CN107204393A - A kind of welded radiator and chip integrative packaging light-source structure - Google Patents
A kind of welded radiator and chip integrative packaging light-source structure Download PDFInfo
- Publication number
- CN107204393A CN107204393A CN201710576051.2A CN201710576051A CN107204393A CN 107204393 A CN107204393 A CN 107204393A CN 201710576051 A CN201710576051 A CN 201710576051A CN 107204393 A CN107204393 A CN 107204393A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- chip
- welded
- source structure
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000000565 sealant Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to the technical field of LED/light source, disclose a kind of welded radiator and chip integrative packaging light-source structure, including the heat sink being made of metal, multiple heat dissipation elements, LED chip and outside heat sink injection molding insulation shell, one side surface of the heat sink offers multiple grooves or through hole for being used to assemble the heat dissipation element, and another side surface offers the locating slot offered on glass chamber and the surface with heat sink side edge；The bottom insulation of the cup chamber is fixed with two contact pins, and two contact pins are connected with the both positive and negative polarity of the LED chip respectively, and LED chip die bond is welded on a glass intracavitary；The inside of the insulation shell is integrally formed with the inserting column being placed on outside contact pin, and its end is integrally formed with the locating dowel matched with locating slot, solve single existing radiator structure form, poor universality, heat dispersion difference and LED chip packaging efficiency it is low the problem of.
Description
Technical field
The present invention relates to the technical field of LED/light source, in particular it relates to a kind of welded radiator envelope integrated with chip
Fill light-source structure.
Background technology
With the development of science and technology, LED solid light sources are also more next as lighting source using increasingly extensive
It is more.In general, whether LED work stable, the quality of quality, is radiated in itself with lamp body most important, the height of in the market
The radiating of brightness LED, usually using natural heat dissipation, effect is unsatisfactory.The LED lamp that LED/light source is made, by LED, radiating
Structure, driver, lens composition, therefore radiating is also a part and parcel, if LED can not radiate very well, its life-span
Also can be impacted.
Current LED light device is typically to be made up of radiator, aluminium base, lamp bead, PC covers, power supply, and it is used with very
Big limitation, is primarily present problems with：One is that LED/light source is directly welded on aluminium base, and aluminium base is fixed on lamp radiating
On device, client can not carry out self-maintain to the light source and power supply for needing to change；Two be prior art LED lamp pearl encapsulation due to
Its structure is limited, and heat dispersion is poor, and unit area light efficiency and power are relatively low, it is impossible to meets the requirement of LED matrix, causes
The service life of LED is shorter.
The radiating that existing prior art regarding to the issue above can greatly increase LED lamp by using radiator structure is imitated
Really, but on the one hand, existing radiator structure is fixed, heat-removal modalities are single, it is impossible to for the LED chip of different capacity size
Flexible modulation and position arrangement are carried out to radiator structure, the LED chip needs correspondence of different capacity offers different moulds and entered
Row injection molding, poor universality, very flexible cause the production cost of LED lamp higher；On the other hand, existing LED chip
Use integrated radiator form, its packaging efficiency is low, and the suitability to sealed in unit requires high.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of welded radiator and chip integrative packaging light source knot
Structure realizes its versatility and flexibility to reach improving heat radiation efficiency, optimization heat dissipation structure of LED lamp and improves LED chip
The purpose of packaging efficiency, solves single existing radiator structure form, poor universality, heat dispersion difference and LED chip
The problem of packaging efficiency is low.
In order to realize above-mentioned technique effect, technical scheme provided by the present invention is：A kind of welded radiator and chip
Integrative packaging light-source structure, it is characterised in that including the heat sink being made of metal, multiple heat dissipation elements, LED chip and
The insulation shell of injection molding outside heat sink, a side surface of the heat sink, which is offered, multiple to be used to assemble the radiating
The groove or through hole of element, another side surface offer the positioning offered on glass chamber and the surface with heat sink side edge
Groove；The bottom insulation of the cup chamber is fixed with two contact pins, and two contact pins are connected with the both positive and negative polarity of the LED chip respectively, and
LED chip die bond is welded on a glass intracavitary；The inside of the insulation shell is integrally formed with the inserting column being placed on outside contact pin, and its end
Portion is integrally formed with the locating dowel matched with locating slot.
Further, the heat dissipation element is set to thermal column；Offered and thermal column on one side surface of the heat sink
The through hole matched.
Further, the heat dissipation element is set to offer on the circular shell of both ends open, the side wall of circular shell many
It is individual along the equally distributed heat emission hole of its circumferential direction；Offer what is matched with circular shell on one side surface of the heat sink
Annular groove.
Further, the heat dissipation element be set to offer on special-shaped fin, a side surface of the heat sink with it is different
The groove that shape fin matches.
Further, the end edge of the insulation shell is integrally formed with the multiple buckles corresponding with heat sink.
Further, the buckle includes clamp and card column, and the surface of the clamp and the surface of heat sink offset；Institute
The Central Symmetry that clamp and card column are stated both with respect to heat sink is set.
Further, the end of two contact pins is equipped with pad, and pad is welded to connect with the LED chip.
Further, the end of the locating slot extends to the edge of glass chamber, and cup intracavitary integrally formed with it is described fixed
The connected chip package cup chamber of position post, chip package cup intracavitary sealant pouring and sealing has the LED chip.
Further, the cup chamber is located at the middle part of radiating plate surface.
Further, the heat dissipation element is made of metal, and after the assembling of heat dissipation element and heat sink and passes through welding
It is fixed.
Compared to prior art, the beneficial effects of the invention are as follows：
1. the present invention is encapsulated by designing heat sink disposal molding on encapsulating structure with the metal heat sink of formation
Structure, the direct die bond of LED chip removes support and PCB in the surface of heat sink, reduces thermal resistance to one layer, greatly improves heat
Conduction efficiency, meanwhile, the structure has big area of dissipation, can form good cross-ventilation, can be with Quick diffusing heat；
There is longer service life relative to existing LED/light source；
2. the heat dissipation element of the present invention is assemblied on heat sink, and is fixed heat dissipation element by way of welding, radiate
Element is adjusted according to the watt level of LED chip to arrangement quantity and length, and the LED chip of different capacity need not be corresponded to
Many molds are prepared, the universal good, flexibility relative to existing LED light source structure is high；
3.LED chip direct packages are in the cup intracavitary of heat sink, and packaging efficiency is than existing integrated radiator LED/light source
It is more efficient, production cost can be reduced with general existing sealed in unit.
Brief description of the drawings
Fig. 1 is the welded radiator and entirety in the embodiment one of chip integrative packaging light-source structure that the present invention is provided
Structural representation；
Fig. 2 is the welded radiator and fractionation in the embodiment one of chip integrative packaging light-source structure that the present invention is provided
Structural representation；
Fig. 3 is the welded radiator and radiating in the embodiment one of chip integrative packaging light-source structure that the present invention is provided
The assembling schematic diagram of plate and heat dissipation element；
Fig. 4 is the welded radiator and entirety in the embodiment two of chip integrative packaging light-source structure that the present invention is provided
Structural representation；
Fig. 5 is the welded radiator and radiating in the embodiment two of chip integrative packaging light-source structure that the present invention is provided
The assembling schematic diagram of plate and heat dissipation element；
Fig. 6 is the welded radiator and radiating in the embodiment two of chip integrative packaging light-source structure that the present invention is provided
The structural representation of element；
Fig. 7 is the welded radiator and entirety in the embodiment three of chip integrative packaging light-source structure that the present invention is provided
Structural representation；
Fig. 8 is the welded radiator and radiating in the embodiment three of chip integrative packaging light-source structure that the present invention is provided
The assembling schematic diagram of plate and heat dissipation element；
Fig. 9 is the welded radiator and radiating in the embodiment three of chip integrative packaging light-source structure that the present invention is provided
The structural representation of element；
Figure 10 is the knot of welded radiator and insulation shell in chip integrative packaging light-source structure that the present invention is provided
Structure schematic diagram.
Embodiment
The present invention is further described in detail with reference to specific embodiment, following word is intended to indicate that this hair
Protection domain that is bright, being not intended to limit the present invention.
As shown in Figure 1-Figure 3, the embodiment one that the present invention can be as follows：A kind of welded radiator and chip one
Body packaged light source structure, including be made of metal heat sink 1, multiple heat dissipation elements, LED chip 2 and outside heat sink 1
The insulation shell 3 of portion's injection molding, each described heat dissipation element is uniformly distributed around the center of heat sink 1, and the heat dissipation element is set
For the thermal column 4 matched with the through hole；Offered on one side surface of the heat sink 1 and leading to that thermal column 4 matches
Hole, another side surface offers the locating slot 14 offered on glass chamber 5 and the surface with the side edge of heat sink 1, locating slot 14
On the one hand it is used to the position to heat sink 1 relative to insulation shell 3 be fixed；On the other hand, to the both positive and negative polarity position of contact pin 6
Arrangement is positioned, it is ensured that LED/light source is quickly correctly being connected with miscellaneous part；The bottom insulation of the cup chamber 5 is fixed with
Two contact pins 6, two contact pins 6 are connected with the both positive and negative polarity of the LED chip 2 respectively, and the die bond of LED chip 2 is welded on glass chamber 5
Interior, the heat of LED chip 2 is directly radiated by contacting heat sink 1；The inside of the insulation shell 3 is integrally formed with set
Inserting column 7 outside contact pin 6, inserting column 7 is coated on the outside of contact pin 6, and the open end of insulation shell 3 is stretched out in the end of inserting column 7,
And the end of insulation shell 3 is integrally formed with the locating dowel 8 matched with locating slot 14.As preferred, the thermal column is adopted
It is made of metal, and after thermal column and heat sink 1 are assembled and by being welded and fixed.
As Figure 4-Figure 6, the embodiment two that the present invention can be as follows：The heat dissipation element is set to both ends open
Circular shell 9, offer on the side wall of circular shell 9 multiple along the equally distributed heat emission hole 10 of its circumferential direction, heat emission hole
10 quantity and the big I of perforate carry out corresponding adjustment according to the watt level of LED chip 2 and set；The one of the heat sink 1
The annular groove matched with circular shell 9 is offered on side surface；It is used as preferred, the use of the circular shell 9 metal system
Into, and after circular shell 9 and heat sink 1 are assembled and by being welded and fixed；The circular shell 9 can be provided with two and two circles
Housing 9 is nested together along same axle center.
As shown in figs. 7 to 9, the embodiment three that the present invention can be as follows：The heat dissipation element is set to special-shaped radiating
The groove matched with special-shaped fin 11, similarly, special-shaped fin are offered on piece 11, a side surface of the heat sink 1
11 arrangement quantity and length can accordingly be set according to the watt level of LED chip 2；It is used as preferred, the abnormity
After fin 11 is made of metal, and special-shaped fin 11 is assembled with heat sink 1 and by being welded and fixed；The abnormity radiating
Piece 11 is using the shape similar to many places bending, and the shape bending is in W type shapes, to increase the radiating contact area with air.
In above example one, embodiment two and embodiment three, as shown in Figure 10, the end edge of the insulation shell 3
Edge is integrally formed with the multiple buckles corresponding with heat sink 1.The buckle includes clamp 12 and card column 13, the clamp 12
Surface and the surface of heat sink 1 offset, and clamp 12 realizes the fixation of heat sink 1；The clamp 12 and card column 13 both with respect to
The Central Symmetry of heat sink 1 is set, and card column 13 is used for LED light source structure and is connected with outside other components progress clamping.
The end of two contact pins 6 is equipped with pad, and pad is welded to connect with the LED chip 2, and LED chip 2 passes through
Contact pin 6 stretches out the outside of the end of inserting column 7 and carries out circuit turn-on, realizes the normal work of LED/light source.
The end of the locating slot 14 extends to the edge of glass chamber 5, and in cup chamber 5 integrally formed with the locating dowel 8
Sealant pouring and sealing has the LED chip 2 in connected chip package cup chamber 15, chip package cup chamber 15；The chip package cup chamber
15 are integrally formed with locating dowel 8, and the height of chip package cup chamber 15 is more than the depth of cup chamber 5, realizes chip package cup chamber
15, which can aid in the die bond welding in cup chamber 5 of LED chip 2, more consolidates, and can also aid in that the position of heat sink 1 is fixed.
As preferred, the cup chamber 5 is located to the middle part on the surface of heat sink 1, on the one hand, be easy to LED/light source and other
The installation of part, realizes the use versatility of LED/light source；On the other hand, heat dissipation element can be achieved equal around the position of LED chip 2
It is even to be distributed on heat sink 1, be conducive to the heat dissipation uniformity and high efficiency of LED/light source.
The manufacturing process of the present invention is as follows：
One heat sink 1 and multiple heat dissipation elements being made of metal is provided, by the watt level of LED chip 2, will be radiated
Plate 1 is carried out after rationally arrangement installation with heat dissipation element, is fixed heat sink 1 and heat dissipation element by way of welding, then will dress
The heat sink 1 and heat dissipation element prepared is placed into the mould of customization, and mould, which is closed, is molded into modeling, is formed after product, by LED chip 2
Carry out die bond to be welded in the cup chamber 5 of heat sink 1, by being filled in described integrally formed chip package cup chamber 15
Glue is sealed.
Any one skilled in the art the invention discloses technical scope in, can readily occur in change or
Replace, should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the guarantor described in claim
Shield scope is defined.
Claims (10)
1. a kind of welded radiator and chip integrative packaging light-source structure, it is characterised in that including dissipating for being made of metal
Hot plate, multiple heat dissipation elements, LED chip and outside heat sink injection molding insulation shell, the side of the heat sink
Surface offers multiple grooves or through hole for being used to assemble the heat dissipation element, and another side surface is offered on glass chamber and the surface
Offer the locating slot with heat sink side edge；The bottom insulation of the cup chamber is fixed with two contact pins, two contact pin difference
Connected with the both positive and negative polarity of the LED chip, and LED chip die bond is welded on a glass intracavitary；The insulation shell inside one into
Type has the inserting column being placed on outside contact pin, and its end is integrally formed with the locating dowel matched with locating slot.
2. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
Heat dissipation element is set to thermal column；The through hole matched with thermal column is offered on one side surface of the heat sink.
3. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
Heat dissipation element is set to offer on the circular shell of both ends open, the side wall of circular shell multiple to be uniformly distributed along its circumferential direction
Heat emission hole；The annular groove matched with circular shell is offered on one side surface of the heat sink.
4. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
Heat dissipation element is set to offer the groove matched with special-shaped fin on special-shaped fin, a side surface of the heat sink.
5. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
The end edge of insulation shell is integrally formed with the multiple buckles corresponding with heat sink.
6. welded radiator according to claim 5 and chip integrative packaging light-source structure, it is characterised in that described
Buckle includes clamp and card column, and the surface of the clamp and the surface of heat sink offset；The clamp and card column both with respect to
The Central Symmetry of heat sink is set.
7. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
The end of two contact pins is equipped with pad, and pad is welded to connect with the LED chip.
8. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
The end of locating slot extends to the edge of glass chamber, and cup intracavitary is integrally formed with the chip package cup being connected with the locating dowel
Chamber, chip package cup intracavitary sealant pouring and sealing has the LED chip.
9. welded radiator according to claim 1 and chip integrative packaging light-source structure, it is characterised in that described
Cup chamber is located at the middle part of radiating plate surface.
10. welded radiator and chip integrative packaging light-source structure according to any one in claim 1-4, its
It is characterised by, the heat dissipation element is made of metal, and after heat dissipation element and heat sink are assembled and by being welded and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710576051.2A CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710576051.2A CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107204393A true CN107204393A (en) | 2017-09-26 |
| CN107204393B CN107204393B (en) | 2023-05-30 |
Family
ID=59911728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710576051.2A Active CN107204393B (en) | 2017-07-14 | 2017-07-14 | Welding type radiator and chip integrated packaging light source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107204393B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095542A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070235739A1 (en) * | 2006-03-31 | 2007-10-11 | Edison Opto Corporation | Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same |
| US20080089072A1 (en) * | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
| JP2009205834A (en) * | 2008-02-26 | 2009-09-10 | Ichikoh Ind Ltd | Lighting fixture for vehicle |
| CN202032322U (en) * | 2011-01-19 | 2011-11-09 | 南京吉山光电科技有限公司 | High-efficiency white light source structure |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| US20150131293A1 (en) * | 2013-11-14 | 2015-05-14 | Cree, Inc. | Led lamp |
| CN105674224A (en) * | 2016-03-30 | 2016-06-15 | 朱衡 | Light source and lens integrated structure of plug type LED chip heat radiator |
| US20160377280A1 (en) * | 2015-06-23 | 2016-12-29 | Abl Ip Holding Llc | In-grade light fixture |
| US20170167714A1 (en) * | 2015-12-14 | 2017-06-15 | Lg Electronics Inc. | Light source module |
| CN207149578U (en) * | 2017-07-14 | 2018-03-27 | 湖南粤港模科实业有限公司 | A kind of welded radiator and chip integrative packaging light-source structure |
-
2017
- 2017-07-14 CN CN201710576051.2A patent/CN107204393B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070235739A1 (en) * | 2006-03-31 | 2007-10-11 | Edison Opto Corporation | Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same |
| US20080089072A1 (en) * | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
| JP2009205834A (en) * | 2008-02-26 | 2009-09-10 | Ichikoh Ind Ltd | Lighting fixture for vehicle |
| CN202032322U (en) * | 2011-01-19 | 2011-11-09 | 南京吉山光电科技有限公司 | High-efficiency white light source structure |
| CN203503699U (en) * | 2013-10-14 | 2014-03-26 | 长兴科迪光电有限公司 | SMD-based LED packaging structure |
| US20150131293A1 (en) * | 2013-11-14 | 2015-05-14 | Cree, Inc. | Led lamp |
| US20160377280A1 (en) * | 2015-06-23 | 2016-12-29 | Abl Ip Holding Llc | In-grade light fixture |
| US20170167714A1 (en) * | 2015-12-14 | 2017-06-15 | Lg Electronics Inc. | Light source module |
| CN105674224A (en) * | 2016-03-30 | 2016-06-15 | 朱衡 | Light source and lens integrated structure of plug type LED chip heat radiator |
| CN207149578U (en) * | 2017-07-14 | 2018-03-27 | 湖南粤港模科实业有限公司 | A kind of welded radiator and chip integrative packaging light-source structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095542A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107204393B (en) | 2023-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103206683B (en) | LED3D curved surface lead frame of light-emitting device | |
| CN201363572Y (en) | LED light source module | |
| CN201820758U (en) | LED integrated structure with cooling device | |
| CN203273818U (en) | LED (light-emitting diode) bulb | |
| JP2015528191A (en) | General-purpose LED bulb construction method, clamp ring structure LED bulb, and LED lamp | |
| WO2012003699A1 (en) | Led integrated structure and manufacturing method thereof | |
| CN201741711U (en) | Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure | |
| WO2012003700A1 (en) | Manufacturing method of led integrated structure | |
| CN207149578U (en) | A kind of welded radiator and chip integrative packaging light-source structure | |
| CN107204393A (en) | A kind of welded radiator and chip integrative packaging light-source structure | |
| CN103982788B (en) | A kind of omnirange LED ball bulb | |
| CN2938416Y (en) | High power LED of packed by metal casing | |
| CN205979632U (en) | Integrated LED lamp | |
| CN201927592U (en) | Drive circuit packaging structure for LED lighting device | |
| CN103807622B (en) | Lighting device | |
| CN107256922B (en) | Aluminum foil type radiator and chip packaging integrated light source structure | |
| CN109659418A (en) | LED upside-down mounting integration packaging mould group | |
| CN105570733B (en) | A kind of LED module and LED point light source light fixture | |
| CN207149583U (en) | A kind of aluminum foil type radiator and chip package integrated optical source structure | |
| CN205657084U (en) | Light -emitting diode structure and emitting diode bulb | |
| CN103090338A (en) | Driver component and method for manufacturing same | |
| CN103765096B (en) | Headlamp | |
| CN206130793U (en) | LED headlamp | |
| CN206130601U (en) | Light -emitting diode (LED) bulb lamp | |
| KR101021944B1 (en) | Heat sink for lighting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |