WO2020246223A1 - Circuit structure and electrical connection box - Google Patents

Circuit structure and electrical connection box Download PDF

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Publication number
WO2020246223A1
WO2020246223A1 PCT/JP2020/019565 JP2020019565W WO2020246223A1 WO 2020246223 A1 WO2020246223 A1 WO 2020246223A1 JP 2020019565 W JP2020019565 W JP 2020019565W WO 2020246223 A1 WO2020246223 A1 WO 2020246223A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat transfer
transfer material
hole
insulating sheet
Prior art date
Application number
PCT/JP2020/019565
Other languages
French (fr)
Japanese (ja)
Inventor
北　幸功
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2020246223A1 publication Critical patent/WO2020246223A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This disclosure relates to circuit configurations and electrical junction boxes.
  • Patent Document 1 discloses a technique for transferring the heat of a circuit board to a heat radiating member through a metal member and a heat transfer material.
  • circuit board and the heat radiating member be brought close to each other.
  • the purpose is to provide a technology that can bring the circuit board and the heat radiating member closer to each other.
  • the circuit configuration of the present disclosure is a circuit configuration including a circuit board, a heat radiating member superposed on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member.
  • the circuit board and the heat radiating member can be brought close to each other.
  • FIG. 1 is a schematic cross-sectional view showing a circuit configuration according to the first embodiment and an electrical junction box including the circuit configuration.
  • FIG. 2 is a schematic plan view showing a circuit board.
  • FIG. 3 is a schematic bottom view showing a circuit board.
  • FIG. 4 is a schematic cross-sectional view showing the circuit configuration according to the second embodiment and the electrical junction box including the circuit configuration.
  • FIG. 5 is a schematic plan view showing a circuit board with a metal member.
  • FIG. 6 is a schematic bottom view showing a circuit board with a metal member.
  • the circuit configuration of the present disclosure is as follows.
  • a circuit configuration including a circuit board, a heat radiating member stacked on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member. Since the circuit board and the heat radiating member can be insulated by providing the insulating sheet between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
  • a heat transfer material having better thermal conductivity than the insulating sheet may be further provided, and the heat transfer material may be provided on at least one side of the insulating sheet. As a result, the heat of the circuit board is easily transferred to the heat radiating member through the heat transfer material.
  • the heat transfer material includes a first heat transfer material provided between the circuit board and the insulating sheet, and a second heat transfer material provided between the heat radiating member and the insulating sheet. , May be included. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the first heat transfer material and the second heat transfer material.
  • a metal member attached to the circuit board is further provided, and the metal member is connected to an insertion portion inserted into a hole formed in the circuit board and one end of the insertion portion, and the heat radiation member side from the hole. It may include a protrusion that protrudes toward. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the metal member.
  • Through holes may be formed in the insulating sheet. As a result, the thermal resistance between the circuit board and the heat radiating member is reduced in the portion where the through hole is formed.
  • a first conductive path and a second conductive path are formed on the circuit board, and the through hole is formed at a position corresponding to the first conductive path in the insulating sheet to correspond to the second conductive path. It is not necessary that a through hole is formed at the position where the through hole is formed. As a result, for example, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet due to the formation of through holes at places where the need for insulation is low.
  • the electrical junction box of the present disclosure is an electrical junction box including the circuit configuration and a case covering the circuit configuration. Since the circuit board and the heat radiating member can be insulated by the insulating sheet provided between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
  • FIG. 1 is a schematic cross-sectional view showing a circuit configuration 20 according to the first embodiment and an electrical connection box 10 including the circuit configuration 20.
  • FIG. 2 is a schematic plan view showing the circuit board 30.
  • FIG. 3 is a schematic bottom view showing the circuit board 30.
  • the cross section in FIG. 1 corresponds to the cross section at the position of line L1 in FIG.
  • the electric junction box 10 is arranged in a power supply path between a power source such as a battery and a load such as an in-vehicle electrical component such as a lamp and a wiper in a vehicle, for example.
  • the electrical junction box 10 may be used, for example, in a DC-DC converter, an inverter, or the like.
  • the electrical junction box 10 includes a case 12 and a circuit configuration 20.
  • the case 12 covers the circuit configuration 20.
  • the case 12 has a box shape with an opening on the lower side.
  • the circuit structure 20 serves as the lid of the case 12.
  • the case 12 may accommodate the entire circuit configuration 20 inside.
  • the case 12 may have a main body and a lid.
  • the material constituting the case 12 is not particularly limited, but for example, a metal such as aluminum or an aluminum alloy or a synthetic resin may be adopted.
  • the circuit structure 20 includes a circuit board 30, a heat radiating member 50, and an insulating sheet 60.
  • the circuit configuration 20 further includes a heat transfer material 70.
  • the circuit board 30 includes an insulating portion 32 and a conductive path 34.
  • the insulating portion 32 has an insulating plate in the printed circuit board.
  • the insulating portion 32 may have a solder resist or the like on the printed circuit board.
  • the conductive path 34 has a printed wiring board 35 on the printed circuit board. In the example shown in FIG. 1, the printed circuit board has two layers.
  • the printed wiring 35 is formed on both main surfaces of the insulating plate.
  • the printed circuit board may be a multilayer board in which wiring is also formed in the middle in the thickness direction.
  • the conductive path 34 may have a bus bar provided separately from the printed circuit board.
  • the conductive path 34 may have a land exposed on the main surface of the printed circuit board.
  • a plurality of conductive paths 34 are provided so as to be insulated from each other.
  • the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C are provided.
  • a heat generating component 40 is mounted on the circuit board 30.
  • the heat generating component 40 is a FET (Field Effect Transistor)
  • the heat generating component 40 may be a resistor such as a shunt resistor, a coil, a capacitor, or the like.
  • the number of heat generating parts 40 is one, but a plurality of heat generating parts 40 may be provided.
  • the heat generating component 40 includes a main body 42 and a plurality of terminals 44.
  • the main body 42 is located on the land of the first conductive path 34A.
  • the plurality of terminals 44 are exposed to the outside of the main body 42.
  • the plurality of terminals 44 have a first terminal 44A, a second terminal 44B, and a third terminal 44C.
  • the first terminal 44A is provided on the back surface of the main body 42.
  • the first terminal 44A is connected to the first conductive path 34A.
  • the second terminal 44B and the third terminal 44C are provided so as to project from the side surface of the main body 42.
  • the second terminal 44B and the third terminal 44C are connected to the second conductive path 34B and the third conductive path 34C, respectively.
  • Each terminal 44 is connected to the conductive path 34, for example, by soldering to a land.
  • the heat generating component 40 is an FET
  • the first terminal 44A, the second terminal 44B, and the third terminal 44C correspond to, for example, a drain terminal, a gate terminal, and a source terminal.
  • a through hole 36 is formed in the circuit board 30.
  • the through hole 36 has a structure in which a metal material 37 such as copper foil or plating is provided on the inner surface of the hole provided in the insulating plate and the peripheral edge of the opening.
  • the metal material 37 forms a part of the conductive path 34. That is, in the conductive path 34 provided with the through hole 36, the printed wiring 35 on the upper surface and the printed wiring 35 on the lower surface of the insulating plate are electrically connected by the metal material 37.
  • a metal material 37 such as copper foil or plating
  • a through hole 36 (also referred to as a via hole) into which an electric component is not inserted is provided as a through hole 36, but a through hole into which an electric component is inserted (also referred to as a through hole for an electric component or the like) is provided. ) May be provided.
  • the via hole for heat dissipation is also called a thermal via.
  • through holes 36 are formed in each of the printed wirings 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • Through holes 36 are formed in portions other than the lands in the printed wiring 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • a through hole 36 is also formed in a portion of the printed wiring 35 forming the first conductive path 34A that overlaps with the main body 42.
  • the position of the through hole 36 is not limited to that described above, and can be set as appropriate. Further, there may be a printed wiring in which the through hole 36 is not formed.
  • the conductive path 34 is exposed on the main surface of the circuit board 30 on the heat radiating member 50 side.
  • the metal material 37 in the through hole 36 is exposed.
  • the conductive paths 34 the printed wiring, the bus bar, and the like may be exposed.
  • the heat radiating member 50 is superposed on the circuit board 30.
  • the heat radiating member 50 is made of a metal having high thermal conductivity such as aluminum or an aluminum alloy.
  • the heat radiating member 50 has a mounting surface. The mounting surface is directed to the circuit board 30.
  • the circuit board 30, the insulating sheet 60, and the heat transfer material 70 are stacked on the mounting surface.
  • the mounting surface should be formed flat.
  • the heat radiating member 50 is provided with fins or the like in order to increase the surface area.
  • the fins are formed, for example, in the shape of comb teeth.
  • the fin is a portion of the heat radiating member 50 exposed to the outer surface of the electric junction box 10 (the surface opposite to the mounting surface in this example). It is good if it is provided in.
  • the heat radiating member 50 and the circuit board 30 may be fixed by fixing means such as screws (not shown).
  • the circuit configuration 20 may be provided with a spacer that maintains the mounting surface and the circuit board 30 at regular intervals.
  • the spacer is provided so as to project in the normal direction from the mounting surface.
  • the circuit board 30 is maintained in a state of having a constant distance from the mounting surface.
  • spacers are provided around the mounting surface. In this case, the spacer supports the peripheral edge of the circuit board 30.
  • the spacer may be provided integrally with the heat radiating member 50, or may be a separate member from the heat radiating member 50.
  • the insulating sheet 60 is provided between the circuit board 30 and the heat radiating member 50.
  • the insulating sheet 60 is a member formed into a sheet by a material having an insulating property.
  • the material of the insulating sheet 60 is not particularly limited, but is preferably a material having high insulating properties (material having high electrical resistivity). As a result, the thickness of the insulating sheet 60 having a predetermined electric resistance value can be reduced.
  • polyimide or the like may be adopted as the material of the insulating sheet 60.
  • the insulating sheet 60 is provided so as to cover at least a part of the conductive path 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side. As a result, it is possible to suppress a short circuit between the conductive path 34 exposed on the circuit board 30 and the heat radiating member 50.
  • the insulating sheet 60 covers all of the conductive paths 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side, but the insulating sheet 60 is on the main surface of the circuit board 30 on the heat radiating member 50 side. Only a part of the exposed conductive path 34 may be covered.
  • insulating sheet 60 covers all of the exposed conductive paths 34
  • a plurality of insulating sheets may cover the conductive paths 34 in different regions.
  • the heat transfer material 70 has better thermal conductivity than the insulating sheet 60.
  • the heat transfer material 70 is also called a thermal interface material (TIM: Thermal Interface Material) or the like.
  • the heat transfer material 70 is made of a material having a higher thermal conductivity than the insulating sheet 60.
  • the heat transfer material 70 may have a lower insulating property than the insulating sheet 60.
  • the heat transfer material 70 may be made of a material having a lower insulating property than the insulating sheet 60.
  • the heat transfer material 70 is called thermal paste or heat conductive grease.
  • the heat transfer material 70 may be a single base or a base mixed with a filler.
  • a material having an insulating property such as silicone may be adopted as the base material.
  • the filler is mixed to increase the thermal conductivity of the heat transfer material 70.
  • the filler material should have a higher thermal conductivity than the base material.
  • the material of the filler may be a conductive material such as metal.
  • the heat transfer material 70 is provided on both sides of the insulating sheet 60.
  • the heat transfer material 70 provided between the circuit board 30 and the insulating sheet 60 is the first heat transfer material 70A.
  • the heat transfer material 70 provided between the heat radiating member 50 and the insulating sheet 60 is the second heat transfer material 70B.
  • first heat transfer material 70A and the second heat transfer material 70B are formed of materials having the same physical properties. That is, the first heat transfer material 70A and the second heat transfer material 70B are the same materials arranged at different positions. Of course, the first heat transfer material 70A and the second heat transfer material 70B may be formed of materials having different physical properties.
  • the first heat transfer material 70A is in close contact with the circuit board 30 and the insulating sheet 60 to fill the gap between the circuit board 30 and the insulating sheet 60.
  • the second heat transfer material 70B is in close contact with the heat radiating member 50 and the insulating sheet 60 to fill the gap between the heat radiating member 50 and the insulating sheet 60.
  • the first heat transfer material 70A and the second heat transfer material 70B are pressed against the circuit board 30, the insulating sheet 60, and the heat radiating member 50 in a state of having fluidity, so that the circuit board 30, the insulating sheet 60, and the heat radiating member are pressed. Each can be in close contact with 50.
  • the first heat transfer material 70A and the second heat transfer material 70B are preferably members that can be in a viscous state at a temperature lower than the melting point of each part of the circuit board 30.
  • the first heat transfer material 70A and the second heat transfer material 70B are members having viscosity under a normal state, such as thermal paste, that is, a viscous body.
  • the first heat transfer material 70A and the second heat transfer material 70B may be members such as an adhesive that can be in a viscous state before being solidified.
  • the heat transfer material 70 may be a heat transfer sheet formed into a sheet shape.
  • the heat transfer sheet may be easily deformed to the extent that the gap between the insulating sheet 60 and the circuit board 30 or the heat radiating member 50 can be filled.
  • the first heat transfer material 70A is provided so as to extend over a plurality of conductive paths 34.
  • the first heat transfer material 70A may have an insulating property to such an extent that the state in which the plurality of conductive paths 34 are insulated can be maintained. That is, it suffices that the plurality of conductive paths 34 are not electrically connected via the first heat transfer material 70A.
  • the first heat transfer material 70A is provided so as to cover all of the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • the first heat transfer material 70A may have a portion provided so as to be in contact with only one conductive path 34.
  • a portion of the first heat transfer material 70A corresponding to the first conductive path 34A, a portion corresponding to the second conductive path 34B, and a portion corresponding to the third conductive path 34C are provided apart from each other. Either one may be provided apart from the other two. In this case, the portion of the first heat transfer material 70A provided so as to come into contact with only one of the conductive paths 34 does not have to have insulating properties.
  • the second heat transfer material 70B is in contact with the insulating sheet 60 and the heat radiating member 50.
  • the second heat transfer material 70B does not have to have an insulating property.
  • the thicknesses of the insulating sheet 60, the first heat transfer material 70A, and the second heat transfer material 70B are not particularly limited and may be appropriately set.
  • the thickness of the insulating sheet 60 may be the same as the thickness of the first heat transfer material 70A and the thickness of the second heat transfer material 70B, or may be thinner or thicker than them.
  • the insulating sheet 60 is provided to ensure the insulating property between the circuit board 30 and the heat radiating member 50. From this point of view, it is conceivable that the thickness of the insulating sheet 60 is set to a thickness according to the required insulating performance.
  • the first heat transfer material 70A and the second heat transfer material 70B are provided to fill the gap between the insulating sheet 60, the circuit board 30, and the heat radiating member 50 to improve the adhesion. From this viewpoint and from the viewpoint of wanting to bring the circuit board 30 and the heat radiating member 50 as close as possible, it is preferable that the thickness of the first heat transfer material 70A and the second heat transfer material 70B is as thin as possible.
  • Embodiment 1 According to the circuit structure 20 and the electrical junction box 10 configured as described above, the insulating sheet 60 provided between the circuit board 30 and the heat radiating member 50 maintains the insulation between the circuit board 30 and the heat radiating member 50. Therefore, the circuit board 30 and the heat radiating member 50 can be brought close to each other. As a result, it is possible to improve the heat dissipation of the circuit board 30 and reduce the size of the circuit structure 20.
  • the heat transfer material 70 the heat of the circuit board 30 is easily transferred to the heat radiating member 50.
  • the first heat transfer material 70A and the second heat transfer material 70B the gap between the insulating sheet 60 and the circuit board 30 and the gap between the insulating sheet 60 and the heat radiating member 50 are filled, so that the circuit board The heat of 30 is easily transferred to the heat radiating member 50.
  • FIG. 4 is a schematic cross-sectional view showing the circuit configuration 120 according to the second embodiment and the electrical junction box 110 including the circuit configuration 120.
  • FIG. 5 is a schematic plan view showing a circuit board 130 with a metal member 80.
  • FIG. 6 is a schematic bottom view showing a circuit board 130 with a metal member 80.
  • the cross section in FIG. 4 corresponds to the cross section at the position of line L2 in FIG. Further, in the description of the present embodiment, the same reference numerals are given to the components as described above, and the description thereof is omitted.
  • the configuration of the circuit configuration 120 is different from the configuration of the circuit configuration 20 in the first embodiment.
  • the circuit configuration 120 further includes a metal member 80.
  • a hole 38 is formed in the circuit board 130 instead of the through hole 36.
  • the hole 38 is provided so as to penetrate the circuit board 130.
  • the hole 38 is formed larger than the through hole 36.
  • the holes 38 are provided at positions corresponding to the respective conductive paths 34.
  • the hole 38 is provided at a position avoiding the main body 42 and the first terminal 44A of the heat generating component 40.
  • the holes 38 are provided at positions avoiding the second terminal 44B and the third terminal 44C of the heat generating component 40, respectively.
  • the hole 38 may be provided at a position where it overlaps with the main body 42, the terminal 44, and the like of the heat generating component 40.
  • the cross-sectional shape of the hole 38 along the axial direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the metal member 80 is attached to the circuit board 130.
  • the metal member 80 is fixed to the circuit board 130. Further, here, the metal member 80 is electrically connected to the conductive path 34.
  • the material of the metal member 80 for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel or the like may be adopted.
  • the metal member 80 includes an insertion portion 82 and a protrusion 84.
  • the insertion portion 82 is inserted into the hole 38.
  • the insertion portion 82 is formed smaller than the hole 38.
  • the cross-sectional shape of the insertion portion 82 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the cross-sectional shape of the insertion portion 82 may be the same as the cross-sectional shape of the hole 38, or may be a different shape.
  • the cross-sectional shapes of the insertion portion 82 and the hole 38 are both circular.
  • the insertion portion 82 is connected to and fixed to the conductive path 34 via a joining material 90 described later.
  • the protruding portion 84 is connected to one end of the insertion portion 82.
  • the protruding portion 84 protrudes from the hole 38 toward the heat radiating member 50 side.
  • the cross-sectional shape of the protruding portion 84 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the cross-sectional shape of the protruding portion 84 may be the same as or different from the cross-sectional shape of the insertion portion 82.
  • the cross-sectional shapes of the insertion portion 82 and the protrusion 84 are both circular.
  • the protruding portion 84 is formed wider than the insertion portion 82.
  • the protrusion 84 is formed larger than the hole 38.
  • the metal member 80 is prevented from coming off from the hole 38, and the metal member 80 is positioned with respect to the circuit board 130 in the insertion direction. More specifically, when the metal member 80 is about to be inserted too much into the hole 38, the protrusion 84 is caught on the peripheral edge of the opening of the hole 38, so that further insertion is suppressed. Further, the metal member 80 is positioned with respect to the circuit board 30 along the insertion direction by inserting the protruding portion 84 to a position where it is caught on the peripheral edge of the opening of the hole 38.
  • the metal member 80 in which the protruding portion 84 is formed wider than the insertion portion 82 may be referred to as a rivet. However, it is not necessary that the protruding portion 84 is formed wider than the insertion portion 82.
  • the metal member may be formed in a columnar shape having the same cross section continuously.
  • the other end of the insertion portion 82 does not protrude from the circuit board 130.
  • the other end surface of the insertion portion 82 is flush with the same height as the upper surface of the circuit board 130.
  • the other end surface of the insertion portion 82 may be lower or higher than the height of the upper surface of the circuit board 130.
  • the other end of the insertion portion 82 and the conductive path 34 around the other end are not insulated, but may be insulated.
  • the joining material 90 fills the gap between the insertion portion 82 and the inner surface of the hole 38.
  • the bonding material 90 is, for example, solder.
  • the joining material 90 is joined to the inner surface of the hole 38 and the outer surface of the insertion portion 82.
  • the metal member 80 is fixed to the circuit board 30.
  • the joining material 90 is joined to the printed wiring 35.
  • the printed wiring 35 and the insertion portion 82 are electrically connected via the joining material 90.
  • the conductive path 34 and the metal member 80 are electrically connected.
  • a printed circuit board having holes 38 is prepared instead of the through holes 36. Then, after the fluid bonding material 90 such as solder paste and the insertion portion 82 are inserted into the holes 38 in the printed circuit board, the fluid bonding material 90 solidifies to obtain the circuit board 130 with the metal member 80. ..
  • a printed circuit board provided with through holes corresponding to the size of the holes 38 may be prepared, and the insertion portion 82 may be inserted through the through holes.
  • the bonding material 90 may or may not be used for connecting and fixing the metal member 80 and the printed circuit board.
  • the bonding material 90 is not used, for example, the metal member 80 is fixed to the printed circuit board by press-fitting the insertion portion 82 into a through hole formed slightly smaller than the insertion portion 82. At this time, the insertion portion 82 and the metal material are electrically connected by being pressed against the metal material provided on the inner surface of the through hole by the force applied to the press fitting.
  • the surface of the protruding portion 84 facing the circuit board 130 and the main surface of the circuit board 130 on the heat radiating member 50 side may be adhered with an adhesive or the like to fix the metal member 80 to the circuit board 130. Further, the surface of the protruding portion 84 facing the circuit board 130 side and the main surface of the circuit board 130 on the heat radiating member 50 side may be joined by the joining material 90.
  • a through hole 62 is formed in the insulating sheet 160.
  • the through hole 62 is formed in the insulating sheet 160 at a position corresponding to the first conductive path 34A.
  • the through hole 62 is formed at a position corresponding to the metal member 80 provided in the first conductive path 34A.
  • a through hole 62 is not formed in the insulating sheet 160 at a position corresponding to the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A is a portion where the need for insulation with the heat radiating member 50 is lower than that of the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A is a portion that maintains a potential closer to the potential in the heat radiating member 50 as compared with the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A and the heat radiating member 50 have the same potential (for example, the ground potential).
  • the through hole 62 is provided with a member having a thermal conductivity higher than that of the insulating sheet 160.
  • the protrusion 84 is inserted through the through hole 62. Therefore, the through hole 62 is formed to be the same as or larger than the protrusion 84.
  • the outer surface of the protruding portion 84 has the same height as the surface of the insulating sheet 60 on the heat radiating member 50 side, but this is not an essential configuration. The outer surface of the protruding portion 84 may protrude from the through hole 62 in the insulating sheet 160 toward the heat radiating member 50 side.
  • a heat transfer material 70 may be arranged in the gap between the outer peripheral surface of the protruding portion 84 and the inner surface of the through hole 62.
  • the heat transfer material 70 may be the first heat transfer material 70A or the second heat transfer material 70B.
  • the first heat transfer material 70A is in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62. As a result, the contact area between the protruding portion 84 and the first heat transfer material 70A becomes large.
  • the first heat transfer material 70A does not have to be in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62.
  • the heat transfer material 70 may be arranged in the through hole 62 without arranging the protruding portion 84.
  • the protruding portion 84 may not reach the through hole 62, and the second heat transfer material 70B may be arranged in the through hole 62 and in close contact with the end face of the protruding portion 84 facing the heat radiating member 50 side.
  • the through hole 62 may be formed smaller than the protrusion 84.
  • the insulating sheet 160 is pushed by the protruding portion 84 of the metal member 80 provided on the second conductive path 34B and the third conductive path 34C and is bent so as to be convex toward the heat radiating member 50 side. ..
  • the insulating sheet 60 does not have to have a portion bent in the normal direction.
  • the metal member 80 provided in the second conductive path 34B and the third conductive path 34C is in contact with the insulating sheet 160.
  • the first heat transfer material 70A may be arranged between the metal member 80 provided in the second conductive path 34B and the third conductive path 34C and the insulating sheet 160. In this case, even if the portion of the first heat transfer material 70A arranged between the metal member 80 and the insulating sheet 160 is thinner than the portion arranged between the circuit board 130 and the insulating sheet 160. Good.
  • circuit configuration 120 and the electrical junction box 110 in this example can also obtain the same effects as the circuit configuration 20 and the electrical junction box 10 in the first embodiment.
  • the heat of the circuit board 130 is easily transferred to the heat radiating member 50 by the metal member 80.
  • the protruding portion 84 provided on the metal member 80 is closer to the heat radiating member 50 than the main surface of the circuit board 130, the thermal resistance of this portion is reduced.
  • the thermal resistance between the circuit board 130 and the heat radiating member 50 becomes smaller in the portion where the through hole 62 is formed.
  • the protruding portion 84 can be brought into close contact with the second heat transfer material 70B without passing through the insulating sheet 160, so that the thermal resistance of this portion is reduced.
  • the through hole 62 at a position where the need for insulation is low, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet 160 even when the through hole 62 is formed.
  • the heat transfer material 70 has been described as being provided on both sides of the insulating sheets 60 and 160, the heat transfer material 70 may be provided on only one side of the insulating sheets 60 and 160.
  • the heat transfer material 70 may be provided only on the circuit boards 30 and 130 sides with respect to the insulating sheets 60 and 160, or may be provided only on the heat radiating member 50 side.
  • the heat transfer material 70 may be provided on at least one side of the insulating sheets 60 and 160.
  • the heat transfer material 70 may be provided at least on the circuit boards 30 and 130 side with respect to the insulating sheets 60 and 160, or may be provided at least on the heat radiating member 50 side.
  • circuit components 20 and 120 may not include the heat transfer material 70.
  • the circuit components 20 and 120 do not include the heat transfer material 70, the insulating sheets 60 and 160 may be in contact with the circuit boards 30 and 130 and the heat radiating member 50.
  • the protrusion 84 may be in contact with the heat radiating member 50 through the through hole 62.
  • the metal member 80 may be provided only in a part of the conductive paths.
  • the circuit configuration is provided with a metal member 80 in a conductive path 34 connected to the heat-generating component 40 having a large heat generation amount, and the heat generation amount is increased.
  • the metal member 80 may not be provided in the conductive path 34 connected to the small heat generating component. In this case, a thermal via may be provided in the conductive path 34 connected to the heat generating component having a small heat generation amount.
  • the insulating sheet 160 having the through hole 62 formed in the second embodiment may be adopted instead of the insulating sheet 60.
  • a member having a higher thermal conductivity than the insulating sheet 160 such as the heat transfer material 70
  • the circuit configuration is configured such that the first heat transfer material 70A and the second heat transfer material 70B come into contact with each other inside or outside the through hole 62. You may be.
  • the circuit structure may be configured such that the first heat transfer material 70A comes into contact with the heat radiating member 50 at or outside the heat radiating member 50 side opening of the through hole 62.
  • the circuit structure may be configured such that the second heat transfer material 70B comes into contact with the circuit board 30 at or outside the opening on the circuit board 30 side of the through hole 62.
  • the insulating sheet 60 in which the through hole 62 in the first embodiment is not formed may be adopted instead of the insulating sheet 160.

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Abstract

The purpose of the present invention is to provide a technology by which a circuit board and a heat dissipation member can be brought close to each other. This circuit structure is provided with a circuit board, a heat dissipation member that is to be stacked on the circuit board, and an insulation sheet provided between the circuit board and the heat dissipation member.

Description

回路構成体及び電気接続箱Circuit components and electrical junction boxes
　本開示は、回路構成体及び電気接続箱に関する。 This disclosure relates to circuit configurations and electrical junction boxes.
　特許文献１は、回路基板の熱を金属部材及び伝熱材を通じて放熱部材に伝える技術を開示している。 Patent Document 1 discloses a technique for transferring the heat of a circuit board to a heat radiating member through a metal member and a heat transfer material.
特開２０１８－１８２１４７号公報JP-A-2018-182147
　回路基板と放熱部材とを近づけることが望まれている。 It is desired that the circuit board and the heat radiating member be brought close to each other.
　そこで、回路基板と放熱部材とを近づけることができる技術を提供することを目的とする。 Therefore, the purpose is to provide a technology that can bring the circuit board and the heat radiating member closer to each other.
　本開示の回路構成体は、回路基板と、前記回路基板に重ねられる放熱部材と、前記回路基板と前記放熱部材との間に設けられる絶縁シートと、を備える、回路構成体である。 The circuit configuration of the present disclosure is a circuit configuration including a circuit board, a heat radiating member superposed on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member.
　本開示によれば、回路基板と放熱部材とを近づけることができる。 According to the present disclosure, the circuit board and the heat radiating member can be brought close to each other.
図１は実施形態１にかかる回路構成体及びそれを備える電気接続箱を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing a circuit configuration according to the first embodiment and an electrical junction box including the circuit configuration. 図２は回路基板を示す概略平面図である。FIG. 2 is a schematic plan view showing a circuit board. 図３は回路基板を示す概略底面図である。FIG. 3 is a schematic bottom view showing a circuit board. 図４は実施形態２にかかる回路構成体及びそれを備える電気接続箱を示す概略断面図である。FIG. 4 is a schematic cross-sectional view showing the circuit configuration according to the second embodiment and the electrical junction box including the circuit configuration. 図５は金属部材付きの回路基板を示す概略平面図である。FIG. 5 is a schematic plan view showing a circuit board with a metal member. 図６は金属部材付きの回路基板を示す概略底面図である。FIG. 6 is a schematic bottom view showing a circuit board with a metal member.
　［本開示の実施形態の説明］
　最初に本開示の実施態様を列記して説明する。 [Explanation of Embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described.
　本開示の回路構成体は、次の通りである。 The circuit configuration of the present disclosure is as follows.
　（１）回路基板と、前記回路基板に重ねられる放熱部材と、前記回路基板と前記放熱部材との間に設けられる絶縁シートと、を備える、回路構成体である。回路基板と放熱部材との間に絶縁シートが設けられることによって回路基板と放熱部材とを絶縁することができるため、回路基板と放熱部材とを近づけることができる。 (1) A circuit configuration including a circuit board, a heat radiating member stacked on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member. Since the circuit board and the heat radiating member can be insulated by providing the insulating sheet between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
　（２）前記絶縁シートよりも熱伝導性が良い伝熱材をさらに備え、前記伝熱材は、前記絶縁シートに対して少なくとも一方側に設けられていてもよい。これにより、伝熱材を介して回路基板の熱が放熱部材に伝わりやすくなる。 (2) A heat transfer material having better thermal conductivity than the insulating sheet may be further provided, and the heat transfer material may be provided on at least one side of the insulating sheet. As a result, the heat of the circuit board is easily transferred to the heat radiating member through the heat transfer material.
　（３）前記伝熱材は、前記回路基板と前記絶縁シートとの間に設けられた第１伝熱材と、前記放熱部材と前記絶縁シートとの間に設けられた第２伝熱材と、を含んでいてもよい。これにより、第１伝熱材及び第２伝熱材を介して回路基板の熱が放熱部材に伝わりやすくなる。 (3) The heat transfer material includes a first heat transfer material provided between the circuit board and the insulating sheet, and a second heat transfer material provided between the heat radiating member and the insulating sheet. , May be included. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the first heat transfer material and the second heat transfer material.
　（４）前記回路基板に取付けられた金属部材をさらに備え、前記金属部材は前記回路基板に形成された孔に挿通された挿通部と、前記挿通部の一端に連なり前記孔から前記放熱部材側に向けて突出する突出部とを含んでいてもよい。これにより、金属部材を介して回路基板の熱が放熱部材に伝わりやすくなる。 (4) A metal member attached to the circuit board is further provided, and the metal member is connected to an insertion portion inserted into a hole formed in the circuit board and one end of the insertion portion, and the heat radiation member side from the hole. It may include a protrusion that protrudes toward. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the metal member.
　（５）前記絶縁シートに貫通孔が形成されていてもよい。これにより、貫通孔が形成された部分において回路基板と放熱部材との間の熱抵抗が小さくなる。 (5) Through holes may be formed in the insulating sheet. As a result, the thermal resistance between the circuit board and the heat radiating member is reduced in the portion where the through hole is formed.
　（６）前記回路基板には第１導電路と第２導電路とが形成され、前記絶縁シートにおいて前記第１導電路に対応する位置に前記貫通孔が形成され、前記第２導電路に対応する位置に貫通孔が形成されていなくてもよい。これにより、例えば絶縁の必要性の低い箇所に貫通孔が形成されることによって絶縁シートの絶縁性能が低下する影響を小さくすることができる。 (6) A first conductive path and a second conductive path are formed on the circuit board, and the through hole is formed at a position corresponding to the first conductive path in the insulating sheet to correspond to the second conductive path. It is not necessary that a through hole is formed at the position where the through hole is formed. As a result, for example, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet due to the formation of through holes at places where the need for insulation is low.
　（７）また、本開示の電気接続箱は、前記回路構成体と、前記回路構成体を覆うケースと、を備える電気接続箱である。回路基板と放熱部材との間に設けられる絶縁シートによって回路基板と放熱部材とを絶縁することができるため、回路基板と放熱部材とを近づけることができる。 (7) Further, the electrical junction box of the present disclosure is an electrical junction box including the circuit configuration and a case covering the circuit configuration. Since the circuit board and the heat radiating member can be insulated by the insulating sheet provided between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
　［本開示の実施形態の詳細］
　本開示の回路構成体及び電気接続箱の具体例を、以下に図面を参照しつつ説明する。なお、本開示はこれらの例示に限定されるものではなく、請求の範囲によって示され、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。 [Details of Embodiments of the present disclosure]
Specific examples of the circuit configuration and the electrical junction box of the present disclosure will be described below with reference to the drawings. It should be noted that the present disclosure is not limited to these examples, and is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.
　［実施形態１］
　以下、実施形態１にかかる回路構成体及びそれを備える電気接続箱について説明する。図１は実施形態１にかかる回路構成体２０及びそれを備える電気接続箱１０を示す概略断面図である。図２は回路基板３０を示す概略平面図である。図３は回路基板３０を示す概略底面図である。なお図１における断面は図２における線Ｌ１の位置での断面に相当する。 [Embodiment 1]
Hereinafter, the circuit configuration according to the first embodiment and the electrical junction box including the circuit configuration will be described. FIG. 1 is a schematic cross-sectional view showing a circuit configuration 20 according to the first embodiment and an electrical connection box 10 including the circuit configuration 20. FIG. 2 is a schematic plan view showing the circuit board 30. FIG. 3 is a schematic bottom view showing the circuit board 30. The cross section in FIG. 1 corresponds to the cross section at the position of line L1 in FIG.
　＜電気接続箱＞
　電気接続箱１０は、例えば車両においてバッテリ等の電源と、ランプ、ワイパー等の車載電装品等の負荷との間の電力供給経路に配される。電気接続箱１０は、例えばＤＣ－ＤＣコンバータ又はインバータ等に用いられてもよい。電気接続箱１０は、ケース１２と回路構成体２０とを備える。 <Electrical junction box>
The electric junction box 10 is arranged in a power supply path between a power source such as a battery and a load such as an in-vehicle electrical component such as a lamp and a wiper in a vehicle, for example. The electrical junction box 10 may be used, for example, in a DC-DC converter, an inverter, or the like. The electrical junction box 10 includes a case 12 and a circuit configuration 20.
　ケース１２は、回路構成体２０を覆っている。図１に示す例では、ケース１２は、下方側が開口する箱形である。回路構成体２０がケース１２の蓋部となる。もっともケース１２は、回路構成体２０全体を内部に収容可能であってもよい。この場合、ケース１２は本体部及び蓋部を有していると良い。ケース１２を構成する材料は特に限定されるものではないが、例えばアルミニウム、アルミニウム合金等の金属又は合成樹脂などが採用されてもよい。 The case 12 covers the circuit configuration 20. In the example shown in FIG. 1, the case 12 has a box shape with an opening on the lower side. The circuit structure 20 serves as the lid of the case 12. However, the case 12 may accommodate the entire circuit configuration 20 inside. In this case, the case 12 may have a main body and a lid. The material constituting the case 12 is not particularly limited, but for example, a metal such as aluminum or an aluminum alloy or a synthetic resin may be adopted.
　＜回路構成体＞
　回路構成体２０は、回路基板３０と放熱部材５０と絶縁シート６０とを備える。ここでは回路構成体２０は、伝熱材７０をさらに備える。 <Circuit configuration>
The circuit structure 20 includes a circuit board 30, a heat radiating member 50, and an insulating sheet 60. Here, the circuit configuration 20 further includes a heat transfer material 70.
　回路基板３０は、絶縁部３２と導電路３４とを含む。ここでは回路基板３０としてプリント基板が用いられている例が説明される。絶縁部３２はプリント基板における絶縁板を有する。絶縁部３２はプリント基板におけるソルダレジストなどを有していてもよい。導電路３４はプリント基板におけるプリント配線３５を有する。図１に示す例では、プリント基板は２層である。プリント配線３５は、絶縁板の両主面に形成されている。プリント基板は、厚み方向中間にも配線が形成された多層基板であってもよい。導電路３４はプリント基板とは別に設けられたバスバを有していてもよい。導電路３４はプリント基板の主面に露出するランドを有していてもよい。導電路３４は、相互に絶縁される態様で複数設けられている。ここでは第１導電路３４Ａ、第２導電路３４Ｂ、及び第３導電路３４Ｃが設けられている。 The circuit board 30 includes an insulating portion 32 and a conductive path 34. Here, an example in which a printed circuit board is used as the circuit board 30 will be described. The insulating portion 32 has an insulating plate in the printed circuit board. The insulating portion 32 may have a solder resist or the like on the printed circuit board. The conductive path 34 has a printed wiring board 35 on the printed circuit board. In the example shown in FIG. 1, the printed circuit board has two layers. The printed wiring 35 is formed on both main surfaces of the insulating plate. The printed circuit board may be a multilayer board in which wiring is also formed in the middle in the thickness direction. The conductive path 34 may have a bus bar provided separately from the printed circuit board. The conductive path 34 may have a land exposed on the main surface of the printed circuit board. A plurality of conductive paths 34 are provided so as to be insulated from each other. Here, the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C are provided.
　回路基板３０には発熱部品４０が実装されている。ここではかかる発熱部品４０が、ＦＥＴ（Field Effect Transistor）である例が説明される。発熱部品４０はシャント抵抗等の抵抗、コイル、コンデンサ等であってもよい。図１に示す例では発熱部品４０は１つであるが、発熱部品４０は複数設けられていてもよい。 A heat generating component 40 is mounted on the circuit board 30. Here, an example in which the heat generating component 40 is a FET (Field Effect Transistor) will be described. The heat generating component 40 may be a resistor such as a shunt resistor, a coil, a capacitor, or the like. In the example shown in FIG. 1, the number of heat generating parts 40 is one, but a plurality of heat generating parts 40 may be provided.
　発熱部品４０は本体４２と複数の端子４４とを含む。本体４２は第１導電路３４Ａのランドに位置している。複数の端子４４は本体４２の外部に露出する。複数の端子４４は第１端子４４Ａ、第２端子４４Ｂ、及び第３端子４４Ｃを有する。第１端子４４Ａは本体４２の裏面に設けられている。第１端子４４Ａは第１導電路３４Ａに接続されている。第２端子４４Ｂ及び第３端子４４Ｃは、本体４２の側面から突出するように設けられている。第２端子４４Ｂ及び第３端子４４Ｃは第２導電路３４Ｂ及び第３導電路３４Ｃにそれぞれ接続されている。各端子４４は、例えばランドに半田付けされるなどして導電路３４と接続される。発熱部品４０がＦＥＴである場合、第１端子４４Ａ、第２端子４４Ｂ、及び第３端子４４Ｃは、例えばドレイン端子、ゲート端子、及びソース端子に対応する。 The heat generating component 40 includes a main body 42 and a plurality of terminals 44. The main body 42 is located on the land of the first conductive path 34A. The plurality of terminals 44 are exposed to the outside of the main body 42. The plurality of terminals 44 have a first terminal 44A, a second terminal 44B, and a third terminal 44C. The first terminal 44A is provided on the back surface of the main body 42. The first terminal 44A is connected to the first conductive path 34A. The second terminal 44B and the third terminal 44C are provided so as to project from the side surface of the main body 42. The second terminal 44B and the third terminal 44C are connected to the second conductive path 34B and the third conductive path 34C, respectively. Each terminal 44 is connected to the conductive path 34, for example, by soldering to a land. When the heat generating component 40 is an FET, the first terminal 44A, the second terminal 44B, and the third terminal 44C correspond to, for example, a drain terminal, a gate terminal, and a source terminal.
　回路基板３０にはスルーホール３６が形成されている。スルーホール３６は、絶縁板に設けられた孔の内面及び開口周縁に銅箔又はメッキ等の金属材料３７が設けられた構成とされている。かかる金属材料３７は、導電路３４の一部をなしている。つまりスルーホール３６の設けられた導電路３４において絶縁板における上面のプリント配線３５と下面のプリント配線３５とが金属材料３７によって電気的に接続される。なお図１に示す例では、スルーホール３６として電気部品が挿入されないスルーホール３６（ビアホールなどとも言う）が設けられているが、電気部品が挿入されるスルーホール（電気部品用スルーホールなどとも言う）が設けられていてもよい。なお、ビアホールのうち特に放熱のためのビアホールはサーマルビアなどとも呼ばれる。 A through hole 36 is formed in the circuit board 30. The through hole 36 has a structure in which a metal material 37 such as copper foil or plating is provided on the inner surface of the hole provided in the insulating plate and the peripheral edge of the opening. The metal material 37 forms a part of the conductive path 34. That is, in the conductive path 34 provided with the through hole 36, the printed wiring 35 on the upper surface and the printed wiring 35 on the lower surface of the insulating plate are electrically connected by the metal material 37. In the example shown in FIG. 1, a through hole 36 (also referred to as a via hole) into which an electric component is not inserted is provided as a through hole 36, but a through hole into which an electric component is inserted (also referred to as a through hole for an electric component or the like) is provided. ) May be provided. Of the via holes, the via hole for heat dissipation is also called a thermal via.
　図２に示す例では、第１導電路３４Ａ、第２導電路３４Ｂ、第３導電路３４Ｃをなすプリント配線３５のそれぞれにスルーホール３６が形成されている。第１導電路３４Ａ、第２導電路３４Ｂ、第３導電路３４Ｃをなすプリント配線３５においてランド以外の部分にスルーホール３６が形成されている。第１導電路３４Ａをなすプリント配線３５において本体４２と重なる部分にもスルーホール３６が形成されている。もっともスルーホール３６の位置は上記したものに限られず、適宜設定可能である。またスルーホール３６が形成されていないプリント配線があってもよい。 In the example shown in FIG. 2, through holes 36 are formed in each of the printed wirings 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C. Through holes 36 are formed in portions other than the lands in the printed wiring 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C. A through hole 36 is also formed in a portion of the printed wiring 35 forming the first conductive path 34A that overlaps with the main body 42. However, the position of the through hole 36 is not limited to that described above, and can be set as appropriate. Further, there may be a printed wiring in which the through hole 36 is not formed.
　回路基板３０のうち放熱部材５０側の主面において導電路３４が露出している。ここではスルーホール３６における金属材料３７が露出している。導電路３４のうちプリント配線、バスバなどが露出していてもよい。 The conductive path 34 is exposed on the main surface of the circuit board 30 on the heat radiating member 50 side. Here, the metal material 37 in the through hole 36 is exposed. Of the conductive paths 34, the printed wiring, the bus bar, and the like may be exposed.
　放熱部材５０は、回路基板３０に重ねられる。放熱部材５０はアルミニウム、アルミニウム合金等の熱伝導率が高い金属類製である。放熱部材５０は載置面を有する。載置面は回路基板３０に向けられている。載置面上に回路基板３０、絶縁シート６０、伝熱材７０が重ねられている。載置面は平坦に形成されていると良い。 The heat radiating member 50 is superposed on the circuit board 30. The heat radiating member 50 is made of a metal having high thermal conductivity such as aluminum or an aluminum alloy. The heat radiating member 50 has a mounting surface. The mounting surface is directed to the circuit board 30. The circuit board 30, the insulating sheet 60, and the heat transfer material 70 are stacked on the mounting surface. The mounting surface should be formed flat.
　なお放熱部材５０には、表面積を大きくするためにフィン（fin）などが設けられているとよい。フィンは例えば櫛歯状に形成される。本例のように放熱部材５０が電気接続箱１０の外面に露出する場合、フィンは放熱部材５０において電気接続箱１０の外面に露出する部分（本例では載置面とは反対側の面）に設けられていると良い。また放熱部材５０と回路基板３０とは図示しないネジ等の固定手段により固定されると良い。 It is preferable that the heat radiating member 50 is provided with fins or the like in order to increase the surface area. The fins are formed, for example, in the shape of comb teeth. When the heat radiating member 50 is exposed to the outer surface of the electric junction box 10 as in this example, the fin is a portion of the heat radiating member 50 exposed to the outer surface of the electric junction box 10 (the surface opposite to the mounting surface in this example). It is good if it is provided in. Further, the heat radiating member 50 and the circuit board 30 may be fixed by fixing means such as screws (not shown).
　また回路構成体２０は、載置面と回路基板３０とを一定間隔に維持するスペーサが設けられていてもよい。スペーサは、載置面から法線方向に突出するように設けられる。回路基板３０は、スペーサに支持されることによって載置面と一定間隔を有した状態に維持される。例えばスペーサは載置面の周囲に設けられる。この場合、スペーサは回路基板３０の周縁部を支持する。スペーサは放熱部材５０と一体に設けられていてもよいし、放熱部材５０とは別部材であってもよい。 Further, the circuit configuration 20 may be provided with a spacer that maintains the mounting surface and the circuit board 30 at regular intervals. The spacer is provided so as to project in the normal direction from the mounting surface. By being supported by the spacer, the circuit board 30 is maintained in a state of having a constant distance from the mounting surface. For example, spacers are provided around the mounting surface. In this case, the spacer supports the peripheral edge of the circuit board 30. The spacer may be provided integrally with the heat radiating member 50, or may be a separate member from the heat radiating member 50.
　絶縁シート６０は、回路基板３０と放熱部材５０との間に設けられる。絶縁シート６０は絶縁性を有する材料によってシート状に成形された部材である。絶縁シート６０の材料は、特に限定されるものではないが、絶縁性の高い材料（電気抵抗率の高い材料）であることが好ましい。これにより所定の電気抵抗値を有する絶縁シート６０の厚みを薄くすることができる。例えば、絶縁シート６０の材料としてポリイミドなどが採用されてもよい。 The insulating sheet 60 is provided between the circuit board 30 and the heat radiating member 50. The insulating sheet 60 is a member formed into a sheet by a material having an insulating property. The material of the insulating sheet 60 is not particularly limited, but is preferably a material having high insulating properties (material having high electrical resistivity). As a result, the thickness of the insulating sheet 60 having a predetermined electric resistance value can be reduced. For example, polyimide or the like may be adopted as the material of the insulating sheet 60.
　絶縁シート６０は回路基板３０における放熱部材５０側の主面において露出する導電路３４の少なくとも一部を覆うように設けられる。これにより回路基板３０において露出する導電路３４と放熱部材５０との短絡を抑制することができる。ここでは絶縁シート６０は回路基板３０における放熱部材５０側の主面において露出する導電路３４のすべてを覆う例が説明されるが、絶縁シート６０は回路基板３０における放熱部材５０側の主面において露出する導電路３４の一部のみを覆っていてもよい。 The insulating sheet 60 is provided so as to cover at least a part of the conductive path 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side. As a result, it is possible to suppress a short circuit between the conductive path 34 exposed on the circuit board 30 and the heat radiating member 50. Here, an example will be described in which the insulating sheet 60 covers all of the conductive paths 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side, but the insulating sheet 60 is on the main surface of the circuit board 30 on the heat radiating member 50 side. Only a part of the exposed conductive path 34 may be covered.
　またここでは一の絶縁シート６０が露出する導電路３４のすべてを覆う例が説明されるが、複数の絶縁シートがそれぞれ異なる領域の導電路３４を覆っていてもよい。 Further, although an example in which one insulating sheet 60 covers all of the exposed conductive paths 34 will be described here, a plurality of insulating sheets may cover the conductive paths 34 in different regions.
　伝熱材７０は絶縁シート６０よりも熱伝導性が良い。伝熱材７０は、熱界面材料（ＴＩＭ：Thermal Interface Material）などとも呼ばれる。伝熱材７０は絶縁シート６０よりも熱伝導率の高い材料によって形成されている。伝熱材７０は絶縁シート６０よりも絶縁性が低くてもよい。伝熱材７０は絶縁シート６０よりも絶縁性が低い材料によって形成されていてもよい。ここでは伝熱材７０がグリス（grease）状部材である例が説明される。かかる伝熱材７０は放熱グリス、熱伝導グリスと呼ばれるものである。伝熱材７０はベース単体であってもよいし、ベースにフィラーが混ぜられたものであってもよい。ベースの材料は例えばシリコーンなど絶縁性を有するものが採用されるとよい。フィラーは伝熱材７０の熱伝導率を高めるために混ぜられる。フィラーの材料はベースの材料よりも熱伝導率が高いものが採用されるとよい。フィラーの材料は例えば金属など導電性を有するものであってもよい。 The heat transfer material 70 has better thermal conductivity than the insulating sheet 60. The heat transfer material 70 is also called a thermal interface material (TIM: Thermal Interface Material) or the like. The heat transfer material 70 is made of a material having a higher thermal conductivity than the insulating sheet 60. The heat transfer material 70 may have a lower insulating property than the insulating sheet 60. The heat transfer material 70 may be made of a material having a lower insulating property than the insulating sheet 60. Here, an example in which the heat transfer material 70 is a grease-like member will be described. The heat transfer material 70 is called thermal paste or heat conductive grease. The heat transfer material 70 may be a single base or a base mixed with a filler. As the base material, a material having an insulating property such as silicone may be adopted. The filler is mixed to increase the thermal conductivity of the heat transfer material 70. The filler material should have a higher thermal conductivity than the base material. The material of the filler may be a conductive material such as metal.
　伝熱材７０は、絶縁シート６０に対して両側に設けられている。回路基板３０と絶縁シート６０との間に設けられている伝熱材７０が、第１伝熱材７０Ａである。放熱部材５０と絶縁シート６０との間に設けられている伝熱材７０が、第２伝熱材７０Ｂである。 The heat transfer material 70 is provided on both sides of the insulating sheet 60. The heat transfer material 70 provided between the circuit board 30 and the insulating sheet 60 is the first heat transfer material 70A. The heat transfer material 70 provided between the heat radiating member 50 and the insulating sheet 60 is the second heat transfer material 70B.
　ここでは第１伝熱材７０Ａと第２伝熱材７０Ｂとは、同じ物性を有する材料によって形成されている例が説明される。つまり、第１伝熱材７０Ａと第２伝熱材７０Ｂとは、同じ材料が異なる位置に配されたものである。もちろん、第１伝熱材７０Ａと第２伝熱材７０Ｂとは、異なる物性を有する材料によって形成されていてもよい。 Here, an example in which the first heat transfer material 70A and the second heat transfer material 70B are formed of materials having the same physical properties will be described. That is, the first heat transfer material 70A and the second heat transfer material 70B are the same materials arranged at different positions. Of course, the first heat transfer material 70A and the second heat transfer material 70B may be formed of materials having different physical properties.
　第１伝熱材７０Ａは回路基板３０及び絶縁シート６０と密着して回路基板３０と絶縁シート６０との間の隙間を埋めている。第２伝熱材７０Ｂは放熱部材５０及び絶縁シート６０と密着して放熱部材５０と絶縁シート６０との間の隙間を埋めている。これにより回路基板３０、絶縁シート６０、放熱部材５０の間に含まれる空気を少なくすることができ、この部分の熱抵抗が小さくなる。第１伝熱材７０Ａ及び第２伝熱材７０Ｂは、例えば、流動性を有する状態で回路基板３０、絶縁シート６０、放熱部材５０に押し付けられることによって、回路基板３０、絶縁シート６０、放熱部材５０とそれぞれ密着可能である。第１伝熱材７０Ａ及び第２伝熱材７０Ｂは、回路基板３０における各部の融点よりも低い温度で粘性を有する状態となり得る部材であると良い。例えば第１伝熱材７０Ａ及び第２伝熱材７０Ｂは、放熱グリスのように通常状態において粘性を有する部材、つまり粘体である。また例えば第１伝熱材７０Ａ及び第２伝熱材７０Ｂは、接着剤などのように固化する前に粘性を有する状態になることができる部材であってもよい。 The first heat transfer material 70A is in close contact with the circuit board 30 and the insulating sheet 60 to fill the gap between the circuit board 30 and the insulating sheet 60. The second heat transfer material 70B is in close contact with the heat radiating member 50 and the insulating sheet 60 to fill the gap between the heat radiating member 50 and the insulating sheet 60. As a result, the amount of air contained between the circuit board 30, the insulating sheet 60, and the heat radiating member 50 can be reduced, and the thermal resistance of this portion is reduced. The first heat transfer material 70A and the second heat transfer material 70B are pressed against the circuit board 30, the insulating sheet 60, and the heat radiating member 50 in a state of having fluidity, so that the circuit board 30, the insulating sheet 60, and the heat radiating member are pressed. Each can be in close contact with 50. The first heat transfer material 70A and the second heat transfer material 70B are preferably members that can be in a viscous state at a temperature lower than the melting point of each part of the circuit board 30. For example, the first heat transfer material 70A and the second heat transfer material 70B are members having viscosity under a normal state, such as thermal paste, that is, a viscous body. Further, for example, the first heat transfer material 70A and the second heat transfer material 70B may be members such as an adhesive that can be in a viscous state before being solidified.
　もっとも伝熱材７０はシート状に成形された伝熱シートであってもよい。この場合、伝熱シートは、絶縁シート６０と回路基板３０又は放熱部材５０との隙間を埋めることができる程度に変形容易であると良い。 However, the heat transfer material 70 may be a heat transfer sheet formed into a sheet shape. In this case, the heat transfer sheet may be easily deformed to the extent that the gap between the insulating sheet 60 and the circuit board 30 or the heat radiating member 50 can be filled.
　第１伝熱材７０Ａは複数の導電路３４にわたるように設けられている。この場合、第１伝熱材７０Ａは複数の導電路３４間が絶縁された状態を維持可能な程度に絶縁性を有していればよい。つまり、第１伝熱材７０Ａを介して複数の導電路３４が電気的に接続されないようになっていればよい。ここでは第１伝熱材７０Ａは第１導電路３４Ａ、第２導電路３４Ｂ、第３導電路３４Ｃのすべてにわたるように設けられている。 The first heat transfer material 70A is provided so as to extend over a plurality of conductive paths 34. In this case, the first heat transfer material 70A may have an insulating property to such an extent that the state in which the plurality of conductive paths 34 are insulated can be maintained. That is, it suffices that the plurality of conductive paths 34 are not electrically connected via the first heat transfer material 70A. Here, the first heat transfer material 70A is provided so as to cover all of the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
　第１伝熱材７０Ａは一の導電路３４のみに接触するように設けられた部分を有していてもよい。例えば、第１伝熱材７０Ａのうち第１導電路３４Ａに対応する部分と、第２導電路３４Ｂに対応する部分と、第３導電路３４Ｃに対応する部分とが相互に離れて設けられていてもよいし、いずれか１つが他の２つから離れて設けられていてもよい。この場合、第１伝熱材７０Ａのうち一の導電路３４のみに接触するように設けられた部分は絶縁性を有していなくてもよい。 The first heat transfer material 70A may have a portion provided so as to be in contact with only one conductive path 34. For example, a portion of the first heat transfer material 70A corresponding to the first conductive path 34A, a portion corresponding to the second conductive path 34B, and a portion corresponding to the third conductive path 34C are provided apart from each other. Either one may be provided apart from the other two. In this case, the portion of the first heat transfer material 70A provided so as to come into contact with only one of the conductive paths 34 does not have to have insulating properties.
　第２伝熱材７０Ｂは、絶縁シート６０と放熱部材５０とに接触している。第２伝熱材７０Ｂは絶縁性を有していなくてもよい。 The second heat transfer material 70B is in contact with the insulating sheet 60 and the heat radiating member 50. The second heat transfer material 70B does not have to have an insulating property.
　絶縁シート６０、第１伝熱材７０Ａ及び第２伝熱材７０Ｂの厚みは特に限定されるものではなく、適宜設定されていればよい。例えば、絶縁シート６０の厚みが第１伝熱材７０Ａの厚み及び第２伝熱材７０Ｂの厚みと同じであってもよいし、それらより薄くてもよいし、厚くてもよい。 The thicknesses of the insulating sheet 60, the first heat transfer material 70A, and the second heat transfer material 70B are not particularly limited and may be appropriately set. For example, the thickness of the insulating sheet 60 may be the same as the thickness of the first heat transfer material 70A and the thickness of the second heat transfer material 70B, or may be thinner or thicker than them.
　ここで絶縁シート６０は回路基板３０と放熱部材５０との絶縁性を確保するために設けられるものである。この観点から、絶縁シート６０の厚みは、必要な絶縁性能に応じた厚みに設定されることが考えられる。一方、第１伝熱材７０Ａ及び第２伝熱材７０Ｂは絶縁シート６０と回路基板３０、放熱部材５０との隙間を埋めて密着性を高めるために設けられるものである。この観点及び回路基板３０と放熱部材５０とをなるべく近づけたいとの観点から、第１伝熱材７０Ａ及び第２伝熱材７０Ｂの厚みはなるべく薄いことが好ましい。 Here, the insulating sheet 60 is provided to ensure the insulating property between the circuit board 30 and the heat radiating member 50. From this point of view, it is conceivable that the thickness of the insulating sheet 60 is set to a thickness according to the required insulating performance. On the other hand, the first heat transfer material 70A and the second heat transfer material 70B are provided to fill the gap between the insulating sheet 60, the circuit board 30, and the heat radiating member 50 to improve the adhesion. From this viewpoint and from the viewpoint of wanting to bring the circuit board 30 and the heat radiating member 50 as close as possible, it is preferable that the thickness of the first heat transfer material 70A and the second heat transfer material 70B is as thin as possible.
　＜実施形態１における効果等＞
　以上のように構成された回路構成体２０及び電気接続箱１０によると、回路基板３０と放熱部材５０との間に設けられた絶縁シート６０によって回路基板３０と放熱部材５０との絶縁性が保たれるため、回路基板３０と放熱部材５０とを近づけることができる。これにより回路基板３０の放熱性の向上、回路構成体２０の小型化などを図ることができる。 <Effects, etc. in Embodiment 1>
According to the circuit structure 20 and the electrical junction box 10 configured as described above, the insulating sheet 60 provided between the circuit board 30 and the heat radiating member 50 maintains the insulation between the circuit board 30 and the heat radiating member 50. Therefore, the circuit board 30 and the heat radiating member 50 can be brought close to each other. As a result, it is possible to improve the heat dissipation of the circuit board 30 and reduce the size of the circuit structure 20.
　また伝熱材７０が設けられることによって、回路基板３０の熱が放熱部材５０に伝わりやすくなる。特に、第１伝熱材７０Ａ及び第２伝熱材７０Ｂが設けられることによって、絶縁シート６０と回路基板３０との隙間、及び絶縁シート６０と放熱部材５０との隙間が埋められるため、回路基板３０の熱が放熱部材５０に伝わりやすくなる。 Further, by providing the heat transfer material 70, the heat of the circuit board 30 is easily transferred to the heat radiating member 50. In particular, by providing the first heat transfer material 70A and the second heat transfer material 70B, the gap between the insulating sheet 60 and the circuit board 30 and the gap between the insulating sheet 60 and the heat radiating member 50 are filled, so that the circuit board The heat of 30 is easily transferred to the heat radiating member 50.
　［実施形態２］
　実施形態２にかかる回路構成体及びそれを備える電気接続箱について説明する。図４は実施形態２にかかる回路構成体１２０及びそれを備える電気接続箱１１０を示す概略断面図である。図５は金属部材８０付きの回路基板１３０を示す概略平面図である。図６は金属部材８０付きの回路基板１３０を示す概略底面図である。なお図４における断面は図５における線Ｌ２の位置での断面に相当する。また本実施形態の説明において、これまで説明したものと同様構成要素については同一符号が付されてその説明が省略される。 [Embodiment 2]
The circuit configuration according to the second embodiment and the electric junction box including the circuit configuration will be described. FIG. 4 is a schematic cross-sectional view showing the circuit configuration 120 according to the second embodiment and the electrical junction box 110 including the circuit configuration 120. FIG. 5 is a schematic plan view showing a circuit board 130 with a metal member 80. FIG. 6 is a schematic bottom view showing a circuit board 130 with a metal member 80. The cross section in FIG. 4 corresponds to the cross section at the position of line L2 in FIG. Further, in the description of the present embodiment, the same reference numerals are given to the components as described above, and the description thereof is omitted.
　本例では回路構成体１２０の構成が実施形態１における回路構成体２０の構成とは異なる。具体的には回路構成体１２０は、金属部材８０をさらに備える。また回路基板１３０にはスルーホール３６に替えて孔３８が形成されている。 In this example, the configuration of the circuit configuration 120 is different from the configuration of the circuit configuration 20 in the first embodiment. Specifically, the circuit configuration 120 further includes a metal member 80. Further, a hole 38 is formed in the circuit board 130 instead of the through hole 36.
　孔３８は、回路基板１３０を貫通するように設けられている。孔３８は上記スルーホール３６よりも大きく形成されている。孔３８は各導電路３４に対応する位置に設けられている。第１導電路３４Ａにおいて孔３８は発熱部品４０の本体４２及び第１端子４４Ａを避けた位置に設けられている。第２導電路３４Ｂ及び第３導電路３４Ｃにおいて孔３８は発熱部品４０の第２端子４４Ｂ及び第３端子４４Ｃを避けた位置にそれぞれ設けられている。もっとも孔３８は発熱部品４０の本体４２、端子４４などと重なる位置に設けられていてもよい。軸方向に沿った孔３８の断面形状は円形状であってもよいし、楕円形状、角形状などであってもよい。 The hole 38 is provided so as to penetrate the circuit board 130. The hole 38 is formed larger than the through hole 36. The holes 38 are provided at positions corresponding to the respective conductive paths 34. In the first conductive path 34A, the hole 38 is provided at a position avoiding the main body 42 and the first terminal 44A of the heat generating component 40. In the second conductive path 34B and the third conductive path 34C, the holes 38 are provided at positions avoiding the second terminal 44B and the third terminal 44C of the heat generating component 40, respectively. However, the hole 38 may be provided at a position where it overlaps with the main body 42, the terminal 44, and the like of the heat generating component 40. The cross-sectional shape of the hole 38 along the axial direction may be a circular shape, an elliptical shape, a square shape, or the like.
　金属部材８０は、回路基板１３０に取付けられている。金属部材８０は、回路基板１３０に固定されている。さらにここでは金属部材８０は、導電路３４と電気的に接続されている。金属部材８０の材料としては、例えば、銅、銅合金、アルミニウム、アルミニウム合金、鉄、ステンレス鋼等が採用されてもよい。金属部材８０は挿通部８２と突出部８４とを含む。 The metal member 80 is attached to the circuit board 130. The metal member 80 is fixed to the circuit board 130. Further, here, the metal member 80 is electrically connected to the conductive path 34. As the material of the metal member 80, for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel or the like may be adopted. The metal member 80 includes an insertion portion 82 and a protrusion 84.
　挿通部８２は、孔３８に挿通されている。挿通部８２は孔３８よりも小さく形成されている。挿通方向に沿った挿通部８２の断面形状は円形状であってもよいし、楕円形状、角形状などであってもよい。挿通部８２の断面形状は孔３８の断面形状と同様の形状であってもよいし、異なる形状であってもよい。ここでは挿通部８２及び孔３８の断面形状は共に円形状である。挿通部８２は後述する接合材９０を介して導電路３４と接続及び固定されている。 The insertion portion 82 is inserted into the hole 38. The insertion portion 82 is formed smaller than the hole 38. The cross-sectional shape of the insertion portion 82 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like. The cross-sectional shape of the insertion portion 82 may be the same as the cross-sectional shape of the hole 38, or may be a different shape. Here, the cross-sectional shapes of the insertion portion 82 and the hole 38 are both circular. The insertion portion 82 is connected to and fixed to the conductive path 34 via a joining material 90 described later.
　突出部８４は、挿通部８２の一端に連なる。突出部８４は孔３８から放熱部材５０側に向けて突出している。挿通方向に沿った突出部８４の断面形状は円形状であってもよいし、楕円形状、角形状などであってもよい。突出部８４の断面形状は挿通部８２の断面形状と同様の形状であってもよいし、異なる形状であってもよい。ここでは挿通部８２及び突出部８４の断面形状は共に円形状である。 The protruding portion 84 is connected to one end of the insertion portion 82. The protruding portion 84 protrudes from the hole 38 toward the heat radiating member 50 side. The cross-sectional shape of the protruding portion 84 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like. The cross-sectional shape of the protruding portion 84 may be the same as or different from the cross-sectional shape of the insertion portion 82. Here, the cross-sectional shapes of the insertion portion 82 and the protrusion 84 are both circular.
　ここでは突出部８４は挿通部８２よりも幅広に形成されている。特にここでは突出部８４は孔３８よりも大きく形成されている。これにより孔３８からの金属部材８０の抜け止め及び回路基板１３０に対する金属部材８０の挿通方向における位置決めが図られる。より詳細には、金属部材８０が孔３８に挿通されすぎそうになった場合に、突出部８４が孔３８の開口周縁に引っ掛かることによって、それ以上の挿通が抑制される。また突出部８４が孔３８の開口周縁に引っ掛かる位置まで挿通されることによって金属部材８０が挿通方向に沿って回路基板３０に対して位置決めされる。突出部８４が挿通部８２よりも幅広に形成された金属部材８０をリベットと呼ぶこともある。もっとも突出部８４が挿通部８２よりも幅広に形成されている必要はない。例えば金属部材は同一断面が連続する柱状に形成されていてもよい。 Here, the protruding portion 84 is formed wider than the insertion portion 82. In particular, here, the protrusion 84 is formed larger than the hole 38. As a result, the metal member 80 is prevented from coming off from the hole 38, and the metal member 80 is positioned with respect to the circuit board 130 in the insertion direction. More specifically, when the metal member 80 is about to be inserted too much into the hole 38, the protrusion 84 is caught on the peripheral edge of the opening of the hole 38, so that further insertion is suppressed. Further, the metal member 80 is positioned with respect to the circuit board 30 along the insertion direction by inserting the protruding portion 84 to a position where it is caught on the peripheral edge of the opening of the hole 38. The metal member 80 in which the protruding portion 84 is formed wider than the insertion portion 82 may be referred to as a rivet. However, it is not necessary that the protruding portion 84 is formed wider than the insertion portion 82. For example, the metal member may be formed in a columnar shape having the same cross section continuously.
　なお挿通部８２における他端は回路基板１３０から突出していない。挿通部８２における他端の端面は回路基板１３０における上面と同じ高さ（面一）になっている。もっとも挿通部８２における他端の端面は回路基板１３０における上面の高さより低くなっていてもよいし、高くなっていてもよい。また図５に示す例では挿通部８２における他端及びその周辺の導電路３４は絶縁されていないが、絶縁されていてもよい。 The other end of the insertion portion 82 does not protrude from the circuit board 130. The other end surface of the insertion portion 82 is flush with the same height as the upper surface of the circuit board 130. However, the other end surface of the insertion portion 82 may be lower or higher than the height of the upper surface of the circuit board 130. Further, in the example shown in FIG. 5, the other end of the insertion portion 82 and the conductive path 34 around the other end are not insulated, but may be insulated.
　接合材９０は挿通部８２と孔３８の内面との隙間を埋めている。接合材９０は例えば半田である。接合材９０は孔３８の内面と挿通部８２の外面とに接合されている。これにより金属部材８０が回路基板３０に固定される。接合材９０はプリント配線３５と接合されている。これによりプリント配線３５と挿通部８２とが接合材９０を介して電気的に接続されている。これにより導電路３４と金属部材８０とが電気的に接続されている。 The joining material 90 fills the gap between the insertion portion 82 and the inner surface of the hole 38. The bonding material 90 is, for example, solder. The joining material 90 is joined to the inner surface of the hole 38 and the outer surface of the insertion portion 82. As a result, the metal member 80 is fixed to the circuit board 30. The joining material 90 is joined to the printed wiring 35. As a result, the printed wiring 35 and the insertion portion 82 are electrically connected via the joining material 90. As a result, the conductive path 34 and the metal member 80 are electrically connected.
　金属部材８０付き回路基板１３０を形成するに当たり、例えばプリント基板が準備される段階で、スルーホール３６ではなく、単に孔３８のあいたプリント基板が準備される。そしてプリント基板における孔３８に例えばソルダーペーストなどの流動状の接合材９０及び挿通部８２が挿通された後、流動状の接合材９０が固化することによって、金属部材８０付き回路基板１３０が得られる。もちろん、孔３８の大きさに対応するスルーホールが設けられたプリント基板が準備されて、スルーホールに挿通部８２が挿通されていてもよい。 In forming the circuit board 130 with the metal member 80, for example, at the stage where the printed circuit board is prepared, a printed circuit board having holes 38 is prepared instead of the through holes 36. Then, after the fluid bonding material 90 such as solder paste and the insertion portion 82 are inserted into the holes 38 in the printed circuit board, the fluid bonding material 90 solidifies to obtain the circuit board 130 with the metal member 80. .. Of course, a printed circuit board provided with through holes corresponding to the size of the holes 38 may be prepared, and the insertion portion 82 may be inserted through the through holes.
　スルーホールに挿通部８２が挿通される場合、金属部材８０とプリント基板との接続及び固定に接合材９０が用いられていてもよいし、用いられていなくてもよい。接合材９０が用いられない場合、例えば挿通部８２が挿通部８２よりも若干小さく形成されたスルーホールに圧入されることによって金属部材８０がプリント基板に固定される。この際、挿通部８２がスルーホールの内面に設けられた金属材料に向けて圧入にかかる力によって押し付けられることによって挿通部８２と金属材料とが電気的に接続される。 When the insertion portion 82 is inserted through the through hole, the bonding material 90 may or may not be used for connecting and fixing the metal member 80 and the printed circuit board. When the bonding material 90 is not used, for example, the metal member 80 is fixed to the printed circuit board by press-fitting the insertion portion 82 into a through hole formed slightly smaller than the insertion portion 82. At this time, the insertion portion 82 and the metal material are electrically connected by being pressed against the metal material provided on the inner surface of the through hole by the force applied to the press fitting.
　突出部８４のうち回路基板１３０側を向く面と回路基板１３０における放熱部材５０側の主面とが接着剤などによって接着されて金属部材８０が回路基板１３０に固定されていてもよい。また突出部８４のうち回路基板１３０側を向く面と回路基板１３０における放熱部材５０側の主面とが接合材９０によって接合されていてもよい。 The surface of the protruding portion 84 facing the circuit board 130 and the main surface of the circuit board 130 on the heat radiating member 50 side may be adhered with an adhesive or the like to fix the metal member 80 to the circuit board 130. Further, the surface of the protruding portion 84 facing the circuit board 130 side and the main surface of the circuit board 130 on the heat radiating member 50 side may be joined by the joining material 90.
　また本例では、絶縁シート１６０に貫通孔６２が形成されている。図４に示す例では貫通孔６２は絶縁シート１６０において第１導電路３４Ａに対応する位置に形成されている。特に貫通孔６２は第１導電路３４Ａに設けられた金属部材８０に対応する位置に形成されている。絶縁シート１６０において第２導電路３４Ｂ及び第３導電路３４Ｃに対応する位置には貫通孔６２が形成されていない。例えば第１導電路３４Ａは第２導電路３４Ｂ及び第３導電路３４Ｃと比べて放熱部材５０との絶縁の必要性が低い部分であることが考えられる。具体的には例えば第１導電路３４Ａは第２導電路３４Ｂ及び第３導電路３４Ｃと比べて放熱部材５０における電位と近い電位を保つ部位であることが考えられる。特にかかる第１導電路３４Ａ及び放熱部材５０は同じ電位（例えばグラウンド電位）を有していることが考えられる。 Further, in this example, a through hole 62 is formed in the insulating sheet 160. In the example shown in FIG. 4, the through hole 62 is formed in the insulating sheet 160 at a position corresponding to the first conductive path 34A. In particular, the through hole 62 is formed at a position corresponding to the metal member 80 provided in the first conductive path 34A. A through hole 62 is not formed in the insulating sheet 160 at a position corresponding to the second conductive path 34B and the third conductive path 34C. For example, it is considered that the first conductive path 34A is a portion where the need for insulation with the heat radiating member 50 is lower than that of the second conductive path 34B and the third conductive path 34C. Specifically, for example, it is considered that the first conductive path 34A is a portion that maintains a potential closer to the potential in the heat radiating member 50 as compared with the second conductive path 34B and the third conductive path 34C. In particular, it is considered that the first conductive path 34A and the heat radiating member 50 have the same potential (for example, the ground potential).
　貫通孔６２には絶縁シート１６０の熱伝導率よりも高い熱伝導率を有する部材が配されているとよい。ここでは、突出部８４が貫通孔６２に挿通されている。このため貫通孔６２は突出部８４と同じかそれよりも大きく形成されている。図４に示す例では、突出部８４の外面は絶縁シート６０の放熱部材５０側の面と同じ高さであるが、このことは必須の構成ではない。突出部８４の外面は絶縁シート１６０における貫通孔６２から放熱部材５０側に突出していてもよい。 It is preferable that the through hole 62 is provided with a member having a thermal conductivity higher than that of the insulating sheet 160. Here, the protrusion 84 is inserted through the through hole 62. Therefore, the through hole 62 is formed to be the same as or larger than the protrusion 84. In the example shown in FIG. 4, the outer surface of the protruding portion 84 has the same height as the surface of the insulating sheet 60 on the heat radiating member 50 side, but this is not an essential configuration. The outer surface of the protruding portion 84 may protrude from the through hole 62 in the insulating sheet 160 toward the heat radiating member 50 side.
　突出部８４における外周面と貫通孔６２の内面との隙間には伝熱材７０が配されていてもよい。伝熱材７０は第１伝熱材７０Ａであってもよいし、第２伝熱材７０Ｂであってもよい。突出部８４の外周面のうち貫通孔６２よりも回路基板１３０側の部分には第１伝熱材７０Ａが密着している。これにより突出部８４と第１伝熱材７０Ａとの接触面積が大きくなる。突出部８４の外周面のうち貫通孔６２よりも回路基板１３０側の部分には第１伝熱材７０Ａが密着していなくてもよい。 A heat transfer material 70 may be arranged in the gap between the outer peripheral surface of the protruding portion 84 and the inner surface of the through hole 62. The heat transfer material 70 may be the first heat transfer material 70A or the second heat transfer material 70B. The first heat transfer material 70A is in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62. As a result, the contact area between the protruding portion 84 and the first heat transfer material 70A becomes large. The first heat transfer material 70A does not have to be in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62.
　貫通孔６２には突出部８４が配されずに、伝熱材７０が配されていてもよい。例えば、突出部８４が貫通孔６２に達しておらず、第２伝熱材７０Ｂが貫通孔６２に配されて突出部８４のうち放熱部材５０側を向く端面と密着していてもよい。この場合、貫通孔６２は突出部８４よりも小さく形成されていてもよい。 The heat transfer material 70 may be arranged in the through hole 62 without arranging the protruding portion 84. For example, the protruding portion 84 may not reach the through hole 62, and the second heat transfer material 70B may be arranged in the through hole 62 and in close contact with the end face of the protruding portion 84 facing the heat radiating member 50 side. In this case, the through hole 62 may be formed smaller than the protrusion 84.
　図４に示す例では、絶縁シート１６０は第２導電路３４Ｂ及び第３導電路３４Ｃに設けられた金属部材８０の突出部８４に押されて放熱部材５０側に凸となるように曲がっている。絶縁シート６０は法線方向に曲がった部分を有していなくてもよい。 In the example shown in FIG. 4, the insulating sheet 160 is pushed by the protruding portion 84 of the metal member 80 provided on the second conductive path 34B and the third conductive path 34C and is bent so as to be convex toward the heat radiating member 50 side. .. The insulating sheet 60 does not have to have a portion bent in the normal direction.
　また図４に示す例では、第２導電路３４Ｂ及び第３導電路３４Ｃに設けられた金属部材８０と絶縁シート１６０とが接している。もっとも第２導電路３４Ｂ及び第３導電路３４Ｃに設けられた金属部材８０と絶縁シート１６０との間に第１伝熱材７０Ａが配されていてもよい。この場合、第１伝熱材７０Ａのうち金属部材８０と絶縁シート１６０との間に配された部分は、回路基板１３０と絶縁シート１６０との間に配された部分よりも薄くなっていてもよい。 Further, in the example shown in FIG. 4, the metal member 80 provided in the second conductive path 34B and the third conductive path 34C is in contact with the insulating sheet 160. However, the first heat transfer material 70A may be arranged between the metal member 80 provided in the second conductive path 34B and the third conductive path 34C and the insulating sheet 160. In this case, even if the portion of the first heat transfer material 70A arranged between the metal member 80 and the insulating sheet 160 is thinner than the portion arranged between the circuit board 130 and the insulating sheet 160. Good.
　＜実施形態２における効果等＞
　本例における回路構成体１２０及び電気接続箱１１０によっても、実施形態１における回路構成体２０及び電気接続箱１０と同様の効果を得ることができる。 <Effects, etc. in Embodiment 2>
The circuit configuration 120 and the electrical junction box 110 in this example can also obtain the same effects as the circuit configuration 20 and the electrical junction box 10 in the first embodiment.
　さらに本例における回路構成体１２０及び電気接続箱１１０によると、金属部材８０によって回路基板１３０の熱が放熱部材５０に伝わりやすくなる。特に金属部材８０に設けられた突出部８４が回路基板１３０の主面よりも放熱部材５０に近くなることによって、この部分の熱抵抗が小さくなる。 Further, according to the circuit configuration 120 and the electric junction box 110 in this example, the heat of the circuit board 130 is easily transferred to the heat radiating member 50 by the metal member 80. In particular, since the protruding portion 84 provided on the metal member 80 is closer to the heat radiating member 50 than the main surface of the circuit board 130, the thermal resistance of this portion is reduced.
　また貫通孔６２が形成された部分において回路基板１３０と放熱部材５０との間の熱抵抗が小さくなる。特にここでは突出部８４が絶縁シート１６０を介さずに第２伝熱材７０Ｂと密着できることによって、この部分の熱抵抗が小さくなる。このとき例えば絶縁の必要性の低い箇所に貫通孔６２が形成されることによって、貫通孔６２が形成された場合でも絶縁シート１６０の絶縁性能が低下する影響を小さくすることができる。 Further, the thermal resistance between the circuit board 130 and the heat radiating member 50 becomes smaller in the portion where the through hole 62 is formed. In particular, here, the protruding portion 84 can be brought into close contact with the second heat transfer material 70B without passing through the insulating sheet 160, so that the thermal resistance of this portion is reduced. At this time, for example, by forming the through hole 62 at a position where the need for insulation is low, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet 160 even when the through hole 62 is formed.
　［変形例］
　これまで伝熱材７０が絶縁シート６０、１６０に対して両側に設けられるものとして説明してきたが、伝熱材７０は絶縁シート６０、１６０に対して一方側にのみ設けられていてもよい。伝熱材７０は絶縁シート６０、１６０に対して回路基板３０、１３０側にのみ設けられていてもよいし、放熱部材５０側にのみ設けられていてもよい。伝熱材７０は絶縁シート６０、１６０に対して少なくとも一方側に設けられているとよい。伝熱材７０は絶縁シート６０、１６０に対して少なくとも回路基板３０、１３０側に設けられていてもよいし、少なくとも放熱部材５０側に設けられていてもよい。 [Modification example]
Although the heat transfer material 70 has been described as being provided on both sides of the insulating sheets 60 and 160, the heat transfer material 70 may be provided on only one side of the insulating sheets 60 and 160. The heat transfer material 70 may be provided only on the circuit boards 30 and 130 sides with respect to the insulating sheets 60 and 160, or may be provided only on the heat radiating member 50 side. The heat transfer material 70 may be provided on at least one side of the insulating sheets 60 and 160. The heat transfer material 70 may be provided at least on the circuit boards 30 and 130 side with respect to the insulating sheets 60 and 160, or may be provided at least on the heat radiating member 50 side.
　これまで回路構成体２０、１２０が伝熱材７０を備えているものとして説明してきたが、回路構成体２０、１２０は伝熱材７０を備えていなくてもよい。回路構成体２０、１２０が伝熱材７０を備えていない場合、絶縁シート６０、１６０が回路基板３０、１３０及び放熱部材５０に接しているとよい。回路構成体１２０が伝熱材７０を備えていない場合、突出部８４が貫通孔６２を通じて放熱部材５０に接していてもよい。 Although the circuit components 20 and 120 have been described so far as having the heat transfer material 70, the circuit components 20 and 120 may not include the heat transfer material 70. When the circuit components 20 and 120 do not include the heat transfer material 70, the insulating sheets 60 and 160 may be in contact with the circuit boards 30 and 130 and the heat radiating member 50. When the circuit structure 120 does not include the heat transfer material 70, the protrusion 84 may be in contact with the heat radiating member 50 through the through hole 62.
　これまで回路構成体１２０において、すべての導電路３４に金属部材８０が設けられるものとして説明してきたが、一部の導電路のみに金属部材８０が設けられてもよい。例えば、回路構成体に発熱量の異なる複数の発熱部品４０が実装される場合、回路構成体は、発熱量の大きい発熱部品４０に接続される導電路３４に金属部材８０が設けられ、発熱量の小さい発熱部品に接続される導電路３４に金属部材８０が設けられていないように構成されていてもよい。この場合、発熱量の小さい発熱部品に接続される導電路３４にはサーマルビアが設けられていてもよい。 Although it has been described so far that the metal member 80 is provided in all the conductive paths 34 in the circuit configuration 120, the metal member 80 may be provided only in a part of the conductive paths. For example, when a plurality of heat-generating components 40 having different heat generation amounts are mounted on the circuit configuration, the circuit configuration is provided with a metal member 80 in a conductive path 34 connected to the heat-generating component 40 having a large heat generation amount, and the heat generation amount is increased. The metal member 80 may not be provided in the conductive path 34 connected to the small heat generating component. In this case, a thermal via may be provided in the conductive path 34 connected to the heat generating component having a small heat generation amount.
　なお、上記各実施形態及び各変形例で説明した各構成は、相互に矛盾しない限り適宜組み合わせることができる。 It should be noted that the configurations described in the above embodiments and the modifications can be appropriately combined as long as they do not conflict with each other.
　例えば実施形態１における回路構成体２０において、絶縁シート６０に替えて、実施形態２における貫通孔６２が形成された絶縁シート１６０が採用されてもよい。この場合、例えば伝熱材７０のように絶縁シート１６０よりも熱伝導率の高い部材が貫通孔６２の内部に設けられるとよい。伝熱材７０が貫通孔６２の内部に設けられる場合、回路構成体は、第１伝熱材７０Ａ及び第２伝熱材７０Ｂが貫通孔６２の内部又は外部で相互に接触するように構成されていてもよい。また回路構成体は、第１伝熱材７０Ａが貫通孔６２の放熱部材５０側開口部又はそれよりも外側で放熱部材５０に接触するように構成されていてもよい。また回路構成体は、第２伝熱材７０Ｂが貫通孔６２の回路基板３０側開口部又はそれよりも外側で回路基板３０に接触するように構成されていてもよい。 For example, in the circuit configuration 20 according to the first embodiment, the insulating sheet 160 having the through hole 62 formed in the second embodiment may be adopted instead of the insulating sheet 60. In this case, a member having a higher thermal conductivity than the insulating sheet 160, such as the heat transfer material 70, may be provided inside the through hole 62. When the heat transfer material 70 is provided inside the through hole 62, the circuit configuration is configured such that the first heat transfer material 70A and the second heat transfer material 70B come into contact with each other inside or outside the through hole 62. You may be. Further, the circuit structure may be configured such that the first heat transfer material 70A comes into contact with the heat radiating member 50 at or outside the heat radiating member 50 side opening of the through hole 62. Further, the circuit structure may be configured such that the second heat transfer material 70B comes into contact with the circuit board 30 at or outside the opening on the circuit board 30 side of the through hole 62.
　また例えば実施形態２における回路構成体１２０において、絶縁シート１６０に替えて、実施形態１における貫通孔６２が形成されていない絶縁シート６０が採用されてもよい。 Further, for example, in the circuit configuration 120 in the second embodiment, the insulating sheet 60 in which the through hole 62 in the first embodiment is not formed may be adopted instead of the insulating sheet 160.
　１０、１１０　電気接続箱
　１２　ケース
　２０、１２０　回路構成体
　３０、１３０　回路基板
　３２　絶縁部
　３４　導電路
　３４Ａ　第１導電路
　３４Ｂ　第２導電路
　３４Ｃ　第３導電路
　３５　プリント配線
　３６　スルーホール
　３７　金属材料
　３８　孔
　４０　発熱部品
　４２　本体
　４４　端子
　４４Ａ　第１端子
　４４Ｂ　第２端子
　４４Ｃ　第３端子
　５０　放熱部材
　６０、１６０　絶縁シート
　６２　貫通孔
　７０　伝熱材
　７０Ａ　第１伝熱材
　７０Ｂ　第２伝熱材
　８０　金属部材
　８２　挿通部
　８４　突出部
　９０　接合材 10, 110 Electrical junction box 12 Case 20, 120 Circuit structure 30, 130 Circuit board 32 Insulation 34 Conductive path 34A 1st conductive path 34B 2nd conductive path 34C 3rd conductive path 35 Printed wiring board 36 Through hole 37 Metal material 38 Hole 40 Heat generating part 42 Main body 44 Terminal 44A 1st terminal 44B 2nd terminal 44C 3rd terminal 50 Heat dissipation member 60, 160 Insulation sheet 62 Through hole 70 Heat transfer material 70A 1st heat transfer material 70B 2nd heat transfer material 80 Metal member 82 Insertion part 84 Protrusion part 90 Joint material

Claims (7)

  1. 　回路基板と、
    　前記回路基板に重ねられる放熱部材と、
    　前記回路基板と前記放熱部材との間に設けられる絶縁シートと、
    　を備える、回路構成体。     With the circuit board
    The heat radiating member stacked on the circuit board and
    An insulating sheet provided between the circuit board and the heat radiating member,
    A circuit configuration comprising.
  2. 　請求項１に記載の回路構成体であって、
    　前記絶縁シートよりも熱伝導性が良い伝熱材をさらに備え、
    　前記伝熱材は、前記絶縁シートに対して少なくとも一方側に設けられている、回路構成体。     The circuit configuration according to claim 1.
    Further provided with a heat transfer material having better thermal conductivity than the insulating sheet,
    The heat transfer material is a circuit configuration provided on at least one side of the insulating sheet.
  3. 　請求項２に記載の回路構成体であって、
    　前記伝熱材は、前記回路基板と前記絶縁シートとの間に設けられた第１伝熱材と、前記放熱部材と前記絶縁シートとの間に設けられた第２伝熱材と、を含む、回路構成体。     The circuit configuration according to claim 2.
    The heat transfer material includes a first heat transfer material provided between the circuit board and the insulating sheet, and a second heat transfer material provided between the heat radiating member and the insulating sheet. , Circuit configuration.
  4. 　請求項１から請求項３のいずれか１項に記載の回路構成体であって、
    　前記回路基板に取付けられた金属部材をさらに備え、
    　前記金属部材は前記回路基板に形成された孔に挿通された挿通部と、前記挿通部の一端に連なり前記孔から前記放熱部材側に向けて突出する突出部とを含む、回路構成体。     The circuit configuration according to any one of claims 1 to 3.
    Further provided with a metal member attached to the circuit board
    The metal member includes an insertion portion inserted into a hole formed in the circuit board, and a protrusion portion connected to one end of the insertion portion and protruding from the hole toward the heat radiating member side.
  5. 　請求項１から請求項４のいずれか１項に記載の回路構成体であって、
    　前記絶縁シートに貫通孔が形成されている、回路構成体。     The circuit configuration according to any one of claims 1 to 4.
    A circuit configuration in which a through hole is formed in the insulating sheet.
  6. 　請求項５に記載の回路構成体であって、
    　前記回路基板には第１導電路と第２導電路とが形成され、
    　前記絶縁シートにおいて前記第１導電路に対応する位置に前記貫通孔が形成され、前記第２導電路に対応する位置に貫通孔が形成されていない、回路構成体。     The circuit configuration according to claim 5.
    A first conductive path and a second conductive path are formed on the circuit board.
    A circuit configuration in which the through hole is formed at a position corresponding to the first conductive path in the insulating sheet, and the through hole is not formed at a position corresponding to the second conductive path.
  7. 　請求項１から請求項６のいずれか１項に記載の回路構成体と、
    　前記回路構成体を覆うケースと、を備える電気接続箱。     The circuit configuration according to any one of claims 1 to 6.
    An electrical junction box comprising a case that covers the circuit configuration.
PCT/JP2020/019565 2019-06-06 2020-05-18 Circuit structure and electrical connection box WO2020246223A1 (en)

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JP2019105903A JP2020202203A (en) 2019-06-06 2019-06-06 Circuit structure and electrical junction box

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156463A (en) * 2014-01-14 2015-08-27 新光電気工業株式会社 wiring board and semiconductor package
JP2018182147A (en) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 Substrate with metal member, circuit configuration body, and electric connection box
JP2019079903A (en) * 2017-10-24 2019-05-23 株式会社オートネットワーク技術研究所 Circuit structure and manufacturing method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156463A (en) * 2014-01-14 2015-08-27 新光電気工業株式会社 wiring board and semiconductor package
JP2018182147A (en) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 Substrate with metal member, circuit configuration body, and electric connection box
JP2019079903A (en) * 2017-10-24 2019-05-23 株式会社オートネットワーク技術研究所 Circuit structure and manufacturing method of the same

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