JP2002050883A - Fitting structure of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fitting structure of an electronic part, where the heat from an electronic part of high capacity is efficiently released. SOLUTION: An FET Q of a high-capacity electronic part is fitted onto a bus bar 11 provided on an aluminum diecast housing 1 which also acts as a heat radiation metal plate through an insulation sheet 4, while tightly fitted by a surface of a resin package 3a and a heat-radiation metal body part 3a. The heat generated at the FET Q is released from the housing 1 through the bus bar 11 and the insulation sheet 4, while it is released through a block body in which the bus bar 11 is inserted and a harness plug connected to a plug blade of a connector part as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting structure.

[0002]

2. Description of the Related Art Conventionally, when electronic components such as high-capacity semiconductor switching elements are mounted in an electrical equipment housing for a vehicle, bus bars 11 to 11 made of a metal plate as shown in FIGS. 18 and the like are arranged in a die-cast housing 1 such as an aluminum die-cast while maintaining insulation with respect to the housing 1, and relays RY1, RY2 are provided.
And electronic components such as capacitors C1 and C2, and electric components are mounted on the corresponding bus bars 11..., And a high-capacity, heat-generating semiconductor switching element, for example, a high-capacity FET Q
5, the electrode terminals 2 are connected to the corresponding bus bars 11 and the resin package 3 is brought into close contact with the bottom surface of the housing 1 via the insulating sheet 4 (or silicon grease) as shown in FIG. The housing is attached to the housing 1 by an insulating attachment screw 5 such as a resin screw, and the heat generated by the FET Q is radiated through the housing 1. In FIG. 5, reference numerals 11a to 14a denote connector terminals exposed in the connector portions 10 provided on the side surface of the housing 1.
14a is formed by the ends of the bus bars 11 to 14.

[0003]

In the configuration of the above-mentioned conventional example, the heat generated by the high-capacity electronic component (the FET Q in the above example) is radiated only by the die-cast housing 1. There was a limit in obtaining the heat radiation effect. In addition, there is a problem that a useless space is formed between the bus bars 11 and the FET Q, which leads to an increase in the size of the housing and an increase in cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic component mounting structure capable of efficiently radiating heat from a high-capacity electronic component. To provide.

It is another object of the present invention to provide an electronic component mounting structure in which the size of a housing to be housed can be reduced and the cost can be reduced.

[0006]

To achieve the above object, according to the first aspect of the present invention, a plug blade of a connector to which a harness plug is connected is integrally formed, and a bus bar inserted into a resin molded structure is provided. And a high-capacity electronic component is disposed in close contact with the bus bar.

According to a second aspect of the present invention, in the first aspect of the present invention, the bus bar is thermally coupled to a metal body for heat radiation.

According to a third aspect of the present invention, in the second aspect of the invention, the heat dissipating metal body is a die-cast housing for accommodating electronic components.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment constituting a vehicle electrical unit.

FIG. 1 shows a main part of the present invention. In FIG. 1, a bus bar 11 which is a metal plate is provided on a bottom surface of a housing 1 which also serves as a heat sink made of aluminum die-casting, with an insulating sheet 4 interposed therebetween. The bus bar 11 and the housing 1 are thermally coupled to each other, and a high-capacity electronic component, for example, FETQ, is fixed to the upper surface of the bus bar 11 above the insulating sheet 4 using an insulating mounting screw 5 made of a synthetic resin screw. is there. At this time, the surfaces of the resin package 3a and the heat dissipating metal body 3b of the FETQ are brought into close contact with the upper surface of the bus bar 11 in order to improve the heat conduction. When the electrode terminals 2 of the FET Q are connected to a predetermined bus bar, they are welded and fixed so as to have a spring property so that disconnection or the like does not occur due to an external impact.

FIG. 2 shows bus bars 11 used in this embodiment.
Shows the upper surface of a block body 21 that is a resin molded structure in which is held by insert molding into a resin molded body 20;
As shown in FIG. 3, the inserted bus bars 11 are exposed on the upper surface of the block body 21, and concave portions 22 for disposing the FET Q which is a high-capacity electronic component are provided. For example, in the portion of the bus bar 11 exposed in the concave portion 22,
Mounting screw insertion hole 2 for FETQ, a high capacity electronic component
3 is drilled.

FIG. 3 shows the relationship between the main part of the housing 1 and the block body 21. A part of the rear surface of the housing 1 enters into the concave portion 24 on the rear surface side of the concave portion 22, and the concave portion 24 shows a state where the bus bar 11 is in contact with the bus bar 11 exposed at 24. Then, the resin package 3 of the FET Q disposed in each recess 22 is brought into close contact with the bus bar 11, 12 or 13 exposed in the recess 22.

In the vicinity of the recesses 22, there are provided windows 25 for exposing connection portions for connecting the electrode terminals of the FET Q.

In the figure, 11b, 11c, 12b, 12c, 1
Reference numerals 3b, 13c, 14b, and 14c denote connection terminal surfaces formed on the bus bars 11, 12, 13, and 14 exposed to the window 25, respectively. At the end of each of the bus bars 11, 12, 13, and 14, a plug blade 26 that is exposed in the connector 10 provided at the end of the block body 21 is integrally formed.

In this embodiment, the housing 1 and the bus bar 1
1 and the FET Q, there is no useless space, so that the height of the housing 1 for housing the block body 21 can be reduced. Further, the heat transmitted through the bus bars 11 is connected to the plug blade 26 of the connector section 10 and is radiated to the outside through the harness plug, so that a high heat radiation effect is obtained.

In the above-described example, the FET Q in which the heat-dissipating metal part 3b is provided with a mounting hole is used as a high-capacity electronic component. However, as shown in FIG. In the case of high-capacity electronic components, soldering is performed on the bus bars 11.
The bus bars 11 are connected to the electrode terminals by wire bonding 6
It is good to connect by.

In the above-described embodiment, the bus bar 11 is disposed so as to be thermally coupled to the die-cast housing 1 via the insulating sheet 2. However, the bus bar 11 is not connected to the housing 1 via the insulating sheet 2. May be directly arranged. Further, instead of the housing 1, another metal plate for heat radiation may be provided, and the bus bar 11 may be disposed on the metal plate for heat radiation directly or via an insulating sheet.

[0018]

According to the first aspect of the present invention, a plug blade of a connector to which a harness plug is connected is integrally formed, a bus bar inserted into a resin molded structure, and a high-capacity electronic component is brought into close contact with the bus bar. The heat generated by the high-capacity electronic component can be radiated through the bus bar, through the resin molded structure, or through the harness plug, and as a result, heat can be efficiently radiated.

According to a second aspect of the present invention, in the first aspect of the present invention, since the bus bar is thermally coupled to the heat dissipating metal body, heat generated by the high-capacity electronic component is dissipated through the bus bar. Heat can also be radiated from the body, so the heat radiation effect is further improved, and there is no wasteful space between the high-capacity electronic components and the bus bar, and the height of the mounting structure can be reduced. is there.

According to a third aspect of the present invention, in the first aspect of the present invention, since the heat dissipating metal body is a die-cast housing for accommodating an electronic component, the housing can be made small by the low-profile structure. As a result, there is an effect that the cost of the entire unit can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a schematic configuration of a main part of an embodiment of the present invention.

FIG. 2 is a top view of a block body holding a bus bar according to the specific example.

FIG. 3 is a partially omitted cross-sectional view showing a relationship between the above-described block body and a housing.

FIG. 4 is a cross-sectional view showing a schematic configuration of a main part when another type of FET is used in the embodiment.

FIG. 5A is a side view showing a schematic configuration showing a conventional example. (B) is a top view which shows the schematic structure same as the above.
(C) is a front view which shows the schematic structure same as the above.

FIG. 6 is an enlarged cross-sectional view showing a mounting state of the above FET.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Electrode terminal 3a Resin package 3b Heat dissipation metal body 4 Insulating sheet 5 Mounting screw 11 Bus bar QFET

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshihisa Taguchi 18-7, Hirade Industrial Park, Utsunomiya City, Tochigi Prefecture Nestec Co., Ltd. (72) Inventor Masayuki Kikuchi 18-7, Hirade Industrial Park, Utsunomiya City, Tochigi Prefecture Nestec Co., Ltd. F term (reference) 4E353 AA06 AA11 AA16 AA18 BB02 BB04 BB05 BB07 CC01 CC12 CC13 CC32 CC33 DD01 DD11 DR08 DR17 DR36 DR49 EE01 EE08 GG11 GG17 5E322 AA01 AA03 AB01 FA09

Claims (3)

[Claims] 1. A plug blade of a connector to which a harness plug is connected is integrally formed, a bus bar inserted into a resin molded structure is provided, and a high-capacity electronic component is closely attached to the bus bar. The mounting structure of electronic components. 2. The electronic component mounting structure according to claim 1, wherein said bus bar is thermally coupled to a metal body for heat radiation. 3. The electronic component mounting structure according to claim 2, wherein said metal body for heat radiation is a die-cast housing for storing electronic components.