CN109342912A - The frock clamp of SMD surface mount packages device ageing - Google Patents
The frock clamp of SMD surface mount packages device ageing Download PDFInfo
- Publication number
- CN109342912A CN109342912A CN201811159320.6A CN201811159320A CN109342912A CN 109342912 A CN109342912 A CN 109342912A CN 201811159320 A CN201811159320 A CN 201811159320A CN 109342912 A CN109342912 A CN 109342912A
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- CN
- China
- Prior art keywords
- main body
- jig main
- surface mount
- frock clamp
- smd
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of frock clamps of SMD surface mount packages device ageing, including jig main body and elastic thimble, the groove for mask placement device is provided at the top of jig main body, clamp device is provided with above groove, clamp device is for fixing and making device radiating surface and jig main body to be in close contact；Jig main body is as radiator, the drain contact of jig main body and device, jig main body electrification；Property thimble the side of jig main body is set, the fixing end of elastic thimble is welded with conducting wire, the free end of elastic thimble and device grids and drain electrode connects；Frock clamp of the present invention greatly improves SMD encapsulation stable state ageing power, SMD-0.5 encapsulation has been increased to 30W from 1W, and SMD-1.0 encapsulation has been increased to 50W from 2W, and SMD-2.0 encapsulation has been increased to 50W from 3W, it, can ageing diode, triode and field-effect tube with good versatility；Installation is simple, high production efficiency；Design is simple, easy processing production；High reliablity, it is at low cost.
Description
Technical field
The invention belongs to surface mount packages device detection fields, and in particular to a kind of tooling of SMD surface mount packages device ageing
Fixture.
Background technique
According to GJB128 " micro semiconductor discrete device test method " method 1039 and 1042 steady state power test determinations, originally
Test is used to reject the device of hidden danger or rejecting those has manufacture to lack hidden device, the failure of these devices and time and stress
Related, without ageing, these devices in normal conditions of use can initial failure.This test makes semiconductor devices in defined item
It is worked under part to disclose electrical failure mode related with time and stress.Stable state function is carried out to SMD surface mount packages device at present
The method of rate test is mainly: small-power ageing, wind-cooling heat dissipating.The test of device steady state power is got over using unit in face of component
Carry out more harsh condition, existing fixture is also increasingly unable to satisfy requirement.Since there is presently no be directed to SMD Surface Mount device in the market
The frock clamp of the high-power ageing of part, designed, designed frock clamp are imperative.
Summary of the invention
In order to solve problems of the prior art, the invention discloses a kind of SMD surface mount packages device is high-power
The frock clamp of steady state test so that SMD surface mount packages device is able to carry out high-power aging test, and presss from both sides test tool
Tool is convenient, easy to operate, and test is safe and reliable, solves the problems, such as that SMD surface mount packages device is difficult to carry out high-power steady state test,
Its use reliability is improved, its production efficiency is promoted.
To achieve the goals above, the technical solution adopted by the present invention is that, the tooling of SMD surface mount packages device ageing is pressed from both sides
Have, including jig main body and elastic thimble, the groove for mask placement device, setting above groove are provided at the top of jig main body
There is clamp device, clamp device is for fixing and making device radiating surface and jig main body to be in close contact；Jig main body is as scattered
The drain contact of hot device, jig main body and device, jig main body electrification；The side of jig main body is arranged in elastic thimble, elasticity
The fixing end of thimble is welded with conducting wire, the free end of elastic thimble and device grids and drain electrode connects.
Jig main body bottom is additionally provided with a bottom plate, and the area of bottom plate is greater than the bottom of frock clamp main body, goes back on bottom plate
It is provided perpendicular to the copper post of bottom plate, pcb board is provided at the top of copper post, pcb board is parallel to bottom plate, opens up on pcb board useful
In the hole for installing elastic thimble.
Pcb board and the fixed elastic thimble of copper post.
Frock clamp main body and bottom plate are integrally formed.
Bottom plate is used with copper post and is threadedly coupled.
The through-hole for fixed heat sink is offered on the bottom plate of jig main body, is fixed on radiator by the through-hole
On water cooling platform.
Clamp device is cover board, and cover board is adopted with jig main body and is bolted connection.
Clamp device is cover board, and one end of cover board is fixedly connected with jig main body, and the other end of cover board connects hasp, wherein
Cover board is elastic material.
The thermal coefficient of jig main body material therefor is not less than the thermal coefficient of aluminium.
Compared with prior art, the present invention at least has the advantages that frock clamp of the present invention greatly improves
SMD encapsulates stable state ageing power, and SMD-0.5 encapsulation has been increased to 30W from 1W, and SMD-1.0 encapsulation has been increased to 50W from 2W,
SMD-2.0 encapsulation has been increased to 50W from 3W, has good versatility, can ageing diode, triode and field-effect tube；
Installation is simple, high production efficiency；Design is simple, easy processing production；High reliablity, it is at low cost.
Further, bottom plate is used for stationary fixture main body and cooling device, while improving heat dissipation effect,
Further, frock clamp main body and bottom plate are integrally formed, and joint gap, good heat dissipation effect is not present.
Further, bottom plate is with copper post using being threadedly coupled, then copper post and pcb board are replaceable.
Further, setting cover board fixes SMD surface mount packages device with jig main body at the top of jig main body, fixed form
It is reliable and stable, and SMD surface mount packages device is not damaged.
Further, SMD surface mount packages device can be close to by setting elastic cover plate with jig main body at the top of jig main body, right
SMD surface mount packages device has protective effect.
Further, the side of jig main body is provided with radiating fin and improves heat-sinking capability.
Further, the thermal coefficient of jig main body material therefor is not less than the thermal coefficient of aluminium, can in time dissipate heat
Out.
Detailed description of the invention
Fig. 1 is the frock clamp perspective view of the explosion of SMD surface mount packages device ageing；
Fig. 2 is the jig main body schematic diagram in SMD surface mount packages device frock clamp；
In attached drawing, 1- clamp device, 2- fixture theme, 3- groove, 4- elasticity thimble, 5-PCB plate, 6- copper post.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
The device of SMD Surface Mount series, chip are all mounted on the pin of drain electrode, so by the way of drain electrode heat dissipation
Stable state ageing power can be effectively improved.
SMD Surface Mount frock clamp radiates in such a way that drain electrode and radiator are in close contact under cover board pressure, SMD table
It pasting and is provided with groove on frock clamp, in the mountable groove of the drain electrode of SMD surface mount packages device, source electrode and grid are prominent,
Elastic thimble withstands source electrode and grid；Radiator is directly contacted with drain electrode, and radiator body electrification is a pole, two elastic thimbles
Welding lead is other the two poles of the earth.
As shown in Figure 1, the frock clamp of SMD surface mount packages device ageing, including jig main body 2 and elastic thimble 4, fixture
The top of main body 2 is provided with the groove for mask placement device, clamp device 1 is provided with above groove, clamp device 1 is for fixing
And it is in close contact device radiating surface and jig main body 2；Jig main body 2 is used as radiator, the drain electrode of jig main body 2 and device
Contact, jig main body 2 charge；The side of jig main body 2 is arranged in elastic thimble 4, and the fixing end of elastic thimble 4, which is welded with, to be led
Line, the free end of elastic thimble 4 and device grids and drain electrode connect, and elastic 4 shell of thimble is welded on PCB, interior needle top
Grid and drain electrode are connected, interior needle bottom welding lead, spring and shell no current flow through；Pcb board 5 and the fixed elastic top of copper post 6
Needle.
Currently preferred clamp device 1 is cover board, and cover board is adopted with jig main body 2 and is bolted connection.
2 bottom of jig main body is additionally provided with a bottom plate, and the area of bottom plate is greater than the bottom of frock clamp main body 2, on bottom plate
It is additionally provided with the copper post 6 perpendicular to bottom plate, the top of copper post 6 is provided with pcb board 5, and pcb board 5 is parallel to bottom plate, opens on pcb board 5
Equipped with the hole for installing elastic thimble 4；The side of jig main body 2 is provided with radiating fin.
Currently preferred, frock clamp main body 2 and bottom plate are using integrated molding.
Bottom plate is used with copper post 6 and is threadedly coupled.
Square groove as shown in Fig. 2, the radiator schematic diagram in SMD surface mount packages device frock clamp, on radiator
For the drain electrode of mask placement device, grid and source electrode form protruding parts.
An explanation is done to present clip with reference to the accompanying drawings and examples；
Ageing seat is elastic thimble,
As shown, the application method that the present invention includes radiator and ageing seat SMD package tool fixture is:
Test device is put into the groove 3 of radiator, drain electrode and concave surface full contact, grid and source electrode and elastic thimble
4 contacts, then with cover board 1 that device and jig main body 2 is fixed, design has corresponding fixation hole, bullet on cover board 1 and jig main body
Property thimble 4 lower weld conducting wire draw grid and source electrode, then jig main body is drain electrode, and three pins of device are drawn
Out, connection equipment can carry out steady state power test, and 2 bottom of jig main body offers the through-hole for fixed heat sink, passes through
Radiator is fixed on water cooling platform by the through-hole, further strengthens heat dissipation effect.
Claims (9)
- The frock clamp of 1.SMD surface mount packages device ageing, which is characterized in that including jig main body (2) and elastic thimble (4), It is provided with the groove for mask placement device at the top of jig main body (2), is provided with clamp device (1), clamp device above groove (1) for fixing and making device radiating surface and jig main body (2) to be in close contact；Jig main body (2) is used as radiator, fixture master The drain contact of body (2) and device, jig main body (2) electrification；Property thimble (4) be arranged in the side of jig main body (2), elastic top The fixing end of needle (4) is welded with conducting wire, the free end of elastic thimble (4) and device grids and drain electrode connects.
- 2. the frock clamp of SMD surface mount packages device according to claim 1, which is characterized in that jig main body (2) bottom It is additionally provided with a bottom plate, the area of bottom plate is greater than the bottom of frock clamp main body (2), is additionally provided on bottom plate perpendicular to bottom plate Copper post (6) is provided with pcb board (5) at the top of copper post (6), and pcb board (5) is parallel to bottom plate, and pcb board offers on (5) for pacifying Fill the hole of elastic thimble (4).
- 3. the frock clamp of SMD surface mount packages device ageing according to claim 2, which is characterized in that pcb board (5) with The fixed elastic thimble of copper post (6).
- 4. the frock clamp of SMD surface mount packages device ageing according to claim 2, which is characterized in that frock clamp master Body (2) and bottom plate are integrally formed.
- 5. the frock clamp of SMD surface mount packages device ageing according to claim 2, which is characterized in that bottom plate and copper post (6) using threaded connection.
- 6. the frock clamp of SMD surface mount packages device ageing according to claim 2, which is characterized in that jig main body (2) Bottom plate on offer through-hole for fixed heat sink, radiator is fixed on water cooling platform by the through-hole.
- 7. the frock clamp of SMD surface mount packages device ageing according to claim 1, which is characterized in that clamp device (1) For cover board, cover board is adopted with jig main body (2) and is bolted connection.
- 8. the frock clamp of SMD surface mount packages device ageing according to claim 1, which is characterized in that clamp device is One end of cover board, cover board is fixedly connected with jig main body (2), and the other end of cover board connects hasp, and cover plate is elastic material.
- 9. the frock clamp of described in any item SMD surface mount packages device ageings according to claim 1~8, which is characterized in that folder The thermal coefficient for having main body (2) material therefor is not less than the thermal coefficient of aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811159320.6A CN109342912A (en) | 2018-09-30 | 2018-09-30 | The frock clamp of SMD surface mount packages device ageing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811159320.6A CN109342912A (en) | 2018-09-30 | 2018-09-30 | The frock clamp of SMD surface mount packages device ageing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109342912A true CN109342912A (en) | 2019-02-15 |
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ID=65307674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811159320.6A Pending CN109342912A (en) | 2018-09-30 | 2018-09-30 | The frock clamp of SMD surface mount packages device ageing |
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| CN (1) | CN109342912A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111337809A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for TO-254/257 packaged power device |
| CN111337810A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for SMD-3 packaged power device |
| CN112345845A (en) * | 2020-09-25 | 2021-02-09 | 华东光电集成器件研究所 | Microminiature encapsulation circuit aging clamp |
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|---|---|---|---|---|
| CN101834544A (en) * | 2010-04-27 | 2010-09-15 | 西安交通大学 | Synchronous rectifying circuit structure for high-frequency switch power supply |
| CN202816878U (en) * | 2012-08-08 | 2013-03-20 | 朝阳无线电元件有限责任公司 | SMD-0.5 electrical aging fixture with heating panel |
| CN103472380A (en) * | 2013-09-17 | 2013-12-25 | 中国振华集团永光电子有限公司 | Burn-in device of ceramic surface mount type encapsulating semiconductor power element |
| CN204028296U (en) * | 2014-07-02 | 2014-12-17 | 上海精密计量测试研究所 | A kind of device for the seasoned test of heavy-duty diode electricity |
| CN204789953U (en) * | 2015-07-20 | 2015-11-18 | 航天科工防御技术研究试验中心 | High -power power module smelts frock always |
| KR20170078457A (en) * | 2015-12-29 | 2017-07-07 | 주식회사 오킨스전자 | Burn-in test socket having wire silicon rubber interposed between contact pin and semiconductor device |
| CN207586266U (en) * | 2017-12-18 | 2018-07-06 | 浙江杭可科技股份有限公司 | A kind of chip package semi-conductor discrete device fixture for testing |
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2018
- 2018-09-30 CN CN201811159320.6A patent/CN109342912A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834544A (en) * | 2010-04-27 | 2010-09-15 | 西安交通大学 | Synchronous rectifying circuit structure for high-frequency switch power supply |
| CN202816878U (en) * | 2012-08-08 | 2013-03-20 | 朝阳无线电元件有限责任公司 | SMD-0.5 electrical aging fixture with heating panel |
| CN103472380A (en) * | 2013-09-17 | 2013-12-25 | 中国振华集团永光电子有限公司 | Burn-in device of ceramic surface mount type encapsulating semiconductor power element |
| CN204028296U (en) * | 2014-07-02 | 2014-12-17 | 上海精密计量测试研究所 | A kind of device for the seasoned test of heavy-duty diode electricity |
| CN204789953U (en) * | 2015-07-20 | 2015-11-18 | 航天科工防御技术研究试验中心 | High -power power module smelts frock always |
| KR20170078457A (en) * | 2015-12-29 | 2017-07-07 | 주식회사 오킨스전자 | Burn-in test socket having wire silicon rubber interposed between contact pin and semiconductor device |
| CN207586266U (en) * | 2017-12-18 | 2018-07-06 | 浙江杭可科技股份有限公司 | A kind of chip package semi-conductor discrete device fixture for testing |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111337809A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for TO-254/257 packaged power device |
| CN111337810A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for SMD-3 packaged power device |
| CN112345845A (en) * | 2020-09-25 | 2021-02-09 | 华东光电集成器件研究所 | Microminiature encapsulation circuit aging clamp |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |
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| RJ01 | Rejection of invention patent application after publication |