CN108258036B - Patch triode - Google Patents
Patch triode Download PDFInfo
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- CN108258036B CN108258036B CN201810164549.2A CN201810164549A CN108258036B CN 108258036 B CN108258036 B CN 108258036B CN 201810164549 A CN201810164549 A CN 201810164549A CN 108258036 B CN108258036 B CN 108258036B
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- triode
- fixedly arranged
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- tongue piece
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- 230000001681 protective effect Effects 0.000 claims abstract description 39
- 238000003466 welding Methods 0.000 claims abstract description 9
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 239000012634 fragment Substances 0.000 claims description 3
- 238000004512 die casting Methods 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 8
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- 239000004065 semiconductor Substances 0.000 description 5
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- KKQWHYGECTYFIA-UHFFFAOYSA-N 2,5-dichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1 KKQWHYGECTYFIA-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 210000005224 forefinger Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a patch triode, which comprises a triode body, wherein a triode protective shell is fixedly arranged on the outer side surface of the triode body, the triode protective shell is fixedly arranged on the side surface and the top surface of the triode body through bolts, a heat conducting fin is fixedly arranged at the contact part of the triode protective shell and the triode body, a blind hole is fixedly arranged on the upper surface of the triode protective shell, the other end of the blind hole penetrates through the outer surface of the triode protective shell to reach the inside of the triode protective shell, and the top end of the blind hole is connected with the heat conducting fin; the connection structure of triode and PCB board redesigns, can not just directly fix the triode on the PCB board through welding tin welding when installing the paster triode, guarantees the firm of structure simultaneously, great reduction when needs maintain and change the triode the required time of change components and parts.
Description
Technical Field
The invention belongs to the technical field of a patch triode, and particularly relates to a patch triode.
Background
The triode, which is called as semiconductor triode, bipolar transistor and transistor triode, is a semiconductor device for controlling current, and has the function of amplifying weak signal into electric signal with large amplitude value, and the conversion still follows energy conservation, and it only converts the energy of power supply into the energy of signal, and also can be used as contactless switch. The transistor is one of semiconductor basic components, has the function of current amplification, and is a core element of an electronic circuit. The triode is formed by manufacturing two PN junctions which are very close to each other on a semiconductor substrate, the whole semiconductor is divided into three parts by the two PN junctions, the middle part is a base region, the two side parts are an emitter region and a collector region, and the arrangement modes include PNP and NPN. Present paster triode is put the triode paster and carries out the welding on the PCB board when using, but present paster can lead to the rosin joint when the welding, and the condition of rosin joint takes place, causes equipment life not up to standard, and the triode can produce a large amount of heats when changing moreover, and the triode often needs to be changed, and it is difficult to adopt welded mode to change, to the overheated and difficult problem of changing of present triode, for this we propose a paster triode.
Disclosure of Invention
The invention aims to provide a surface mount transistor, which solves the problems that the temperature of the transistor is too high during work and the operation is complex when the transistor is replaced in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a patch triode comprises a triode body, wherein a triode protective shell is fixedly arranged on the outer side surface of the triode body and fixedly arranged on the side surface and the top surface of the triode body through bolts, a heat conducting fin is fixedly arranged at the contact part of the triode protective shell and the triode body, a blind hole is fixedly arranged on the upper surface of the triode protective shell, the other end of the blind hole penetrates through the outer surface of the triode protective shell to reach the inside of the triode protective shell, the top end of the blind hole is connected with the heat conducting fin, a triode adsorption magnet is fixedly arranged on the outer side surface of the blind hole, the triode adsorption magnet is fixedly arranged on the inner side surface of the triode protective shell, the top end surface of the triode adsorption magnet is consistent with the surface height of the triode protective shell, and a radiating, the heat sink comprises a heat sink, a blind hole, a heat conducting fin, a fixing pin, a heat sink fixing magnet, a heat sink, a lifting spring sheet, a fixing tongue sheet, a fixing groove and a fixing groove, wherein the fixing pin is fixedly arranged below one side surface of the heat sink, one end of the fixing pin is fixedly arranged on one side surface of the heat sink through welding, the other end of the fixing pin is fixedly arranged in the blind hole and is contacted with the side surface of the heat conducting fin, the heat sink fixing magnet is fixedly arranged on the outer side surface of one end of the fixing pin, the side surface of one end of the fixing magnet is contacted with the side surface of the heat sink, the side surface of the other end of the heat sink fixing magnet and the side surface of one end of the, the barb tongue piece is characterized in that a PCB is fixedly arranged between the barb tongue piece and the fixing tongue piece, connecting pieces are fixedly arranged on two side faces of the PCB, the upper end surface of each connecting piece is in contact with the lower surface of the fixing tongue piece, and the lower end surface of each connecting piece is in contact with the side surface of the top end of the barb tongue piece.
Preferably, four blind holes are fixedly formed in the upper surface of the triode protective shell, and the fixing positions of the blind holes are mutually symmetrical.
Preferably, a pin is fixedly arranged on the surface of one side of the triode protective shell, two pins are fixedly arranged on the surface of the other side of the triode protective shell, and a fixing tongue piece is fixedly arranged at the top end of each pin.
Preferably, the appearance structure of the cross section of the pin is a circular structure, and the appearance structure of the fixing tongue piece is a cuboid structure.
Compared with the prior art, the invention has the beneficial effects that:
(1) the connection structure of triode and PCB board redesigns, can not just directly fix the triode on the PCB board through welding tin welding when installing the paster triode, guarantees the firm of structure simultaneously, great reduction when needs maintain and change the triode the required time of change components and parts.
(2) The jack-up shell fragment of the inboard tongue piece of triode can contact the inner wall of tongue piece and PCB board, is being connected the inseparable and PCB board of tongue piece when fixing, has guaranteed the unblocked of circuit, has avoided leading to contact point contact failure because rosin joint or empty solder joint.
(3) The blind hole at the top of triode and the magnet of blind hole outer lane can be with the fixed top that sets up at the triode of fin, and the inside conducting strip of blind hole can reduce the temperature of triode on heat conduction to the fin simultaneously, has prolonged the life of triode.
(4) The split type design of fin and triode can directly change the triode when the triode need be changed, then place the fin on new triode, does not need synchronous change fin, has avoided the waste of equipment.
Drawings
FIG. 1 is a schematic view of the external structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the tongue construction of the present invention;
FIG. 4 is a schematic view of the structure of the heat sink of the present invention;
FIG. 5 is a schematic view of a heat sink fixing structure according to the present invention;
in the figure: the manufacturing method comprises the following steps of 1-fixing a tongue piece, 2-pins, 3-triode body, 4-blind holes, 5-triode adsorption magnet, 6-triode protective shell, 7-heat conducting fin, 8-heat radiating fin, 9-PCB, 10-connecting piece, 11-jacking elastic piece, 12-barb tongue piece, 13-heat radiating fin fixing magnet and 14-fixing pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a patch triode comprises a triode body 3, a triode protective shell 6 is fixedly arranged on the outer side surface of the triode body 3, the triode protective shell 6 is fixedly arranged on the side surface and the top surface of the triode body 3 through bolts, a heat conducting fin 7 is fixedly arranged at the contact part of the triode protective shell 6 and the triode body 3, a blind hole 4 is fixedly arranged on the upper surface of the triode protective shell 6, the other end of the blind hole 4 penetrates through the outer surface of the triode protective shell 6 to reach the inside of the triode protective shell 6, the top end of the blind hole 4 is connected with the heat conducting fin 7, a triode adsorption magnet 5 is fixedly arranged on the outer side surface of the blind hole 4, the triode adsorption magnet 5 is fixedly arranged on the inner side surface of the triode protective shell 6, the top end surface of the triode adsorption magnet 5 is consistent with the surface, a fixed pin 14 is fixedly arranged below one side surface of the radiating fin 8, one end of the fixed pin 14 is fixedly arranged on one side surface of the radiating fin 8 by welding, the other end of the fixed pin 14 is fixedly arranged in the blind hole 4 and is contacted with the side surface of the heat conducting fin 7, a radiating fin fixed magnet 13 is fixedly arranged on the outer side surface of one end of the fixed pin 14, one end side surface of the radiating fin fixed magnet 13 is contacted with the side surface of the radiating fin 8, the other end side surface of the radiating fin fixed magnet 13 and the side surface of one end of the triode adsorption magnet 5 are mutually attracted and fixed, pins 2 are fixedly arranged on the two side surfaces of the triode protective shell 6, one end of each pin 2 is fixedly provided with a fixed tongue piece 1 by die casting, the side wall of each pin 2 is fixedly provided with a jacking elastic piece 11, the other end of the jacking elastic piece 11 is fixedly arranged on, a PCB 9 is fixedly arranged between the barb tongue piece 12 and the fixing tongue piece 1, connecting pieces 10 are fixedly arranged on two side faces of the PCB 9, the upper end surface of each connecting piece 10 is in contact with the lower surface of the corresponding fixing tongue piece 1, and the lower end surface of each connecting piece 10 is in contact with the side surface of the top end of the corresponding barb tongue piece 12.
In order to make the heat sink more rapid and convenient to mount, in this embodiment, preferably, the upper surface of the triode protective shell 6 is fixedly provided with four blind holes 4, and the fixed positions of the blind holes 4 are symmetrical to each other.
In order to make the fixing structure of the triode more stable, in this embodiment, preferably, one pin 2 is fixedly disposed on a surface of one side of the triode protective shell 6, two pins 2 are fixedly disposed on a surface of the other side of the triode protective shell 6, and a fixing tongue piece is fixedly disposed at the top end of each pin 2.
In order to facilitate the installation of the triode in the process of being installed on the PCB, in this embodiment, preferably, the external structure of the cross section of the pin 2 is a circular structure, and the external structure of the fixing tongue piece 1 is a rectangular structure.
The working principle and the using process of the invention are as follows: when the device is used, the triode body 3 is fixedly arranged on the upper surface of a PCB (printed circuit board) 9 through a fixing tongue piece 1, a barb tongue piece 12 and a jacking elastic sheet 11, a circuit is connected through the contact of a connecting sheet 10 and the fixing tongue piece 1 and the contact of the connecting sheet 10 and the barb tongue piece 12, a heat conducting sheet 7 transfers heat to a radiating fin 8 through a fixing pin 14 during operation, the heat is radiated to the surrounding environment to keep the temperature of the triode body 3 not too high, and the radiating fin 8 is fixed through the mutual adsorption of a radiating fin fixing magnet 13 and a triode adsorption magnet 5;
put the thumb in one side that has solitary pin 2 when needs are dismantled, put one side that has two pins 2 with forefinger and middle finger, pull out fixed tongue piece 1 with the hand simultaneously and separate triode body 3 and PCB board 9, take off the direct side of following triode protective housing 6 of fin 8 strength after triode body 3 and the separation of PCB board 9, change triode body 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A patch triode, includes triode body (3), its characterized in that: the triode protective shell (6) is fixedly arranged on the surface of the outer side of the triode body (3), the triode protective shell (6) is fixedly arranged on the side surface and the top surface of the triode body (3) through bolts, a heat conducting sheet (7) is fixedly arranged at the contact part of the triode protective shell (6) and the triode body (3), a blind hole (4) is fixedly arranged on the upper surface of the triode protective shell (6), the other end of the blind hole (4) penetrates through the outer surface of the triode protective shell (6) to reach the inside of the triode protective shell (6), the top end of the blind hole (4) is connected with the heat conducting sheet (7), a triode adsorption magnet (5) is fixedly arranged on the outer side surface of the blind hole (4), the triode adsorption magnet (5) is fixedly arranged on the surface of the inner side of the triode protective shell (6), and the top end surface of the triode adsorption magnet (5) is consistent with, the triode protective shell is characterized in that a radiating fin (8) is fixedly arranged above the triode protective shell (6), a fixing pin (14) is fixedly arranged below one side surface of the radiating fin (8), one end of the fixing pin (14) is fixedly arranged on one side surface of the radiating fin (8) through welding, the other end of the fixing pin (14) is fixedly arranged inside the blind hole (4) and is in contact with the side surface of the heat conducting fin (7), a radiating fin fixing magnet (13) is fixedly arranged on the surface of the outer side of one end of the fixing pin (14), the side surface of one end of the radiating fin fixing magnet (13) is in contact with the side surface of the radiating fin (8), the side surface of the other end of the radiating fin fixing magnet (13) and the side surface of one end of the triode adsorption magnet (5) are mutually attracted and fixed, and pins (2), the one end of pin (2) is provided with fixed tongue piece (1) through die-casting is fixed, the fixed jack-up shell fragment (11) that is provided with of lateral wall of pin (2), the other end of jack-up shell fragment (11) sets up the side surface at fixed tongue piece (1) through welded fastening, the opposite side surface of fixed tongue piece (1) is provided with barb tongue piece (12) through welded fastening, fixed PCB board (9) that is provided with between barb tongue piece (12) and fixed tongue piece (1), the both sides face of PCB board (9) all is fixed and is provided with connection piece (10), the upper end surface of connection piece (10) and the lower surface contact of fixed tongue piece (1), the lower extreme surface of connection piece (10) contacts with the side surface on the top of barb tongue piece (12).
2. The patch transistor of claim 1, wherein: the upper surface of the triode protective shell (6) is fixedly provided with four blind holes (4), and the fixed positions of the blind holes (4) are mutually symmetrical.
3. The patch transistor of claim 1, wherein: the novel triode protection shell is characterized in that one side surface of the triode protection shell (6) is fixedly provided with one pin (2), the other side surface of the triode protection shell (6) is fixedly provided with two pins (2), and each pin (2) is fixedly provided with a fixed tongue piece (1) at the top end.
4. The patch transistor of claim 1, wherein: the appearance structure of the cross section of the pin (2) is a circular structure, and the appearance structure of the fixing tongue piece (1) is a cuboid structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164549.2A CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164549.2A CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108258036A CN108258036A (en) | 2018-07-06 |
| CN108258036B true CN108258036B (en) | 2020-10-30 |
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ID=62745397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810164549.2A Active CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108258036B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116887B (en) * | 2023-09-14 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045889B2 (en) * | 2001-08-21 | 2006-05-16 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| CN102468254A (en) * | 2010-11-12 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Radiation device combination |
| CN203353032U (en) * | 2012-07-20 | 2013-12-18 | Sma太阳能技术股份公司 | Electronic assembly |
| JP2016082017A (en) * | 2014-10-15 | 2016-05-16 | 株式会社オートネットワーク技術研究所 | Bonding jig and method of manufacturing circuit structure with heat dissipator |
-
2018
- 2018-02-28 CN CN201810164549.2A patent/CN108258036B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045889B2 (en) * | 2001-08-21 | 2006-05-16 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| CN102468254A (en) * | 2010-11-12 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Radiation device combination |
| CN203353032U (en) * | 2012-07-20 | 2013-12-18 | Sma太阳能技术股份公司 | Electronic assembly |
| JP2016082017A (en) * | 2014-10-15 | 2016-05-16 | 株式会社オートネットワーク技術研究所 | Bonding jig and method of manufacturing circuit structure with heat dissipator |
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|---|---|
| CN108258036A (en) | 2018-07-06 |
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