JP3809051B2 - Electronic component mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting structure.
[0002]
[Prior art]
Conventionally, when mounting an electronic component such as a high-capacity semiconductor switching element in an in-vehicle electrical housing, bus bars 11 to 18 made of a metal plate are attached to an aluminum die as shown in FIGS. A die cast housing 1 such as a cast is disposed while being insulated from the housing 1, and electronic components such as relays RY1 and RY2 and capacitors C1 and C2 and electric parts are mounted on corresponding bus bars 11. Further, a semiconductor switching element that generates heat with a high capacity, for example, a high-capacity FET Q, has a portion of the resin package 3 connected to the insulating sheet 4 (with the electrode terminals 2 connected to the corresponding bus bars 11 as shown in FIG. Alternatively, the housing is fixed to the bottom surface of the housing 1 via silicon grease) by an insulating mounting screw 5 such as a synthetic resin screw. The mounting, heat generated in the FETQ was supposed to heat dissipation through the housing 1. 5, reference numerals 11a to 14a denote connector terminals exposed in the connector portions 10 and 10 provided on the side surface of the housing 1, and these connector terminals 11a to 14a are formed by end portions of the bus bars 11 to 14, respectively.
[0003]
[Problems to be solved by the invention]
In the configuration of the above-described conventional example, the heat generated in the high-capacity electronic component (FETQ in the above example) is radiated only by the die-cast housing 1, so that there is a limit to obtaining a further radiating effect. It was. Further, there is a problem that a useless space is created between the bus bars 11 and the FET Q, leading to an increase in the size of the housing and an increase in cost.
[0004]
The present invention has been made in view of the above points, and an object of the invention of claim 1 is to provide an electronic component mounting structure capable of efficiently radiating heat from a high-capacity electronic component. It is in.
[0005]
Another object of the invention of claim 2 is to provide an electronic component mounting structure capable of reducing the size and cost of a housing to be accommodated in addition to the object of the invention of claim 1.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, the plug blade of the connector to which the harness plug is connected is integrally formed, and is inserted into the resin molded structure and provided on one surface of the resin molded structure. A bus bar exposed through the recess, wherein the high-capacity electronic component is disposed in close contact with the bus bar in the recess, and the bus bar is thermally coupled to the metal body for heat dissipation provided on the other surface of the resin molded structure. Features .
[0007]
According to a second aspect of the present invention, in the first aspect of the present invention, the metal body for heat dissipation is a die-cast housing for storing electronic components.
[0008]
According to a third aspect of the present invention, in the second aspect of the invention, the bus bar is disposed on the housing, and the mounting screw is inserted into the housing through the mounting holes provided in the high-capacity electronic component and the bus bar, respectively. It is characterized by providing.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described with reference to an embodiment constituting a vehicle-mounted electrical unit.
[0010]
FIG. 1 shows an essential part of the present invention. In FIG. 1, a bus bar 11 which is a metal plate is disposed on the bottom surface of a housing 1 which also serves as a heat sink made of aluminum die cast with an insulating sheet 4 interposed therebetween. The housing 1 is thermally coupled to the upper surface of the bus bar 11 above the insulating sheet 4 and a high-capacity electronic component, for example, FETQ, is fixed using an insulating mounting screw 5 made of a synthetic resin screw. At this time, the surface of the FETQ resin package 3a and the heat dissipating metal body portion 3b are brought into close contact with the upper surface of the bus bar 11 in order to improve heat conduction. Further, when the FETQ electrode terminals 2 are connected to a predetermined bus bar, they are welded and fixed with springiness so that disconnection or the like does not occur due to external impact.
[0011]
FIG. 2 shows an upper surface of a block body 21 which is a resin molded structure in which the bus bars 11... Used in the present embodiment are insert-molded and held in the resin molded body 20. The upper surface of the block body 21 is shown in FIG. As shown in FIG. 5, the inserted bus bars 11 are exposed and provided with recesses 22 for arranging FETQ which is a high-capacity electronic component. For example, a mounting screw insertion hole 23 for a FETQ, which is a high-capacity electronic component, is formed in the portion of the bus bar 11 exposed in the recess 22.
[0012]
FIG. 3 shows the relationship between the main parts of the housing 1 and the block body 21. A part of the back surface of the housing 1 enters the recess 24 on the back surface side of the recess 22 and is exposed to the recess 24 through the insulating sheet 2. The state which is contacting the bus-bar 11 which is carrying out is shown. Then, the FETQ resin package 3 disposed in each recess 22 is brought into close contact with the bus bars 11, 12 or 13 exposed in the recesses 22.
[0013]
In the vicinity of the recesses 22 are provided windows 25 through which connection portions for connecting the electrode terminals of the FETQ are exposed.
[0014]
In the figure, reference numerals 11b, 11c, 12b, 12c, 13b, 13c, 14b, and 14c denote connection terminal surfaces formed on the bus bars 11, 12, 13, and 14 exposed in the window 25, respectively. The end portions of the bus bars 11, 12, 13, 14 are integrally formed with plug blades 26 exposed in the connector portion 10 provided at the end portions of the block body 21.
[0015]
In this embodiment, since there is no useless space between the housing 1 and the bus bars 11... And the FET Q, the housing 1 that houses the block body 21 can be made low-profile. Further, the heat transmitted through the bus bars 11... Is connected to the plug blade 26 of the connector unit 10 and is transmitted to the outside through the harness plug, so that a high heat dissipation effect is obtained.
[0016]
In the above-described example, the FETQ in which the mounting hole is provided in the heat dissipating metal body portion 3b is used as a high-capacity electronic component. However, as shown in FIG. In the case of components, the bus bars 11 are attached by soldering, and the bus bars 11 and the electrode terminals may be connected by wire bonding 6.
[0017]
In the above-described embodiment, the bus bar 11 is arranged to be thermally coupled to the die-cast housing 1 via the insulating sheet 2. However, the bus bar 11 is directly connected to the housing 1 without the insulating sheet 2. You may arrange in. Moreover, it is good also as a structure which comprises the metal plate for another heat radiation instead of the housing 1, and arrange | positions the bus-bar 11 to this metal plate directly or via an insulating sheet for this heat radiation.
[0018]
【The invention's effect】
According to a first aspect of the present invention, there is provided a bus bar which integrally forms a plug blade of a connector to which a harness plug is connected, and is exposed through a recess provided in one surface of the resin molded structure. In the recess, the high-capacity electronic component is disposed in close contact with the bus bar, and the bus bar is thermally coupled to the heat dissipating metal body provided on the other surface of the resin molded structure, so that heat generated by the high-capacity electronic component is generated. Heat can be dissipated through the resin molding structure through the bus bar or through the harness plug, and as a result, efficient heat dissipation can be performed. Furthermore, the heat generated by the high-capacity electronic components can also be dissipated from the metal body for heat dissipation via the bus bar, so that the heat dissipation effect is further improved and there is a wasted space between the high-capacity electronic components and the bus bar. This eliminates the effect of reducing the height of the mounting structure.
[0019]
The invention of claim 2 is that in the invention of claim 1, since the heat dissipating metal body is a die-cast housing for storing electronic components, the low-profile structure makes it possible to manufacture the housing in a small size. There is an effect that the cost of the entire unit can be reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a schematic configuration of a main part of an embodiment of the present invention.
FIG. 2 is a top view of a block body holding a bus bar of a specific example of the above.
FIG. 3 is a partially omitted cross-sectional view showing the relationship between the block body and the housing.
FIG. 4 is a cross-sectional view showing a schematic configuration of a main part when another form of FET is used.
FIG. 5A is a side view showing a schematic configuration of a conventional example.
(B) is a top view which shows schematic structure same as the above.
(C) is a front view showing a schematic configuration of the above.
FIG. 6 is an enlarged cross-sectional view showing an attached state of the FET.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing 2 Electrode terminal 3a Resin package 3b Heat-dissipating metal body part 4 Insulation sheet 5 Mounting screw 11 Bus bar Q FET

Claims (3)

Forming a plug pins of the connector harness plug is connected together, are inserted into the resin molded structure comprising a bus bar which is exposed through the recess formed on one surface of the resin molded structure, high capacity electrons in the recess A mounting structure for an electronic component, wherein the component is disposed in close contact with the bus bar, and the bus bar is thermally coupled to a metal body for heat dissipation provided on the other surface of the resin molded structure. 2. The electronic component mounting structure according to claim 1, wherein the heat dissipating metal body is a die-cast housing for storing electronic components. 3. The electronic component according to claim 2, further comprising: a mounting screw that is disposed on the housing and includes a mounting screw that is inserted into a mounting hole provided in each of the high-capacity electronic component and the bus bar and is screwed into the housing. Mounting structure.

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