JP2016082017A - Bonding jig and method of manufacturing circuit structure with heat dissipator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding jig capable of maintaining a circuit structure and a heat dissipator in adhesion state by applying a pressure thereto until an adhesive is hardened, without applying a pressure to an electronic component when bonding the heat dissipator to the circuit structure, and to provide a method of manufacturing a circuit structure with a heat dissipator using the same.SOLUTION: A bonding jig 1 includes a first jig 2, and a second jig 3. The first jig 2 is arranged on a circuit structure 4. The second jig 3 is arranged below a heat dissipator 6. The first jig 2 has a first jig body 21, and a plurality of pin members 22. The pin members 22 extend perpendicularly from the surface of the first jig body 21 on the circuit structure 4 side, and arranged at a position capable of abutting against the surface of a circuit board 42 while avoiding an electronic component 43. The pin member 22 exhibits ferromagnetism at at least the tip thereof. The second jig 3 has a second jig body 31, and magnets 32. The magnets 32 are provided on the surface of the second jig body 31 on the heat dissipator 6 side, and arranged correspondingly to respective pin members 22.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a bonding jig and a method for manufacturing a circuit component with a radiator.

  Conventionally, in order to distribute electric power from an in-vehicle power source to various electrical components, an electrical junction box in which a circuit structure is housed in a waterproof case has been used. In general, a circuit structure is formed by bonding a plurality of bus bars constituting a power circuit and a circuit board for controlling driving of electronic components provided in the power circuit via an epoxy adhesive or the like, followed by reflow soldering. It is manufactured by mounting electronic components on a circuit board by attaching.

  In addition, in order to efficiently exhaust the heat generated from electronic components and to keep the temperature of the entire circuit below a certain level and to guarantee the operation of the circuit structure, it is generally thermosetting on the bus bar side surface of the circuit structure. The heat dissipating member is joined by the adhesive.

  Prior art document 1 describes a technique for configuring a circuit configuration body by mounting electronic components on a circuit body joined to a heat dissipation body, thereby obtaining a circuit configuration body with a heat dissipation body. Yes.

JP 2005-151624 A

  When bonding the circuit component and the radiator with an adhesive, in order to ensure sufficient bonding force between the circuit component and the radiator, the adhesive is cured with the circuit component pressed against the radiator. There is a need. However, many electronic components that are vulnerable to pressure are mounted on the circuit structure. Therefore, when joining the heat sink to the circuit structure, pressure is applied to the circuit structure and the heat sink to keep them in close contact until the adhesive is cured without applying pressure to the electronic components. It is difficult. As a result, it is difficult to ensure a sufficient bonding force between the circuit component and the radiator.

  In addition, it is difficult to pass the reflow furnace because the heat sink having a complicated shape is joined in the method of joining the heat sink to the circuit body before mounting the electronic component and then mounting the electronic component. It is.

  The present invention has been made in view of the above background, and when joining a heat sink to a circuit component, the circuit component and the heat are dissipated until the adhesive is cured without applying pressure to the electronic component. It is an object of the present invention to provide a joining jig capable of applying pressure to a body to keep them in close contact with each other, and a method for manufacturing a circuit component with a radiator using the same.

According to one embodiment of the present invention, a heat radiator is bonded to a surface on the bus bar side in a circuit structure including a bus bar, a circuit board stacked on the bus bar, and an electronic component mounted on the circuit board by an adhesive. A joining jig used for
A first jig disposed on the circuit configuration body; and a second jig disposed below the heat dissipating body and paired with the first jig,
The first jig extends vertically from a plate-like first jig body arranged to face the circuit structure, and a surface of the first jig body on the circuit structure side, and has at least a tip. A portion having a plurality of pin members exhibiting ferromagnetism,
The second jig is provided on a surface of the second jig main body facing the heat dissipating body and the heat dissipating body side of the second jig main body, and is disposed corresponding to the plurality of pin members. And has a magnet part made of a permanent magnet or an electromagnet,
The plurality of pin members are in a joining jig characterized in that the plurality of pin members are arranged at positions that can contact the circuit board surface while avoiding the electronic components.

According to another aspect of the present invention, a heat radiator is bonded to the bus bar side surface of a circuit structure having a bus bar, a circuit board laminated on the bus bar, and an electronic component mounted on the circuit board by an adhesive. A method of manufacturing a circuit assembly with a heat radiator by:
The first jig of the joining jig is placed on the tip of the pin member on the circuit structure in the laminate in which the heat radiator, the uncured adhesive, and the circuit structure are laminated in this order. The second jig of the joining jig is placed under the heat dissipating body of the laminated body, and the magnet part is placed on the pin. A pinching step that is arranged so as to correspond to the member and sandwiches the laminate using a magnetic force acting between the tip portion of the pin member and the magnet portion;
A curing step of curing the uncured adhesive while maintaining the sandwiched state,
It is in the manufacturing method of the circuit structure with a heat radiator characterized by having.

  The joining jig has the above-described configuration. Therefore, the joining jig avoids the electronic components mounted on the circuit board when joining the heat radiating body to the circuit component, and the pin member of the first jig and the magnet part of the second jig A magnetic force can be generated between the two. For this reason, the bonding jig applies an appropriate pressure by the magnetic force to the circuit component and the heat radiating member to keep them in close contact until the adhesive is cured without applying pressure to the electronic components. be able to. Therefore, according to the above-mentioned joining jig, the adhesive can be cured while maintaining the above-mentioned close contact state during the manufacture of the circuit component with the radiator, so that the bonding force between the circuit component and the radiator can be increased. It is easy to secure enough.

  The manufacturing method of the said circuit structure with a heat radiator has said each process. Therefore, it is possible to manufacture a circuit component with a radiator that has a good bonding force between the circuit component and the radiator.

  In addition, the manufacturing method of the circuit assembly with the heat radiator includes a case where the heat radiator is joined to the circuit body before the electronic component is mounted, because the heat radiator is joined to the circuit body on which the electronic component is already mounted. In comparison, there is no problem that it is difficult to pass through the reflow furnace.

It is explanatory drawing which showed typically the jig | tool for joining of Example 1. FIG. It is explanatory drawing which showed an example of the circuit structure body to which a heat radiator is joined. It is explanatory drawing for demonstrating typically the manufacturing method of the circuit structure body with a heat radiator using the jig | tool for joining of Example 1. FIG.

  The joining jig is used for joining a heat sink with an adhesive to a bus bar side surface in a circuit structure having a bus bar, a circuit board laminated on the bus bar, and an electronic component mounted on the circuit board. It is what Specific examples of the adhesive include, for example, epoxy adhesives, silicone adhesives, acrylic adhesives, hot melt adhesives, anaerobic adhesives, epoxy adhesive sheets, silicone adhesive sheets, and the like. The thermosetting adhesive can be suitably used. The above adhesives control the orientation of molecules to ensure thermal conductivity and insulation, and have high thermal conductivity and insulation properties such as alumina, aluminum hydroxide, aluminum nitride, magnesia, silicon oxide, boron nitride. Thermal conductivity and insulation can be improved by mixing fillers or the like.

  In the joining jig, at least the tip of the pin member provided in the first jig may exhibit ferromagnetism. This is because it can be pulled by the magnet part of the second jig. Specifically, the pin member may be configured so as to exhibit ferromagnetism as a whole when formed entirely from a ferromagnetic material, or the tip portion is formed from a ferromagnetic material, and the rest are soft. The tip portion may be configured to be ferromagnetic by being formed of a magnetic material, a nonmagnetic material, or the like.

  More specifically, the pin member can be configured to have a pin portion and a ferromagnetic portion that is provided at the tip of the pin portion and is made of a ferromagnetic material. In this case, the distal end portion of the pin member can surely exhibit ferromagnetism, and a relatively inexpensive material can be selected as the material of the pin portion. The size and shape of the ferromagnetic portion in each pin member may be the same, or the size and shape may be different according to the surface shape of the circuit board in the circuit structure. Also, the length of the pin portion can be adjusted as appropriate according to the surface shape of the circuit board in the circuit structure so that the ferromagnetic portion abuts the circuit board surface while avoiding electronic components.

  Specifically, the ferromagnetic material can be configured to have ferromagnetism in a temperature range of 120 ° C. or lower, preferably 118 ° C. or lower, more preferably 115 ° C. or lower. Many adhesives used for adhering the radiator are cured within the above temperature range. Therefore, in this case, the ferromagnetic part of the pin member can be configured to have ferromagnetism reliably in the temperature range where the adhesive is cured. In addition, the lower limit value of the temperature range can be set to 20 ° C. or higher in consideration of an ambient temperature of about room temperature in the manufacturing process of the circuit structure with a radiator. In this case, the ferromagnetic part of the pin member can surely have ferromagnetism at the time of manufacturing the circuit structure with a radiator.

  Specific examples of the ferromagnetic material include cobalt, nickel, alloys thereof, and ferrite. These can be used alone or in combination of two or more. These ferromagnetic materials have ferromagnetism in a temperature range of 20 ° C. or higher and 120 ° C. or lower. Therefore, in this case, the ferromagnetic portion of the pin member can be configured to have ferromagnetism reliably in the ambient temperature range in which the adhesive is cured.

  In the joining jig, the surface of the second jig body included in the second jig on the side of the radiator can be specifically formed in a shape along the outer surface shape of the radiator. In this case, it becomes easy to make the magnet portion adhere to the outer surface of the radiator when using the joining jig.

  In the above-mentioned joining jig, the magnet part provided in the second jig is made of a permanent magnet or an electromagnet. When a permanent magnet is used, the configuration of the second jig can be made relatively simple. In addition, when an electromagnet is used, the magnitude of the magnetic force can be changed by changing the magnitude of the current to flow. Therefore, by controlling the magnetic force when using the above-mentioned joining jig, it becomes possible to control the adhesion state when the adhesive is cured, and the circuit component and the radiator in the obtained circuit component with a radiator It becomes easy to control the bonding force.

  The manufacturing method of the circuit assembly with a radiator includes the clamping step and the curing step. In the sandwiching step, specifically, the laminate can be prepared, for example, by bonding a heat radiating body in which an uncured adhesive is applied to the adhesive side surface and a circuit component. In addition, specifically, the laminate can be prepared by, for example, sandwiching a sheet-like uncured adhesive between the heat radiating body and the circuit component. Moreover, in the said hardening process, hardening of an unhardened adhesive agent can be specifically implemented by heat-processing at an appropriate hardening temperature, when a thermosetting adhesive agent is used.

  In addition, each structure mentioned above can be arbitrarily combined as needed, in order to acquire each effect etc. which were mentioned above.

  Hereinafter, the manufacturing method of the joining jig of an Example and the circuit structure with a heat sink is demonstrated using drawing. In addition, about the same member, it demonstrates using the same code | symbol.

Example 1
The manufacturing method of the joining jig of Example 1 and the circuit structure with a radiator will be described with reference to FIGS. As shown in FIG. 1 to FIG. 3, the joining jig 1 of this example is used for joining a heat dissipating body 6 with an adhesive 5 to the surface of the circuit component 4 on the bus bar 41 side.

  The circuit configuration body 4 includes a bus bar 41, a circuit board 42 stacked on the bus bar 41, and an electronic component 43 mounted on the circuit board 42.

  More specifically, in this example, the bus bar 41 includes a plurality of bus bars 41 and is electrically connected to the electronic component 43 by reflow soldering to constitute a power circuit. The bus bar 41 is configured by appropriately bending and dividing a bus bar constituting plate (not shown) formed by punching a predetermined metal plate by pressing.

  The circuit board 42 has a control circuit (not shown) for controlling the electronic component 43 and is electrically connected to the electronic component 43 by reflow soldering. The circuit board 42 has a plurality of board-side openings 421 that penetrate in the board thickness direction. The board-side opening 421 is a part where the terminal part of the electronic component 43 is disposed in order to reflow solder the electronic component 43 to the surface of the bus bar 41 exposed in the board-side opening 421. The bus bar 41 and the circuit board 42 are joined together by a thermosetting adhesive 44 such as an epoxy adhesive. The adhesive 44 can be changed to a pressure-sensitive adhesive sheet.

  Specifically, the electronic component 43 is a switching element. Specifically, a semiconductor switching element 431 and a mechanical relay switch 432 are used as the switching element. The electronic component 43 is reflow soldered to the surface of the bus bar 41 through the board side opening 421. In this example, specifically, the mechanical relay switch 432 as the electronic component 43 specifically includes a bus bar connection terminal 432a and a board connection terminal 432b. The bus bar connection terminal 432a is reflow soldered to the surface of the bus bar 41 through the board-side opening 421. The board connection terminal 432b is soldered to the land portion 421 of the circuit board 42. On the other hand, the semiconductor switching element 431 as the electronic component 43 has a drain terminal (not shown), a source terminal (not shown), and a gate terminal (not shown). The drain terminal and the source terminal are reflow soldered to the surface of the bus bar 41 through the substrate side opening 421. The gate terminal is reflow soldered to a land portion (not shown) of the circuit board 42.

  The joining jig 1 of this example includes a first jig 2 and a second jig 3. The first jig 2 is disposed on the circuit structure 4. The second jig 3 is disposed under the radiator 6 and is paired with the first jig 2.

  The first jig 2 has a first jig body 21 and a plurality of pin members 22. The 1st jig | tool main body 21 is arrange | positioned facing the circuit structure 4, and is exhibiting plate shape. Each pin member 22 extends vertically from the surface of the first jig body 21 on the circuit component 4 side. Each pin member 22 is disposed at a position where it can contact the surface of the circuit board 42 while avoiding the electronic component 43. Each pin member 22 is ferromagnetic at least at the tip.

  In this example, specifically, the pin member 22 includes a pin portion 221 and a ferromagnetic portion 222. The ferromagnetic part 222 is provided at the tip of the pin part 221 and is made of a ferromagnetic material. In this example, the ferromagnetic material specifically has ferromagnetism in a temperature range of 120 ° C. or lower. The ferromagnetic material includes at least one selected from the group consisting of cobalt, nickel, alloys thereof, and ferrite. In this example, more specifically, the pin portion 221 is made of SUS, and the ferromagnetic portion 222 is made of nickel which is a ferromagnetic material.

  In this example, the first jig 2 has leg portions 223 (see FIG. 1) that are brought into contact with the radiator 6 from the outer peripheral edge of the first jig body 21 in order to improve stability when the radiator 6 is joined. Is omitted).

  The second jig 3 has a second jig body 31 and a magnet part 32. The second jig body 31 is disposed to face the heat radiating body 6. The magnet portion 32 is provided on the surface of the second jig main body 31 on the side of the heat radiating body 6 and is disposed corresponding to the plurality of pin members 22.

  In the present example, the second jig main body 31 is schematically drawn in a flat plate shape. Usually, the outer surface of the heat radiating body 6 often has an uneven portion to promote heat dissipation. Therefore, in such a case, it is preferable that the surface of the second jig main body 31 included in the second jig 3 on the side of the radiator 6 is formed in a shape that conforms to the outer surface shape of the radiator 6. This is because the magnet portion 32 can be easily brought into close contact with the outer surface of the radiator 6 when the bonding jig 1 is used.

  Next, the manufacturing method of the circuit structure with a heat radiator of this example will be described.

  The manufacturing method of the circuit structure with a heat radiator of this example is a method of manufacturing the circuit structure with a heat radiator by joining the heat radiator 6 with the adhesive 5 to the surface of the circuit structure 4 on the bus bar 41 side. In this example, specifically, the circuit configuration body 4 described above is used as the circuit configuration body 4.

  The manufacturing method of the circuit structure with a heat radiator of this example includes a sandwiching step and a curing step.

  In the sandwiching step, the radiator 6, the uncured adhesive 5, and the circuit component 4 are stacked in this order on the circuit component 4 in the laminate 7. One jig 2 is arranged so that the tip of the pin member 22 abuts the surface of the circuit board 42 while avoiding the electronic component 43. Further, in the sandwiching step, the second jig 3 of the joining jig 1 of this example is arranged below the heat dissipating body 6 in the laminated body 7 so that the magnet portion 32 corresponds to the pin member 22. And the laminated body 7 is clamped by the 1st jig | tool 2 and the 2nd jig | tool 3 using the magnetic force which acts between the front-end | tip part of the pin member 22, and the magnet part 32. FIG.

  In addition, in this example, the laminated body 7 is prepared by bonding the heat radiator 6 with the uncured adhesive 5 applied to the adhesive side surface and the circuit component 4. The uncured adhesive 5 is a thermosetting epoxy adhesive.

  In the sandwiching step, the laminate 7 can be sandwiched by moving the first jig 2 onto the laminate 7 disposed on the second jig 3, for example. When the magnet part 32 is a permanent magnet, when the distance between the first jig 2 and the second jig 3 becomes a distance where the magnetic force acts, the first jig 2 and the second jig 3 attract each other. The laminated body 7 is sandwiched between the first jig 2 and the second jig 3 using magnetic force. On the other hand, when the magnet part 32 is an electromagnet, the 1st jig | tool 2 and the 2nd jig | tool 3 can be closely approached in the state which supplied with electricity to the electromagnet. In this case, the laminated body 7 is sandwiched between the first jig 2 and the second jig 3 using magnetic force in the same manner as when the magnet portion 32 is a permanent magnet.

  In addition, when the magnet part 32 is an electromagnet, for example, after the laminated body 7 is sandwiched between the first jig 2 and the second jig 3 without applying a magnetic force, the second jig 3 The magnet portion 32 may be energized, and the laminate 7 may be sandwiched between the first jig 2 and the second jig 3 using the generated magnetic force.

  In the curing step, the uncured adhesive 5 is cured while maintaining the sandwiched state. In this example, specifically, the ambient temperature when curing the adhesive 5 is 120 ° C. or lower, more specifically, in the range of 100 to 120 ° C.

  Next, the effect of the joining jig of this example will be described.

  The joining jig 1 of this example has the above-described configuration. Therefore, the joining jig 1 of this example avoids the electronic component 43 mounted on the circuit board 42 when joining the heat radiating body 6 to the circuit component 4, and the pin member 22 of the first jig 2. And a magnet part 32 of the second jig 3 can generate a magnetic force. Therefore, the joining jig 1 of this example applies an appropriate pressure due to the magnetic force to the circuit component 4 and the radiator 6 until the adhesive 5 is cured without applying pressure to the electronic component 43. Both can be kept in close contact. Therefore, according to the joining jig 1 of the present example, the adhesive 5 can be cured while maintaining the above-mentioned contact state when the circuit component with the heat radiator is manufactured. It is easy to ensure a sufficient bonding force with 6.

  Next, the effect of the manufacturing method of the circuit structure with a heat radiator of this example will be described.

  The manufacturing method of the circuit structure with a heat radiator of this example has the above-described steps. Therefore, it is possible to manufacture a circuit component with a radiator that has a good bonding force between the circuit component 4 and the radiator 6.

  Further, in the manufacturing method of the circuit component with a heat radiator of this example, the heat radiator 6 is joined to the circuit component 4 on which the electronic component 43 has already been mounted. Therefore, heat is radiated to the circuit body before the electronic component 43 is mounted. Compared with the case where the body 6 is joined, there is no problem that it is difficult to pass through the reflow furnace.

  As mentioned above, although the Example of this invention was described in detail, this invention is not limited to the said Example, A various change is possible within the range which does not impair the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Joining jig | tool 2 1st jig | tool 21 1st jig | tool main body 22 Pin member 221 Pin part 222 Ferromagnetic part 3 2nd jig | tool 31 2nd jig | tool main body 32 Magnet part 4 Circuit structure 41 Busbar 42 Circuit board 43 Electronic component 5 Adhesive 6 Heat radiator 7 Laminate

Claims (5)

A joining treatment used for joining a heat dissipating member with an adhesive to a surface of the bus bar side in a circuit structure having a bus bar, a circuit board laminated on the bus bar, and an electronic component mounted on the circuit board. Tools,
A first jig disposed on the circuit configuration body; and a second jig disposed below the heat dissipating body and paired with the first jig,
The first jig extends vertically from a plate-like first jig body arranged to face the circuit structure, and a surface of the first jig body on the circuit structure side, and has at least a tip. A portion having a plurality of pin members exhibiting ferromagnetism,
The second jig is provided on a surface of the second jig main body facing the heat dissipating body and the heat dissipating body side of the second jig main body, and is disposed corresponding to the plurality of pin members. And has a magnet part made of a permanent magnet or an electromagnet,
The bonding jig, wherein the plurality of pin members are arranged at positions where the electronic component can be avoided and contacted with the circuit board surface.   2. The joining jig according to claim 1, wherein the pin member has a pin portion and a ferromagnetic portion provided at a tip portion of the pin portion and made of a ferromagnetic material. .   The bonding jig according to claim 2, wherein the ferromagnetic material has ferromagnetism in a temperature range of 120 ° C. or less.   4. The joining jig according to claim 2, wherein the ferromagnetic material includes at least one selected from the group consisting of cobalt, nickel, alloys thereof, and ferrite. Circuit configuration with a radiator by joining a radiator with an adhesive to the bus bar side surface in a circuit component having a bus bar, a circuit board laminated on the bus bar, and an electronic component mounted on the circuit board A method of manufacturing a body,
The joining jig according to any one of claims 1 to 4, wherein the radiator, the uncured adhesive, and the circuit component in the laminate in which the circuit components are laminated in this order. The first jig is disposed so that the tip end portion of the pin member is in contact with the surface of the circuit board while avoiding the electronic component, and below the radiator in the laminated body. The second jig of the joining jig described in any one of the above items is disposed so that the magnet portion corresponds to the pin member, and acts between the tip portion of the pin member and the magnet portion. A sandwiching step of sandwiching the laminate using magnetic force;
A curing step of curing the uncured adhesive while maintaining the sandwiched state,
The manufacturing method of the circuit structure with a heat radiator characterized by having.

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