CN108258036A - A kind of patch triode - Google Patents
A kind of patch triode Download PDFInfo
- Publication number
- CN108258036A CN108258036A CN201810164549.2A CN201810164549A CN108258036A CN 108258036 A CN108258036 A CN 108258036A CN 201810164549 A CN201810164549 A CN 201810164549A CN 108258036 A CN108258036 A CN 108258036A
- Authority
- CN
- China
- Prior art keywords
- triode
- fixedly installed
- protective shell
- fixed
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 45
- 238000001816 cooling Methods 0.000 claims description 29
- 238000001179 sorption measurement Methods 0.000 claims description 13
- 238000004512 die casting Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009640 blood culture Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 210000005224 forefinger Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
Abstract
The invention discloses a kind of patch triodes; including triode ontology; the outer surface of the triode ontology is fixedly installed triode protective shell; the triode protective shell is bolted the side surface for being arranged on triode ontology and top surface; the contact position of the triode protective shell and triode ontology is fixedly installed thermally conductive sheet; the upper surface of the triode protective shell is fixedly installed blind hole; the other end of the blind hole reaches the inside of triode protective shell through the outer surface of triode protective shell, and the top of the blind hole is connected with thermally conductive sheet；The connection structure of triode and pcb board is redesigned, it can not be welded and directly triode can be fixed on pcb board by scolding tin when being installed to patch triode, ensure the firm of structure simultaneously, greatly reduced when needing to repair triode with replacing and replace the component required time.
Description
Technical field
The invention belongs to patch triode technical fields, and in particular to a kind of patch triode.
Background technology
Triode, full name should be transistor, also referred to as bipolar transistor, transistor, be a kind of control electricity
Its effect of the semiconductor devices of stream is that small-signal is zoomed into the larger electric signal of range value, and this conversion still follows energy
Conservation, it is only converted into the energy of power supply the energy of signal, also serves as noncontacting switch.Transistor is semiconductor
One of basic component, has Current amplifier effect, is the core element of electronic circuit.Triode is in a block semiconductor substrate
Bulk semiconductor is divided into three parts by the upper PN junction for making two close proximities, two PN junctions, and middle section is base area, both sides
It is emitter region and collecting zone to divide, and arrangement mode has two kinds of PNP and NPN.Current patch triode is by triode when in use
Patch is placed on pcb board and is welded, but current patch can lead to rosin joint in welding, and happening for missing solder causes
Service life of equipment is not up to standard, and triode can generate a large amount of heat when being converted, and triode is frequently necessary to replace,
It is replaced and is not easy by the way of welding, overheat for current triode and the problem of be not easy to replace, thus it is proposed that one
Kind patch triode.
Invention content
The purpose of the present invention is to provide a kind of patch triodes, are existed with solving triode mentioned above in the background art
Temperature is excessively high during work, replaces the problem of complicated for operation during triode.
To achieve the above object, the present invention provides following technical solution：A kind of patch triode, including triode ontology,
The outer surface of the triode ontology is fixedly installed triode protective shell, and the triode protective shell, which is bolted, to be set
It puts in the side surface of triode ontology and top surface, the contact position of the triode protective shell and triode ontology is fixedly installed
Thermally conductive sheet, the upper surface of the triode protective shell are fixedly installed blind hole, and the other end of the blind hole is protected through triode
The outer surface of shell reaches the inside of triode protective shell, and the top of the blind hole is connected with thermally conductive sheet, the outside of the blind hole
Face is fixedly installed triode adsorption magnet, and the triode adsorption magnet is fixed at the private side table of triode protective shell
Face, the top end surface of the triode adsorption magnet is consistent with the apparent height of triode protective shell, the triode protective shell
Top be fixedly installed cooling fin, the side lower face of the cooling fin is fixedly installed fixed pin, the fixed pin
One end is arranged on a side surface of cooling fin by being welded and fixed, and the other end of the fixed pin is fixed at the inside of blind hole
And be in contact with the side surface of thermally conductive sheet, one end outer surface of the fixed pin is fixedly installed cooling fin fixed magnet, institute
One end side surface for stating cooling fin fixed magnet is in contact with the side surface of cooling fin, the other end of the cooling fin fixed magnet
The side of side and one end of triode adsorption magnet is mutually fixed, and the both side surface of the triode protective shell is all fixed
Pin is provided with, one end of the pin is fixedly installed fixing tongue by die casting, and the side wall of the pin is fixedly installed
Shrapnel is jacked up, the other end for jacking up shrapnel is arranged on the side surface of fixing tongue, the fixing tongue by being welded and fixed
Another side surface be provided with barb tongue piece by being welded and fixed, be fixedly installed between the barb tongue piece and fixing tongue
Pcb board, the two sides of the pcb board are all fixedly installed connection sheet, under the upper end face and fixing tongue of the connection sheet
Surface contacts, and the rear surface of the connection sheet is in contact with the side surface on the top of barb tongue piece.
Preferably, there are four blind hole, the fixed positions of the blind hole for the upper surface fixed setting of the triode protective shell
It is mutually symmetrical with.
Preferably, a side surface of the triode protective shell is fixedly installed a pin, the triode protective shell
Another side surface be fixedly installed two pins, the top of each pin is fixedly installed fixing tongue.
Preferably, the surface structure of the cross section of the pin is circular configuration, and the surface structure of the fixing tongue is
Rectangular parallelepiped structure.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) connection structure of triode and pcb board is redesigned, can not when being installed to patch triode
Directly triode can be fixed on pcb board by scolding tin welding, while ensures the firm of structure, is being needed to triode
It greatly reduced when repairing with replacing and replace the component required time.
(2) the jack-up shrapnel on the inside of the tongue piece of triode can contact tongue piece with the inner wall of pcb board, consolidated
Tongue piece is closely connect by timing with pcb board, ensure that the unimpeded of circuit, and avoid causes to contact because of rosin joint or missing solder
Point contact is bad.
(3) cooling fin can be fixed at the top of triode by the magnet of the blind hole at the top of triode and blind hole outer ring
Portion, while the thermally conductive sheet inside blind hole can be conducted heat on cooling fin, reduced the temperature of triode, extended triode
Service life.
(4) split-type design of cooling fin and triode can directly replace three poles when triode is replaced
Cooling fin, is then placed on new triode by pipe, does not need to synchronous replacement cooling fin, avoids the waste of equipment.
Description of the drawings
Fig. 1 is the surface structure schematic diagram of the present invention；
Fig. 2 is the side structure schematic view of the present invention；
Fig. 3 is the tongue piece structure schematic diagram of the present invention；
Fig. 4 is the heat sink structure illustration of the present invention；
Fig. 5 is the blood culture bottle schematic diagram of the present invention；
In figure：1- fixing tongue, 2- pins, 3- triodes ontology, 4- blind holes, 5- triodes adsorption magnet, 6- triodes
Protective shell, 7- thermally conductive sheets, 8- cooling fins, 9-PCB plates, 10- connection sheets, 11- jack up shrapnel, 12- barbs tongue piece, 13- cooling fins
Fixed magnet, 14- fixed pins.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
- Fig. 5 is please referred to Fig.1, the present invention provides a kind of technical solution：A kind of patch triode, including triode ontology 3,
The outer surface of triode ontology 3 is fixedly installed triode protective shell 6, and triode protective shell 6, which is bolted, to be arranged on
The side surface of triode ontology 3 and top surface, triode protective shell 6 and the contact position of triode ontology 3 are fixedly installed heat conduction
Piece 7, the upper surface of triode protective shell 6 are fixedly installed blind hole 4, and the other end of blind hole 4 runs through the appearance of triode protective shell 6
Face reaches the inside of triode protective shell 6, and the top of blind hole 4 is connected with thermally conductive sheet 7, and the lateral surface of blind hole 4 is fixedly installed
Triode adsorption magnet 5, triode adsorption magnet 5 are fixed at the inner lateral surfaces of triode protective shell 6, triode absorption
The top end surface of magnet 5 is consistent with the apparent height of triode protective shell 6, and the top of triode protective shell 6 is fixedly installed scattered
Backing 8, the side lower face of cooling fin 8 are fixedly installed fixed pin 14, and one end of fixed pin 14 is by being welded and fixed setting
In a side surface of cooling fin 8, the other end of fixed pin 14 be fixed at the inside of blind hole 4 and with the side surface of thermally conductive sheet 7
It being in contact, one end outer surface of fixed pin 14 is fixedly installed cooling fin fixed magnet 13, and the one of cooling fin fixed magnet 13
End side surface is in contact with the side surface of cooling fin 8, other end side and the triode adsorption magnet 5 of cooling fin fixed magnet 13
The side of one end be mutually fixed, the both side surface of triode protective shell 6 is all fixedly installed pin 2, one end of pin 2
Fixing tongue 1 is fixedly installed by die casting, the side wall of pin 2, which is fixedly installed, jacks up shrapnel 11, jacks up the another of shrapnel 11
By being welded and fixed the side surface for being arranged on fixing tongue 1, another side surface of fixing tongue 1 is provided with by being welded and fixed at end
Barb tongue piece 12, is fixedly installed pcb board 9 between barb tongue piece 12 and fixing tongue 1, two sides all fixations of pcb board 9 are set
Connection sheet 10 is equipped with, the upper end face of connection sheet 10 is contacted with the lower surface of fixing tongue 1, and the rear surface of connection sheet 10 is with falling
The side surface on the top of hook bolt piece 12 is in contact.
In order to enable more rapid and convenient when cooling fin is installed, in the present embodiment, it is preferred that triode protective shell 6
Blind hole 4 that there are four upper surface fixed settings, the fixed position of blind hole 4 are mutually symmetrical with.
In order to enable the fixed structure of triode is more stablized, in the present embodiment, it is preferred that triode protective shell 6
One side surface is fixedly installed a pin 2, and another side surface of triode protective shell 6 is fixedly installed two pins 2, each
The top of pin 2 is all fixedly installed fixing tongue.
In order to enable triode is more convenient for installing during being mounted on pcb board, in the present embodiment, it is preferred that pin 2
The surface structure of cross section is circular configuration, and the surface structure of fixing tongue 1 is rectangular parallelepiped structure.
The operation principle and process for using of the present invention：The equipment by triode ontology 3 when in use by passing through fixed tongue
Piece 1, barb tongue piece 12 are fixed at the upper surface of pcb board 9 with jacking up shrapnel 11, by connection sheet 10 and fixing tongue 1, connect
The contact with barb tongue piece 12 of contact pin 10 connects circuit, and heat is transmitted to scattered by thermally conductive sheet 7 by fixed pin 14 at runtime
On backing 8, peripherad function of environment heat emission keeps the temperature of triode ontology 3 will not be excessively high, and cooling fin 8 is fixed by cooling fin
Magnet 13 and the mutual absorption of triode adsorption magnet 5 are completed to fix；
Place a thumb on the side of individual pin 2 when needing dismounting, by forefinger and middle finger be placed on there are two draw
The side of foot 2, while scratch fixing tongue 1 with hand and detach triode ontology 3 with pcb board 9, triode ontology 3 and pcb board 9
Cooling fin 8 firmly directly from the side of triode protective shell 6 is taken off after separation, triode ontology 3 is replaced.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of patch triode, including triode ontology (3), it is characterised in that：The outer surface of the triode ontology (3)
Triode protective shell (6) is fixedly installed, the triode protective shell (6), which is bolted, is arranged on triode ontology (3)
Side surface and top surface, the contact position of the triode protective shell (6) and triode ontology (3) be fixedly installed thermally conductive sheet
(7), the upper surface of the triode protective shell (6) is fixedly installed blind hole (4), and the other end of the blind hole (4) runs through three poles
The outer surface of protection of pipe shell (6) reaches the inside of triode protective shell (6), and the top of the blind hole (4) is connected with thermally conductive sheet (7)
It connects, the lateral surface of the blind hole (4) is fixedly installed triode adsorption magnet (5), and triode adsorption magnet (5) fixation is set
Put the inner lateral surfaces in triode protective shell (6), top end surface and the triode protective shell of the triode adsorption magnet (5)
(6) apparent height is consistent, and cooling fin (8), the cooling fin (8) are fixedly installed above the triode protective shell (6)
Side lower face be fixedly installed fixed pin (14), one end of the fixed pin (14) is arranged on heat dissipation by being welded and fixed
One side surface of piece (8), the other end of the fixed pin (14) be fixed at the inside of blind hole (4) and with thermally conductive sheet (7)
Side surface is in contact, and one end outer surface of the fixed pin (14) is fixedly installed cooling fin fixed magnet (13), described to dissipate
One end side surface of backing fixed magnet (13) is in contact with the side surface of cooling fin (8), the cooling fin fixed magnet (13)
Other end side and the side of one end of triode adsorption magnet (5) be mutually fixed, the triode protective shell (6)
Both side surface is all fixedly installed pin (2), and one end of the pin (2) is fixedly installed fixing tongue (1), institute by die casting
The side wall for stating pin (2) is fixedly installed jack-up shrapnel (11), and the other end for jacking up shrapnel (11) is set by being welded and fixed
It puts in the side surface of fixing tongue (1), another side surface of the fixing tongue (1) is provided with barb tongue piece by being welded and fixed
(12), pcb board (9), the both sides of the pcb board (9) are fixedly installed between the barb tongue piece (12) and fixing tongue (1)
Face is all fixedly installed connection sheet (10), and the upper end face of the connection sheet (10) is contacted with the lower surface of fixing tongue (1), institute
The rear surface for stating connection sheet (10) is in contact with the side surface on the top of barb tongue piece (12).
2. a kind of patch triode according to claim 1, it is characterised in that：The upper table of the triode protective shell (6)
Blind hole (4) that there are four face fixed settings, the fixed position of the blind hole (4) are mutually symmetrical with.
3. a kind of patch triode according to claim 1, it is characterised in that：The side of the triode protective shell (6)
There are one pins (2) for surface fixed setting, and another side surface of the triode protective shell (6) is fixedly installed two pins
(2), the top of each pin (2) is fixedly installed fixing tongue (1).
4. a kind of patch triode according to claim 1, it is characterised in that：The appearance of the cross section of the pin (2)
Structure is circular configuration, and the surface structure of the fixing tongue (1) is rectangular parallelepiped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164549.2A CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164549.2A CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108258036A true CN108258036A (en) | 2018-07-06 |
| CN108258036B CN108258036B (en) | 2020-10-30 |
Family
ID=62745397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810164549.2A Active CN108258036B (en) | 2018-02-28 | 2018-02-28 | Patch triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108258036B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116887A (en) * | 2023-09-14 | 2023-11-24 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
| CN117116887B (en) * | 2023-09-14 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045889B2 (en) * | 2001-08-21 | 2006-05-16 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| CN102468254A (en) * | 2010-11-12 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Radiation device combination |
| CN203353032U (en) * | 2012-07-20 | 2013-12-18 | Sma太阳能技术股份公司 | Electronic assembly |
| JP2016082017A (en) * | 2014-10-15 | 2016-05-16 | 株式会社オートネットワーク技術研究所 | Bonding jig and method of manufacturing circuit structure with heat dissipator |
-
2018
- 2018-02-28 CN CN201810164549.2A patent/CN108258036B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045889B2 (en) * | 2001-08-21 | 2006-05-16 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| CN102468254A (en) * | 2010-11-12 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Radiation device combination |
| CN203353032U (en) * | 2012-07-20 | 2013-12-18 | Sma太阳能技术股份公司 | Electronic assembly |
| JP2016082017A (en) * | 2014-10-15 | 2016-05-16 | 株式会社オートネットワーク技術研究所 | Bonding jig and method of manufacturing circuit structure with heat dissipator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116887A (en) * | 2023-09-14 | 2023-11-24 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
| CN117116887B (en) * | 2023-09-14 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108258036B (en) | 2020-10-30 |
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