CN208889642U - A kind of triode of good heat dissipation effect - Google Patents
A kind of triode of good heat dissipation effect Download PDFInfo
- Publication number
- CN208889642U CN208889642U CN201821771821.5U CN201821771821U CN208889642U CN 208889642 U CN208889642 U CN 208889642U CN 201821771821 U CN201821771821 U CN 201821771821U CN 208889642 U CN208889642 U CN 208889642U
- Authority
- CN
- China
- Prior art keywords
- shell
- heat sink
- triode
- dissipation effect
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 230000000694 effects Effects 0.000 title claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 50
- 239000000110 cooling liquid Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 8
- 230000007704 transition Effects 0.000 abstract description 4
- 239000002826 coolant Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of triodes of good heat dissipation effect, including shell, fixed plate is arranged in the cover top portion, the interior of shell is equipped with chip, the chip is located at the top of the first heat sink, first heat sink is located at the top of cooling storehouse, the cooling storehouse bottom is installed by the second heat sink, the chip respectively with emitter, base stage is connected with collector, the utility model can will not cause interior of shell temperature to reduce rapidly by the way that cooling storehouse is arranged when guaranteeing heat dissipation effect, i.e. due to carrying out transition by cooling storehouse between the first heat sink and the second heat sink, and then it avoids when ambient temperature is too low, the temperature in shell is caused rapidly to reduce due to directly contacting between the first heat sink and the second heat sink, and then cause to make wafer damaging repercussions since the temperature of interior of shell is too low, by making outer pin and interior pin point From, and then avoid when welding triode due to the phenomenon that being damaged in the chip short time by a large amount of heat.
Description
Technical field
The utility model relates to triode field more particularly to a kind of triodes of good heat dissipation effect.
Background technique
Triode, full name should be transistor, also referred to as bipolar junction transistor, transistor, be a kind of control electricity
Its effect of the semiconductor devices of stream is small-signal to be zoomed into the biggish electric signal of range value, also serves as noncontacting switch.Three
Pole pipe is one of basic component of semiconductor, has Current amplifier effect, is the core element of electronic circuit.Triode is one
The PN junction of two close proximities is made on block semiconductor substrate, bulk semiconductor is divided into three parts, middle section by two PN junctions
It is base area, two side portions are emitter region and collecting zone, and arrangement mode has PNP and two kinds of NPN.
Triode can generate heat when in use, and if carrying out heat dissipation to triode not in time will result in triode
Internal chip is burned out, while triode is when being welded on circuit board, since emitter, base stage, collector can overheat,
And then partial heat when welding is transmitted in triode, and then chip is be easy to cause to be burned out because heated.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of triodes of good heat dissipation effect, cold by being arranged
But storehouse can will not cause interior of shell temperature to reduce rapidly when guaranteeing heat dissipation effect, i.e., due to the first heat sink and second
Transition is carried out by cooling storehouse between heat sink, and then is avoided when ambient temperature is too low, due to the first heat sink and second
Directly contact causes the temperature in shell rapidly to reduce between heat sink, so cause since the temperature of interior of shell is too low and
Make wafer damaging repercussions, by separating outer pin with interior pin, and then avoids when welding triode due in the chip short time
The phenomenon that being damaged by a large amount of heat.
The technical solution of the utility model is as follows: a kind of triode of good heat dissipation effect, including shell, the cover top portion
Fixed plate is set, and the interior of shell is equipped with chip, and the chip is located at the top of the first heat sink, and first heat sink is located at
At the top of cooling storehouse, the second heat sink is installed in the cooling storehouse bottom, and the chip connects with emitter, base stage and collector respectively
It connects, and the base stage is between the emitter and collector, the emitter includes outer pin and interior pin, described outer to draw
Cavity is equipped with inside foot, and the interior pin is inserted into the cavity, and passes through company between the outer pin and the interior pin
Extension bar connection.
Preferably, the base stage, collector are identical as the structure of emitter, i.e., the described base stage and collector are by interior pin
It is formed with outer pin.
Preferably, first heat sink bottom is equipped with the first cooling fin, is equipped with second at the top of second heat sink and dissipates
Backing.
Preferably, first cooling fin and the second cooling fin are inserted into cooling storehouse, and first cooling fin and
Two cooling fins are interspersed.
Preferably, the emitter, base stage and collector both pass through shell, and between the emitter and shell, base stage
It is close connection between shell, between collector and shell.
It preferably, is in be fixedly connected, and the fixed plate is equipped with circular hole between the fixed plate and shell.
Preferably, the cooling storehouse is filled with coolant liquid.
Using the above scheme, the utility model beneficial effect is:
The utility model can will not cause interior of shell temperature fast by the way that cooling storehouse is arranged when guaranteeing heat dissipation effect
Speed reduces, i.e., due to carrying out transition by cooling storehouse between the first heat sink and the second heat sink, and then avoids when extraneous temperature
When spending low, the temperature in shell is caused rapidly to reduce due to directly contacting between the first heat sink and the second heat sink, into
And cause to make wafer damaging repercussions since the temperature of interior of shell is too low, it is separated by making outer pin with interior pin, and then avoid
When welding triode due to the phenomenon that being damaged in the chip short time by a large amount of heat.
Detailed description of the invention
Fig. 1 is the overall structure figure of the utility model；
Fig. 2 is the utility model emitter schematic diagram of internal structure；
Fig. 3 is the utility model interior of shell structural schematic diagram.
In figure: 1, fixed plate；2, shell；3, emitter；4, base stage；5, collector；6, connecting rod；7, cavity；8, interior to draw
Foot；9, outer pin；10, the first cooling fin；11, the second cooling fin；12, cooling storehouse；13, chip；14, the first heat sink；15,
Two heat sinks.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail；
It is as shown in Figure 1 to Figure 3: a kind of triode of good heat dissipation effect, including shell 2 are present embodiments provided, it is described outer
Fixed plate 1 is set at the top of shell 2, chip 13 is equipped with inside the shell 2, the chip 13 is located at 14 top of the first heat sink, institute
It states the first heat sink 14 and is located at 12 top of cooling storehouse, the second heat sink 15 is installed in 12 bottom of cooling storehouse, and the chip 13 divides
It is not connect with emitter 3, base stage 4 and collector 5, and the base stage 4 is between the emitter 3 and collector 5, the hair
Emitter-base bandgap grading 3 includes outer pin 9 and interior pin 8, is equipped with cavity 7 inside the outer pin 9, and the interior pin 8 is inserted into the cavity 7
It is interior, and connected between the outer pin 9 and the interior pin 8 by connecting rod 6.
The base stage 4, collector 5 are identical as the structure of emitter 3, i.e., the described base stage 4 and collector 5 are by interior pin 8
It is formed with outer pin 9, and then avoids base stage 4, collector 5 and emitter 3 in welding, the most of heat for welding generation can be into
Enter in shell 2.
First heat sink, 14 bottom is equipped with the first cooling fin 10, and then enables the first cooling fin 10 by the first heat dissipation
The heat of plate 14 is dispersed into cooling storehouse 12, and the second cooling fin 11 is equipped at the top of second heat sink 15.
First cooling fin 10 and the second cooling fin 11 are inserted into cooling storehouse 12, and first cooling fin 10 and
Two cooling fins 11 are interspersed, and then convenient for the heat dissipation of the first cooling fin 10 and the heat absorption of the second cooling fin 11.
The emitter 3, base stage 4 and collector 5 both pass through shell 2, and between the emitter 3 and shell 2, base stage 4
It is close connection between collector 5 and shell 2, and then facilitate welding triode between shell 2.
It is in be fixedly connected, and the fixed plate 1 is equipped with circular hole between the fixed plate 1 and shell 2.
The cooling storehouse 12 is filled with coolant liquid, and then cooling storehouse 12 is enable to absorb the heat that the first cooling fin 10 distributes
Amount.
Embodiment
The working principle of the utility model is as follows:
A kind of triode of good heat dissipation effect, in use, when user welds the triode of installation on circuit boards
When connecing, since outer pin 9 is separated with interior pin 8, and then the heat that outer pin 9 absorbs can only have sub-fraction to be transmitted to interior pin
On 8, and then high temperature is fully transmitted on chip 13 by emitter 3, base stage 4 and collector 5 when avoiding welding, and then is avoided
Due to the phenomenon that being damaged in 13 short time of chip by a large amount of heat, when chip 13 is used in long-time and heat is generated
When amount, heat is absorbed by the first heat sink 14, is then dispersed into the coolant liquid in cooling storehouse 12 by the first cooling fin 10, so
The second cooling fin 11 absorbs the heat of coolant liquid in cooling storehouse 12 afterwards, and is shed by the second heat sink 15, and then complete three poles
The heat dissipation of pipe simultaneously because carrying out transition by cooling storehouse 12 between the first heat sink 14 and the second heat sink 15, and then avoids
When ambient temperature is too low, due to directly contacting the temperature caused in shell 2 between the first heat sink 14 and the second heat sink 15
Degree rapidly reduces, and then causes to keep chip 13 impaired since the temperature inside shell 2 is too low.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (7)
1. a kind of triode of good heat dissipation effect, including shell, it is characterised in that: fixed plate is arranged in the cover top portion, described
Interior of shell is equipped with chip, and the chip is located at the top of the first heat sink, and first heat sink is located at the top of cooling storehouse, described
The second heat sink is installed in cooling storehouse bottom, and the chip is connect with emitter, base stage and collector respectively, and the base stage is located at
Between the emitter and collector, the emitter includes outer pin and interior pin, and cavity is equipped with inside the outer pin, and
The interior pin is inserted into the cavity, and is connected between the outer pin and the interior pin by connecting rod.
2. a kind of triode of good heat dissipation effect according to claim 1, it is characterised in that: the base stage, collector and hair
The structure of emitter-base bandgap grading is identical, i.e., the described base stage and collector are made of interior pin and outer pin.
3. a kind of triode of good heat dissipation effect according to claim 1, it is characterised in that: first heat sink bottom is set
There is the first cooling fin, is equipped with the second cooling fin at the top of second heat sink.
4. a kind of triode of good heat dissipation effect according to claim 3, it is characterised in that: first cooling fin and second
Cooling fin is inserted into cooling storehouse, and first cooling fin is interspersed with the second cooling fin.
5. a kind of triode of good heat dissipation effect according to claim 1, it is characterised in that: the emitter, base stage sum aggregate
Electrode both passes through shell, and between the emitter and shell, is close between base stage and shell, between collector and shell
Connection.
6. a kind of triode of good heat dissipation effect according to claim 1, it is characterised in that: between the fixed plate and shell
In being fixedly connected, and the fixed plate is equipped with circular hole.
7. a kind of triode of good heat dissipation effect according to claim 1, it is characterised in that: the cooling storehouse is filled with cooling
Liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821771821.5U CN208889642U (en) | 2018-10-30 | 2018-10-30 | A kind of triode of good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821771821.5U CN208889642U (en) | 2018-10-30 | 2018-10-30 | A kind of triode of good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208889642U true CN208889642U (en) | 2019-05-21 |
Family
ID=66517469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821771821.5U Expired - Fee Related CN208889642U (en) | 2018-10-30 | 2018-10-30 | A kind of triode of good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208889642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729268A (en) * | 2019-09-19 | 2020-01-24 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
-
2018
- 2018-10-30 CN CN201821771821.5U patent/CN208889642U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729268A (en) * | 2019-09-19 | 2020-01-24 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
| CN110729268B (en) * | 2019-09-19 | 2021-04-16 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208889642U (en) | A kind of triode of good heat dissipation effect | |
| CN109979896B (en) | Brand-new IGBT module | |
| CN206807850U (en) | PCB radiator structures based on QFN encapsulation | |
| CN209747503U (en) | Integrated power module radiator | |
| CN208580736U (en) | A kind of stability triode | |
| CN216213419U (en) | Multi-base island silicon carbide power switch tube for chip packaging | |
| CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
| CN207938600U (en) | A kind of insulation-encapsulated large power triode | |
| CN206961816U (en) | A kind of cooling encapsulation triode | |
| CN209249453U (en) | A kind of patch type triode with radiator structure | |
| CN207134359U (en) | A kind of triode | |
| CN210778562U (en) | Vehicle-mounted special triode | |
| CN207474464U (en) | A kind of transistor of fast quick-detach | |
| CN208580732U (en) | A kind of high-temp resistant type triode | |
| CN209183551U (en) | A kind of base stage patch triode | |
| CN208352289U (en) | A kind of encapsulating structure of high-power IGBT chip | |
| CN206164351U (en) | Low voltage and high current mosfet power module | |
| CN207765430U (en) | Diode with heat sinking function | |
| CN209216964U (en) | A kind of heat radiating type patch triode | |
| CN108258036A (en) | A kind of patch triode | |
| CN207303074U (en) | A kind of surface mounting crystal triode | |
| CN205016530U (en) | High stable switch transistor | |
| CN207149562U (en) | A kind of large power triode | |
| CN207217510U (en) | A kind of heat radiating type integrates triode | |
| CN207217518U (en) | A kind of triode of slim long-life |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190521 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |