CN207303074U - A kind of surface mounting crystal triode - Google Patents
A kind of surface mounting crystal triode Download PDFInfo
- Publication number
- CN207303074U CN207303074U CN201721181985.8U CN201721181985U CN207303074U CN 207303074 U CN207303074 U CN 207303074U CN 201721181985 U CN201721181985 U CN 201721181985U CN 207303074 U CN207303074 U CN 207303074U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat sink
- pin
- packaging body
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It the utility model is related to electronic component technology field, more particularly to a kind of surface mounting crystal triode, including packaging body, pin for the installation of connection, heat sink for heat dissipation, the heat sink is arranged at packaging body one side, the pin is inserted in the side that packaging body corresponds to heat sink, the pin is equipped with three, every insertion package interior is connected with frame, conductive chip is connected between each frame, the heat sink is equipped with heat-conducting layer successively close to frame position, heat dissipating layer and insulating layer, the heat sink is equipped with connecting seat away from heat conduction is laminated, the connecting seat is equipped with some radiating grooves；The two-sided thermal trough being equipped with for heat conduction of the heat-conducting layer；The utility model carries out two-sided heat conduction by heat-conducting layer, can effectively improve heat dissipation effect, improves service life.
Description
Technical field
Electronic component technology field is the utility model is related to, more particularly to a kind of surface mounting crystal triode.
Background technology
Triode, full name should be transistor, also referred to as bipolar transistor, transistor, be a kind of control electricity
Its effect of the semiconductor devices of stream is that small-signal is zoomed into the larger electric signal of range value, also serves as noncontacting switch.It is brilliant
Body triode, is one of basic component of semiconductor, has Current amplifier effect, is the core element of electronic circuit.Triode
It is the PN junction that two close proximities are made on a block semiconductor substrate, bulk semiconductor is divided into three parts by two PN junctions, in
Between be partly base, two side portions are launch site and collecting zone, and arrangement mode has two kinds of PNP and NPN.
But used transistor largely encapsulates for direct straight cutting, needed in the assembling process of accessory substantial amounts of
Manpower works to carry out pin shaping, plug-in unit and manual welding, and the waste of manpower is very big, and precision is not also high.Needing high accuracy
Requirement when, be manually less reliable, it is necessary to be welded by chip mounter, it is necessary to allow the structure and chip mounter of triode
It is adapted；But existing manufacture mostly meets use demand；Such as：The problems such as heat-conducting effect is not good enough, and service life is short
In the presence of.
Utility model content
To solve the above problems, the utility model provides one kind carries out two-sided heat conduction by heat-conducting layer, can effectively improve
Heat dissipation effect, improves the surface mounting crystal triode of service life.
Technical solution is used by the utility model：A kind of surface mounting crystal triode, including packaging body, for connection
The pin of installation, for the heat sink of heat dissipation, the heat sink is arranged at packaging body one side, and the pin is inserted in packaging body pair
Answer the side of heat sink, the pin be equipped with three, every insertion package interior be connected with frame, between each frame
Conductive chip is connected with, the heat sink is equipped with heat-conducting layer, heat dissipating layer and insulating layer, the heat sink successively close to frame position
Connecting seat is equipped with away from heat conduction is laminated, the connecting seat is equipped with some radiating grooves；The heat-conducting layer is two-sided to be equipped with for leading
The thermal trough of heat.
Further improvement of these options is that the heat sink is integrally formed with connecting seat.
Further improvement of these options is that the thermal trough is opened up in one kind of crossed grooves, oblique slot or vertical slot.
Further improvement of these options is that the insulating layer is non-conductive fibre film.
Further improvement of these options is that the pin offers some welding grooves away from insertion packaging body one end.
Further improvement of these options is that the heat dissipating layer offers some ventholes.
The beneficial effects of the utility model are：
1st, a kind of surface mounting crystal triode, in a first aspect, being equipped with packaging body, installation protecting effect is played by packaging body,
Protecting effect is good, and for the pin of the installation of connection, welded and installed effect is played by pin, for the heat sink of heat dissipation, leads to
Cross heat sink and heat dissipation effect, good heat dissipation effect are played to the utility model；Second aspect, the heat sink are arranged at packaging body one
Face, plays packaging body heat dissipation effect, good heat dissipation effect, the pin is inserted in packaging body and corresponds to heat sink easy to heat sink
Side, is easily installed welding pin, and convenient welding is easy to use；The third aspect, the pin are equipped with three, every insertion envelope
Dress body is internally connected with frame, and connection effect is played by frame, easy to connect, and conductive core is connected between each frame
Piece, plays conductive effect, conductive effect is good, and using effect is good by conductive chip；Fourth aspect, the heat sink is close to frame
Position is equipped with heat-conducting layer, heat dissipating layer and insulating layer successively, by heat-conducting layer by the heat derives of package interior, passes through heat dissipating layer
Dissipating heat to heat-conducting layer is exported, insulation effect is played by insulating layer, prevents that the utility model is short-circuit, safe effect
It is good；5th aspect, the heat sink are equipped with connecting seat away from heat conduction is laminated, and the connecting seat is equipped with some radiating grooves, passes through
Connecting seat can further improve the heat dissipation effect of the utility model with radiating groove, improve service life；The heat-conducting layer is two-sided
The thermal trough for heat conduction is equipped with, can be further by the heat derives that package interior is sent by dissipating by thermal trough
Backing is dispersed with radiating groove, good heat dissipation effect, improves service life.
2nd, the heat sink and connecting seat are integrally formed, and are integrally formed by die casting, can save manufacture cost, and can
Improve heat dissipation effect.
3rd, the thermal trough is opened up in one kind of crossed grooves, oblique slot or vertical slot, is opened up according to actual use, energy
Heat-conducting effect is enough effectively improved, good heat conduction effect, radiates easy to heat sink, good heat dissipation effect.
4th, the insulating layer is non-conductive fibre film, by using non-conductive fibre film, can effectively play insulation effect, at the same time
With good heat-resisting effect, the security used is improved, improves service life.
5th, the pin offers some welding grooves away from insertion packaging body one end, can effectively be improved by welding groove
The convenience of pin welding, convenient welding, is improved easy to use.
6th, the heat dissipating layer offers some ventholes, and heat dissipating layer can be further improved in packaging body by venthole
The heat dissipation effect in portion, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the internal structure schematic diagram of the utility model；
Fig. 3 is the radiator structure schematic diagram of the utility model.
Attached drawing identifier declaration：Triode 100, packaging body 110, pin 120, welding groove 121, frame 130, heat sink 140,
Heat-conducting layer 141, thermal trough 141a, heat dissipating layer 142, venthole 142a, insulating layer 143, connecting seat 144, radiating groove 145, conduction
Chip 150.
Embodiment
The utility model is further described below in conjunction with attached drawing.
As shown in FIG. 1 to 3, it is respectively the stereogram, internal structure schematic diagram and radiator structure signal of the utility model
Figure.
A kind of surface mounting crystal triode 100, including packaging body 110, for the pin 120 of the installation of connection, for radiating
Heat sink 140, the heat sink 140 is arranged at the one side of packaging body 110, and the pin 120, which is inserted in packaging body 110 and corresponds to, to be dissipated
The side of backing 140, the pin 120 is internally connected with frame 130 equipped with three, every insertion packaging body 110, described each
Conductive chip 150 is connected between frame 130, the heat sink 140 is equipped with heat-conducting layer 141 close to 130 position of frame, dissipates successively
Thermosphere 142 and insulating layer 143, the heat sink 140 are equipped with connecting seat 144, the connecting seat 144 away from 141 one side of heat-conducting layer
Equipped with some radiating grooves 145；The two-sided thermal trough 141a being equipped with for heat conduction of the heat-conducting layer 141.
Heat sink 140 is integrally formed with connecting seat 144, is integrally formed by die casting, can save manufacture cost, and can
Improve heat dissipation effect.
Thermal trough 141a is opened up in one kind of crossed grooves, oblique slot or vertical slot, is opened up according to actual use, can
Heat-conducting effect is effectively improved, good heat conduction effect, radiates easy to heat sink 140, good heat dissipation effect.
Insulating layer 143 is non-conductive fibre film, by using non-conductive fibre film, can effectively play insulation effect, have at the same time
There is good heat-resisting effect, improve the security used, improve service life.
Pin 120 offers some welding grooves 121 away from 110 one end of insertion packaging body, can be effective by welding groove 121
Improve pin 120 weld convenience, convenient welding, improve it is easy to use.
Heat dissipating layer 142 offers some venthole 142a, and it is right to further improve heat dissipating layer 142 by venthole 142a
Heat dissipation effect inside packaging body 110, good heat dissipation effect.
In a first aspect, being equipped with packaging body 110, installation protecting effect is played by packaging body 110, protecting effect is good, is used for
The pin 120 of the installation of connection, welded and installed effect is played by pin 120, for the heat sink 140 of heat dissipation, passes through heat dissipation
Piece 140 plays the utility model heat dissipation effect, good heat dissipation effect；Second aspect, the heat sink 140 are arranged at packaging body
110 one sides, play packaging body 110 heat dissipation effect, good heat dissipation effect, the pin 120 is inserted in encapsulation easy to heat sink 140
Body 110 corresponds to the side of heat sink 140, is easily installed welding pin 120, convenient welding is easy to use；The third aspect, it is described
Pin 120 is internally connected with frame 130 equipped with three, every insertion packaging body 110, plays connection effect by frame 130, even
Connect conveniently, be connected with conductive chip 150 between each frame 130, conductive effect is played by conductive chip 150, it is conductive
Effect is good, and using effect is good；Fourth aspect, the heat sink 140 radiate equipped with heat-conducting layer 141 successively close to 130 position of frame
Layer 142 and insulating layer 143, by heat-conducting layer 141 by the heat derives inside packaging body 110, is driven heat by heat dissipating layer 142
It is dissipated to heat-conducting layer 141 to be exported, insulation effect is played by insulating layer 143, prevents that the utility model is short-circuit, safe effect
It is good；5th aspect, the heat sink 140 are equipped with connecting seat 144 away from 141 one side of heat-conducting layer, and the connecting seat 144 is equipped with some
Radiating groove 145, the heat dissipation effect of the utility model can be further improved by connecting seat 144 and radiating groove 145, improved and used
Service life；The two-sided thermal trough 141a being equipped with for heat conduction of the heat-conducting layer 141, by thermal trough 141a can further by
The heat derives sent inside packaging body 110 are dispersed by heat sink 140 and radiating groove 145, and good heat dissipation effect, raising makes
Use the service life.
Embodiment described above only expresses the several embodiments of the utility model, its description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
- A kind of 1. surface mounting crystal triode, it is characterised in that：Including packaging body, for the pin of the installation of connection, for radiating Heat sink, the heat sink be arranged at packaging body one side, the pin is inserted in the side that packaging body corresponds to heat sink, described Pin is connected with frame equipped with three, every insertion package interior, and conductive chip is connected between each frame, described Heat sink is equipped with heat-conducting layer, heat dissipating layer and insulating layer successively close to frame position, and the heat sink is equipped with away from heat conduction is laminated Connecting seat, the connecting seat are equipped with some radiating grooves；The two-sided thermal trough being equipped with for heat conduction of the heat-conducting layer.
- A kind of 2. surface mounting crystal triode according to claim 1, it is characterised in that：The heat sink and connecting seat one Shaping.
- A kind of 3. surface mounting crystal triode according to claim 1, it is characterised in that：The thermal trough in crossed grooves, tiltedly Opened up to one kind of groove or vertical slot.
- A kind of 4. surface mounting crystal triode according to claim 1, it is characterised in that：The insulating layer is non-conductive fibre Film.
- A kind of 5. surface mounting crystal triode according to claim 1, it is characterised in that：The pin is away from insertion packaging body One end offers some welding grooves.
- A kind of 6. surface mounting crystal triode according to claim 1, it is characterised in that：The heat dissipating layer offers some logical Stomata.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721181985.8U CN207303074U (en) | 2017-09-15 | 2017-09-15 | A kind of surface mounting crystal triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721181985.8U CN207303074U (en) | 2017-09-15 | 2017-09-15 | A kind of surface mounting crystal triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207303074U true CN207303074U (en) | 2018-05-01 |
Family
ID=62441515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721181985.8U Active CN207303074U (en) | 2017-09-15 | 2017-09-15 | A kind of surface mounting crystal triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207303074U (en) |
-
2017
- 2017-09-15 CN CN201721181985.8U patent/CN207303074U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104900609B (en) | Encapsulating structure | |
| CN105870095B (en) | The semiconductor chip package with contact plug at short edge | |
| CN101073151A (en) | Semiconductor package structure having enhanced thermal dissipation characteristics | |
| CN105024003B (en) | Electronic packaging structure and ceramic substrate thereof | |
| CN104766843A (en) | High-power semiconductor package structure capable of being pasted through SMT technology | |
| CN207381382U (en) | Electric power electronic module and power electric component package substrate | |
| CN106783753A (en) | Semiconductor devices | |
| CN207303074U (en) | A kind of surface mounting crystal triode | |
| CN219435850U (en) | MOSFET chip packaging structure | |
| CN109342912A (en) | The frock clamp of SMD surface mount packages device ageing | |
| CN2916930Y (en) | LED light source | |
| CN209249453U (en) | A kind of patch type triode with radiator structure | |
| CN110867835B (en) | Intelligent power module and air conditioner | |
| CN208889642U (en) | A kind of triode of good heat dissipation effect | |
| CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
| CN207303071U (en) | A kind of high-power patch encapsulation triode | |
| CN105280593B (en) | Encapsulation extension is connected for semiconductor device package | |
| CN209183551U (en) | A kind of base stage patch triode | |
| CN206961816U (en) | A kind of cooling encapsulation triode | |
| CN209216964U (en) | A kind of heat radiating type patch triode | |
| CN207938600U (en) | A kind of insulation-encapsulated large power triode | |
| CN207505233U (en) | A kind of novel high-density printed board | |
| CN206432253U (en) | Semiconductor devices | |
| CN202384395U (en) | Potting adhesive power type light-emitting diode (LED) | |
| CN204216023U (en) | A kind of triode with radiating surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 523000 Dongguan, Guangdong, Songshan Lake high tech Industrial Development Zone, New Town Road, 5, hung Ho, 7 A, Long Yi Zhi Valley, A701 Patentee after: Dongguan Nan Jing Electronics Co., Ltd. Address before: 523000 Yi Hongrong high tech Industrial Park, No. 7, Chi Ling Industrial Road, Houjie Town, Dongguan, Guangdong. Patentee before: Dongguan Nan Jing Electronics Co., Ltd. |
|
| CP02 | Change in the address of a patent holder |