CN205657084U - Light -emitting diode structure and emitting diode bulb - Google Patents
Light -emitting diode structure and emitting diode bulb Download PDFInfo
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- CN205657084U CN205657084U CN201620339444.2U CN201620339444U CN205657084U CN 205657084 U CN205657084 U CN 205657084U CN 201620339444 U CN201620339444 U CN 201620339444U CN 205657084 U CN205657084 U CN 205657084U
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- emitting diode
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- light
- backlight unit
- diode chip
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- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 238000004020 luminiscence type Methods 0.000 claims description 5
- 239000011295 pitch Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 2
- 239000007787 solid Substances 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model relates to a light -emitting diode structure and adopt the emitting diode bulb of this kind of light -emitting diode structure. Wherein, the light -emitting diode structure adopt two -sidedly or the solid brilliant mode of multiaspect luminous in order to realize the wide -angle, wherein emitting diode support set up emitting diode chip that the alar part passed the positive back of base plate of heat dispersion and/or emitting diode support with the increase on base plate length direction derangement in order to prevent that heat from concentrating. Moreover the positive back of base plate of emitting diode support can be provided with bowl cup structure, also may not set up bowl cup structure, and the emitting diode chip can adopt the routing connected mode, also can adopt the flip -chip connected mode. Therefore, the utility model discloses a light -emitting diode structure can have advantages such as heat conduction heat dispersion preferred.
Description
Technical field
This utility model relates to LED technology field, particularly relates to a kind of package structure for LED and sends out
Optical diode bulb.
Background technology
Light emitting diode (Light-emitting Diode, LED) is a kind of can to convert electrical energy into consolidating of visible ray
State semiconductor device, it directly can be converted into light electric energy.Owing to LED light source has the features such as energy-conservation, life-span length, environmental protection,
Determining LED is the more satisfactory light source substituting conventional light source, and tool has been widely used.
And in the application of LED, inevitably relate to many LED chip encapsulation technology and obtain with making required
LED encapsulation structure, the easy inhibition and generation, cost degradation, high performance and the user that the most how to realize LED encapsulation structure easily use
It it is the problem that each manufacturer is actively studied at present.
Utility model content
In view of this, the purpose of this utility model essentially consists in a kind of package structure for LED of proposition and employing should
Plant the light emitting diode bulb of package structure for LED.
Specifically, a kind of package structure for LED that an embodiment of the present utility model proposes, including luminous two
Pole pipe holder, multiple light-emitting diode chip for backlight unit and packaging body.Wherein, described LED support include substrate, insulating part,
First electrode and the second electrode, described substrate includes main part and extends laterally at least one wing of formation from described main part
Portion, described insulating part arranges around described main part and forms the on the first surface and second surface of described main part respectively
One bowl structure and the second bowl structure, at least one alar part described is positioned at described first bowl structure and described second bowl knot
The outside of structure, described first electrode and described second electrode all stretch into described first bowl structure and described second bowl structure
Internal.The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit and the second light-emitting diode chip for backlight unit, described
One light-emitting diode chip for backlight unit is fixed on described first surface and the electrical connection of the described main part of described first bowl inside configuration
Described first electrode and described second electrode, described second light-emitting diode chip for backlight unit is fixed on described second bowl inside configuration
The described second surface of described main part and electrically connect described first electrode and described second electrode.Described packaging body includes first
Packaging body and the second packaging body, be filled in described first bowl structure respectively and described second bowl structure is interior to be covered each by
State the first light-emitting diode chip for backlight unit and described second light-emitting diode chip for backlight unit.
In an embodiment of the present utility model, described first light-emitting diode chip for backlight unit connects described first by routing
Electrode and described second electrode and described first packaging body also cover described first light-emitting diode chip for backlight unit and described first electrode
And the metal connecting line between described second electrode, described second light-emitting diode chip for backlight unit by routing connect described first electrode and
Described second electrode and described second packaging body also cover described second light-emitting diode chip for backlight unit and described first electrode and described
Metal connecting line between second electrode.
In an embodiment of the present utility model, described substrate, described first electrode and described second electrode are punching
Molded part, and described insulating part and described substrate, described first electrode and described second electrode Unitary injection formed form institute
State LED support.
In an embodiment of the present utility model, each described alar part of described first light emitting diode is in described main body
First first light-emitting diode chip for backlight unit that length on the length direction in portion arranges not less than the length direction along described main part
And the spacing between the last first light-emitting diode chip for backlight unit.
In an embodiment of the present utility model, the first type surface of each described alar part and/or side surface are formed
Groove.
In an embodiment of the present utility model, described first electrode and described second electrode lay respectively at described main body
The two ends in portion and all offer installation through hole on described main part mutually insulated, described first electrode and described second electrode.
In an embodiment of the present utility model, described first light-emitting diode chip for backlight unit and described second light emitting diode
Chip is Heterogeneous Permutation on the length direction of described main part.
In an embodiment of the present utility model, the arrangement mode of described first light-emitting diode chip for backlight unit is described master
It is gradually reduced to the arrangement pitches at two ends from middle on the length direction of body.
In an embodiment of the present utility model, the described first surface of described main part and described second surface are respectively
Being formed with the die bond platform of projection, described first light-emitting diode chip for backlight unit and described second light-emitting diode chip for backlight unit are separately fixed at
On corresponding die bond platform.
Furthermore, an embodiment of the present utility model also proposes a kind of light emitting diode bulb, including: lamp holder, printing opacity lamp
Cover, stem stem and at least one any one package structure for LED aforementioned.Described transparent lamp shade and described stem stem and institute
State the fixing connection of lamp holder, and described package structure for LED is fixed on described stem stem.
In an embodiment of the present utility model, described package structure for LED tilts to install by described alar part
It is fixed on described stem stem.
In an embodiment of the present utility model, described package structure for LED passes through described first electrode and institute
State the installation through hole on the second electrode to tilt to be fixed on described stem stem.
Additionally, a kind of package structure for LED that another embodiment of the present utility model proposes, including luminous two
Pole pipe holder, multiple light-emitting diode chip for backlight unit and packaging body.Wherein, described LED support includes the first bowl knot
Structure, the second bowl structure, the first electrode and the second electrode, described first electrode and described second electrode all stretch into described first
Bowl structure and the inside of described second bowl structure.The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit
With the second light-emitting diode chip for backlight unit, described first light-emitting diode chip for backlight unit is fixed on the bottom of described first bowl structure and passes through
Routing connects described first electrode and described second electrode, and described second light-emitting diode chip for backlight unit is fixed on described second bowl knot
The bottom of structure and connect described first electrode and described second electrode by routing, described first light-emitting diode chip for backlight unit is with described
Second light-emitting diode chip for backlight unit is Heterogeneous Permutation on the length direction of described first bowl structure and described second bowl structure.Institute
State packaging body and include that the first packaging body and the second packaging body, described first packaging body are filled in described first bowl structure to cover
Cover described first light-emitting diode chip for backlight unit and described first light-emitting diode chip for backlight unit and described first electrode and described second electrode
Between metal connecting line, described second packaging body is filled in described second bowl structure to cover described second light emitting diode
Metal connecting line between chip and described second light-emitting diode chip for backlight unit and described first electrode and described second electrode.
In an embodiment of the present utility model, described first electrode, described second electrode, described first bowl structure
It is integrated sinter molding structure with described second bowl structure.
It addition, a kind of package structure for LED that another embodiment of the present utility model proposes, including luminous two
Pole pipe holder, multiple light-emitting diode chip for backlight unit and packaging body.Wherein, described LED support includes substrate, is arranged on
The first electrode on the first surface of described substrate and the second electrode and the on second surface on the substrate is set
Three electrodes and the 4th electrode.The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit and the second light-emitting diodes
Die, described first light-emitting diode chip for backlight unit is fixing on the first surface and electrically connect described first electrode and described the
Two electrodes, described second light-emitting diode chip for backlight unit is fixed on described second surface and electrically connects described 3rd electrode and described
Four electrodes, described first light-emitting diode chip for backlight unit misplaces along the length direction of described substrate with described second light-emitting diode chip for backlight unit
Arrangement.Described packaging body includes the first packaging body and the second packaging body, is covered each by described first light-emitting diode chip for backlight unit and institute
State the second light-emitting diode chip for backlight unit.
In an embodiment of the present utility model, described first light-emitting diode chip for backlight unit is positioned at described first electrode and institute
State between the second electrode and routing connects described first electrode and described second electrode；Described first packaging body also covers described
Metal connecting line between one light-emitting diode chip for backlight unit and described first electrode and described second electrode.
In an embodiment of the present utility model, described first light-emitting diode chip for backlight unit upside-down mounting connects described first electrode
With described second electrode.
From the foregoing, it will be observed that this utility model embodiment can reach following one or more beneficial effect: 1) use multiaspect solid
It is luminous that the most two-sided die bond of crystalline substance can reach wide-angle；2) material declines with the technical need of support, can effectively reduce cost；3)
Structure is firmer, and user is easily assembled to and transports conveniently；And 4) heat conduction/heat dispersion strengthened.
By the detailed description below with reference to accompanying drawing, other side of the present utility model and feature become obvious.But should
When knowing, this accompanying drawing is only the purpose design rather than the restriction as scope of the present utility model explained.Also should know
Road, unless otherwise noted, it is not necessary to scale accompanying drawing, they only try hard to structure described herein is described conceptually.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail.
Figure 1A be a kind of package structure for LED of proposing of embodiment of the present utility model complete bonding wire and
Fill the perspective view before packaging body.
Figure 1B is the front view after completing bonding wire and filling packaging body of the package structure for LED shown in Figure 1A.
Fig. 2 be further embodiment of the present utility model propose a kind of package structure for LED complete bonding wire and
Fill the perspective view before packaging body.
Fig. 3 A, 3B and 3C are the three-dimensional knot of the various package structure for LED that other embodiments of this utility model propose
Structure schematic diagram.
Fig. 4 is the front view of a kind of package structure for LED that another embodiment of the present utility model proposes.
Fig. 5 is the front view of a kind of package structure for LED that another embodiment of the present utility model proposes.
Fig. 6 is the light emitting diode of a kind of package structure for LED that an embodiment of the present utility model proposes
The substrate of support and the perspective view of electrode.
Fig. 7 is that the stereochemical structure of a kind of LED support mass-production plate that an embodiment of the present utility model proposes is shown
It is intended to.
Fig. 8 is the perspective view of a kind of light emitting diode bulb that an embodiment of the present utility model proposes.
Fig. 9 is that the sectional perspective structure of the another kind of light emitting diode bulb that an embodiment of the present utility model proposes is shown
It is intended to.
Figure 10 is the vertical of a kind of package structure for LED without alar part of embodiment proposition of the present utility model
Body structural representation.
Figure 11 A and 11B is the light emitting diode envelope of a kind of structure without bowl that an embodiment of the present utility model proposes
The top view of assembling structure and front view.
Figure 12 A and 12B is the another kind light emitting diode without bowl structure of embodiment proposition of the present utility model
The top view of encapsulating structure and front view.
Detailed description of the invention
Understandable for enabling above-mentioned purpose of the present utility model, feature and advantage to become apparent from, below in conjunction with the accompanying drawings to this
The detailed description of the invention of utility model is described in detail.
Refer to Figure 1A and Figure 1B, the one two-sided solid crystal illuminating diode envelope that an embodiment of the present utility model proposes
Assembling structure 10 includes: LED support (LED Leadframe) 11, light-emitting diode chip for backlight unit 131,133 and packaging body
151、153。
Wherein, LED support 11 includes substrate 111, insulating part 113 and electrode 115,117.Substrate 111 includes
Main part 1111 and main body 1111 extend laterally the alar part 1113 of formation, and alar part 1113 sets up the phase at main part 1111 separately
To both sides.Insulating part 113 arrange around main part 1111 and main part 1111 the most respectively formed bowl knot
Structure 1131 and bowl structure 1133.Electrode 115,117 lays respectively at the two ends of main part 1111 and all stretches into bowl structure 1131
And the inside of bowl structure 1133.Alar part 1113 is positioned at the outside of bowl structure 1131,1133.
The front of the main part 1111 that light-emitting diode chip for backlight unit 131 is fixed in bowl structure 1131 and being connected by routing
To electrode 115,117.The back side of the main part 1111 that light emitting diode 133 is fixed in bowl structure 1133 and by routing even
It is connected to electrode 115,117.Further, it is appreciated that from Figure 1B: light-emitting diode chip for backlight unit 131 and light-emitting diode chip for backlight unit 133 are along master
Length direction (horizontal direction in the such as Figure 1B) Heterogeneous Permutation of body 1111, is staggered the most up and down；So can have
Effect prevents heat concentration.
It is interior with covering luminousing diode chip 131 and light-emitting diodes tube core that packaging body 151 is filled in bowl structure 1131
Metal connecting line between sheet 131 and electrode 115,117；Similarly, send out to cover in packaging body 153 is filled in bowl structure 1133
Metal connecting line between luminous diode chip 133 and light-emitting diode chip for backlight unit 133 and electrode 115,117.So, can strengthen
Electric connection stability between electrode 115,117 and light-emitting diode chip for backlight unit 131,133.Herein, packaging body 151,153 is such as
For fluorescent glue.
Preferably, in the embodiment shown in Figure 1A and Figure 1B, substrate 111 and electrode 115,117 are punch forming part, and
And insulating part 113 forms LED support 11 with substrate 111 and electrode 115,117 Unitary injection formed；So, electrode
115,117 formed a fixed connection with substrate 111 and insulating part 113 is mutually electrically insulated with substrate 111 by insulating part 113.
Herein, the material for example, metal of substrate 111 and electrode 115,117, and the material of insulating part 113 for example, plastics.Certainly, exist
In other embodiments, the material of substrate 111 can also select transparent material.
In the embodiment shown in Figure 1A and Figure 1B, owing to being the two-sided die bond structure of employing, therefore
Its production procedure used may is that Certainly, its production procedure can also be: Understanding additionally, combine the structure shown in Figure 1A and Figure 1B, in process of production, during the bonding wire of front, light emitting diode props up
The back side bowl structure 1133 of frame 11 can provide stable support, and the metal contact wires that during bonding wire of the back side, front bonding wire completes can
Protect via front bowl structure 1131；Additionally, needed for electrode 115,117 and alar part 1113 can provide sinking path and bonding wire
Heat.
Referring to Fig. 2, in other embodiments, the size of the alar part 1113 of substrate 111 can being increased to provide bigger
Biography/sinking path, the performance of heat radiation.Specifically, as in figure 2 it is shown, alar part 1113 is at the length direction of main part 1111
On length L equal to main part 1111 length direction front arrangement first light-emitting diode chip for backlight unit 131H with the last send out
Spacing between luminous diode chip 131T, length L the most herein can also be more than the length direction front of main part 1111
Spacing between first light-emitting diode chip for backlight unit 131H and the last light-emitting diode chip for backlight unit 131T of arrangement.
Refer to Fig. 3 A, 3B and 3C, in other embodiments, it is also possible to increase the specific surface area of alar part 1113 to provide relatively
Big biography/sinking path, the performance of heat radiation.Specifically, in figure 3 a, first type surface (namely front and the back of the body of alar part 1113
Face) on be formed with groove 11131；Furthermore, electrode 115,117 is respectively formed with installation through hole 1151,1171.In figure 3b,
Groove 11133 it is formed with on the side of alar part 1113.In fig. 3 c, the first type surface of alar part 1113 is formed with groove 11131 and side
Face is formed with groove 11133.
Refer to Fig. 4, in other embodiments, the luminescence in the front of the main part 1111 being fixed in bowl structure 1131
Diode chip for backlight unit 131 is not limited to the equidistant arrangement shown in Figure 1B on the length direction of main part 1111, it is also possible to according to dissipating
Heat demand carries out irregular alignment, and centre certainly the most as shown in Figure 4 is gradually reduced to the arrangement pitches at two ends, namely arranges close
Degree is gradually increased to two ends from middle.Similarly, the luminescence two at the back side of the main part 1111 being fixed in bowl structure 1133
Pole die 133 is not limited to the equidistant arrangement shown in Figure 1B on the length direction of main part 1111, it is also possible to according to heat radiation
Demand carries out irregular alignment, and centre certainly the most as shown in Figure 4 is gradually reduced to the arrangement pitches at two ends.
Refer to Fig. 5, in other embodiments, be fixed on light-emitting diode chip for backlight unit 131 He in the front of main part 1111
The light-emitting diode chip for backlight unit 133 at the back side being fixed on main part 1111 be not limited to shown in Fig. 2 and Fig. 4 along main part 1111
Length direction Heterogeneous Permutation, it is also possible to as shown in Figure 5 the most just to arrangement and the light-emitting diode chip for backlight unit 131/ on each surface
133 carry out irregular alignment according to radiating requirements on the length direction of main part 1111, the most as shown in Figure 5 from middle to
The arrangement pitches at two ends is gradually reduced.Further, it is to be appreciated that for avoiding hot concentration phenomenon further, it is also possible to allow main body
The light-emitting diode chip for backlight unit 131 in front, portion 1111 and the light-emitting diode chip for backlight unit 133 at main part 1111 back side are at main part 1111
Width (direction of vertical paper in such as Fig. 5) upper the most staggered.
Referring to Fig. 6, it is the substrate in a kind of LED support that an embodiment of the present utility model proposes
Perspective view with electrode.As shown in Figure 6, the front of the main part of substrate 111 is formed with the die bond platform of projection
11112, correspondingly in follow-up encapsulation process, light-emitting diode chip for backlight unit 131 can be fixed on die bond platform 11112.Similarly,
The back side of the main part of substrate 111 is also formed with the firmware platform (not indicating in Fig. 6) of projection, and in follow-up encapsulation process
In, light-emitting diode chip for backlight unit 133 can be fixed on the die bond platform at the back side.
Referring to Fig. 7, it is a kind of LED support mass-production plate that an embodiment of the present utility model proposes
Perspective view.In the figure 7, LED support mass-production plate includes multiple array arrangement and the luminescence linked together
Diode support 11.So, LED support 11 is used to carry out in two-sided die bond encapsulation process, can be by shown in Fig. 7
LED support mass-production plate is loaded directly on the reeded heat conduction transmission track of formation and carries out die bond, routing and some glue etc.
Packaging technology, it is also possible to LED support mass-production plate is first placed on reeded heat conduction and carries to refill in the class and be loaded onto transmission rail
The packaging technologies such as die bond, routing and some glue are carried out to avoid transmission track directly to contact generation pollution with mass-production plate on road.
Referring to Fig. 8, it is the three-dimensional knot of a kind of light emitting diode bulb that an embodiment of the present utility model proposes
Structure schematic diagram.In fig. 8, light emitting diode bulb 80 includes: lamp holder 81, transparent lamp shade 83, stem stem 85 and one or more
It is connected as the package structure for LED 87 of filament, transparent lamp shade 83 and stem stem 85 are fixing with lamp holder 81, and each conduct
The package structure for LED 87 of filament is fixed on stem stem 85.In the present embodiment, stem stem 85 is each luminescence two
Pole pipe encapsulating structure 87 provides and is mechanically fixed and power supply, and each package structure for LED 87 is respectively by electrode
Through hole is installed tilt to be fixed on stem stem 85, and preferably stem stem 85 selects transparent material；As for LED package
The concrete structure of structure 87 may refer to the structure shown in aforementioned Figure 1A to Fig. 5, does not repeats them here.
Refer to Fig. 9, in other embodiments, as the package structure for LED of filament in light emitting diode bulb
The 87 installation through holes being not limited to by being formed on electrode are mechanically fixed with stem stem, it would however also be possible to employ alar part realizes
With fixing of stem stem, such as, shown in Fig. 9, each package structure for LED 87 tilts to be fixed on frustum by its alar part
The hollow heating column 851 of shape, and hollow heating column 851 is as the composition part of stem stem.Here, hollow heating column 851 is preferably
Select transparent material.Additionally, from Fig. 9 it has also been found that: each package structure for LED 87 can also be only in one side
Alar part is set, and is not limited to aforesaid bilateral and alar part is set.
Refer to Figure 10, in other embodiments, the light-emitting diodes in package structure for LED of the present utility model
Pipe holder 11 also can be not provided with alar part.Specifically, as shown in Figure 10, LED support 11 include bowl structure 1131,
1133 and electrode 115,117, light-emitting diode chip for backlight unit 131 is fixed on the bottom by routing even of front bowl structure 1131
Being connected to the electrode 115,117 stretched within bowl structure 1131, light-emitting diode chip for backlight unit 133 is fixed on back side bowl structure 1133
Bottom and be connected to the electrode 115,117 stretched within bowl structure 1133 by routing.Light-emitting diode chip for backlight unit 131 and sending out
Luminous diode chip 133 is Heterogeneous Permutation on the length direction of substrate 11, namely arrangement or left and right are staggered alternatively up and down.Allusion quotation
Type ground, bowl structure 1131,1133 is ceramic material, and correspondingly, electrode 115,117 and bowl structure 1131,1133 are integrated
Sinter molding structure.
It addition, in other embodiments, package structure for LED of the present utility model also can be not provided with bowl structure
And alar part.Specifically, such as shown in Figure 11 A and Figure 11 B, the LED support 11 of package structure for LED includes base
Plate 111, the front of substrate 111 is provided with electrode 115a and 117a, and the back side of substrate 111 is also equipped with the electrode being similar to.Luminous
Diode chip for backlight unit 131 is fixed on the front of substrate 111 and is connected to electrode 115a and 117a, light-emitting diode chip for backlight unit by routing
133 back sides being fixed on substrate 111 and be connected to the electrode at the back side by routing, light-emitting diode chip for backlight unit 131 and light-emitting diodes
Die 133 is along the length direction Heterogeneous Permutation of substrate 111.Packaging body 151 covering luminousing diode chip 131 and light-emitting diodes
Metal connecting line between die 131 and electrode 115a, 117a, packaging body 153 covering luminousing diode chip 133 and luminous two
Metal connecting line between pole die 133 and corresponding electrode.Additionally, can also learn from Figure 11 A, light-emitting diode chip for backlight unit
131 between electrode 115a and electrode 117a；Of course, it should be understood that light-emitting diode chip for backlight unit 133 is in too
Between two electrodes on substrate back.
The most such as shown in Figure 12 A and Figure 12 B, the LED support 11 of package structure for LED includes substrate
111, the front of substrate 111 is provided with electrode 115a and 117a, and the back side of substrate 111 is also equipped with the electrode being similar to.Luminous two
Pole die 131 is fixed on front and upside-down mounting (flip chip) connection electrode 115a and 117a, the light emitting diode of substrate 111
Chip 133 is fixed on the back side and the electrode of upside-down mounting linker back of substrate 111, light-emitting diode chip for backlight unit 131 and luminous two
Pole die 133 is along the length direction Heterogeneous Permutation of substrate 111.Packaging body 151 covering luminousing diode chip 131 and luminous two
Pole die 131, packaging body 153 covering luminousing diode chip 133.
Finally it is worth mentioning that, package structure for LED of the present utility model is not limited to aforesaid two-sided solid
Brilliant, it is also possible to be the die bond on more than two sides.Furthermore, any one die bond surface of LED support is not limited to aforementioned
It is arranged with a line light-emitting diode chip for backlight unit, it is also possible to be to be arranged with multirow light-emitting diode chip for backlight unit.
The above, be only preferred embodiment of the present utility model, not this utility model is made any in form
Restriction, although this utility model is disclosed above with preferred embodiment, but is not limited to this utility model, any ripe
Know professional and technical personnel, in the range of without departing from technical solutions of the utility model, when in the technology of available the disclosure above
Hold and make a little change or be modified to the Equivalent embodiments of equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent variations and modification above example made according to technical spirit of the present utility model, the most still
Belong in the range of technical solutions of the utility model.
Claims (17)
1. a package structure for LED, including LED support, multiple light-emitting diode chip for backlight unit and packaging body；
It is characterized in that,
Described LED support includes substrate, insulating part, the first electrode and the second electrode, described substrate include main part and
Extend laterally at least one alar part of formation from described main part, described insulating part is arranged and described master around described main part
The first bowl structure and the second bowl structure, at least one alar part described is formed respectively on the first surface of body and second surface
It is positioned at described first bowl structure and the outside of described second bowl structure, described first electrode and described second electrode all stretch into
Described first bowl structure and the inside of described second bowl structure；
The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit and the second light-emitting diode chip for backlight unit, described first
Light-emitting diode chip for backlight unit is fixed on described first surface and the electrical connection institute of the described main part of described first bowl inside configuration
Stating the first electrode and described second electrode, described second light-emitting diode chip for backlight unit is fixed on the institute of described second bowl inside configuration
State the described second surface of main part and electrically connect described first electrode and described second electrode；And
Described packaging body includes the first packaging body and the second packaging body, is filled in described first bowl structure and described second respectively
To be covered each by described first light-emitting diode chip for backlight unit and described second light-emitting diode chip for backlight unit in bowl structure.
2. package structure for LED as claimed in claim 1, it is characterised in that described first light-emitting diode chip for backlight unit leads to
Cross routing described first electrode of connection and described second electrode and described first packaging body also covers described first light emitting diode
Metal connecting line between chip and described first electrode and described second electrode, described second light-emitting diode chip for backlight unit passes through routing
Connect described first electrode and described second electrode and described second packaging body also cover described second light-emitting diode chip for backlight unit with
Metal connecting line between described first electrode and described second electrode.
3. package structure for LED as claimed in claim 1, it is characterised in that described substrate, described first electrode and
Described second electrode is punch forming part, and described insulating part and described substrate, described first electrode and described second electrode
Unitary injection formed forms described LED support.
4. package structure for LED as claimed in claim 1, it is characterised in that described first light emitting diode each
Described alar part length on the length direction of described main part is first not less than what the length direction along described main part arranged
Spacing between first light-emitting diode chip for backlight unit and the last the first light-emitting diode chip for backlight unit.
5. package structure for LED as claimed in claim 1, it is characterised in that the first type surface of each described alar part
And/or on side surface, it is formed with groove.
6. package structure for LED as claimed in claim 1, it is characterised in that described first electrode and described second electricity
Pole lay respectively at described main part two ends and with on described main part mutually insulated, described first electrode and described second electrode
All offer installation through hole.
7. package structure for LED as claimed in claim 1, it is characterised in that described first light-emitting diode chip for backlight unit with
Described second light-emitting diode chip for backlight unit Heterogeneous Permutation on the length direction of described main part.
8. package structure for LED as claimed in claim 1, it is characterised in that described first light-emitting diode chip for backlight unit
Arrangement mode is to be gradually reduced to the arrangement pitches at two ends from middle on the length direction of described main part.
9. package structure for LED as claimed in claim 1, it is characterised in that the described first surface of described main part
With the die bond platform that described second surface is respectively formed with projection, described first light-emitting diode chip for backlight unit and described second luminescence two
Pole die is separately fixed on corresponding die bond platform.
10. a light emitting diode bulb, including: lamp holder, transparent lamp shade, stem stem and at least one is such as claim 1 to 9 times
Anticipating, a described package structure for LED, described transparent lamp shade and described stem stem are fixing with described lamp holder to be connected, and institute
State package structure for LED to be fixed on described stem stem.
11. light emitting diode bulbs as claimed in claim 10, it is characterised in that described package structure for LED passes through
Described alar part tilts to be fixed on described stem stem.
12. light emitting diode bulbs as claimed in claim 10, it is characterised in that described package structure for LED passes through
Installation through hole on described first electrode and described second electrode tilts to be fixed on described stem stem.
13. 1 kinds of package structure for LED, including LED support, multiple light-emitting diode chip for backlight unit and encapsulation
Body；It is characterized in that,
Described LED support includes the first bowl structure, the second bowl structure, the first electrode and the second electrode, described
First electrode and described second electrode all stretch into described first bowl structure and the inside of described second bowl structure；
The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit and the second light-emitting diode chip for backlight unit, described first
Light-emitting diode chip for backlight unit is fixed on the bottom of described first bowl structure and connects described first electrode and described by routing
Two electrodes, described second light-emitting diode chip for backlight unit is fixed on the bottom of described second bowl structure and connects described by routing
One electrode and described second electrode, described first light-emitting diode chip for backlight unit and described second light-emitting diode chip for backlight unit are described first
Heterogeneous Permutation on the length direction of bowl structure and described second bowl structure；And
Described packaging body includes that the first packaging body and the second packaging body, described first packaging body are filled in described first bowl structure
In to cover described first light-emitting diode chip for backlight unit and described first light-emitting diode chip for backlight unit and described first electrode and described the
Metal connecting line between two electrodes, described second packaging body is luminous to cover described second in being filled in described second bowl structure
Metal connecting line between diode chip for backlight unit and described second light-emitting diode chip for backlight unit and described first electrode and described second electrode.
14. package structure for LED as claimed in claim 13, it is characterised in that described first electrode, described second
Electrode, described first bowl structure and described second bowl structure are integrated sinter molding structure.
15. 1 kinds of package structure for LED, including LED support, multiple light-emitting diode chip for backlight unit and encapsulation
Body；It is characterized in that,
Described LED support includes substrate, be arranged on described substrate the first electrode on first surface and the second electricity
The 3rd electrode on pole and setting second surface on the substrate and the 4th electrode；
The plurality of light-emitting diode chip for backlight unit includes the first light-emitting diode chip for backlight unit and the second light-emitting diode chip for backlight unit, described
One light-emitting diode chip for backlight unit is fixing on the first surface and electrically connect described first electrode and described second electrode, and described the
Two light-emitting diode chip for backlight unit are fixed on described second surface and electrically connect described 3rd electrode and described 4th electrode, and described
One light-emitting diode chip for backlight unit and described second light-emitting diode chip for backlight unit are along the length direction Heterogeneous Permutation of described substrate；
Described packaging body includes the first packaging body and the second packaging body, is covered each by described first light-emitting diode chip for backlight unit and described
Second light-emitting diode chip for backlight unit.
16. package structure for LED as claimed in claim 15, it is characterised in that described first light-emitting diode chip for backlight unit
Between described first electrode and described second electrode and routing connects described first electrode and described second electrode；Described
One packaging body also covers the metal between described first light-emitting diode chip for backlight unit and described first electrode and described second electrode even
Line.
17. package structure for LED as claimed in claim 15, it is characterised in that described first light-emitting diode chip for backlight unit
Upside-down mounting connects described first electrode and described second electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620339444.2U CN205657084U (en) | 2016-04-21 | 2016-04-21 | Light -emitting diode structure and emitting diode bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620339444.2U CN205657084U (en) | 2016-04-21 | 2016-04-21 | Light -emitting diode structure and emitting diode bulb |
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| Publication Number | Publication Date |
|---|---|
| CN205657084U true CN205657084U (en) | 2016-10-19 |
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|---|---|---|---|
| CN201620339444.2U Active CN205657084U (en) | 2016-04-21 | 2016-04-21 | Light -emitting diode structure and emitting diode bulb |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114497319A (en) * | 2022-01-07 | 2022-05-13 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
| CN114497319B (en) * | 2022-01-07 | 2024-07-09 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
-
2016
- 2016-04-21 CN CN201620339444.2U patent/CN205657084U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114497319A (en) * | 2022-01-07 | 2022-05-13 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
| CN114497319B (en) * | 2022-01-07 | 2024-07-09 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
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Effective date of registration: 20180605 Address after: 361101 Fujian Xiamen torch high tech Zone (Xiangan) Industrial Area No. 101 Xing Xing road. Co-patentee after: EPISTAR Corp. Patentee after: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Address before: 361101 No. 101, Xiang Xing Road, Xiamen torch high tech Zone (Xiangan) Industrial Zone, Xiamen, Fujian Co-patentee before: INTERLIGHT OPTOTECH Corp. Patentee before: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. |
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| CP03 | Change of name, title or address |
Address after: 361101 Fujian Xiamen torch high tech Zone (Xiangan) Industrial Area No. 101 Xing Xing road. Patentee after: Purui Optoelectronics (Xiamen) Co.,Ltd. Country or region after: China Patentee after: EPISTAR Corp. Country or region after: TaiWan, China Address before: 361101 Fujian Xiamen torch high tech Zone (Xiangan) Industrial Area No. 101 Xing Xing road. Patentee before: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Country or region before: China Patentee before: EPISTAR Corp. Country or region before: TaiWan, China |