CN107204393B - Welding type radiator and chip integrated packaging light source structure - Google Patents
Welding type radiator and chip integrated packaging light source structure Download PDFInfo
- Publication number
- CN107204393B CN107204393B CN201710576051.2A CN201710576051A CN107204393B CN 107204393 B CN107204393 B CN 107204393B CN 201710576051 A CN201710576051 A CN 201710576051A CN 107204393 B CN107204393 B CN 107204393B
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- light source
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- heat dissipation
- radiating
- chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000005493 welding type Methods 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 230000005855 radiation Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to the technical field of LED light sources, and discloses a welding radiator and chip integrated packaging light source structure, which comprises a radiating plate made of metal, a plurality of radiating elements, an LED chip and an insulating shell injection molded outside the radiating plate, wherein one side surface of the radiating plate is provided with a plurality of grooves or through holes for assembling the radiating elements, the other side surface of the radiating plate is provided with a cup cavity, and the surface is provided with a positioning groove connected with the edge of the radiating plate; two contact pins are fixed at the bottom of the cup cavity in an insulating way, the two contact pins are respectively communicated with the anode and the cathode of the LED chip, and the LED chip is fixedly welded in the cup cavity; the inside integrated into one piece of insulating housing has the spliced pole of cover in the contact pin outside, and its tip integrated into one piece has with constant head tank assorted reference column, has solved current heat dissipation structure form singleness, the commonality is poor, heat dispersion is poor and the problem that LED chip's packaging efficiency is low.
Description
Technical Field
The invention relates to the technical field of LED light sources, in particular to a welded radiator and chip integrated packaging light source structure.
Background
With the development of science and technology, the application of the LED solid illumination light source is increasingly wide, and the LED solid illumination light source is increasingly used as the illumination light source. Generally, whether the LED lamp works stably or not and whether the LED lamp is good or not, the heat dissipation of the LED lamp and the lamp body is very important, the heat dissipation of the high-brightness LED lamp in the market usually adopts natural heat dissipation, and the effect is not ideal. The LED lamp manufactured by the LED light source consists of an LED, a heat radiation structure, a driver and a lens, so that heat radiation is also an important part, and if the LED cannot radiate well, the service life of the LED can be influenced.
The current LED lighting device is generally composed of a heat radiation body, an aluminum substrate, lamp beads, a PC cover and a power supply, has great limitation in use, and mainly has the following problems: firstly, an LED light source is directly welded on an aluminum substrate, the aluminum substrate is fixed on a lamp radiator, and a customer cannot self-maintain the light source and the power supply which need to be replaced; secondly, the packaging of the LED lamp beads in the prior art is poor in heat dissipation performance due to structural limitation, and the unit area light efficiency and the unit area power are low, so that the requirements of an LED device cannot be met, and the service life of the LED lamp is short.
The existing technology can greatly increase the heat radiation effect of the LED lamp by adopting the heat radiation structure aiming at the problems, but on one hand, the existing heat radiation structure is fixed, the heat radiation form is single, the heat radiation structure cannot be flexibly adjusted and arranged according to LED chips with different power, and the LED chips with different power need to be correspondingly provided with different moulds for injection molding, so that the universality is poor, the flexibility is poor, and the production cost of the LED lamp is higher; on the other hand, the existing LED chip adopts an integrated radiator, has low packaging efficiency and high adaptability requirement on packaging equipment.
Disclosure of Invention
In order to solve the technical problems, the invention provides a welding type radiator and chip integrated packaging light source structure so as to achieve the purposes of improving the radiating efficiency, optimizing the radiating structure of an LED lamp to realize the universality and the flexibility of the radiating structure and improving the packaging efficiency of an LED chip, and solve the problems of single radiating structure form, poor universality, poor radiating performance and low packaging efficiency of the LED chip.
In order to achieve the technical effects, the technical scheme provided by the invention is as follows: the welding type radiator and chip integrated packaging light source structure is characterized by comprising a radiating plate made of metal, a plurality of radiating elements, an LED chip and an insulating shell injection molded outside the radiating plate, wherein one side surface of the radiating plate is provided with a plurality of grooves or through holes for assembling the radiating elements, the other side surface of the radiating plate is provided with a cup cavity, and the surface of the radiating plate is provided with a positioning groove connected with the edge of the radiating plate; two contact pins are fixed at the bottom of the cup cavity in an insulating way, the two contact pins are respectively communicated with the anode and the cathode of the LED chip, and the LED chip is fixedly welded in the cup cavity; the inside integrated into one piece of insulating casing has the spliced pole of cover in the contact pin outside, and its tip integrated into one piece has the reference column with constant head tank assorted.
Further, the heat dissipation element is provided as a heat dissipation column; and a through hole matched with the heat dissipation column is formed in one side surface of the heat dissipation plate.
Further, the heat dissipation element is a circular shell with two open ends, and a plurality of heat dissipation holes which are uniformly distributed along the circumferential direction of the circular shell are formed in the side wall of the circular shell; an annular groove matched with the circular shell is formed in one side surface of the heat radiating plate.
Further, the heat dissipation element is set to be a special-shaped heat dissipation plate, and a groove matched with the special-shaped heat dissipation plate is formed in one side surface of the heat dissipation plate.
Further, a plurality of buckles corresponding to the heat dissipation plate are integrally formed at the end edge of the insulating shell.
Further, the buckle comprises a clamping plate and a clamping column, and the surface of the clamping plate is abutted against the surface of the heat dissipation plate; the clamping plates and the clamping columns are symmetrically arranged at the center of the heat dissipation plate.
Further, the ends of the two pins are respectively provided with a bonding pad, and the bonding pads are connected with the LED chip in a welding way.
Further, the end part of the positioning groove extends to the edge of the cup cavity, a chip packaging cup cavity connected with the positioning column is integrally formed in the cup cavity, and the LED chip is sealed in the chip packaging cup cavity by glue filling.
Further, the cup cavity is positioned in the middle of the surface of the heat dissipation plate.
Further, the heat dissipation element is made of metal, and is fixed by welding after being assembled with the heat dissipation plate.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the metal radiator packaging structure formed by forming the radiating plate on the packaging structure at one time, the LED chip is directly fixed on the surface of the radiating plate, the bracket and the PCB are removed, the thermal resistance is reduced to one layer, the heat conduction efficiency is greatly improved, meanwhile, the structure has a large radiating area, good air convection can be formed, and heat can be rapidly radiated; compared with the existing LED light source, the LED light source has longer service life;
2. the heat dissipation element is assembled on the heat dissipation plate and fixed in a welding mode, the heat dissipation element adjusts the arrangement quantity and the length according to the power of the LED chips, and the LED chips with different powers do not need to be correspondingly provided with a plurality of sets of dies, so that the LED light source structure is good in universality and high in flexibility compared with the existing LED light source structure;
and 3. The LED chip is directly packaged in the cup cavity of the radiating plate, the packaging efficiency is higher than that of the LED light source of the existing integrated radiator, the existing packaging equipment can be used universally, and the production cost is reduced.
Drawings
Fig. 1 is a schematic diagram of an overall structure of an embodiment of a soldered heat spreader and chip integrated package light source structure according to the present invention;
fig. 2 is a schematic diagram of a split structure of an embodiment of a soldered heat spreader and chip integrated package light source structure according to the present invention;
FIG. 3 is a schematic diagram illustrating an assembly of a heat dissipating plate and a heat dissipating component in a first embodiment of a soldering heat sink and chip integrated package light source structure according to the present invention;
fig. 4 is a schematic diagram of the overall structure of a second embodiment of a soldered heat sink and chip integrated package light source structure according to the present invention;
fig. 5 is an assembly schematic diagram of a heat dissipation plate and a heat dissipation element in a second embodiment of a welded heat sink and chip integrated package light source structure provided by the present invention;
fig. 6 is a schematic structural diagram of a heat dissipating element in a second embodiment of a soldered heat spreader and chip integrated package light source structure provided by the present invention;
fig. 7 is a schematic diagram of the overall structure of a third embodiment of a soldered heat sink and chip integrated package light source structure according to the present invention;
fig. 8 is an assembly schematic diagram of a heat dissipation plate and a heat dissipation element in a third embodiment of a welded heat sink and chip integrated package light source structure provided by the present invention;
fig. 9 is a schematic structural diagram of a heat dissipating element in a third embodiment of a soldered heat spreader and chip integrated package light source structure provided by the present invention;
fig. 10 is a schematic structural diagram of an insulating housing in the structure of the integrated package light source of the soldering heat sink and the chip provided by the invention.
Detailed Description
The invention is described in further detail below in connection with specific embodiments, and the following text is intended to illustrate the invention and not to limit the scope of the invention.
As shown in fig. 1-3, the present invention may be embodied as a first embodiment in the following manner: the welding type radiator and chip integrated packaging light source structure comprises a radiating plate 1 made of metal, a plurality of radiating elements, an LED chip 2 and an insulating shell 3 which is injection molded outside the radiating plate 1, wherein the radiating elements are uniformly distributed around the center of the radiating plate 1, and the radiating elements are provided with radiating columns 4 matched with the through holes; a through hole matched with the heat dissipation column 4 is formed in one side surface of the heat dissipation plate 1, a cup cavity 5 is formed in the other side surface of the heat dissipation plate 1, a positioning groove 14 connected with the edge of the heat dissipation plate 1 is formed in the surface of the heat dissipation plate, and the positioning groove 14 is used for fixing the position of the heat dissipation plate 1 relative to the insulating shell 3; on the other hand, the arrangement of the positive and negative electrode positions of the pins 6 is positioned, so that the LED light source is ensured to be quickly and correctly connected with other parts; two pins 6 are fixed at the bottom of the cup cavity 5 in an insulating way, the two pins 6 are respectively communicated with the anode and the cathode of the LED chip 2, the LED chip 2 is fixedly welded in the cup cavity 5, and heat of the LED chip 2 is directly dissipated by contacting with the heat dissipation plate 1; the inside integrated into one piece of insulating housing 3 has the spliced pole 7 of cover in contact pin 6 outside, and spliced pole 7 cladding is in contact pin 6 outside, and the open end of insulating housing 3 is stretched out to the tip of spliced pole 7, and insulating housing 3's tip integrated into one piece has the reference column 8 with constant head tank 14 assorted. Preferably, the heat dissipation post is made of metal, and is fixed by welding after being assembled with the heat dissipation plate 1.
As shown in fig. 4-6, the present invention can be implemented as a second embodiment in the following manner: the heat dissipation element is a circular shell 9 with two open ends, a plurality of heat dissipation holes 10 which are uniformly distributed along the circumferential direction of the circular shell 9 are formed in the side wall of the circular shell 9, and the number of the heat dissipation holes 10 and the size of the holes can be correspondingly adjusted according to the power of the LED chip 2; an annular groove matched with the circular shell 9 is formed in one side surface of the heat radiation plate 1; preferably, the circular shell 9 is made of metal, and the circular shell 9 is assembled with the heat dissipation plate 1 and fixed by welding; the circular shells 9 can be provided with two circular shells 9 which are sleeved together along the same axis.
As shown in fig. 7-9, the present invention can be implemented as a third embodiment in the following manner: the heat dissipation element is set as a special-shaped heat dissipation fin 11, a groove matched with the special-shaped heat dissipation fin 11 is formed on one side surface of the heat dissipation plate 1, and the number and the length of the special-shaped heat dissipation fin 11 can be correspondingly set according to the power of the LED chip 2; preferably, the special-shaped cooling fin 11 is made of metal, and the special-shaped cooling fin 11 is assembled with the cooling plate 1 and fixed by welding; the special-shaped cooling fin 11 adopts a shape similar to a plurality of bends, and the shape is bent into a W shape so as to increase the cooling contact area with air.
In the first, second and third embodiments, as shown in fig. 10, a plurality of buckles corresponding to the heat dissipation plate 1 are integrally formed on the end edge of the insulating housing 3. The buckle comprises a clamping plate 12 and a clamping column 13, the surface of the clamping plate 12 is abutted against the surface of the heat dissipation plate 1, and the clamping plate 12 is used for fixing the heat dissipation plate 1; the clamping plates 12 and the clamping columns 13 are symmetrically arranged at the center of the heat dissipation plate 1, and the clamping columns 13 are used for clamping connection between the LED light source structure and other external components.
The ends of the two pins 6 are respectively provided with a bonding pad, the bonding pads are connected with the LED chip 2 in a welded mode, and the LED chip 2 is conducted through the outside of the end of the pin 6 extending out of the inserting column 7, so that the normal work of the LED light source is realized.
The end part of the positioning groove 14 extends to the edge of the cup cavity 5, a chip packaging cup cavity 15 connected with the positioning column 8 is integrally formed in the cup cavity 5, and the LED chip 2 is sealed in the chip packaging cup cavity 15 by glue filling; the chip packaging cup cavity 15 and the positioning column 8 are integrally formed, the height of the chip packaging cup cavity 15 is larger than the depth of the cup cavity 5, the chip packaging cup cavity 15 can assist in die bonding and welding of the LED chip 2 in the cup cavity 5 to be more stable, and the position of the heat dissipation plate 1 can be assisted to be fixed.
Preferably, the cup cavity 5 is located in the middle of the surface of the heat dissipation plate 1, so that on one hand, the installation of the LED light source and other components is facilitated, and the use universality of the LED light source is realized; on the other hand, the heat radiating elements can be uniformly distributed on the heat radiating plate 1 around the positions of the LED chips 2, and the heat radiating uniformity and the high efficiency of the LED light source are facilitated.
The manufacturing process of the invention is as follows:
providing a radiating plate 1 and a plurality of radiating elements made of metal, reasonably arranging and installing the radiating plate 1 and the radiating elements through the power of the LED chip 2, fixing the radiating plate 1 and the radiating elements in a welding mode, putting the assembled radiating plate 1 and radiating elements into a customized mold, closing the mold, performing injection molding on the mold, and after forming a product, fixedly welding the LED chip 2 into a cup cavity 5 of the radiating plate 1, and performing glue filling and sealing in an integrally formed chip packaging cup cavity 15.
Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present disclosure, and the present disclosure is intended to be covered by the present disclosure. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The welding type radiator and chip integrated packaging light source structure is characterized by comprising a radiating plate made of metal, a plurality of radiating elements, an LED chip and an insulating shell injection molded outside the radiating plate, wherein one side surface of the radiating plate is provided with a plurality of grooves or through holes for assembling the radiating elements, the other side surface of the radiating plate is provided with a cup cavity, and the surface of the radiating plate is provided with a positioning groove connected with the edge of the radiating plate; two contact pins are fixed at the bottom of the cup cavity in an insulating way, the two contact pins are respectively communicated with the anode and the cathode of the LED chip, and the LED chip is fixedly welded in the cup cavity; the insulation shell is internally and integrally formed with a plug post sleeved outside the contact pin, and the end part of the insulation shell is integrally formed with a positioning post matched with the positioning groove; the heat dissipation element is made of metal, and is fixed by welding after being assembled with the heat dissipation plate.
2. The solder heat sink and chip integrated package light source structure of claim 1, wherein the heat sink element is provided as a heat sink post; and a through hole matched with the heat dissipation column is formed in one side surface of the heat dissipation plate.
3. The welding type radiator and chip integrated packaging light source structure according to claim 1, wherein the radiating element is a circular shell with two open ends, and a plurality of radiating holes uniformly distributed along the circumferential direction are formed in the side wall of the circular shell; an annular groove matched with the circular shell is formed in one side surface of the heat radiating plate.
4. The structure of claim 1, wherein the heat dissipation element is a W-shaped heat sink, and a groove matching the W-shaped heat sink is formed on a surface of one side of the heat dissipation plate.
5. The solder heat sink and chip integrated package light source structure of claim 1, wherein a plurality of snaps corresponding to the heat spreader plate are integrally formed at an end edge of the insulating housing.
6. The welded radiator and chip integrated package light source structure according to claim 5, wherein the fastener comprises a clamping plate and a clamping column, and the surface of the clamping plate is abutted against the surface of the radiating plate; the clamping plates and the clamping columns are symmetrically arranged at the center of the heat dissipation plate.
7. The welded radiator and chip integrated package light source structure according to claim 1, wherein the ends of the two pins are provided with bonding pads, and the bonding pads are welded and connected with the LED chip.
8. The structure of claim 1, wherein the end of the positioning groove extends to the edge of the cup cavity, a chip packaging cup cavity connected with the positioning post is integrally formed in the cup cavity, and the LED chip is encapsulated in the chip packaging cup cavity by glue filling.
9. The solder heat sink and chip integrated package light source structure of claim 1, wherein the cup cavity is located in the middle of the surface of the heat sink plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710576051.2A CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710576051.2A CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
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| Publication Number | Publication Date |
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| CN107204393A CN107204393A (en) | 2017-09-26 |
| CN107204393B true CN107204393B (en) | 2023-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710576051.2A Active CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207458990U (en) * | 2017-11-20 | 2018-06-05 | 湖南粤港模科实业有限公司 | The encapsulating structure of LED light source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009205834A (en) * | 2008-02-26 | 2009-09-10 | Ichikoh Ind Ltd | Lighting fixture for vehicle |
| CN202032322U (en) * | 2011-01-19 | 2011-11-09 | 南京吉山光电科技有限公司 | High-efficiency white light source structure |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| CN105674224A (en) * | 2016-03-30 | 2016-06-15 | 朱衡 | Light source and lens integrated structure of plug type LED chip heat radiator |
| CN207149578U (en) * | 2017-07-14 | 2018-03-27 | 湖南粤港模科实业有限公司 | A kind of welded radiator and chip integrative packaging light-source structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070235739A1 (en) * | 2006-03-31 | 2007-10-11 | Edison Opto Corporation | Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same |
| US20080089072A1 (en) * | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
| US9651240B2 (en) * | 2013-11-14 | 2017-05-16 | Cree, Inc. | LED lamp |
| US10161621B2 (en) * | 2015-06-23 | 2018-12-25 | Abl Ip Holding Llc | In-grade light fixture |
| US10317068B2 (en) * | 2015-12-14 | 2019-06-11 | Lg Electronics Inc. | Light source module |
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2017
- 2017-07-14 CN CN201710576051.2A patent/CN107204393B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009205834A (en) * | 2008-02-26 | 2009-09-10 | Ichikoh Ind Ltd | Lighting fixture for vehicle |
| CN202032322U (en) * | 2011-01-19 | 2011-11-09 | 南京吉山光电科技有限公司 | High-efficiency white light source structure |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| CN105674224A (en) * | 2016-03-30 | 2016-06-15 | 朱衡 | Light source and lens integrated structure of plug type LED chip heat radiator |
| CN207149578U (en) * | 2017-07-14 | 2018-03-27 | 湖南粤港模科实业有限公司 | A kind of welded radiator and chip integrative packaging light-source structure |
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