WO2020246223A1 - Structure de circuit et boîte de connexion électrique - Google Patents

Structure de circuit et boîte de connexion électrique Download PDF

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Publication number
WO2020246223A1
WO2020246223A1 PCT/JP2020/019565 JP2020019565W WO2020246223A1 WO 2020246223 A1 WO2020246223 A1 WO 2020246223A1 JP 2020019565 W JP2020019565 W JP 2020019565W WO 2020246223 A1 WO2020246223 A1 WO 2020246223A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat transfer
transfer material
hole
insulating sheet
Prior art date
Application number
PCT/JP2020/019565
Other languages
English (en)
Japanese (ja)
Inventor
北　幸功
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2020246223A1 publication Critical patent/WO2020246223A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This disclosure relates to circuit configurations and electrical junction boxes.
  • Patent Document 1 discloses a technique for transferring the heat of a circuit board to a heat radiating member through a metal member and a heat transfer material.
  • circuit board and the heat radiating member be brought close to each other.
  • the purpose is to provide a technology that can bring the circuit board and the heat radiating member closer to each other.
  • the circuit configuration of the present disclosure is a circuit configuration including a circuit board, a heat radiating member superposed on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member.
  • the circuit board and the heat radiating member can be brought close to each other.
  • FIG. 1 is a schematic cross-sectional view showing a circuit configuration according to the first embodiment and an electrical junction box including the circuit configuration.
  • FIG. 2 is a schematic plan view showing a circuit board.
  • FIG. 3 is a schematic bottom view showing a circuit board.
  • FIG. 4 is a schematic cross-sectional view showing the circuit configuration according to the second embodiment and the electrical junction box including the circuit configuration.
  • FIG. 5 is a schematic plan view showing a circuit board with a metal member.
  • FIG. 6 is a schematic bottom view showing a circuit board with a metal member.
  • the circuit configuration of the present disclosure is as follows.
  • a circuit configuration including a circuit board, a heat radiating member stacked on the circuit board, and an insulating sheet provided between the circuit board and the heat radiating member. Since the circuit board and the heat radiating member can be insulated by providing the insulating sheet between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
  • a heat transfer material having better thermal conductivity than the insulating sheet may be further provided, and the heat transfer material may be provided on at least one side of the insulating sheet. As a result, the heat of the circuit board is easily transferred to the heat radiating member through the heat transfer material.
  • the heat transfer material includes a first heat transfer material provided between the circuit board and the insulating sheet, and a second heat transfer material provided between the heat radiating member and the insulating sheet. , May be included. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the first heat transfer material and the second heat transfer material.
  • a metal member attached to the circuit board is further provided, and the metal member is connected to an insertion portion inserted into a hole formed in the circuit board and one end of the insertion portion, and the heat radiation member side from the hole. It may include a protrusion that protrudes toward. As a result, the heat of the circuit board is easily transferred to the heat radiating member via the metal member.
  • Through holes may be formed in the insulating sheet. As a result, the thermal resistance between the circuit board and the heat radiating member is reduced in the portion where the through hole is formed.
  • a first conductive path and a second conductive path are formed on the circuit board, and the through hole is formed at a position corresponding to the first conductive path in the insulating sheet to correspond to the second conductive path. It is not necessary that a through hole is formed at the position where the through hole is formed. As a result, for example, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet due to the formation of through holes at places where the need for insulation is low.
  • the electrical junction box of the present disclosure is an electrical junction box including the circuit configuration and a case covering the circuit configuration. Since the circuit board and the heat radiating member can be insulated by the insulating sheet provided between the circuit board and the heat radiating member, the circuit board and the heat radiating member can be brought close to each other.
  • FIG. 1 is a schematic cross-sectional view showing a circuit configuration 20 according to the first embodiment and an electrical connection box 10 including the circuit configuration 20.
  • FIG. 2 is a schematic plan view showing the circuit board 30.
  • FIG. 3 is a schematic bottom view showing the circuit board 30.
  • the cross section in FIG. 1 corresponds to the cross section at the position of line L1 in FIG.
  • the electric junction box 10 is arranged in a power supply path between a power source such as a battery and a load such as an in-vehicle electrical component such as a lamp and a wiper in a vehicle, for example.
  • the electrical junction box 10 may be used, for example, in a DC-DC converter, an inverter, or the like.
  • the electrical junction box 10 includes a case 12 and a circuit configuration 20.
  • the case 12 covers the circuit configuration 20.
  • the case 12 has a box shape with an opening on the lower side.
  • the circuit structure 20 serves as the lid of the case 12.
  • the case 12 may accommodate the entire circuit configuration 20 inside.
  • the case 12 may have a main body and a lid.
  • the material constituting the case 12 is not particularly limited, but for example, a metal such as aluminum or an aluminum alloy or a synthetic resin may be adopted.
  • the circuit structure 20 includes a circuit board 30, a heat radiating member 50, and an insulating sheet 60.
  • the circuit configuration 20 further includes a heat transfer material 70.
  • the circuit board 30 includes an insulating portion 32 and a conductive path 34.
  • the insulating portion 32 has an insulating plate in the printed circuit board.
  • the insulating portion 32 may have a solder resist or the like on the printed circuit board.
  • the conductive path 34 has a printed wiring board 35 on the printed circuit board. In the example shown in FIG. 1, the printed circuit board has two layers.
  • the printed wiring 35 is formed on both main surfaces of the insulating plate.
  • the printed circuit board may be a multilayer board in which wiring is also formed in the middle in the thickness direction.
  • the conductive path 34 may have a bus bar provided separately from the printed circuit board.
  • the conductive path 34 may have a land exposed on the main surface of the printed circuit board.
  • a plurality of conductive paths 34 are provided so as to be insulated from each other.
  • the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C are provided.
  • a heat generating component 40 is mounted on the circuit board 30.
  • the heat generating component 40 is a FET (Field Effect Transistor)
  • the heat generating component 40 may be a resistor such as a shunt resistor, a coil, a capacitor, or the like.
  • the number of heat generating parts 40 is one, but a plurality of heat generating parts 40 may be provided.
  • the heat generating component 40 includes a main body 42 and a plurality of terminals 44.
  • the main body 42 is located on the land of the first conductive path 34A.
  • the plurality of terminals 44 are exposed to the outside of the main body 42.
  • the plurality of terminals 44 have a first terminal 44A, a second terminal 44B, and a third terminal 44C.
  • the first terminal 44A is provided on the back surface of the main body 42.
  • the first terminal 44A is connected to the first conductive path 34A.
  • the second terminal 44B and the third terminal 44C are provided so as to project from the side surface of the main body 42.
  • the second terminal 44B and the third terminal 44C are connected to the second conductive path 34B and the third conductive path 34C, respectively.
  • Each terminal 44 is connected to the conductive path 34, for example, by soldering to a land.
  • the heat generating component 40 is an FET
  • the first terminal 44A, the second terminal 44B, and the third terminal 44C correspond to, for example, a drain terminal, a gate terminal, and a source terminal.
  • a through hole 36 is formed in the circuit board 30.
  • the through hole 36 has a structure in which a metal material 37 such as copper foil or plating is provided on the inner surface of the hole provided in the insulating plate and the peripheral edge of the opening.
  • the metal material 37 forms a part of the conductive path 34. That is, in the conductive path 34 provided with the through hole 36, the printed wiring 35 on the upper surface and the printed wiring 35 on the lower surface of the insulating plate are electrically connected by the metal material 37.
  • a metal material 37 such as copper foil or plating
  • a through hole 36 (also referred to as a via hole) into which an electric component is not inserted is provided as a through hole 36, but a through hole into which an electric component is inserted (also referred to as a through hole for an electric component or the like) is provided. ) May be provided.
  • the via hole for heat dissipation is also called a thermal via.
  • through holes 36 are formed in each of the printed wirings 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • Through holes 36 are formed in portions other than the lands in the printed wiring 35 forming the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • a through hole 36 is also formed in a portion of the printed wiring 35 forming the first conductive path 34A that overlaps with the main body 42.
  • the position of the through hole 36 is not limited to that described above, and can be set as appropriate. Further, there may be a printed wiring in which the through hole 36 is not formed.
  • the conductive path 34 is exposed on the main surface of the circuit board 30 on the heat radiating member 50 side.
  • the metal material 37 in the through hole 36 is exposed.
  • the conductive paths 34 the printed wiring, the bus bar, and the like may be exposed.
  • the heat radiating member 50 is superposed on the circuit board 30.
  • the heat radiating member 50 is made of a metal having high thermal conductivity such as aluminum or an aluminum alloy.
  • the heat radiating member 50 has a mounting surface. The mounting surface is directed to the circuit board 30.
  • the circuit board 30, the insulating sheet 60, and the heat transfer material 70 are stacked on the mounting surface.
  • the mounting surface should be formed flat.
  • the heat radiating member 50 is provided with fins or the like in order to increase the surface area.
  • the fins are formed, for example, in the shape of comb teeth.
  • the fin is a portion of the heat radiating member 50 exposed to the outer surface of the electric junction box 10 (the surface opposite to the mounting surface in this example). It is good if it is provided in.
  • the heat radiating member 50 and the circuit board 30 may be fixed by fixing means such as screws (not shown).
  • the circuit configuration 20 may be provided with a spacer that maintains the mounting surface and the circuit board 30 at regular intervals.
  • the spacer is provided so as to project in the normal direction from the mounting surface.
  • the circuit board 30 is maintained in a state of having a constant distance from the mounting surface.
  • spacers are provided around the mounting surface. In this case, the spacer supports the peripheral edge of the circuit board 30.
  • the spacer may be provided integrally with the heat radiating member 50, or may be a separate member from the heat radiating member 50.
  • the insulating sheet 60 is provided between the circuit board 30 and the heat radiating member 50.
  • the insulating sheet 60 is a member formed into a sheet by a material having an insulating property.
  • the material of the insulating sheet 60 is not particularly limited, but is preferably a material having high insulating properties (material having high electrical resistivity). As a result, the thickness of the insulating sheet 60 having a predetermined electric resistance value can be reduced.
  • polyimide or the like may be adopted as the material of the insulating sheet 60.
  • the insulating sheet 60 is provided so as to cover at least a part of the conductive path 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side. As a result, it is possible to suppress a short circuit between the conductive path 34 exposed on the circuit board 30 and the heat radiating member 50.
  • the insulating sheet 60 covers all of the conductive paths 34 exposed on the main surface of the circuit board 30 on the heat radiating member 50 side, but the insulating sheet 60 is on the main surface of the circuit board 30 on the heat radiating member 50 side. Only a part of the exposed conductive path 34 may be covered.
  • insulating sheet 60 covers all of the exposed conductive paths 34
  • a plurality of insulating sheets may cover the conductive paths 34 in different regions.
  • the heat transfer material 70 has better thermal conductivity than the insulating sheet 60.
  • the heat transfer material 70 is also called a thermal interface material (TIM: Thermal Interface Material) or the like.
  • the heat transfer material 70 is made of a material having a higher thermal conductivity than the insulating sheet 60.
  • the heat transfer material 70 may have a lower insulating property than the insulating sheet 60.
  • the heat transfer material 70 may be made of a material having a lower insulating property than the insulating sheet 60.
  • the heat transfer material 70 is called thermal paste or heat conductive grease.
  • the heat transfer material 70 may be a single base or a base mixed with a filler.
  • a material having an insulating property such as silicone may be adopted as the base material.
  • the filler is mixed to increase the thermal conductivity of the heat transfer material 70.
  • the filler material should have a higher thermal conductivity than the base material.
  • the material of the filler may be a conductive material such as metal.
  • the heat transfer material 70 is provided on both sides of the insulating sheet 60.
  • the heat transfer material 70 provided between the circuit board 30 and the insulating sheet 60 is the first heat transfer material 70A.
  • the heat transfer material 70 provided between the heat radiating member 50 and the insulating sheet 60 is the second heat transfer material 70B.
  • first heat transfer material 70A and the second heat transfer material 70B are formed of materials having the same physical properties. That is, the first heat transfer material 70A and the second heat transfer material 70B are the same materials arranged at different positions. Of course, the first heat transfer material 70A and the second heat transfer material 70B may be formed of materials having different physical properties.
  • the first heat transfer material 70A is in close contact with the circuit board 30 and the insulating sheet 60 to fill the gap between the circuit board 30 and the insulating sheet 60.
  • the second heat transfer material 70B is in close contact with the heat radiating member 50 and the insulating sheet 60 to fill the gap between the heat radiating member 50 and the insulating sheet 60.
  • the first heat transfer material 70A and the second heat transfer material 70B are pressed against the circuit board 30, the insulating sheet 60, and the heat radiating member 50 in a state of having fluidity, so that the circuit board 30, the insulating sheet 60, and the heat radiating member are pressed. Each can be in close contact with 50.
  • the first heat transfer material 70A and the second heat transfer material 70B are preferably members that can be in a viscous state at a temperature lower than the melting point of each part of the circuit board 30.
  • the first heat transfer material 70A and the second heat transfer material 70B are members having viscosity under a normal state, such as thermal paste, that is, a viscous body.
  • the first heat transfer material 70A and the second heat transfer material 70B may be members such as an adhesive that can be in a viscous state before being solidified.
  • the heat transfer material 70 may be a heat transfer sheet formed into a sheet shape.
  • the heat transfer sheet may be easily deformed to the extent that the gap between the insulating sheet 60 and the circuit board 30 or the heat radiating member 50 can be filled.
  • the first heat transfer material 70A is provided so as to extend over a plurality of conductive paths 34.
  • the first heat transfer material 70A may have an insulating property to such an extent that the state in which the plurality of conductive paths 34 are insulated can be maintained. That is, it suffices that the plurality of conductive paths 34 are not electrically connected via the first heat transfer material 70A.
  • the first heat transfer material 70A is provided so as to cover all of the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C.
  • the first heat transfer material 70A may have a portion provided so as to be in contact with only one conductive path 34.
  • a portion of the first heat transfer material 70A corresponding to the first conductive path 34A, a portion corresponding to the second conductive path 34B, and a portion corresponding to the third conductive path 34C are provided apart from each other. Either one may be provided apart from the other two. In this case, the portion of the first heat transfer material 70A provided so as to come into contact with only one of the conductive paths 34 does not have to have insulating properties.
  • the second heat transfer material 70B is in contact with the insulating sheet 60 and the heat radiating member 50.
  • the second heat transfer material 70B does not have to have an insulating property.
  • the thicknesses of the insulating sheet 60, the first heat transfer material 70A, and the second heat transfer material 70B are not particularly limited and may be appropriately set.
  • the thickness of the insulating sheet 60 may be the same as the thickness of the first heat transfer material 70A and the thickness of the second heat transfer material 70B, or may be thinner or thicker than them.
  • the insulating sheet 60 is provided to ensure the insulating property between the circuit board 30 and the heat radiating member 50. From this point of view, it is conceivable that the thickness of the insulating sheet 60 is set to a thickness according to the required insulating performance.
  • the first heat transfer material 70A and the second heat transfer material 70B are provided to fill the gap between the insulating sheet 60, the circuit board 30, and the heat radiating member 50 to improve the adhesion. From this viewpoint and from the viewpoint of wanting to bring the circuit board 30 and the heat radiating member 50 as close as possible, it is preferable that the thickness of the first heat transfer material 70A and the second heat transfer material 70B is as thin as possible.
  • Embodiment 1 According to the circuit structure 20 and the electrical junction box 10 configured as described above, the insulating sheet 60 provided between the circuit board 30 and the heat radiating member 50 maintains the insulation between the circuit board 30 and the heat radiating member 50. Therefore, the circuit board 30 and the heat radiating member 50 can be brought close to each other. As a result, it is possible to improve the heat dissipation of the circuit board 30 and reduce the size of the circuit structure 20.
  • the heat transfer material 70 the heat of the circuit board 30 is easily transferred to the heat radiating member 50.
  • the first heat transfer material 70A and the second heat transfer material 70B the gap between the insulating sheet 60 and the circuit board 30 and the gap between the insulating sheet 60 and the heat radiating member 50 are filled, so that the circuit board The heat of 30 is easily transferred to the heat radiating member 50.
  • FIG. 4 is a schematic cross-sectional view showing the circuit configuration 120 according to the second embodiment and the electrical junction box 110 including the circuit configuration 120.
  • FIG. 5 is a schematic plan view showing a circuit board 130 with a metal member 80.
  • FIG. 6 is a schematic bottom view showing a circuit board 130 with a metal member 80.
  • the cross section in FIG. 4 corresponds to the cross section at the position of line L2 in FIG. Further, in the description of the present embodiment, the same reference numerals are given to the components as described above, and the description thereof is omitted.
  • the configuration of the circuit configuration 120 is different from the configuration of the circuit configuration 20 in the first embodiment.
  • the circuit configuration 120 further includes a metal member 80.
  • a hole 38 is formed in the circuit board 130 instead of the through hole 36.
  • the hole 38 is provided so as to penetrate the circuit board 130.
  • the hole 38 is formed larger than the through hole 36.
  • the holes 38 are provided at positions corresponding to the respective conductive paths 34.
  • the hole 38 is provided at a position avoiding the main body 42 and the first terminal 44A of the heat generating component 40.
  • the holes 38 are provided at positions avoiding the second terminal 44B and the third terminal 44C of the heat generating component 40, respectively.
  • the hole 38 may be provided at a position where it overlaps with the main body 42, the terminal 44, and the like of the heat generating component 40.
  • the cross-sectional shape of the hole 38 along the axial direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the metal member 80 is attached to the circuit board 130.
  • the metal member 80 is fixed to the circuit board 130. Further, here, the metal member 80 is electrically connected to the conductive path 34.
  • the material of the metal member 80 for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel or the like may be adopted.
  • the metal member 80 includes an insertion portion 82 and a protrusion 84.
  • the insertion portion 82 is inserted into the hole 38.
  • the insertion portion 82 is formed smaller than the hole 38.
  • the cross-sectional shape of the insertion portion 82 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the cross-sectional shape of the insertion portion 82 may be the same as the cross-sectional shape of the hole 38, or may be a different shape.
  • the cross-sectional shapes of the insertion portion 82 and the hole 38 are both circular.
  • the insertion portion 82 is connected to and fixed to the conductive path 34 via a joining material 90 described later.
  • the protruding portion 84 is connected to one end of the insertion portion 82.
  • the protruding portion 84 protrudes from the hole 38 toward the heat radiating member 50 side.
  • the cross-sectional shape of the protruding portion 84 along the insertion direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the cross-sectional shape of the protruding portion 84 may be the same as or different from the cross-sectional shape of the insertion portion 82.
  • the cross-sectional shapes of the insertion portion 82 and the protrusion 84 are both circular.
  • the protruding portion 84 is formed wider than the insertion portion 82.
  • the protrusion 84 is formed larger than the hole 38.
  • the metal member 80 is prevented from coming off from the hole 38, and the metal member 80 is positioned with respect to the circuit board 130 in the insertion direction. More specifically, when the metal member 80 is about to be inserted too much into the hole 38, the protrusion 84 is caught on the peripheral edge of the opening of the hole 38, so that further insertion is suppressed. Further, the metal member 80 is positioned with respect to the circuit board 30 along the insertion direction by inserting the protruding portion 84 to a position where it is caught on the peripheral edge of the opening of the hole 38.
  • the metal member 80 in which the protruding portion 84 is formed wider than the insertion portion 82 may be referred to as a rivet. However, it is not necessary that the protruding portion 84 is formed wider than the insertion portion 82.
  • the metal member may be formed in a columnar shape having the same cross section continuously.
  • the other end of the insertion portion 82 does not protrude from the circuit board 130.
  • the other end surface of the insertion portion 82 is flush with the same height as the upper surface of the circuit board 130.
  • the other end surface of the insertion portion 82 may be lower or higher than the height of the upper surface of the circuit board 130.
  • the other end of the insertion portion 82 and the conductive path 34 around the other end are not insulated, but may be insulated.
  • the joining material 90 fills the gap between the insertion portion 82 and the inner surface of the hole 38.
  • the bonding material 90 is, for example, solder.
  • the joining material 90 is joined to the inner surface of the hole 38 and the outer surface of the insertion portion 82.
  • the metal member 80 is fixed to the circuit board 30.
  • the joining material 90 is joined to the printed wiring 35.
  • the printed wiring 35 and the insertion portion 82 are electrically connected via the joining material 90.
  • the conductive path 34 and the metal member 80 are electrically connected.
  • a printed circuit board having holes 38 is prepared instead of the through holes 36. Then, after the fluid bonding material 90 such as solder paste and the insertion portion 82 are inserted into the holes 38 in the printed circuit board, the fluid bonding material 90 solidifies to obtain the circuit board 130 with the metal member 80. ..
  • a printed circuit board provided with through holes corresponding to the size of the holes 38 may be prepared, and the insertion portion 82 may be inserted through the through holes.
  • the bonding material 90 may or may not be used for connecting and fixing the metal member 80 and the printed circuit board.
  • the bonding material 90 is not used, for example, the metal member 80 is fixed to the printed circuit board by press-fitting the insertion portion 82 into a through hole formed slightly smaller than the insertion portion 82. At this time, the insertion portion 82 and the metal material are electrically connected by being pressed against the metal material provided on the inner surface of the through hole by the force applied to the press fitting.
  • the surface of the protruding portion 84 facing the circuit board 130 and the main surface of the circuit board 130 on the heat radiating member 50 side may be adhered with an adhesive or the like to fix the metal member 80 to the circuit board 130. Further, the surface of the protruding portion 84 facing the circuit board 130 side and the main surface of the circuit board 130 on the heat radiating member 50 side may be joined by the joining material 90.
  • a through hole 62 is formed in the insulating sheet 160.
  • the through hole 62 is formed in the insulating sheet 160 at a position corresponding to the first conductive path 34A.
  • the through hole 62 is formed at a position corresponding to the metal member 80 provided in the first conductive path 34A.
  • a through hole 62 is not formed in the insulating sheet 160 at a position corresponding to the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A is a portion where the need for insulation with the heat radiating member 50 is lower than that of the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A is a portion that maintains a potential closer to the potential in the heat radiating member 50 as compared with the second conductive path 34B and the third conductive path 34C.
  • the first conductive path 34A and the heat radiating member 50 have the same potential (for example, the ground potential).
  • the through hole 62 is provided with a member having a thermal conductivity higher than that of the insulating sheet 160.
  • the protrusion 84 is inserted through the through hole 62. Therefore, the through hole 62 is formed to be the same as or larger than the protrusion 84.
  • the outer surface of the protruding portion 84 has the same height as the surface of the insulating sheet 60 on the heat radiating member 50 side, but this is not an essential configuration. The outer surface of the protruding portion 84 may protrude from the through hole 62 in the insulating sheet 160 toward the heat radiating member 50 side.
  • a heat transfer material 70 may be arranged in the gap between the outer peripheral surface of the protruding portion 84 and the inner surface of the through hole 62.
  • the heat transfer material 70 may be the first heat transfer material 70A or the second heat transfer material 70B.
  • the first heat transfer material 70A is in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62. As a result, the contact area between the protruding portion 84 and the first heat transfer material 70A becomes large.
  • the first heat transfer material 70A does not have to be in close contact with the portion of the outer peripheral surface of the protrusion 84 on the circuit board 130 side of the through hole 62.
  • the heat transfer material 70 may be arranged in the through hole 62 without arranging the protruding portion 84.
  • the protruding portion 84 may not reach the through hole 62, and the second heat transfer material 70B may be arranged in the through hole 62 and in close contact with the end face of the protruding portion 84 facing the heat radiating member 50 side.
  • the through hole 62 may be formed smaller than the protrusion 84.
  • the insulating sheet 160 is pushed by the protruding portion 84 of the metal member 80 provided on the second conductive path 34B and the third conductive path 34C and is bent so as to be convex toward the heat radiating member 50 side. ..
  • the insulating sheet 60 does not have to have a portion bent in the normal direction.
  • the metal member 80 provided in the second conductive path 34B and the third conductive path 34C is in contact with the insulating sheet 160.
  • the first heat transfer material 70A may be arranged between the metal member 80 provided in the second conductive path 34B and the third conductive path 34C and the insulating sheet 160. In this case, even if the portion of the first heat transfer material 70A arranged between the metal member 80 and the insulating sheet 160 is thinner than the portion arranged between the circuit board 130 and the insulating sheet 160. Good.
  • circuit configuration 120 and the electrical junction box 110 in this example can also obtain the same effects as the circuit configuration 20 and the electrical junction box 10 in the first embodiment.
  • the heat of the circuit board 130 is easily transferred to the heat radiating member 50 by the metal member 80.
  • the protruding portion 84 provided on the metal member 80 is closer to the heat radiating member 50 than the main surface of the circuit board 130, the thermal resistance of this portion is reduced.
  • the thermal resistance between the circuit board 130 and the heat radiating member 50 becomes smaller in the portion where the through hole 62 is formed.
  • the protruding portion 84 can be brought into close contact with the second heat transfer material 70B without passing through the insulating sheet 160, so that the thermal resistance of this portion is reduced.
  • the through hole 62 at a position where the need for insulation is low, it is possible to reduce the influence of deterioration of the insulation performance of the insulating sheet 160 even when the through hole 62 is formed.
  • the heat transfer material 70 has been described as being provided on both sides of the insulating sheets 60 and 160, the heat transfer material 70 may be provided on only one side of the insulating sheets 60 and 160.
  • the heat transfer material 70 may be provided only on the circuit boards 30 and 130 sides with respect to the insulating sheets 60 and 160, or may be provided only on the heat radiating member 50 side.
  • the heat transfer material 70 may be provided on at least one side of the insulating sheets 60 and 160.
  • the heat transfer material 70 may be provided at least on the circuit boards 30 and 130 side with respect to the insulating sheets 60 and 160, or may be provided at least on the heat radiating member 50 side.
  • circuit components 20 and 120 may not include the heat transfer material 70.
  • the circuit components 20 and 120 do not include the heat transfer material 70, the insulating sheets 60 and 160 may be in contact with the circuit boards 30 and 130 and the heat radiating member 50.
  • the protrusion 84 may be in contact with the heat radiating member 50 through the through hole 62.
  • the metal member 80 may be provided only in a part of the conductive paths.
  • the circuit configuration is provided with a metal member 80 in a conductive path 34 connected to the heat-generating component 40 having a large heat generation amount, and the heat generation amount is increased.
  • the metal member 80 may not be provided in the conductive path 34 connected to the small heat generating component. In this case, a thermal via may be provided in the conductive path 34 connected to the heat generating component having a small heat generation amount.
  • the insulating sheet 160 having the through hole 62 formed in the second embodiment may be adopted instead of the insulating sheet 60.
  • a member having a higher thermal conductivity than the insulating sheet 160 such as the heat transfer material 70
  • the circuit configuration is configured such that the first heat transfer material 70A and the second heat transfer material 70B come into contact with each other inside or outside the through hole 62. You may be.
  • the circuit structure may be configured such that the first heat transfer material 70A comes into contact with the heat radiating member 50 at or outside the heat radiating member 50 side opening of the through hole 62.
  • the circuit structure may be configured such that the second heat transfer material 70B comes into contact with the circuit board 30 at or outside the opening on the circuit board 30 side of the through hole 62.
  • the insulating sheet 60 in which the through hole 62 in the first embodiment is not formed may be adopted instead of the insulating sheet 160.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

Le but de la présente invention est de fournir une technologie par laquelle une carte de circuit imprimé et un élément de dissipation de chaleur peuvent être rapprochés l'un de l'autre. Cette structure de circuit est pourvue d'une carte de circuit imprimé, d'un élément de dissipation de chaleur qui doit être empilé sur la carte de circuit imprimé, et d'une feuille d'isolation disposée entre la carte de circuit imprimé et l'élément de dissipation de chaleur.
PCT/JP2020/019565 2019-06-06 2020-05-18 Structure de circuit et boîte de connexion électrique WO2020246223A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-105903 2019-06-06
JP2019105903A JP2020202203A (ja) 2019-06-06 2019-06-06 回路構成体及び電気接続箱

Publications (1)

Publication Number Publication Date
WO2020246223A1 true WO2020246223A1 (fr) 2020-12-10

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JP (1) JP2020202203A (fr)
WO (1) WO2020246223A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156463A (ja) * 2014-01-14 2015-08-27 新光電気工業株式会社 配線基板及び半導体パッケージ
JP2018182147A (ja) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 金属部材付き基板、回路構成体及び電気接続箱
JP2019079903A (ja) * 2017-10-24 2019-05-23 株式会社オートネットワーク技術研究所 回路構成体及び回路構成体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156463A (ja) * 2014-01-14 2015-08-27 新光電気工業株式会社 配線基板及び半導体パッケージ
JP2018182147A (ja) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 金属部材付き基板、回路構成体及び電気接続箱
JP2019079903A (ja) * 2017-10-24 2019-05-23 株式会社オートネットワーク技術研究所 回路構成体及び回路構成体の製造方法

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