールならびに、パワーモジュールの製造方法に関するものであり、特には、回路基板の絶縁基板上に設ける金属板の厚みの大小によらず、所要の絶縁性を確保できるパターニングを可能にする技術を提案するものである。 The present invention relates to a metal plate for a circuit board, a metal plate molded product for a circuit board, a circuit board and a power module, and a method for manufacturing the power module, and in particular, the thickness of the metal plate provided on the insulating substrate of the circuit board. The present invention proposes a technique that enables patterning that can ensure the required insulation regardless of the size.
民生機器用や、ガソリン自動車、電気自動車その他の車載用等として用いられ得るパワーモジュールは一般に、絶縁基板の両面のそれぞれに、銅箔等の金属板を接合してなる回路基板を、ヒートシンクとして機能するベース板上に固定し、その回路基板上にパワートランジスタ等の半導体素子を搭載させて使用に供されるものであり、使用に際し、半導体素子が発する高熱をベース板に伝導させて、その熱を速やかに放散することが求められる。 Power modules that can be used for consumer equipment, gasoline cars, electric cars, and other in-vehicle use generally function as a heat sink by using a circuit board made by bonding a metal plate such as copper foil to each side of the insulating board. It is fixed on the base plate and is used for use by mounting a semiconductor element such as a power transistor on the circuit board. In use, the heat generated by the semiconductor element is conducted to the base plate, Is required to be promptly released.
なお、そのような回路基板では一般に、金属板に接合させる絶縁基板として、セラミックス基板を用いることがある。この場合、セラミックス基板には、当該金属板との直接接合が可能なアルミナ（Ａｌ2Ｏ3）が用いられていたが、近年は、このアルミナ製セラミックス基板に代えて、特許文献１〜３等に記載されているように、優れた熱伝導性を有する窒化アルミニウム（ＡｌＮ）等の窒化物セラミックス基板とすることが有効であると考えられている。絶縁基板は樹脂材料等の他の材料で構成することもある。 In such a circuit board, a ceramic substrate is generally used as an insulating substrate to be bonded to a metal plate. In this case, alumina (Al 2 O 3 ) that can be directly bonded to the metal plate has been used for the ceramic substrate. However, in recent years, instead of the alumina ceramic substrate, Patent Documents 1 to 3 and the like are used. It is considered that it is effective to use a nitride ceramic substrate such as aluminum nitride (AlN) having excellent thermal conductivity. The insulating substrate may be composed of other materials such as a resin material.
ところで、上述したような回路基板を製造するには、セラミックス基板等に代表される絶縁基板に、金属板を接合させた後、金属板の露出表面上に感光性フィルムをラミネートし、次いで、その感光性フィルムを露光及び現像することにより、感光性フィルムに所定のレジストパターンを形成し、その後、エッチングによって、レジストパターンを介して金属板の不要な部分を除去することにより、金属板に回路パターンを形成し、最後に、レジストパターンを剥離して除去することが一般に行われている。 By the way, in order to manufacture a circuit board as described above, a metal plate is bonded to an insulating substrate typified by a ceramic substrate, and then a photosensitive film is laminated on the exposed surface of the metal plate. By exposing and developing the photosensitive film, a predetermined resist pattern is formed on the photosensitive film, and then by etching, unnecessary portions of the metal plate are removed through the resist pattern, whereby a circuit pattern is formed on the metal plate. In general, the resist pattern is finally removed by removing the resist pattern.
しかるに、このように、絶縁基板上の金属板に、エッチングによって金属板の不要部分を除去することは、回路基板の製造工程を複雑化させて製造能率を低下させるとともに、製造コストの増大を招くという問題がある。特に、窒化アルミニウムからなる絶縁基板は比較的高価であるので、これを用いる回路基板では、エッチングによる回路パターンの形成は、回路基板の価格をさらに上昇させる。 However, removing unnecessary portions of the metal plate by etching on the metal plate on the insulating substrate in this manner complicates the circuit board manufacturing process, lowers the manufacturing efficiency, and increases the manufacturing cost. There is a problem. In particular, since an insulating substrate made of aluminum nitride is relatively expensive, the formation of a circuit pattern by etching further increases the price of the circuit substrate in a circuit substrate using the insulating substrate.
また、上述したようにしてエッチングにより回路パターンを形成すると、エッチング反応が拡散律速で等方的に進行することに起因して、図１１に断面図で示すように、回路基板１０１の厚み方向で、金属板１０２の露出表面Ｓｅから絶縁基板１０３側の接合表面Ｓｂに向かうに従って、金属板１０２の除去される部分が少なくなる。その結果として、回路基板１０１の断面視で、エッチングにより除去せずに残した金属板１０２の複数の回路構成部分１０２ａ、１０２ｂの相互が、絶縁基板１０３側に向かうに従って次第に接近するテーパ形状をなすパターン溝１０４が形成されることが知られている。 Further, when the circuit pattern is formed by etching as described above, the etching reaction proceeds isotropically by diffusion rate control, and therefore, in the thickness direction of the circuit board 101 as shown in the sectional view of FIG. The portion of the metal plate 102 that is removed decreases from the exposed surface Se of the metal plate 102 toward the bonding surface Sb on the insulating substrate 103 side. As a result, in the cross-sectional view of the circuit board 101, the plurality of circuit constituent parts 102a and 102b of the metal plate 102 left without being removed by etching form a tapered shape that gradually approaches toward the insulating substrate 103 side. It is known that a pattern groove 104 is formed.
これにより、特に、放熱性の向上等を目的として、回路基板１０１の金属板１０２を厚みが比較的厚いものとした場合は、絶縁基板１０３との接合表面Ｓｂ側の金属板１０２の不要部分がエッチングで十分に除去されずに、絶縁基板１０３側で金属板の複数の回路構成部分１０２ａ、１０２ｂが極めて近接し、又は甚だしくは接触することになり、パターニングによる絶縁性が確保されなくなるという問題があった。
この金属板は半導体素子の直下に位置することがあり、その厚みはパワーモジュールの放熱に大きく影響するところ、エッチングによって回路パターンの形成する手法では、上述した絶縁性低下の理由より、金属板の厚みを厚くすることには限界があるので、この手法によっては、金属板厚みの増大による放熱性の更なる向上を実現することができなかった。
Thereby, in particular, when the metal plate 102 of the circuit board 101 is made relatively thick for the purpose of improving heat dissipation, an unnecessary portion of the metal plate 102 on the bonding surface Sb side with the insulating substrate 103 is removed. A plurality of circuit components 102a and 102b of the metal plate are very close to each other or come into contact with each other on the insulating substrate 103 side without being sufficiently removed by etching, and insulation by patterning cannot be secured. there were.
This metal plate may be located directly under the semiconductor element, and its thickness greatly affects the heat dissipation of the power module. In the method of forming a circuit pattern by etching, the metal plate has Since there is a limit to increasing the thickness, it has not been possible to achieve further improvement in heat dissipation by increasing the thickness of the metal plate by this method.
この発明は、このような問題を解決することを課題とするものであり、それの目的とするところは、回路基板用金属板の厚みの大小によらず、パターニングによる所要の絶縁性を確保しつつ、回路基板を容易に製造することのできる回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュール、ならびに、パワーモジュールの製造方法を提供することにある。 The object of the present invention is to solve such problems, and the object of the invention is to ensure the required insulation by patterning regardless of the thickness of the metal plate for circuit boards. It is another object of the present invention to provide a circuit board metal plate, a circuit board metal plate molded product, a circuit board and a power module, and a method for manufacturing the power module that can easily manufacture a circuit board.
発明者は鋭意検討の結果、当該技術分野ではこれまでに用いられていなかったプレス成形により、たとえば回路パターンに合わせた所定の形状の金属板を予め成形した後に、これを絶縁基板に接合させるという新規な手法を用いることにより、先述したようなエッチングによって回路パターンを形成する場合の問題を解決できることを新たに見出した。 As a result of intensive studies, the inventor has previously formed a metal plate having a predetermined shape according to a circuit pattern, for example, by press molding that has not been used in the art so far, and then bonds the metal plate to an insulating substrate. It has been newly found that the problem in forming a circuit pattern by etching as described above can be solved by using a new technique.
かかる知見に基き、この発明の回路基板用金属板は、プレス成形により形成されてなるものである。
この発明の回路基板用金属板は、プレス成形による切断面を有し、該切断面に、破断面領域とせん断面領域とが形成されたものとすることができる。
Based on this knowledge, the metal plate for a circuit board of the present invention is formed by press molding.
The metal plate for a circuit board according to the present invention may have a cut surface by press molding, and a fracture surface region and a shear surface region may be formed on the cut surface.
ここで、当該回路基板用金属板の裏面と前記切断面のせん断面領域とがなす角部に、前記切断面側に向けて当該回路基板用金属板の厚みを漸減させる向きに湾曲するダレ部が形成されていることがある。 Here, a sag portion that curves in a direction to gradually reduce the thickness of the metal plate for the circuit board toward the cut surface side at a corner portion formed by the back surface of the metal plate for the circuit board and the shear plane region of the cut surface May be formed.
この場合、前記ダレ部を通る断面視で、当該回路基板用金属板の幅Ｗｐに対するダレ部形成領域の幅Ｗｄの割合は、百分率で表して１０％以下であることが好ましい。
またこの場合、前記ダレ部を通る断面視で、回路基板用金属板の厚みＤに対するダレ部形成領域の高さＨｄの比が、１／３以下であることが好ましい。
In this case, it is preferable that the ratio of the width Wd of the sagging portion forming region to the width Wp of the circuit board metal plate is 10% or less as a percentage in a sectional view passing through the sagging portion.
In this case, it is preferable that the ratio of the height Hd of the sag portion forming region to the thickness D of the circuit board metal plate is 1/3 or less in a sectional view passing through the sag portion.
また、この発明の回路基板用金属板は、互いに離隔する複数個の回路構成部品を有することが好ましい。
上記の回路構成部品の厚みは、０．２ｍｍ〜３．０ｍｍの範囲内とすることが好ましい。
The circuit board metal plate of the present invention preferably has a plurality of circuit components separated from each other.
The thickness of the circuit component is preferably in the range of 0.2 mm to 3.0 mm.
上記の複数個の回路構成部品は、互いに切り離されて独立して存在するものとすることができる。 The plurality of circuit components may be separated from each other and exist independently.
この発明の回路基板用金属板成形品は、上記の回路基板用金属板を備えるものであって、複数個の回路構成部品のそれぞれの形状に対応する複数個の嵌合孔部を設けた部品保持部材を有し、前記部品保持部材の複数個の嵌合孔部内に、複数個の回路構成部品が、厚み方向の少なくとも一部で摩擦係合して嵌め込まれてなるものである。 A metal plate molded product for a circuit board according to the present invention comprises the above metal plate for a circuit board, and is a component provided with a plurality of fitting holes corresponding to the shapes of a plurality of circuit components. A holding member is provided, and a plurality of circuit components are fitted into the plurality of fitting holes of the component holding member by frictional engagement at least in part in the thickness direction.
この場合においては、部品保持部材の厚み方向で、回路構成部品の、前記嵌合孔部内への嵌込み量を、回路構成部品の厚みの１０％〜７０％の範囲内とすることが好ましい。
またここでは、回路構成部品の、前記嵌合孔部内への嵌込み量の最大値と最小値の差を、０．３ｍｍ以下とすることが好ましい。
またこの場合、前記嵌合孔部内に嵌め込まれた複数個の回路構成部品が、部品保持部材の表面側で該表面から窪んで位置するとともに、部品保持部材の裏面側で該裏面から突出して位置するものとすることができる。
なお、この明細書及び特許請求の範囲では、部品保持部材等の「表面」及び「裏面」との用語は、単に、部品保持部材等の一方の面と、その裏側の他方の面とを区別するためのみに用いており、「裏面」と「表面」とを入れ替えて解釈することも可能である。
In this case, in the thickness direction of the component holding member, it is preferable that the amount of insertion of the circuit component into the fitting hole is in the range of 10% to 70% of the thickness of the circuit component.
Here, it is preferable that the difference between the maximum value and the minimum value of the amount of insertion of the circuit component into the fitting hole is 0.3 mm or less.
Also, in this case, the plurality of circuit components fitted in the fitting hole are positioned so as to be recessed from the surface on the front surface side of the component holding member, and are projected from the back surface side of the component holding member. Can be.
In this specification and claims, the terms “front surface” and “back surface” of a component holding member and the like simply distinguish one surface of the component holding member and the other surface on the back side thereof. It is also possible to interpret the “back surface” and “front surface” interchangeably.
そしてまたここでは、前記嵌合孔部内に嵌め込まれた複数個の回路構成部品の相互間の間隔は、回路構成部品の厚みに対する比で表して、０．５以上とすることが好ましい。
なお、上記の部品保持部材は、一方向に向けて延びる金属条の形状をなすものとすることができる。
And here, it is preferable that the space | interval between the some circuit component components engage | inserted in the said fitting hole part shall be 0.5 or more expressed with the ratio with respect to the thickness of a circuit component component.
In addition, said component holding member shall make the shape of the metal strip extended toward one direction.
この発明の回路基板は、上記のいずれかの回路基板用金属板の回路構成部品と、前記回路構成部品が接合された絶縁基板とを備えるものである。
この発明の回路基板では、絶縁基板上に接合された複数個の回路構成部品が、該回路構成部品の厚み方向の全体にわたって、０．５ｍｍ〜５．０ｍｍの範囲内で互いに離隔して配置されていることが好ましい。
またこの発明のパワーモジュールは、上記のいずれかの回路基板を備えるものである。
A circuit board according to the present invention includes any one of the circuit component parts of the metal plate for circuit boards described above and an insulating substrate to which the circuit component parts are bonded.
In the circuit board according to the present invention, a plurality of circuit component parts bonded on the insulating substrate are arranged apart from each other within a range of 0.5 mm to 5.0 mm over the entire thickness direction of the circuit component parts. It is preferable.
The power module of the present invention includes any one of the circuit boards described above.
この発明のパワーモジュールの製造方法は、プレス成形により金属材料を打ち抜いて、該金属材料から、互いに離隔する複数個の回路構成部品を成形し、その後、回路構成部品を絶縁基板上に貼付させ、回路構成部品上に半導体素子を搭載することにある。 The method for manufacturing a power module of the present invention includes punching a metal material by press molding, forming a plurality of circuit components separated from each other from the metal material, and then bonding the circuit components on an insulating substrate. The semiconductor element is mounted on the circuit component.
この発明のパワーモジュールの製造方法では、プレス成形により回路構成部品を成形するに当り、前記金属材料を打ち抜いて、該金属材料を、互いに離隔する複数個の回路構成部品と、複数個の回路構成部品のそれぞれの外輪郭形状に対応する形状をなす複数個の嵌合孔部を設けた部品保持部材とに分離し、次いで、各回路構成部品を、部品保持部材の対応する各嵌合孔部内に、厚み方向の少なくとも一部で摩擦係合させて嵌め込んで、回路構成部品及び部品保持部材を有する金属板成形品を形成し、回路構成部品を絶縁基板上に貼付させるに際し、前記金属板成形品の回路構成部品を絶縁基板に接合させ、その後、絶縁基板上の回路構成部品から、前記金属板成形品の部品保持部材を取り外して、該部品保持部材を除去することが好ましい。 In the power module manufacturing method according to the present invention, when forming circuit components by press molding, the metal material is punched out, and the metal material is separated from each other by a plurality of circuit components and a plurality of circuit components. The component holding member is provided with a plurality of fitting hole portions each having a shape corresponding to each outer contour shape of the component, and then each circuit component is placed in each corresponding fitting hole portion of the component holding member. In order to form a metal plate molded article having a circuit component and a component holding member by friction engagement with at least a part in the thickness direction, and to attach the circuit component on the insulating substrate, the metal plate It is preferable to join the circuit component of the molded product to the insulating substrate, and then remove the component holding member of the metal plate molded product from the circuit component on the insulating substrate and remove the component holding member.
この発明によれば、プレス成形により所定の形状に成形された回路基板用金属板を、絶縁基板、例えばセラミックス基板上に接合させることにより、回路基板を容易に製造することができる。
また、プレス成形では、先述のエッチングのようなテーパ形状の断面にならない切断面を形成することができるので、金属板のパターニングによる所要の絶縁性を確保することができる。
According to this invention, a circuit board can be easily manufactured by joining a metal plate for circuit boards formed into a predetermined shape by press molding onto an insulating substrate, for example, a ceramic substrate.
In press molding, a cut surface that does not have a tapered cross-section as in the above-described etching can be formed, so that necessary insulation by patterning a metal plate can be ensured.
以下に図面を参照しながら、この発明の実施の形態について詳細に説明する。
図１に例示するところにおいて、図中１は、この発明の一の実施形態の回路基板用金属板（以下、単に「金属板」ともいう。）を示し、また、図中２は、回路基板用金属板１が表面に接合される絶縁基板を、図中３は、絶縁基板２の裏面に接合された金属箔をそれぞれ示す。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the example illustrated in FIG. 1, reference numeral 1 denotes a circuit board metal plate (hereinafter also simply referred to as “metal plate”) according to an embodiment of the present invention, and reference numeral 2 denotes a circuit board. In the figure, reference numeral 3 denotes a metal foil bonded to the back surface of the insulating substrate 2.
ここで、絶縁基板２は、セラミックス又は樹脂その他の材料からなるものである。絶縁基板２をセラミックス材料からなるものとする場合、そのようなセラミックス材料の具体例としては、たとえば、アルミナ（Ａｌ2Ｏ3）等の酸化物セラミックス又は、窒化アルミニウム（ＡｌＮ）等の窒化物アルミニウムを挙げることができる。なかでも、窒化アルミニウムは、優れた熱伝導性を有し、パワー半導体素子により生じた熱を効果的に放散させることができるので、絶縁基板２の材質として好適である。 Here, the insulating substrate 2 is made of ceramics, resin or other material. When the insulating substrate 2 is made of a ceramic material, specific examples of such a ceramic material include oxide ceramics such as alumina (Al 2 O 3 ) or nitride aluminum such as aluminum nitride (AlN). Can be mentioned. Among these, aluminum nitride is suitable as a material for the insulating substrate 2 because it has excellent thermal conductivity and can effectively dissipate heat generated by the power semiconductor element.
またここで、金属板１は、たとえば、純銅又は、所要の元素を添加した銅合金等の金属材料からなる金属箔ないし金属板の形態をなすものとすることができ、絶縁基板２の表面に直接的に接合され、又は銀のろう材もしくはチタンの接合層等を介して間接的に接合される。
より具体的には、金属板１を構成する純銅としては、たとえば、タフピッチ銅や、無酸素銅、高純度銅等を挙げることができ、また、銅合金としては、たとえば、錫含有銅やジルコニウム含有銅、銀含有銅、クロム含有銅等を挙げることができる。
Here, the metal plate 1 can be in the form of a metal foil or a metal plate made of a metal material such as pure copper or a copper alloy to which a required element is added, for example, on the surface of the insulating substrate 2. They are bonded directly or indirectly through a silver brazing material or a titanium bonding layer.
More specifically, examples of the pure copper constituting the metal plate 1 include tough pitch copper, oxygen-free copper, and high-purity copper, and examples of the copper alloy include tin-containing copper and zirconium. Examples thereof include copper containing, silver containing copper, and copper containing chromium.
そしてまた、金属箔３は、金属板１と同様の、純銅又は、所要の元素を添加した銅合金等の金属材料からなるものであり、絶縁基板２の裏面に直接的又は間接的に接合される。但し、回路基板によっては、絶縁基板２の裏面側にこのような金属箔３を設けないこともあるので、この発明の回路基板では、金属箔３は必須の構成ではない。 The metal foil 3 is made of a metal material such as pure copper or a copper alloy to which a required element is added, similar to the metal plate 1, and is directly or indirectly joined to the back surface of the insulating substrate 2. The However, depending on the circuit board, such a metal foil 3 may not be provided on the back side of the insulating substrate 2, and therefore the metal foil 3 is not an essential component in the circuit board of the present invention.
ここにおいて、従来は、金属箔を絶縁基板の表面上に、たとえば直接的に接合させた後、その金属箔の露出表面に感光性フィルムを積層させるとともに露光・現像してマスクし、エッチングによりマスクを介して金属箔の不要部分を除去して、金属箔に回路パターンを形成していた。
しかしながら、このようなエッチングによる回路パターンの形成は、工程が複雑であり、製造能率の低下及び製造コストの増加を招く他、特に金属箔の厚みを増加させた場合に、金属箔の厚み方向にわたって不要部分を確実にエッチング除去できないことから、絶縁性の低下をもたらすという問題があった。
Here, conventionally, after a metal foil is bonded directly onto the surface of an insulating substrate, for example, a photosensitive film is laminated on the exposed surface of the metal foil, masked by exposure and development, and masked by etching. The circuit pattern was formed in the metal foil by removing an unnecessary portion of the metal foil through the metal foil.
However, the formation of the circuit pattern by such etching is complicated in process, leading to a decrease in manufacturing efficiency and an increase in manufacturing cost, and particularly when the thickness of the metal foil is increased, the thickness of the metal foil is increased. Since unnecessary portions cannot be removed by etching reliably, there is a problem in that the insulating property is lowered.
この問題に対処するため、この実施形態では、金属条等の形状をなす金属材料にプレス成形を施して、所定の形状の金属板１を予め成形し、この金属板１を、図１に矢印で示す如く絶縁基板２の表面上に接合させる。
それにより、従来技術のような複雑なエッチング工程を経ることなしに、図２に示すような回路基板４を製造することができる。またプレス成形により、図３に断面図で示すように、たとえば、金属板１の表面Ｓｆや裏面Ｓｂに対して略垂直な切断面８を形成することが可能になり、この場合、金属板１の厚み方向の全体にわたって、互いに対向する切断面８を所定の距離で離して位置させることができるので、所要の絶縁性を確実に確保することができる。
In order to cope with this problem, in this embodiment, a metal material having a shape such as a metal strip is press-molded to pre-form a metal plate 1 having a predetermined shape, and this metal plate 1 is indicated by an arrow in FIG. As shown in FIG. 2, the surface is bonded to the surface of the insulating substrate 2.
Accordingly, the circuit board 4 as shown in FIG. 2 can be manufactured without going through a complicated etching process as in the prior art. Further, as shown in a cross-sectional view in FIG. 3, for example, the cut surface 8 that is substantially perpendicular to the front surface Sf and the back surface Sb of the metal plate 1 can be formed by press molding. Since the cut surfaces 8 facing each other can be positioned at a predetermined distance over the entire thickness direction, the required insulation can be ensured reliably.
なお、上記の回路基板４を、必要に応じて、金属箔３側で、図示しないベース板（ヒートシンク）上に固定するとともに、回路基板４の金属板１上に、これも図示しない半導体素子を搭載することにより、パワーモジュールを製造することができる。 The circuit board 4 is fixed on a base plate (heat sink) (not shown) on the metal foil 3 side as necessary, and a semiconductor element (not shown) is also provided on the metal plate 1 of the circuit board 4. By mounting, a power module can be manufactured.
図１に示す実施形態では、金属板１は、プレス成形により回路パターン６が形成されたことに起因して、回路パターン６によって互いに離隔される複数個の回路構成部品７を有するものである。 In the embodiment shown in FIG. 1, the metal plate 1 has a plurality of circuit components 7 separated from each other by the circuit pattern 6 due to the circuit pattern 6 being formed by press molding.
さらにこの実施形態の金属板１では、図１に示すように、複数個の回路構成部品７が、互いに連結されずに切り離されて、独立に存在している。
そのため、図１の実施形態では、同図に矢印で示すように、金属板１の別個独立した複数個の回路構成部品７のそれぞれを、絶縁基板２の表面上の所定の箇所に接合することにより、図２に示すような回路パターン６を有する回路基板４を製造することができる。
このような互いに独立した複数個の回路構成部品７を有する金属板１は、後述のプレス成形の打抜き加工によって形成することができる。
Furthermore, in the metal plate 1 of this embodiment, as shown in FIG. 1, a plurality of circuit components 7 are separated without being connected to each other and exist independently.
Therefore, in the embodiment of FIG. 1, each of the plurality of independent circuit components 7 of the metal plate 1 is joined to a predetermined location on the surface of the insulating substrate 2 as indicated by an arrow in the drawing. Thus, the circuit board 4 having the circuit pattern 6 as shown in FIG. 2 can be manufactured.
Such a metal plate 1 having a plurality of circuit component parts 7 independent from each other can be formed by stamping of press molding described later.
金属板１を構成する各回路構成部品７の厚みＤは、たとえば、０．２ｍｍ〜３．０ｍｍの範囲内とすることができる。特に、金属板１を、たとえば０．５ｍｍ以上の厚みの回路構成部品７からなるものとした場合、上述したようにエッチングによってはパターニングによる絶縁性が低下する場合が多いので、この実施形態のように、プレス成形により回路パターン６を予め付与した金属板１を用いることが有利である。
従って、この観点から、回路構成部品７は、厚みが０．２ｍｍ〜３．０ｍｍのものであることが有利である。この一方で、回路構成部品７の厚みが上記の上限値を超えるものである場合は、回路構成部品の形状不良が発生するおそれがある。
The thickness D of each circuit component 7 constituting the metal plate 1 can be, for example, in the range of 0.2 mm to 3.0 mm. In particular, when the metal plate 1 is made of, for example, a circuit component 7 having a thickness of 0.5 mm or more, the insulating property due to patterning is often lowered by etching as described above. In addition, it is advantageous to use the metal plate 1 to which the circuit pattern 6 has been applied in advance by press molding.
Therefore, from this point of view, it is advantageous that the circuit component 7 has a thickness of 0.2 mm to 3.0 mm. On the other hand, when the thickness of the circuit component part 7 exceeds the above upper limit value, there is a possibility that the shape defect of the circuit component part may occur.
なお、このように回路構成部品７の厚みＤを比較的厚くすることで、その上に搭載される半導体素子が発する熱を、回路構成部品７で有効に放散することが可能になって、絶縁基板側に設けていたヒートシンクを不要とすることができる場合がある。この場合、ヒートシンクを設けないことにより、パワーモジュール全体として飛躍的な薄肉化、小型化を実現することができる。 In addition, by making the thickness D of the circuit component 7 relatively thick in this way, the heat generated by the semiconductor element mounted thereon can be effectively dissipated by the circuit component 7, so In some cases, the heat sink provided on the substrate side may be unnecessary. In this case, by not providing the heat sink, the power module as a whole can be dramatically reduced in thickness and size.
上記のような金属板１をプレス成形により製造するには、たとえば、図４（ａ）に模式的に示すように、平板状の金属材料５１を、互いに離隔させて位置させたパンチ６１及びダイ６２の間に配置し、その後、図４（ｂ）に示すように、パンチ６１を、金属材料５１の厚みを超える押し込み量で、ダイ６２に向けて押し込んで、金属材料５１を打ち抜くことにより、金属板１の回路構成部品７を分離させてそれぞれ得ることができる。 In order to manufacture the metal plate 1 as described above by press molding, for example, as schematically shown in FIG. 4A, a punch 61 and a die in which flat metal materials 51 are positioned apart from each other. 4 and then punching the metal material 51 by pushing the punch 61 toward the die 62 with a pushing amount exceeding the thickness of the metal material 51, as shown in FIG. The circuit components 7 of the metal plate 1 can be obtained separately.
この場合、金属板１の回路構成部品７の側面は、図５（ａ）に例示するような、上記のプレス成形の抜き加工により形成される切り口面としての切断面８になる。
より詳細には、この切断面８は、金属板１の厚み方向（図５（ａ）では上下方向）に直交する幅方向（図５（ａ）では左右方向）に延びる各一層の破断面領域８ａ及びせん断面領域８ｂからなるものであり、ここでは、破断面領域８ａは、金属板１の表面Ｓｆ側に位置するとともに、破断面領域８ａに隣接するせん断面領域８ｂは、金属板１の裏面Ｓｂ側に位置する。
In this case, the side surface of the circuit component 7 of the metal plate 1 becomes a cut surface 8 as a cut surface formed by the above punching punching process as illustrated in FIG.
More specifically, the cut surface 8 is a fracture surface area of each layer extending in the width direction (left-right direction in FIG. 5A) orthogonal to the thickness direction of the metal plate 1 (up-down direction in FIG. 5A). 8a and a shear surface region 8b. Here, the fracture surface region 8a is located on the surface Sf side of the metal plate 1, and the shear surface region 8b adjacent to the fracture surface region 8a is formed of the metal plate 1. Located on the back surface Sb side.
なおここで、切断面８の上記のせん断面領域８ｂは、プレス成形によって金属板１の厚み方向に引き伸ばされた際にパンチ６１又はダイ６２に擦れることによって形成されるものと考えられ、図５（ａ）に示すように、厚み方向に若干の線状模様の入った平滑面となる。一方、破断面領域８ａは、プレス成形で引き伸ばされた後に、スクラップとなる金属板残部から引きちぎられることによって生じるものと考えられ、図５（ａ）に示すように、せん断面領域８ｂとは明確に異なり、凹凸が存在するディンプル状の面となることが知られている。 Here, the shear surface region 8b of the cut surface 8 is considered to be formed by rubbing against the punch 61 or the die 62 when stretched in the thickness direction of the metal plate 1 by press molding. As shown in (a), the surface becomes a smooth surface with a slight linear pattern in the thickness direction. On the other hand, the fracture surface region 8a is considered to be generated by being pulled from the remainder of the metal plate that becomes scrap after being stretched by press forming, and as shown in FIG. 5 (a), it is clear from the shear surface region 8b. It is known that the surface is a dimple-like surface with unevenness.
金属板１が、このような切断面８を有する場合、その切断面８のせん断面領域８ｂと、金属板１の裏面Ｓｂとがなす角部に、図５（ｂ）及び図６に断面図で示すように、切断面８側（図５（ｂ）では左側）に向けて金属板１の厚みを漸減させる向きに湾曲する曲面状等の傾斜面を有するダレ部９が形成されることがある。このようなダレ部９の形成は、プレス成形時のパンチの６１の押し込みに起因するものと考えられている。 When the metal plate 1 has such a cut surface 8, cross-sectional views in FIG. 5 (b) and FIG. 6 are shown at corners formed by the shear surface region 8 b of the cut surface 8 and the back surface Sb of the metal plate 1. As shown in FIG. 5, a sag portion 9 having an inclined surface such as a curved surface that curves in a direction to gradually reduce the thickness of the metal plate 1 toward the cut surface 8 side (left side in FIG. 5B) is formed. is there. Such formation of the sag portion 9 is considered to be caused by the pressing of the punch 61 during press molding.
かかるダレ部９が大きく形成されると、このダレ部９側である金属板１の裏面Ｓｂを、絶縁基板２に接合した際に、ダレ部９で絶縁基板２と十分に密着しないことになるので、回路基板４としての十分な密着性を確保し得ないことがある。なお、金属板１の表面Ｓｆ側の角部には、表面Ｓｆから突出するバリが形成され得るので、この表面Ｓｆ側を絶縁基板２に接合することは、密着性の観点から望ましいとはいえない。 If the sagging portion 9 is formed large, the sagging portion 9 does not sufficiently adhere to the insulating substrate 2 when the back surface Sb of the metal plate 1 on the sagging portion 9 side is bonded to the insulating substrate 2. Therefore, sufficient adhesion as the circuit board 4 may not be ensured. Since burrs protruding from the surface Sf can be formed at the corners on the surface Sf side of the metal plate 1, it can be said that joining the surface Sf side to the insulating substrate 2 is desirable from the viewpoint of adhesion. Absent.
それ故に、図６に示すように、ダレ部９を通る断面で視て、金属板１を構成する回路構成部品７の幅Ｗｐに対するダレ部形成領域の幅Ｗｄの割合（Ｗｄ／Ｗｐ）は、百分率で表して１０％以下とすることが好ましく、なかでも３％以下とすることがより好ましい。
また、同様にダレ部９を通る断面で視た場合、金属板１を構成する回路構成部品７の厚みＤに対するダレ部形成領域の高さＨｄの比（Ｈｄ／Ｄ）は、１／３以下とすることが好ましく、特に百分率で１％以下とすることがより好ましい。
Therefore, as shown in FIG. 6, the ratio (Wd / Wp) of the width Wd of the sagging portion forming region to the width Wp of the circuit component 7 constituting the metal plate 1 as viewed in a cross section passing through the sagging portion 9 is The percentage is preferably 10% or less, and more preferably 3% or less.
Similarly, when viewed in a cross section passing through the sag portion 9, the ratio (Hd / D) of the height Hd of the sag portion forming region to the thickness D of the circuit component 7 constituting the metal plate 1 is 1/3 or less. In particular, the percentage is more preferably 1% or less.
それにより、ダレ部９を比較的小さくして、プレス成形により形成した金属板１であっても、絶縁基板２との密着性を大きく向上させることが可能になる。
回路構成部品７の幅Ｗｐに対するダレ部形成領域の幅Ｗｄの割合（Ｗｄ／Ｗｐ）が１０％を超える場合、ダレ部９が大きな幅方向の範囲で絶縁基板２と密着しないことから、密着性が不十分になるおそれがある。また、回路構成部品７の厚みＤに対するダレ部形成領域の高さＨｄの比（Ｈｄ／Ｄ）が１／３を超える場合、絶縁基板２との密着力が低下することが懸念される。
Thereby, even if it is the metal plate 1 formed by press molding by making the sagging part 9 comparatively small, it becomes possible to improve the adhesiveness with the insulating substrate 2 greatly.
When the ratio (Wd / Wp) of the width Wd of the sagging portion formation region to the width Wp of the circuit component 7 exceeds 10%, the sagging portion 9 does not adhere to the insulating substrate 2 in the large width direction. May become insufficient. Moreover, when the ratio (Hd / D) of the height Hd of the sagging portion formation region to the thickness D of the circuit component 7 exceeds 1/3, there is a concern that the adhesion with the insulating substrate 2 is reduced.
なおここで、ダレ部９は、図６に示す断面で、ダレ部９を通る断面で、回路構成部品７の、厚みが一定になる幅方向中央部の裏面Ｓｂに平行な直線と、切断面８の特にせん断面領域８ｂに平行な直線とで囲まれる領域にある部分とする。従って、回路構成部品７の厚みは、図６に示すように、切断面８側に向かうに従って、ダレ部９で次第に薄くなるところ、ダレ部形成領域の幅Ｗｄは、その厚みが薄くなり始める位置Ｐａから、切断面８のせん断面領域８ｂまでの長さを意味し、また、ダレ部形成領域の高さＨｄは、その位置Ｐａから、せん断面領域８ｂまでの長さを意味する。 Here, the sag portion 9 is a cross section shown in FIG. 6, and is a cross section passing through the sag portion 9. 8 is a portion in a region surrounded by a straight line parallel to the shear surface region 8b. Therefore, as shown in FIG. 6, the thickness of the circuit component 7 gradually decreases at the sag portion 9 as it goes to the cut surface 8, and the width Wd of the sag portion formation region is a position where the thickness starts to decrease. The length from Pa to the shear surface region 8b of the cut surface 8 is meant, and the height Hd of the sag portion forming region means the length from the position Pa to the shear surface region 8b.
図７に、一の実施形態の回路基板用金属板成形品２１（以下、単に「金属板成形品２１」ともいう。）を示す。
図７に示す金属板成形品２１は、先述したような複数個の回路構成部品２７と、さらに、回路構成部品２７のそれぞれが嵌め込まれた複数個の嵌合孔部２８ａを有する部品保持部材２８とを有する。この実施形態では、部品保持部材２８は、たとえば平面視が方形状等のプレート形状をなすものとしたが、図示は省略するが、一方向に向かって延びる長尺の金属条の形状のものとすることも可能であり、このような部品保持部材では、複数個の回路構成部品２７が嵌め込まれた複数個の嵌合孔部２８ａの複数組を、長尺の金属条の長手方向に一定のピッチで設けることができる。
FIG. 7 shows a metal plate molded product 21 for a circuit board (hereinafter also simply referred to as “metal plate molded product 21”) according to one embodiment.
The metal plate molded product 21 shown in FIG. 7 has a plurality of circuit component parts 27 as described above and a component holding member 28 having a plurality of fitting hole portions 28a into which the circuit component parts 27 are fitted. And have. In this embodiment, the component holding member 28 has a plate shape such as a square shape in plan view, but is not illustrated, but has a shape of a long metal strip extending in one direction. In such a component holding member, a plurality of sets of the plurality of fitting hole portions 28a into which the plurality of circuit component parts 27 are fitted are fixed in the longitudinal direction of the long metal strip. It can be provided at a pitch.
ここでは、嵌合孔部２８ａのそれぞれは、各回路構成部品２７の外輪郭形状に対応させてそれと同一の平面輪郭形状を有するものとしている。そして、これらの嵌合孔部２８ａのそれぞれに、各回路構成部品２７が嵌め込まれ、回路構成部品２７が嵌合孔部２８ａ内に、その厚み方向の少なくとも一部で摩擦により係合している。 Here, each of the fitting hole portions 28 a has the same planar contour shape as the outer contour shape of each circuit component 27. Each of the circuit component parts 27 is fitted in each of the fitting hole portions 28a, and the circuit component parts 27 are engaged with each other in the fitting hole portion 28a by friction at least partially in the thickness direction. .
この金属板成形品２１では、回路構成部品２７は、部品保持部材２８とほぼ同一の厚みを有し、そして、各回路構成部品２７を厚み方向の一部で、嵌合孔部２８ａに摩擦係合させている。それにより、回路構成部品２７は、部品保持部材２８の表面Ｓｆ側では、図７に示すように、その表面Ｓｆから窪む位置に回路構成部品２７の表面が存在するとともに、部品保持部材２８の裏面Ｓｂ側では、図８に示すように、その裏面Ｓｂから突出する位置に回路構成部品２７の裏面が存在する。 In this metal plate molded product 21, the circuit component 27 has substantially the same thickness as the component holding member 28, and each circuit component 27 is frictionally engaged with the fitting hole 28 a by a part in the thickness direction. It is combined. Thereby, on the surface Sf side of the component holding member 28, the circuit component 27 has the surface of the circuit component 27 in a position recessed from the surface Sf as shown in FIG. On the back surface Sb side, as shown in FIG. 8, the back surface of the circuit component 27 exists at a position protruding from the back surface Sb.
このような金属板成形品２１を成形するには、たとえば、いわゆる順送金型等で、一方向に向けて間欠的に送られる金属材料５１に対し、図９（ａ）及び（ｂ）に例示するように、先述した実施形態と同様にして、パンチ６１を、金属材料５１の厚みを超える押し込み量で、ダイ６２に向けて押し込む打抜き加工を施すことにより、金属材料５１を、複数個の回路構成部品２７と、それらの回路構成部品２７を抜いた箇所に複数個の嵌合孔部２８ａが形成された部品保持部材２８とに分離する。
そしてその後、図９（ｃ）に示すように、部品保持部材２８から分離した回路構成部品２７を、部品保持部材２８の対応する嵌合孔部２８ａに押し戻して、各回路構成部品２７を、対応する各嵌合孔部２８ａ内に嵌め込むことにより、金属板成形品２１を成形することができる。
In order to mold such a metal plate molded product 21, for example, a metal material 51 that is intermittently fed in one direction with a so-called progressive die or the like is illustrated in FIGS. 9A and 9B. In the same manner as in the above-described embodiment, the punching process is performed by pressing the punch 61 toward the die 62 with a pressing amount exceeding the thickness of the metal material 51, so that the metal material 51 is made into a plurality of circuits. The component 27 is separated into a component holding member 28 in which a plurality of fitting hole portions 28a are formed at a position where the circuit component 27 is removed.
Then, as shown in FIG. 9C, the circuit component 27 separated from the component holding member 28 is pushed back into the corresponding fitting hole 28a of the component holding member 28, and each circuit component 27 is handled. The metal plate molded product 21 can be molded by fitting into each fitting hole portion 28a.
金属板成形品２１は、かかるプレス成形により成形されるものであるので、回路構成部品２７の外周面（側面）には、先述したような破断面領域及びせん断面領域が形成された切断面となる。 Since the metal plate molded product 21 is formed by such press molding, the outer peripheral surface (side surface) of the circuit component 27 has a cut surface in which the fracture surface region and the shear surface region as described above are formed. Become.
金属板成形品２１をパワーモジュールの製造に用いるに当っては、回路構成部品２７が突出する側の裏面Ｓｂを、絶縁基板２の表面上に接合した後、たとえば、回路構成部品２７を絶縁基板２側に押圧した状態で、絶縁基板２側とは反対側の向きに、部品保持部材２８を引っ張ることで、回路構成部品２７から部品保持部材２８を取り外して、部品保持部材２８を除去する。なおその後は、先述したところと同様にして、回路構成部品２７上に半導体素子を搭載させるとともに、必要に応じて、金属箔３側にベース板を設けることにより、パワーモジュールを製造することができる。
ここでは、絶縁基板２の表面に接合させるまで、絶縁基板２上での所期した回路パターンを形成する複数個の回路構成部品２７の所定の配置態様を、部品保持部材２８により維持することができるので、回路構成部品２７を、部品保持部材２８に保持された状態で、絶縁基板２の表面に接合させるという極めて簡便な方法により、回路基板４を製造することができる。また、この実施形態の金属板成形品２１は、複数個の回路構成部品２７の形状が部品保持部材２８で確実に維持されるので、微細な回路の形成精度を大きく高めることができる。
When the metal plate molded product 21 is used for manufacturing a power module, after the back surface Sb on the side from which the circuit component 27 protrudes is joined onto the surface of the insulating substrate 2, for example, the circuit component 27 is connected to the insulating substrate. The component holding member 28 is removed from the circuit component 27 by removing the component holding member 28 by pulling the component holding member 28 in the direction opposite to the insulating substrate 2 side while being pressed to the second side. After that, in the same manner as described above, a power module can be manufactured by mounting a semiconductor element on the circuit component 27 and, if necessary, providing a base plate on the metal foil 3 side. .
Here, the predetermined arrangement mode of the plurality of circuit components 27 that form the intended circuit pattern on the insulating substrate 2 can be maintained by the component holding member 28 until it is bonded to the surface of the insulating substrate 2. Therefore, the circuit board 4 can be manufactured by an extremely simple method in which the circuit component 27 is bonded to the surface of the insulating substrate 2 while being held by the component holding member 28. Moreover, since the shape of the some circuit component 27 is reliably maintained by the component holding member 28, the metal plate molded product 21 of this embodiment can greatly improve the formation accuracy of a fine circuit.
上記の金属板成形品２１では、回路構成部品２７を部品保持部材２８に確実に保持させつつ、回路構成部品２７を絶縁基板２の表面に接合した後の部品保持部材２８の分離を、大きな力を要することなしに容易に行い得るものとすることが望ましい。
この観点から、部品保持部材２８の厚み方向で、回路構成部品２７の、嵌合孔部２８ａへの嵌込み量Ｖｅは、図１０に示すように、回路構成部品２７の厚みＤの１０％〜７０％とすることが好適である。回路構成部品２７の嵌込み量Ｖｅが小さすぎると、回路構成部品２７が、部品保持部材２８から意図せずして外れるおそれがある。この一方で、回路構成部品２７の嵌込み量Ｖｅが大きすぎると、回路構成部品２７と部品保持部材２８とが強固に摩擦係合することになって、絶縁基板２上への回路構成部品２７の貼付時に、部品保持部材２８が分離し難くなる他、その分離により回路構成部品２７に意図しない変形が生じることが懸念される。
そのため、回路構成部品２７の嵌込み量Ｖｅは、その厚みＤの３０％〜９５％とすることがより一層好ましい。
In the metal plate molded product 21 described above, separation of the component holding member 28 after joining the circuit component 27 to the surface of the insulating substrate 2 is performed with great force while the circuit component 27 is securely held by the component holding member 28. It would be desirable to be able to do this easily without requiring
From this viewpoint, in the thickness direction of the component holding member 28, the fitting amount Ve of the circuit component 27 into the fitting hole 28a is 10% to the thickness D of the circuit component 27 as shown in FIG. 70% is preferable. If the insertion amount Ve of the circuit component 27 is too small, the circuit component 27 may be unintentionally detached from the component holding member 28. On the other hand, if the insertion amount Ve of the circuit component 27 is too large, the circuit component 27 and the component holding member 28 are firmly frictionally engaged, and the circuit component 27 on the insulating substrate 2 is thus engaged. In addition to being difficult to separate the component holding member 28 at the time of application, there is a concern that unintended deformation may occur in the circuit component 27 due to the separation.
Therefore, the insertion amount Ve of the circuit component 27 is more preferably 30% to 95% of the thickness D.
なお、嵌合孔部２８ａ内に嵌め込まれた回路構成部品２７は、嵌合孔部２８ａ内に嵌め込まれた部分のうち、たとえば、回路構成部品２７の表面Ｓｆ側の角部に形成されて表面Ｓｆから突出するバリ等を含む接触部で、部品保持部材２８の嵌合孔部２８ａの壁面と接触して保持され得る。つまり、回路構成部品２７は、プレス成形により形成されることにより、図５（ｂ）に示す切断面８のような凹凸のある切断面を有することから、部品保持部材２８と、嵌合孔部２８ａ内に嵌め込まれた部分の側面全体では接触せずに、その一部のみの接触部で接触して保持される場合がある。
この場合、回路構成部品２７における、部品保持部材２８と接触するこの接触部の厚み方向の領域は、たとえば回路構成部品２７の厚みＤの１〜５％、典型的には回路構成部品２７の厚みＤの３％程度とすることができる。かかる接触部の領域は、回路構成部品２７の外周面の擦られた痕跡を確認することにより特定することができる。
The circuit component 27 fitted in the fitting hole 28a is formed on the surface of the portion fitted in the fitting hole 28a, for example, at the corner on the surface Sf side of the circuit component 27. The contact portion including a burr or the like protruding from Sf can be held in contact with the wall surface of the fitting hole portion 28 a of the component holding member 28. That is, the circuit component 27 is formed by press molding, and thus has a cut surface with an uneven surface such as the cut surface 8 shown in FIG. 5B. Therefore, the component holding member 28 and the fitting hole There is a case where the entire side surface of the portion fitted in 28a is not in contact but is in contact with and held by only a part of the contact portion.
In this case, the region in the thickness direction of the contact portion in contact with the component holding member 28 in the circuit component 27 is, for example, 1 to 5% of the thickness D of the circuit component 27, typically the thickness of the circuit component 27. It can be about 3% of D. The area of the contact portion can be specified by checking the rubbing trace on the outer peripheral surface of the circuit component 27.
そして、部品保持部材２８で回路構成部品２７を確実に保持させるとともに、絶縁基板２上へ回路構成部品２７を高い精度で強固に貼付するため、上述した嵌込み量Ｖｅの最大値と最小値の差は、０．３ｍｍ以下とすることが好適である。言い換えれば、嵌込み量Ｖｅの最大値と最小値の差が０．３ｍｍを上回ると、回路構成部品２７の各位置で嵌込み量のばらつきが生じて、部品保持部材２８からの回路構成部品２７の意図しない外れが生じる可能性がある他、絶縁基板２上に回路構成部品２７を貼付する際に、それらの十分な密着性が得られない懸念があるとともに、若干ずれて貼付されて所望の回路パターンが得られないことも考えられる。この観点より、嵌込み量Ｖｅの最大値と最小値の差は、０．１ｍｍ以下とすることがより好ましい。 Then, in order to securely hold the circuit component 27 by the component holding member 28 and firmly adhere the circuit component 27 to the insulating substrate 2 with high accuracy, the maximum value and the minimum value of the fitting amount Ve described above are used. The difference is preferably 0.3 mm or less. In other words, when the difference between the maximum value and the minimum value of the insertion amount Ve exceeds 0.3 mm, the variation in the insertion amount occurs at each position of the circuit component 27, and the circuit component 27 from the component holding member 28. There is a possibility that unintentional detachment may occur, and there is a concern that sufficient adhesiveness thereof may not be obtained when the circuit component parts 27 are applied on the insulating substrate 2, and a desired deviation is caused when the circuit component parts 27 are attached with a slight deviation. It is also conceivable that a circuit pattern cannot be obtained. From this viewpoint, the difference between the maximum value and the minimum value of the insertion amount Ve is more preferably 0.1 mm or less.
嵌込み量Ｖｅの最大値と最小値の差は、回路構成部品２７を嵌合孔部２８ａ内へ嵌め込んだパターン５枚について、三次元計測器等を用いて回路構成部品２７の高さを測定し、最大の高さと最小の高さの差を求めることにより算出することができる。例えば定盤上にパターンを置き、定点に対する高さの差から求めることも可能である。
嵌込み量Ｖｅの最大値と最小値の差を上記のようにコントロールするには、たとえば、金型にスペーサを配置したり、ポンチの高さの調整を行って押し戻し量を調整したりすること等により行うことができる。
The difference between the maximum value and the minimum value of the insertion amount Ve is the height of the circuit component 27 using a three-dimensional measuring instrument or the like for five patterns in which the circuit component 27 is inserted into the fitting hole 28a. It can be calculated by measuring and finding the difference between the maximum height and the minimum height. For example, it is possible to place a pattern on a surface plate and obtain the difference from the height difference with respect to the fixed point.
In order to control the difference between the maximum value and the minimum value of the insertion amount Ve as described above, for example, a spacer is arranged on the mold, or the height of the punch is adjusted to adjust the pushback amount. Etc.
ここでは、金属板成形品２１はその全体にわたって均一な厚みＤを有するものとしているところ、回路構成部品２７の、部品保持部材２８の裏面Ｓｂからの突出高さＨｐでいえば、回路構成部品２７の厚みＤの３０％〜９０％とすることが好適であり、この突出高さＨｐは、より好ましくは、厚みＤの５％〜７０％とする。
なお、回路構成部品２７と部品保持部材２８との間には、その厚み方向の少なくとも一部に、摩擦係合箇所ＦＥが存在することになる。この摩擦係合箇所ＦＥは、回路構成部品２７が部品保持部材２８に保持されるのであれば、回路構成部品２７の周方向でその外周面の一部に存在するものであってもよいが、通常は、回路構成部品２７の外周面のほぼ全周にわたって存在する。
Here, the metal plate molded product 21 is assumed to have a uniform thickness D throughout, but the circuit component 27 can be described in terms of the protrusion height Hp of the circuit component 27 from the back surface Sb of the component holding member 28. The thickness D is preferably 30% to 90% of the thickness D, and the protrusion height Hp is more preferably 5% to 70% of the thickness D.
In addition, between the circuit component 27 and the component holding member 28, the friction engagement location FE exists in at least a part in the thickness direction. As long as the circuit component 27 is held by the component holding member 28, the friction engagement portion FE may be present on a part of the outer peripheral surface in the circumferential direction of the circuit component 27. Usually, it exists over almost the entire circumference of the outer peripheral surface of the circuit component 27.
また、プレス成形により形成される金属板成形品２１では、嵌合孔部２８ａ内に嵌め込まれた複数個の回路構成部品２７の相互間の間隔Ｇ（つまり回路パターン幅）は、最も狭い箇所で、回路構成部品２７の厚みＤに対する比（Ｇ／Ｄ）で表して、０．５以上とすることができる。これは、回路構成部品２７の厚みＤに対する間隔Ｇの比（Ｇ／Ｄ）が０．５未満のものは、プレス成形による成形が困難となる可能性があることによる。 Moreover, in the metal plate molded product 21 formed by press molding, the interval G (that is, the circuit pattern width) between the plurality of circuit components 27 fitted in the fitting hole 28a is the narrowest portion. Expressed as a ratio (G / D) to the thickness D of the circuit component 27, it can be 0.5 or more. This is because if the ratio (G / D) of the distance G to the thickness D of the circuit component 27 is less than 0.5, it may be difficult to perform press molding.
このような金属板１や、金属板成形品２１を用いることにより、絶縁基板２上に接合された複数個の回路構成部品７、２７が、回路構成部品の厚み方向の全体にわたって、０．５ｍｍ〜５．０ｍｍの範囲で離隔した回路基板４を製造することが可能になる。 By using such a metal plate 1 or a metal plate molded product 21, a plurality of circuit component parts 7 and 27 bonded on the insulating substrate 2 are 0.5 mm over the entire thickness direction of the circuit component parts. It becomes possible to manufacture the circuit board 4 separated in a range of ˜5.0 mm.
次に、この発明の回路基板用金属板を試作し、その効果を確認したので以下に説明する。但し、ここでの説明は単なる例示を目的としたものであり、それに限定されることを意図するものではない。 Next, the circuit board metal plate according to the present invention was prototyped and the effect thereof was confirmed. However, the description here is for illustrative purposes only and is not intended to be limiting.
（試験例１）
回路基板用金属板の幅Ｗｐに対するダレ部形成領域の幅Ｗｄの割合を、表１及び２に示すように変化させたサンプルＡ〜Ｅの回路基板用金属板を作製し、各サンプルＡ〜Ｅを、拡散接合（熱圧着）、ろう付け等によりセラミックス板や樹脂に貼付して、その貼付け状況を外観観察により調査した。それらの結果をそれぞれ表１及び２に示す。
(Test Example 1)
The circuit board metal plates of Samples A to E in which the ratio of the width Wd of the sagging portion forming region to the width Wp of the circuit board metal plate was changed as shown in Tables 1 and 2 were prepared. Was attached to a ceramic plate or resin by diffusion bonding (thermocompression bonding), brazing, or the like, and the state of application was investigated by appearance observation. The results are shown in Tables 1 and 2, respectively.
表１及び２中、「○」は、セラミックス板や樹脂と回路基板用金属板間に空隙・剥離等の欠陥がなく良好であったことを示し、「△」は、セラミックス板や樹脂と回路基板用金属板間に一部空隙や剥離の欠陥が認められたことを示し、「×」は、セラミックス板や樹脂と回路基板用金属板が貼り付かなかったことを示す。 In Tables 1 and 2, “◯” indicates that there were no defects such as voids or peeling between the ceramic plate or resin and the metal plate for circuit board, and “△” indicates that the ceramic plate or resin and circuit were satisfactory. A gap or a separation defect was recognized between the metal plates for the substrate, and “X” indicates that the ceramic plate or the resin and the metal plate for the circuit board were not attached.
表１及び２に示すところから、ダレ部形成領域の幅の割合（Ｗｄ／Ｗｐ×１００）が小さいほど、特に１０％以下であれば、セラミックス板や樹脂との貼り付けが良好になることが解かる。 From the results shown in Tables 1 and 2, the smaller the width ratio (Wd / Wp × 100) of the sagging portion forming region, the better the bonding with the ceramic plate or the resin, especially when it is 10% or less. I understand.
（試験例２）
図７、８、１０に示すように、部品保持部材の嵌合孔部に回路構成部品を嵌め込んだ金属板成形品で、その嵌込み量の最大値と最小値との差を、表３及び４に示すように変化させたサンプルＡ〜Ｅを作製し、各サンプルＡ〜Ｅを、拡散接合（熱圧着）、ろう付け等によりセラミックス板や樹脂に貼付して、その貼付け状況を外観観察により調査した。それらの結果をそれぞれ表３及び４に示す。
(Test Example 2)
As shown in FIGS. 7, 8, and 10, the difference between the maximum value and the minimum value of the insertion amount of the metal plate molded product in which the circuit component is fitted in the fitting hole portion of the component holding member is shown in Table 3. Samples A to E changed as shown in 4 and 4 are prepared, and each sample A to E is attached to a ceramic plate or resin by diffusion bonding (thermocompression bonding), brazing, or the like, and the appearance of the application is observed. Investigated by The results are shown in Tables 3 and 4, respectively.
表３及び４中、「○」は、セラミックス板や樹脂と金属板成形品間に空隙・剥離等の欠陥がなく良好であったことを示し、「△」は、セラミックス板や樹脂と金属板成形品間に一部空隙や剥離の欠陥が認められたことを示し、「×」は、セラミックス板や樹脂と金属板成形品が貼り付かなかったことを示す。 In Tables 3 and 4, “◯” indicates that there were no defects such as voids or peeling between the ceramic plate or resin and the metal plate molded product, and “△” indicates the ceramic plate, resin, and metal plate. It was shown that some voids or peeling defects were observed between the molded products, and “X” indicates that the ceramic plate or resin and the metal plate molded product were not attached.
表３及び４より、嵌込み量の最大値と最小値の差が小さいほど、セラミックス板や樹脂との密着性が良好になり、特にこの差が０．３ｍｍ以下の場合は、セラミックス板や樹脂との間に、貼り付けの欠陥がほぼ確認されなかった。 From Tables 3 and 4, the smaller the difference between the maximum value and the minimum value of the fitting amount, the better the adhesion with the ceramic plate or resin. Especially when this difference is 0.3 mm or less, the ceramic plate or resin In between, almost no defects in the pasting were confirmed.
１ 回路基板用金属板
２ 絶縁基板
３ 金属箔
４ 回路基板
６、２６ 回路パターン
７、２７ 回路構成部品
８ 切断面
８ａ 破断面領域
８ｂ せん断面領域
２１ 回路基板用金属板成形品
２８ 部品保持部材
２８ａ 嵌合孔部
５１ 金属材料
６１ パンチ
６２ ダイ
Ｄ 金属板、金属材料、回路構成部品の厚み
Ｈｐ 回路構成部品の突出高さ
Ｓｆ 表面
Ｓｂ 裏面
ＦＥ 摩擦係合箇所
DESCRIPTION OF SYMBOLS 1 Metal plate for circuit boards 2 Insulation board 3 Metal foil 4 Circuit board 6, 26 Circuit pattern 7, 27 Circuit component 8 Cutting surface 8a Fracture surface area 8b Shear surface area 21 Metal board molded product for circuit boards 28 Component holding member 28a Fitting hole 51 Metal material 61 Punch 62 Die D Metal plate, metal material, thickness of circuit component Hp Projection height of circuit component Sf Surface Sb Back FE Friction engagement location
Claims (19)
回路構成部品を絶縁基板上に貼付させるに際し、前記金属板成形品の回路構成部品を絶縁基板に接合させ、その後、絶縁基板上の回路構成部品から、前記金属板成形品の部品保持部材を取り外して、該部品保持部材を除去する、請求項１８に記載のパワーモジュールの製造方法。 When forming circuit components by press molding, the metal material is punched out, and the metal material corresponds to a plurality of circuit components separated from each other and outer contour shapes of the plurality of circuit components. It is separated into a component holding member provided with a plurality of fitting hole portions having a shape, and each circuit component is then rubbed at least partially in the thickness direction in each corresponding fitting hole portion of the component holding member. Engage and fit to form a metal plate molded product having circuit components and component holding members,
When affixing the circuit component on the insulating substrate, the circuit component of the metal plate molded product is bonded to the insulating substrate, and then the component holding member of the metal plate molded product is removed from the circuit component on the insulating substrate. The method for manufacturing a power module according to claim 18, wherein the component holding member is removed.
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| KR20190112992A (en) * | 2018-03-27 | 2019-10-08 | 현대모비스 주식회사 | Semiconductor module for power converter and method for fabricating the semiconductor module |
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| WO2018211640A1 (en) * | 2017-05-17 | 2018-11-22 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
| WO2023190575A1 (en) * | 2022-03-30 | 2023-10-05 | デンカ株式会社 | Circuit board manufacturing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168293A (en) * | 1982-03-30 | 1983-10-04 | 三菱電機株式会社 | Method of producing printed circuit board |
| JPS62264689A (en) * | 1986-05-13 | 1987-11-17 | 同和鉱業株式会社 | Manufacture of metal-ceramics junction unit with circuit |
| JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
| JP2002359453A (en) * | 2001-03-29 | 2002-12-13 | Ngk Insulators Ltd | Circuit board and manufacturing method therefor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62117387A (en) * | 1985-11-15 | 1987-05-28 | 松下電工株式会社 | Manufacture of wiring substrate |
| JP2010097963A (en) * | 2008-10-14 | 2010-04-30 | Hitachi Metals Ltd | Circuit board and method for manufacturing the same, and electronic component module |
| JP5002614B2 (en) * | 2009-04-30 | 2012-08-15 | 株式会社東芝 | Manufacturing method of ceramic circuit board |
| JP4409628B1 (en) * | 2009-08-17 | 2010-02-03 | 太平電子工業有限会社 | Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate |
| US8917495B2 (en) * | 2009-09-01 | 2014-12-23 | Kabushiki Kaisha Toyota Jidoshokki | Circuit board production method and circuit board |
-
2016
- 2016-06-24 JP JP2016125784A patent/JP2017085077A/en active Pending
- 2016-10-26 JP JP2016209778A patent/JP2017085102A/en active Pending
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2017
- 2017-10-30 JP JP2017209779A patent/JP2018041973A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168293A (en) * | 1982-03-30 | 1983-10-04 | 三菱電機株式会社 | Method of producing printed circuit board |
| JPS62264689A (en) * | 1986-05-13 | 1987-11-17 | 同和鉱業株式会社 | Manufacture of metal-ceramics junction unit with circuit |
| JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
| JP2002359453A (en) * | 2001-03-29 | 2002-12-13 | Ngk Insulators Ltd | Circuit board and manufacturing method therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190112992A (en) * | 2018-03-27 | 2019-10-08 | 현대모비스 주식회사 | Semiconductor module for power converter and method for fabricating the semiconductor module |
| KR102552716B1 (en) * | 2018-03-27 | 2023-07-06 | 현대모비스 주식회사 | Semiconductor module for power converter and method for fabricating the semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017085102A (en) | 2017-05-18 |
| JP2017085077A (en) | 2017-05-18 |
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