JP2017208508A - Circuit structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit structure in which an electronic component can be easily mounted on a circuit board.SOLUTION: A circuit structure comprises: a circuit board having an upper surface on which a circuit pattern is formed; a bus bar fixed to a lower surface of the circuit board; an electronic component including a package placed on the bus bar, a first terminal exposed from the package and electrically connected to the bus bar, and a second terminal exposed from the package and electrically connected to the circuit pattern; and a flexible sheet member for electrically connecting the circuit pattern and the second terminal without being in contact with the bus bar.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a circuit structure.

  An automobile is equipped with an electrical junction box (also called a power distributor) that distributes power from a power source (battery) to a load such as a headlamp or a wiper. As a member constituting the internal circuit of the electrical junction box, for example, there is a circuit structure shown in Patent Document 1.

  The circuit structure is mounted on a control circuit board on which a conductor pattern (circuit pattern) is formed, an input terminal bus bar and an output terminal bus bar bonded to the control circuit board, and the control circuit board and both bus bars. FET (Field effect transistor: electronic component). The FET includes a main body (package), a source terminal and a gate terminal that protrude from the side surface of the main body and extend downward, and a drain terminal provided on the back surface of the main body. The drain terminal of the FET is electrically connected to the input terminal bus bar, and the source terminal is electrically connected to the output terminal bus bar. The gate terminal of the FET is bent and formed so as to be displaced upward by the thickness of the control circuit board with respect to the source terminal, and is electrically connected to the conductor pattern on the control circuit board on the output terminal bus bar. (Specifications 0036-0039, FIG. 4).

JP 2003-164040 A

  Development of a circuit structure that can easily mount electronic components on a circuit board is desired. In the above-described electronic component, in order to electrically connect the source terminal and the gate terminal to the circuit pattern of the bus bar and the circuit board, respectively, the source terminal and the gate terminal are vertically aligned with each other as described above. It is staggering. The vertical shift between the source terminal and the gate terminal can be formed by bending the gate terminal, but the operation is complicated.

  Accordingly, an object is to provide a circuit structure that can easily mount electronic components on a circuit board.

The circuit structure according to the present disclosure is:
A circuit board having an upper surface on which a circuit pattern is formed;
A bus bar fixed to the lower surface of the circuit board;
A package disposed on the bus bar; a first terminal exposed from the package and electrically connected to the bus bar; and a second terminal exposed from the package and electrically connected to the circuit pattern; An electronic component having
A flexible sheet member that electrically connects the circuit pattern and the second terminal without contacting the bus bar;

  The circuit structure is easy to mount electronic components on a circuit board.

1 is a perspective view showing an outline of a circuit configuration body according to Embodiment 1. FIG. 1 is an exploded perspective view showing an outline of a circuit configuration body according to Embodiment 1. FIG. It is sectional drawing which shows the state cut | disconnected by the (III)-(III) cutting line of the circuit structure shown in FIG. It is sectional drawing which shows the state cut | disconnected by the (IV)-(IV) cutting line of the circuit structure shown in FIG.

<< Description of Embodiments of the Present Invention >>
First, embodiments of the present invention will be listed and described.

(1) A circuit structure according to an aspect of the present invention is:
A circuit board having an upper surface on which a circuit pattern is formed;
A bus bar fixed to the lower surface of the circuit board;
A package disposed on the bus bar; a first terminal exposed from the package and electrically connected to the bus bar; and a second terminal exposed from the package and electrically connected to the circuit pattern; An electronic component having
A flexible sheet member that electrically connects the circuit pattern and the second terminal without contacting the bus bar;

  According to the above configuration, the electronic component can be easily mounted on the circuit board. By providing a flexible sheet member, it is not necessary to connect the terminal directly to the circuit pattern, so there is no need to bend the terminal by bending the second terminal in consideration of the thickness of the circuit board. This is because such work is unnecessary. Further, since the flexible sheet member does not contact the bus bar, it is not necessary to interpose an insulating member in order to improve the insulation between the flexible sheet member and the bus bar.

  (2) As one form of the circuit structure, the second terminal may be formed so as to extend linearly from the side surface of the package toward the circuit board.

  According to said structure, even if it is an electronic component which the 2nd terminal has protruded linearly from the side surface of the package to the circuit board side, mounting to a circuit board is easy by providing a flexible sheet | seat member.

  (3) As one form of the said circuit structure, it is mentioned that the said flexible sheet member has a curved part which protrudes upwards between the said circuit pattern and the said 2nd terminal.

  According to said structure, it is easy to absorb external stress by vibration etc. by a curved part. Therefore, it is easy to maintain the connection state between the circuit board and the second terminal and the flexible sheet member. Moreover, the length of a flexible sheet member is longer than the length between a circuit pattern and a 2nd terminal by having a curved part. Therefore, when connecting a flexible sheet member to a circuit pattern and a 2nd terminal, the dimensional tolerance between a circuit pattern and a 2nd terminal can be absorbed, and it is excellent in productivity.

  (4) As one form of the said circuit structure which has the said curved part, it is mentioned that the vertex of a curved part is located below the upper surface of the said package.

  According to said structure, since a flexible sheet member is not located above an electronic component, flexible sheet member itself does not become obstructive.

  (5) The circuit structure which concerns on 1 aspect of this invention is that the 2nd terminal and the said flexible sheet | seat member have the crimping | compression-bonding connection structure mutually connected mechanically.

  According to the above configuration, the crimp connection structure is a mechanically stable joining structure as compared with soldering, and is easy to form.

(I) The following form is mentioned as the manufacturing method I of the said circuit structure.
A preparation step of preparing a circuit board having an upper surface on which a circuit pattern is formed, a bus bar, an electronic component having a first terminal and a second terminal exposed from the package, and a flexible sheet member;
An assembly in which the lower surface of the circuit board and the upper surface of the bus bar are fixed, the first terminal of the electronic component is connected to the upper surface of the bus bar, and the circuit board, the bus bar, and the electronic component are combined. An assembly production process for producing
A connection step of connecting one end and the other end of the flexible sheet member to the circuit pattern of the circuit board and the second terminal of the electronic component in the assembly.

  According to said structure, since an electronic component can be easily mounted in a circuit board by preparing a flexible sheet | seat member, it is excellent in the productivity of a circuit structure.

(II) Examples of the method II for manufacturing the circuit structure include the following modes.
A preparation step of preparing a circuit board having an upper surface on which a circuit pattern is formed, a bus bar, an electronic component having a first terminal and a second terminal exposed from the package, and a flexible sheet member;
A laminate manufacturing step of fixing the lower surface of the circuit board and the upper surface of the bus bar to manufacture a laminate;
A sheet attachment step of connecting the second terminal of the electronic component and one end of the flexible sheet member to produce an electronic component with a sheet;
An application step of applying a conductive connection member to a predetermined portion of the bus bar and the circuit pattern in the laminate;
The electronic component with sheet is placed on the laminate, the first terminal of the electronic component with sheet, the other end of the flexible sheet member, the conductive connection member on the bus bar, and the circuit A placing step of bringing the conductive connecting member on the pattern into contact with each other;
Heat-treating the conductive connecting member to fix the first terminal and the bus bar, and to connect the other end of the flexible sheet member and the circuit pattern.

  According to the above configuration, since the electronic component and the flexible sheet member can be simultaneously connected to the bus bar and the circuit board by producing the electronic component with the sheet, the electronic component can be easily mounted on the circuit board, Excellent productivity.

<< Details of Embodiment of the Present Invention >>
Details of embodiments of the present invention will be described below with reference to the drawings. The same reference numerals in the figure indicate the same names. The description in the embodiment will be made in the order of the circuit structure and the method of manufacturing the circuit structure.

Embodiment 1
[Circuit structure]
With reference to FIGS. 1-4, the circuit structure 1A which concerns on Embodiment 1 is demonstrated. 1 A of circuit structures are the circuit board 2 which has the upper surface in which the circuit pattern 21 is formed, the bus bar 3 fixed to the lower surface of the circuit board 2, and the electronic component 4 which has the package 40 arrange | positioned on the bus bar 3. Prepare. The electronic component 4 has a first terminal 41 and a second terminal 42 exposed from the package 40. The first terminal 41 is electrically connected to the bus bar 3 (31), and the second terminal 42 is electrically connected to the circuit pattern 21. One of the features of the circuit structure 1A is that it includes a flexible sheet member 5 that electrically connects the circuit pattern 21 and the second terminal 42 without contacting the bus bar 3. Details will be described below. In the following description, for convenience of explanation, the bus bar 3 side of the circuit board 2 of the circuit structure 1A will be described below, and the opposite side will be described as the top.

[Circuit board]
The circuit board 2 is a plate-like member on which the electronic component 4 is mounted, and the circuit pattern 21 electrically connected to the terminal (first terminal 41) of the electronic component 4 and the electronic component 4 are mounted on the bus bar 3. Mounting through hole 22 (FIGS. 1 to 4). The circuit pattern 21 is formed on one surface (upper surface) of the insulating substrate. The circuit pattern 21 may be formed on the other surface (lower surface) of the insulating substrate as necessary. The circuit pattern 21 is formed of copper foil. The circuit board 2 can be a printed board. A bus bar 3 is fixed to the lower surface of the circuit board 2.

  The mounting through-hole 22 penetrates the upper and lower surfaces so as to face two adjacent bus bars 31 and 32. Examples of the outline shape of the mounting through hole 22 include a shape along the outer shape of the electronic component 4. The mounting through hole 22 is configured by a series of large and small rectangular holes having different sizes. The package 40 and the third terminal 43 of the electronic component 4 are inserted through the large rectangular hole, and the first terminal 41 of the electronic component 4 is inserted through the small rectangular hole (both will be described later).

  The thickness of the circuit board 2 can be increased. As will be described in detail later, since it is not necessary to bend the second terminal 42 of the electronic component 4 by providing the flexible sheet member 5, it is necessary to consider (thin) the thickness of the circuit board 2 for the bending. Because there is no. Since the thickness of the circuit board 2 can be increased, the circuit board 2 has a single-sided (single layer) substrate in which the circuit pattern 21 is formed on one side of the front and back sides, and both sides in which the circuit pattern 21 is formed on both sides of the front and back ( In addition to a (two-layer) substrate, a multilayer substrate can also be used. The thickness of the circuit board 2 can be 1 mm or more, for example. The thickness of the circuit board 2 can be practically 3 mm or less.

[Busba]
The bus bar 3 constitutes a power circuit (FIGS. 1 to 4). The bus bar 3 is connected to a power source and an electrical load. Examples of the material of the bus bar 3 include conductive metals, and specifically copper and copper alloys. There are a plurality of bus bars 3, and the plurality of bus bars 3 (31, 32) are fixed to the other surface (lower surface) of the circuit board 2 at intervals (FIG. 2). For fixing the plurality of bus bars 3 and the circuit board 2, an adhesive sheet (not shown) interposed between them can be used. Examples of the pressure-sensitive adhesive sheet include high heat-resistant acrylic pressure-sensitive adhesives and insulating adhesives such as epoxy resins. Examples of the shape of the bus bars 31 and 32 include a rectangular shape. The upper surfaces of two adjacent bus bars 31 and 32 are flush with each other.

[Electronic parts]
The electronic component 4 is mounted on both the circuit pattern 21 on the upper surface of the circuit board 2 and the bus bar 3 (FIGS. 1 to 4). The electronic component 4 includes a package 40 disposed on the bus bar 3 and a plurality of terminals electrically connected to the circuit pattern 21 and the bus bar 3. The arrangement location of the plurality of terminals can be selected as appropriate, and may be either the upper or lower surface or the side surface of the package 40, and the arrangement location of each terminal may not be the same surface. For example, the first terminal 41 and the second terminal 42 may be provided on a surface other than the lower surface of the package 40, and the third terminal 43 may be provided on the lower surface of the package 40.

  Here, the electronic component 4 has three types of terminals: a first terminal 41 and a second terminal 42 provided on the side surface of the package 40, and a third terminal 43 disposed on the lower surface of the package 40 (FIG. 2). . The package 40 does not straddle the space between the two bus bars 31, 32, and is disposed on the upper surface of the other bus bar 32 (FIGS. 1, 3, and 4).

  The first terminal 41 extends downward from the side surface of the package 40 (one bus bar 31 side) (FIG. 4). In FIG. 4, for convenience of explanation, the second terminal 42 on the back side of the drawing is omitted. The first terminal 41 spans the interval between the bus bars 31 and 32. The tip of the first terminal 41 is electrically and mechanically connected to one bus bar 31. The vertical arrangement position of the base of the first terminal 41 is located slightly above the upper surface of the circuit board 2 on the side surface of the package 40.

  The second terminal 42 is formed so as to protrude linearly toward the circuit board 2 from the same side surface on which the first terminal 41 is provided in the package 40 (FIGS. 1 and 3). The second terminal 42 is electrically and mechanically connected to the flexible sheet member 5 described later, and is electrically connected to the circuit pattern 21 through this connection. The arrangement position of the second terminal 42 in the vertical direction, that is, the connection position of the second terminal 42 with the flexible sheet member 5 may be above or below the upper surface of the circuit board 2 on the side surface of the package 40. It may be flush with the top surface. Here, the arrangement position (the connection portion) of the second terminal 42 is located slightly above the upper surface of the circuit board 2. The second terminal 42 and the base of the first terminal 41 are located on the same plane.

  The third terminal 43 is provided integrally with the package 40 on the opposite side of the first terminal 41 and the second terminal 42 with the insulating material on the back surface of the package 40 interposed therebetween (FIG. 2). The third terminal 43 is electrically and mechanically connected to the other bus bar 32 different from the first terminal 41.

  For the electrical and mechanical connection between the first terminal 41 and the third terminal 43 and each of the bus bars 31 and 32, a conductive connection member, typically solder 7 (FIG. 4) can be used. In FIG. 4, the connection portion between the third terminal and the bus bar 32 is omitted. Although the connection by the solder 7 will be described in detail later, it can be performed by a reflow method. For electrical and mechanical connection between the second terminal 42 and the flexible sheet member 5, typically, solder 7 (FIGS. 1 and 3) can be used. The connection by the solder 7 can be performed by soldering. The electrical and mechanical connection between the second terminal 42 and the flexible sheet member 5 can also be performed by pressure bonding. That is, the second terminal 42 constitutes a crimp connection structure that is mechanically connected to each other together with the flexible sheet member 5.

  The number of the first terminals 41 to the third terminals 43 may be singular or plural depending on the type of the electronic component 4 and the like. Examples of the type of the electronic component 4 include switching elements such as relays and FETs (Field Effect Transistors). Here, the electronic component 4 uses an FET. The first terminal 41 of the FET shown in FIG. 1 is composed of a gate terminal, the second terminal 42 is composed of a source terminal, and the third terminal 43 is composed of a drain terminal.

[Flexible sheet material]
The flexible sheet member 5 electrically connects the circuit pattern 21 and the second terminal 42 without contacting the bus bar 3. The flexible sheet member 5 eliminates the need to directly connect the second terminal 42 to the circuit pattern 21, so that it is not necessary to bend the second terminal 42 in consideration of the thickness of the circuit board 2, and the like. Work can be made unnecessary. The contact with the bus bar 3 includes contact with and fixing via an adhesive layer or an insulating layer.

  One end of the flexible sheet member 5 is electrically and mechanically connected to the circuit pattern 21, and the other end of the flexible sheet member 5 is electrically and mechanically connected to the second terminal 42. Here, the conduction path from the second terminal 42 to the circuit pattern 21 in the flexible sheet member 5 spans the interval between both bus bars 31 and 32, but connection without straddling is also possible. Solder 7 can be used for this electrical and mechanical connection. Note that the electrical and mechanical connection between the other end of the flexible sheet member 5 and the second terminal 42 may be performed by pressure bonding as described above. That is, the flexible sheet member 5 and the second terminal 42 constitute a crimp connection structure that is mechanically connected to each other.

  The flexible sheet member 5 preferably has a curved portion 51 protruding upward between one end (circuit pattern 21) and the other end (second terminal 42). Then, it is easy to absorb external stress due to vibration or the like. Thereby, it is easy to maintain the connection state between the circuit board 2 and the second terminal 42 and the flexible sheet member 5. The apex of the curved portion 51 is preferably positioned below the upper surface of the package 40 (FIG. 3). Then, since the flexible sheet member 5 is not located above the electronic component 4, the flexible sheet member 5 itself does not get in the way. In FIG. 3, for convenience of explanation, the extended surface of the upper surface of the package 40 is indicated by a two-dot chain line. The position where the apex is located below the upper surface of the package 40 means that all the flexible sheet members 5 are located below the upper surface of the package 40.

  The shape of the flexible sheet member 5 is a rectangular shape. The width of the flexible sheet member 5 may be a length slightly smaller than the land on the circuit pattern 21 side. The width here refers to the parallel direction of the first terminal 41 and the second terminal 42 (the direction orthogonal to the plane of FIG. 3). The length of the flexible sheet member 5 is slightly longer than between the second terminal 42 and the circuit pattern 21. Thereby, the curved part 51 can be formed. Since the length of the flexible sheet member 5 is long, when the flexible sheet member 5 is connected to the circuit pattern 21 and the second terminal 42, the dimensional tolerance between the circuit pattern 21 and the second terminal 42 can be absorbed, thereby improving productivity. Excellent. The thickness of the flexible sheet member 5 is preferably 10 μm or more. If it does so, it is easy to ensure the electrical connection with respect to the 2nd terminal 42 and the circuit pattern 21. FIG. The thickness of the flexible sheet member 5 is preferably 70 μm or less. Then, it is excellent in flexibility (softness). The thickness of the flexible sheet member 5 is preferably 12 μm or more and 35 μm or less.

  For the flexible sheet member 5, copper foil, FPC (Flexible Printed Circuits), or the like can be used.

[Others]
(Heat dissipation member)
It is preferable that 1 A of circuit structures are equipped with the heat radiating member (illustration omitted) which thermally radiates the heat | fever of the bus bar 3 at the time of use. The heat dissipating member is disposed on the lower surface of the bus bar 3. The size of the heat radiating member may be a size that allows contact with the entire lower surface of the bus bar 3. The heat dissipating member may be formed of a flat plate member whose upper and lower surfaces are flat, or a flat plate member whose upper surface is flat and a fin formed of a plurality of protrusions protruding downward from the lower surface of the flat plate member. It may be formed integrally. If the fin is provided, the surface area of the heat radiating member can be increased to increase the heat dissipation.

  The bus bar 3 may be fixed to the upper surface of the heat dissipating member by interposing an adhesive layer (not shown) between the heat dissipating member and the bus bar 3 or through the laminate of the circuit board 2 and the bus bar 3. This may be done by screwing with a screw (not shown) or both of them. Since the thickness of the circuit board 2 can be increased, it is easy to firmly fix the circuit board 2 and the bus bar 3 to the upper surface of the heat dissipation member by screwing. When screwing, a screw hole for screwing a screw is formed on the upper surface of the heat dissipation member. Examples of the constituent material of the heat dissipating member include a metal material having excellent thermal conductivity. Examples of the metal material include aluminum and an aluminum alloy.

[Usage]
The circuit structure 1A can be suitably used for an electric junction box for automobiles. Further, the circuit structure 1A can be suitably used for a substrate for a high-current power circuit such as a direct-current voltage converter, an AC / DC converter, and a DC / AC inverter.

[Function and effect]
According to the circuit configuration body 1A of the first embodiment, the following effects can be obtained.

  (1) Because the flexible sheet member 5 can connect the second terminal 42 and the circuit pattern 21 that extend linearly from the side surface of the package 40, the second terminal 42 and the circuit pattern 21 do not have to be directly connected. . Thereby, it is not necessary to bend the second terminal 42 in consideration of the thickness of the circuit board 2, and work such as bending can be made unnecessary. Therefore, the electronic component 4 can be easily mounted on the circuit board 2. Therefore, it is excellent in productivity. Moreover, since the 2nd terminal 42 does not need to be directly connected with the circuit pattern 21, the length of the 2nd terminal 42 may be short (for example, the grade which does not straddle the space | interval between both the bus bars 31 and 32). Therefore, the lead material can be reduced.

  (2) Since the flexible sheet member 5 is provided, the second terminal 42 of the electronic component 4 does not need to be bent, and therefore it is not necessary to reduce the thickness of the circuit board 2 for the bending. Thereby, the circuit board 2 can be thickened. Therefore, a multilayer board can be used for the circuit board 2. Further, since the thickness of the circuit board 2 can be increased, the circuit board 2 and the bus bar 3 can be screwed to the upper surface of the heat radiating member, and the circuit structure 1A can be firmly fixed to the installation target such as the heat radiating member. .

[Manufacturing method of circuit structure]
The manufacture of the circuit structure 1A is, for example, a manufacturing method I including a preparation process, an assembly production process, and a connection process, or a preparation process, a laminate production process, a sheet attachment process, a coating process, a placing process, and a heat treatment process. It can carry out by the manufacturing method II provided with these. Hereinafter, the manufacturing method I and the manufacturing method II will be described in order. The difference between the manufacturing method I and the manufacturing method II is that the electronic component 4 and the flexible sheet member 5 are individually connected to the laminated body of the circuit board 2 and the bus bar 3 or are connected simultaneously.

[Production Method I]
(Preparation process)
In the preparation step, the above-described circuit board 2, bus bar 3, electronic component 4, and flexible sheet member 5 are prepared.

(Union production process)
In the combination creation process, a combination is formed by combining the circuit board 2, the bus bar 3, and the electronic component 4.

  First, a laminated body of the circuit board 2 and the bus bar 3 is produced. The laminated body can be manufactured by fixing the lower surface of the circuit board 2 and the upper surface of the bus bar 3. For this fixing, an adhesive sheet can be used as described above.

  Next, the first terminal 41 of the electronic component 4 is connected to the upper surface of the bus bar 3. Before the electronic component 4 is placed on each of the bus bars 31 and 32, a conductive connecting member, here, a solder paste is applied in advance to a predetermined position. A specific application | coating location is a location exposed from the through-hole 22 for mounting of the circuit board 2 in both the bus bars 31 and 32. FIG. The first component 41 of the electronic component 4 is connected to one bus bar 31 and the third terminal 43 is connected to the other bus bar 32 by being heated after being placed on the solder paste coated with the electronic component 4. By connecting the bus bar 3 and the electronic component 4 by reflowing the solder 7 in this manner, the connection workability between the bus bar 3 and the electronic component 4 is excellent.

(Connection process)
In the connection step, one end and the other end of the flexible sheet member 5 are connected to the circuit pattern 21 of the circuit board 2 and the second terminal 42 of the electronic component 4 in the assembly. This connection can be made by soldering.

[Production Method II]
(Preparation process)
The preparation process is the same as the preparation process of manufacturing method I described above.

(Laminate production process)
In the laminated body production step, a laminated body of the circuit board 2 and the bus bar 3 is produced. As described above, the laminate can be manufactured by fixing the lower surface of the circuit board 2 and the upper surface of the bus bar 3 using an adhesive sheet.

(Sheet mounting process)
In the sheet attaching step, the second terminal 42 of the electronic component 4 and one end of the flexible sheet member 5 are connected to produce an electronic component with a sheet. This connection may be made by soldering or by crimping both. By this connection, the flexible sheet member 5 is in a state where it is cantilevered by the electronic component 4.

(Coating process)
In the applying step, a conductive connection member is applied to predetermined portions of the bus bar 3 and the circuit pattern 21 in the laminate. Here, a solder paste is used for the conductive connecting member as described above. The solder paste is applied to the portion exposed from the mounting through hole 22 of the circuit board 2 in the bus bar 31 and the circuit pattern 21.

(Installation process)
In the placing step, the electronic component with a sheet is laminated on the laminated body. At this time, the first terminal 41 and the other end of the flexible sheet member 5 in the electronic component with a sheet are brought into contact with the conductive connection member on the bus bar 3 and the conductive connection member on the circuit pattern 21.

(Heat treatment process)
In the heat treatment step, heat treatment is performed on the conductive connecting member. Then, the first terminal 41 and the bus bar 31 are fixed, and the other end of the flexible sheet member 5 and the circuit pattern 21 are connected.

[Function and effect]
According to the manufacturing method I and II of the circuit configuration body of the first embodiment, the electronic component 4 can be easily mounted on the circuit board 2 by preparing the flexible sheet member 5. In particular, according to the manufacturing method I, the second terminal 42 and the circuit pattern 21 are connected by the flexible sheet member 5 after the electronic component 4 is mounted on the bus bar 3, so that each member does not have to be strictly aligned. Because it is good, it is easy to increase productivity. In particular, according to the manufacturing method II, the electronic component 4 and the flexible sheet are formed on the circuit board 2 and the bus bar 3 by preparing an electronic component with a sheet in which the electronic component 4 and the flexible sheet member 5 are integrated in advance. Since the member 5 can be connected simultaneously, the productivity of the circuit structure 1A is excellent.

  The present invention is not limited to these exemplifications, but is defined by the scope of the claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.

DESCRIPTION OF SYMBOLS 1A Circuit structure 2 Circuit board 21 Circuit pattern 22 Mounting through-hole 3 Bus bar 31 One bus bar 32 The other bus bar 4 Electronic component 40 Package 41 1st terminal 42 2nd terminal 43 3rd terminal 5 Flexible sheet member 51 Bending part 7 Solder

Claims (5)

A circuit board having an upper surface on which a circuit pattern is formed;
A bus bar fixed to the lower surface of the circuit board;
A package disposed on the bus bar; a first terminal exposed from the package and electrically connected to the bus bar; and a second terminal exposed from the package and electrically connected to the circuit pattern; An electronic component having
A circuit structure comprising a flexible sheet member that electrically connects the circuit pattern and the second terminal without contacting the bus bar.   2. The circuit structure according to claim 1, wherein the second terminal is formed to extend linearly from a side surface of the package toward the circuit board.   The circuit configuration body according to claim 1, wherein the flexible sheet member has a curved portion protruding upward between the circuit pattern and the second terminal.   The circuit configuration body according to claim 3, wherein an apex of the curved portion is located below a top surface of the package.   The circuit structure according to any one of claims 1 to 4, wherein the second terminal and the flexible sheet member have a crimp connection structure that is mechanically connected to each other.

Images