WO2020246224A1 - Structure de circuit et boîte de connexion électrique - Google Patents

Structure de circuit et boîte de connexion électrique Download PDF

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Publication number
WO2020246224A1
WO2020246224A1 PCT/JP2020/019580 JP2020019580W WO2020246224A1 WO 2020246224 A1 WO2020246224 A1 WO 2020246224A1 JP 2020019580 W JP2020019580 W JP 2020019580W WO 2020246224 A1 WO2020246224 A1 WO 2020246224A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat
metal member
hole
conductive path
Prior art date
Application number
PCT/JP2020/019580
Other languages
English (en)
Japanese (ja)
Inventor
北　幸功
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2020246224A1 publication Critical patent/WO2020246224A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Conductivity including a circuit board on which a heat-generating component is mounted, a heat-dissipating member stacked on the circuit board, and a metal member attached to the circuit board, to which the heat-generating component is connected in the circuit board.
  • a hole is formed in the path at a position avoiding the heat generating component, and the metal member is connected to an insertion portion inserted through the hole and one end of the insertion portion and protrudes from the hole toward the heat radiation member side. It is a circuit structure including a protruding portion.
  • the conductive path 34 may have a land exposed on the main surface of the printed circuit board.
  • a plurality of conductive paths 34 are provided so as to be insulated from each other.
  • the first conductive path 34A, the second conductive path 34B, and the third conductive path 34C are provided.
  • a heat generating component 40 is mounted on the circuit board 30.
  • the heat generating component 40 is a FET (Field Effect Transistor)
  • the heat generating component 40 may be a resistor such as a shunt resistor, a coil, a capacitor, or the like.
  • the number of heat generating parts 40 is one, but a plurality of heat generating parts 40 may be provided.
  • the heat generating component 40 includes a main body 42 and a plurality of terminals 44.
  • the main body 42 is located on the land of the first conductive path 34A.
  • the plurality of terminals 44 are exposed to the outside of the main body 42.
  • the plurality of terminals 44 have a first terminal 44A, a second terminal 44B, and a third terminal 44C.
  • the first terminal 44A is provided on the back surface of the main body 42.
  • the first terminal 44A is connected to the first conductive path 34A.
  • the second terminal 44B and the third terminal 44C are provided so as to project from the side surface of the main body 42.
  • the second terminal 44B and the third terminal 44C are connected to the second conductive path 34B and the third conductive path 34C, respectively.
  • the holes 36 are provided at positions avoiding the second terminal 44B and the third terminal 44C of the heat generating component 40, respectively.
  • the positions, numbers, and the like of the holes 36 in each of the conductive paths 34 are not limited to the above examples, and can be appropriately set.
  • only one hole 36 may be provided in the first conductive path 34A.
  • the cross-sectional shape of the hole 36 along the axial direction may be a circular shape, an elliptical shape, a square shape, or the like.
  • the holes 36 in each of the conductive paths 34 have the same shape and size, but may have different shapes and sizes.
  • the heat radiating member 50 is superposed on the circuit board 30.
  • the heat radiating member 50 is made of a metal having high thermal conductivity such as aluminum or an aluminum alloy.
  • the heat radiating member 50 has a mounting surface. The mounting surface is directed to the circuit board 30.
  • a circuit board 30 with a metal member 60 and a heat transfer material 80 are stacked on the mounting surface.
  • the mounting surface should be formed flat.
  • the metal member 60 is attached to the circuit board 30.
  • a metal member 60 is attached to each hole 36 of the circuit board 30.
  • the metal member 60 is fixed to the circuit board 30. Further, here, the metal member 60 is electrically connected to the conductive path 34.
  • the material of the metal member 60 for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel or the like may be adopted.
  • the metal member 60 includes an insertion portion 62 and a protrusion 64.
  • the other end of the insertion portion 62 does not protrude from the circuit board 30.
  • the other end surface of the insertion portion 62 is flush with the same height as the upper surface of the circuit board 30.
  • the other end surface of the insertion portion 62 may be lower or higher than the height of the upper surface of the circuit board 30.
  • the other end of the insertion portion 62 and the conductive path 34 around the other end are not insulated, but may be insulated.
  • the heat transfer material 80 is provided between the metal member 60 and the heat radiating member 50.
  • the heat transfer material 80 is provided at a position corresponding to the metal member 60.
  • the heat transfer material 80 provided at a position corresponding to one metal member 60 and the heat transfer material 80 provided at a position corresponding to the other metal member 60 are provided apart from each other.
  • the heat transfer materials 80 provided apart from each other are formed of materials having the same physical properties. That is, the heat transfer materials 80 provided apart from each other are the same materials arranged at different positions.
  • the heat transfer materials 80 provided apart from each other may be formed of materials having different physical properties. For example, some of the heat transfer materials 80 provided apart from each other may have high heat transfer properties instead of lower insulating properties than the other heat transfer materials 80.
  • the heat transfer material 80 is in close contact with the end surface of the protruding portion 64 and the mounting surface of the heat radiating member 50 to fill the gap between the protruding portion 64 and the heat radiating member 50. As a result, the amount of air contained between the metal member 60 and the heat radiating member 50 can be reduced, and the thermal resistance of this portion is reduced.
  • the heat transfer material 80 may be a heat transfer sheet formed into a sheet shape.
  • the heat transfer sheet should be easily deformed to the extent that the gap between the metal member 60 and the heat radiating member 50 can be filled.
  • the heat transfer material 180 is in contact with the outer peripheral surface in addition to the end surface of the protrusion 64. As a result, the contact area between the protrusion 64 and the heat transfer material 180 increases. As a result, heat is easily transferred from the metal member 60 to the heat transfer material 180.
  • the circuit components 20 and 120 were provided with the heat transfer materials 80 and 180, but the circuit components 20 and 120 may not be provided with the heat transfer materials 80 and 180.
  • the protruding portion 64 may be in contact with the heat radiating member 50.
  • an insulating sheet may be provided between the protrusion 64 and the heat radiating member 50.
  • Such an insulating sheet may be formed of a material such as polyimide.
  • the fixing member 70 is provided between the insertion portion 62 and the inner surface of the hole 36, but this is not an essential configuration.
  • the fixing member 70 may be provided at another position.
  • the fixing member 70 may be provided between the surface of the protruding portion 64 facing the circuit board 30 side and the main surface of the circuit board 30 on the heat radiating member 50 side to join the two.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La but de la présente invention est de fournir une technologie permettant d'améliorer la dissipation de chaleur efficace sur une carte de circuit imprimé. Cette structure de circuit comporte une carte de circuit imprimé sur laquelle un composant de génération de chaleur est monté, un élément de dissipation de chaleur qui doit être empilé sur la carte de circuit imprimé, un élément métallique fixé à la carte de circuit imprimé, la carte de circuit imprimé ayant un trou formé, dans un trajet conducteur électrique relié au composant de génération de chaleur, à une position éloignée du composant de génération de chaleur ; et l'élément métallique comprend une partie d'insertion insérée dans le trou, et une partie en saillie reliée à une extrémité de la partie d'insertion et qui fait saillie à partir du trou vers l'élément de dissipation de chaleur.
PCT/JP2020/019580 2019-06-06 2020-05-18 Structure de circuit et boîte de connexion électrique WO2020246224A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-105902 2019-06-06
JP2019105902A JP2020202202A (ja) 2019-06-06 2019-06-06 回路構成体及び電気接続箱

Publications (1)

Publication Number Publication Date
WO2020246224A1 true WO2020246224A1 (fr) 2020-12-10

Family

ID=73652816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/019580 WO2020246224A1 (fr) 2019-06-06 2020-05-18 Structure de circuit et boîte de connexion électrique

Country Status (2)

Country Link
JP (1) JP2020202202A (fr)
WO (1) WO2020246224A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127522A (ja) * 2012-12-25 2014-07-07 Keihin Corp プリント基板の放熱構造
WO2018193828A1 (fr) * 2017-04-18 2018-10-25 株式会社オートネットワーク技術研究所 Substrat équipé d'un élément métallique, structure de circuit et boîte de connexion électrique
JP2018182147A (ja) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 金属部材付き基板、回路構成体及び電気接続箱

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127522A (ja) * 2012-12-25 2014-07-07 Keihin Corp プリント基板の放熱構造
WO2018193828A1 (fr) * 2017-04-18 2018-10-25 株式会社オートネットワーク技術研究所 Substrat équipé d'un élément métallique, structure de circuit et boîte de connexion électrique
JP2018182147A (ja) * 2017-04-18 2018-11-15 株式会社オートネットワーク技術研究所 金属部材付き基板、回路構成体及び電気接続箱

Also Published As

Publication number Publication date
JP2020202202A (ja) 2020-12-17

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