CN207586266U - A kind of chip package semi-conductor discrete device fixture for testing - Google Patents
A kind of chip package semi-conductor discrete device fixture for testing Download PDFInfo
- Publication number
- CN207586266U CN207586266U CN201721765554.6U CN201721765554U CN207586266U CN 207586266 U CN207586266 U CN 207586266U CN 201721765554 U CN201721765554 U CN 201721765554U CN 207586266 U CN207586266 U CN 207586266U
- Authority
- CN
- China
- Prior art keywords
- head cover
- tested
- limiting plate
- testing
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A kind of chip package semi-conductor discrete device fixture for testing, top compressing member including being used for the bottom mounting base of fixed tested device and for compressing tested device, the bottom mounting base includes being used to support the base substrate of entire fixture for testing, pedestal for the device limiting plate for blocking tested device and for coordinating with top compressing member, the limiting plate installing zone being equipped with for being fixedly mounted with the device limiting plate of base substrate, for the connecting contact pin being electrically connected with extraneous test equipment and the test circuit arranged according to the surface pads that tested device is connect with device；The top compressing member includes closing in the head cover of susceptor surface, for being pressed on the head cover briquetting of tested top device and the spring for buffering for covering.The beneficial effects of the utility model are：The device of general a variety of encapsulation；With the heat-sinking capability to measured device, reliance security when improving device detection.
Description
Technical field
The utility model is related to a kind of chip package semi-conductor discrete device fixture for testing.
Background technology
The domestic fixture for being used for chip package discrete device at present, each encapsulation is all using special fixture, poor universality.Material
Material is all plastics, it is impossible to be radiated to measured device, the device for making Partial Power big can not be surveyed under defined standard
Examination, and power control is bad or the unstable also easy damage device of power supply in test.
Invention content
In order to solve the domestic fixture for being used for chip package discrete device at present, each encapsulation all using special fixture, is led to
With property is poor, test when power control it is bad or the problem of power supply is unstable, can be common to a variety of envelopes the utility model proposes a kind of
Discrete device experiment is filled, the chip package semi-conductor discrete device fixture for testing of reliance security when improving device detection.
A kind of chip package semi-conductor discrete device fixture for testing described in the utility model, it is characterised in that：Including
Top compressing member for the bottom mounting base of fixed tested device and for compressing tested device, the bottom mounting base
Including being used to support the base substrate of entire fixture for testing, for the device limiting plate that blocks tested device and for
The pedestal of top compressing member cooperation, the base substrate be equipped with for be fixedly mounted with the device limiting plate limiting plate installing zone,
For the connecting contact pin being electrically connected with extraneous test equipment and the surface pads being connect according to tested device with device, the device
In the limiting plate installing zone of the base substrate, the device limiting plate is used to block part limiting plate detachable equipped with several
Firmly it is tested the card slot of device, and be equipped with can the surface that connects of electrode pin each with tested device for each card slot inner wall
Pad electrode passes through the printed circuit on base substrate between the surface pads electrode and the connecting contact pin of the base substrate
It is electrically connected, realizes that the tested device being inserted into card slot is electrically connected with external world's test equipment or test circuit；The floor installation exists
The upper surface of the device limiting plate, and the base center is equipped with and is inserted into for top compressing member section components and is pressed on card
The cavity being tested in slot on device；
The top compressing member includes closing in the head cover of susceptor surface, for being pressed on tested top device for covering
Head cover briquetting and the spring for buffering, the head cover are hinged with the pedestal；The head cover briquetting is mounted on institute by spring
It states head cover to connect towards the one side of pedestal, the top of head cover briquetting and one end of spring, the other end of spring is packed in top cover surface
To the one side of pedestal, realize that head cover briquetting makees straight reciprocating motion along head cover vertical direction；The head cover briquetting and groove position
It corresponds, i.e., head cover lid is closed in susceptor surface, and the bottom of head cover briquetting is pressed on the tested device in corresponding card slot just
At the top of part, the contact connectio of tested each electrode pin of device and respective card slot surface pads electrode is realized.
The base substrate is rectangular slab, and respectively one row of setting connection is inserted positioned at the opposite both sides of limiting plate installing zone
Needle, for being inserted into test fixture or being installed to the aging test of the aging board seat of honour.
The device limiting plate is packed in the upper surface of the base substrate by screw.
On one side with being hinged while pedestal, the head cover another side opposite with pedestal is clamped head cover.
One side bottom opposite with pedestal hinge side of pedestal is equipped with groove, and one side opposite with hinge side of head cover is equipped with
The holding section that can coordinate with groove, and when head cover is pressed on susceptor surface completely, the holding section of head cover is caught in the groove of pedestal
It is interior so that head cover briquetting is pressed on above corresponding card slot.
The head cover, head cover briquetting and pedestal are the metal device of easy heat radiation.
Card slot shape and tested device matching on device limiting plate.
The test circuit for aging circuit when aging equipment (connection) or other functions and electric parameters testing circuit (such as
During connecting test instrument, it can test：Diode forward conducting voltage, triode amplification factor etc.).
In use, head cover and head cover briquetting, equipped with spring in the top of each briquetting, when use turn down head cover ensure it is each
Briquetting can reliably push down each tested device.In entire fixture, head cover head cover briquetting and pedestal these components are all using gold
Belong to material to make, good radiating condition can be provided for measured device.Device limiting plate according to device external form grooving, each slot
Position is corresponding with head cover briquetting position.Base substrate is processed using printed board, is processed according to measured device on plate and is connect with device
Surface pads and required connection circuit, device limiting plate and base substrate be screwed below pedestal, put for limiting
Put tested device and connection effect.For the device of different encapsulation, by replace device limiting plate and base substrate this
Two plates, other components in fixture are generally applicable.Entire fixture during use can be inserted by the connection in base substrate both sides
Needle is inserted into test equipment, and the device under test for being packed into fixture is carried out function and electric parameters testing or be installed on aging board to do always
Refining experiment.
The beneficial effects of the utility model are：1) device of general a variety of encapsulation；2) there is the heat radiation energy to measured device
Power, reliance security when improving device detection：Fixture head cover, head cover briquetting, pedestal are carrying out device survey using metal material
Cooling effect is played to device during examination, make device will not when test the excessive fever of power or when power supply unstable damage.
Description of the drawings
Fig. 1 are the side block diagrams of the utility model.
Fig. 2 are the top views (renovating opening state) of the utility model.
Specific embodiment
The utility model is further illustrated below in conjunction with the accompanying drawings
With reference to attached drawing：
A kind of chip package semi-conductor discrete device fixture for testing described in the utility model of embodiment 1, including being used for
The bottom mounting base of fixed tested device and the top compressing member for compressing tested device 3, the bottom mounting base packet
Include and be used to support the base substrate 6 of entire fixture for testing, for the device limiting plate 5 that blocks tested device and for
The pedestal 4 of top compressing member cooperation, the limiting plate peace being equipped with for being fixedly mounted with the device limiting plate 5 of the base substrate 6
Fill area, for the connecting contact pin 7 being electrically connected with extraneous test equipment and the surface pads being connect according to tested device with device
The printed circuit of arrangement, 5 detachable of device limiting plate is in the limiting plate installing zone of the base substrate 6, the device
Part limiting plate 5 is equipped with several for blocking the card slots of tested device 3, and be equipped with can be with tested device for each card slot inner wall
The surface pads electrode that each electrode pin of part connects, the connecting contact pin 7 of the surface pads electrode and the base substrate 6
Between be electrically connected by the printed circuit on base substrate, realize the tested device 3 that is inserted into card slot and extraneous test equipment or
Test circuit is electrically connected；The floor installation is in the upper surface of the device limiting plate 5, and the base center is equipped with for upper
Portion's compressing member section components are inserted into and are pressed on the cavity being tested in card slot on device；
The top compressing member includes closing in the head cover 1 of susceptor surface, for being pressed on 3 top of tested device for covering
Head cover briquetting 2 and the spring for buffering, the head cover 1 and the pedestal 4 it is hinged；The head cover briquetting 2 is pacified by spring
It is connected mounted in the head cover towards the one side of pedestal, the top of head cover briquetting 2 and one end of spring, the other end of spring is packed in
Head cover realizes that head cover briquetting makees straight reciprocating motion along head cover vertical direction towards the one side of pedestal；The head cover briquetting 2 and card
Groove location corresponds, i.e. the lid of head cover 1 is closed at 4 surface of pedestal, and the bottom of head cover briquetting 2 is pressed on just in corresponding card slot
The contact connectio of tested 3 each electrode pin of device and respective card slot surface pads electrode is realized at tested 3 top of device.
The base substrate 6 is rectangular slab, and respectively one row of setting connection is inserted positioned at the opposite both sides of limiting plate installing zone
Needle, for being inserted into test fixture or being installed to the aging test of the aging board seat of honour.
The device limiting plate 5 is packed in the upper surface of the base substrate 6 by screw.
On one side with being hinged while pedestal 4, the another side opposite with pedestal 4 of head cover 1 is clamped head cover 1.
One side bottom opposite with pedestal hinge side of pedestal 4 is equipped with groove, and one side opposite with hinge side of head cover is set
There is the holding section that can coordinate with groove, and when head cover 1 is pressed on susceptor surface completely, the holding section of head cover 1 is caught in pedestal
In groove so that head cover briquetting 2 is pressed on above corresponding card slot.
The head cover 1, head cover briquetting 2 and pedestal 4 are the metal device of easy heat radiation.
Card slot shape on device limiting plate 5 is matched with tested device 3.
The test circuit for aging circuit when aging equipment (connection) or other functions and electric parameters testing circuit (such as
During connecting test instrument, it can test：Diode forward conducting voltage, triode amplification factor etc.).
In use, head cover 1 and head cover briquetting 2, equipped with spring in the top of each briquetting, when use turn down head cover ensure it is every
A briquetting can reliably push down each tested device.In entire fixture, head cover 1, head cover briquetting 2 and pedestal 4 these components are all
It is made of metal material, good radiating condition can be provided for measured device.Device limiting plate 5 according to device external form grooving,
The position of each slot is corresponding with 2 position of head cover briquetting.Base substrate 6 is processed using printed board, is processed on plate according to measured device
The surface pads being connect with device and required connection circuit, device limiting plate 5 are screwed with base substrate 6 under pedestal 4
Tested device and connection effect are placed for limiting by side.For the device of different encapsulation, by replacing device limiting plate
5 with base substrate 6 the two plates, and other components in fixture are generally applicable.Entire fixture during use, can be by pedestal base
The 7 connecting test instrument of connecting contact pin of 6 both sides of plate carries out function and electric parameters testing or is installed on aging board to do ageing examination
It tests.
The way of realization that content described in this specification embodiment only conceives utility model is enumerated, this practicality is new
The protection domain of type is not construed as being only limitted to the concrete form that embodiment is stated, the scope of protection of the utility model is also wrapped
Include those skilled in the art according to the utility model design it is conceivable that equivalent technologies mean.
Claims (8)
1. a kind of chip package semi-conductor discrete device fixture for testing, it is characterised in that：Including being used for fixed tested device
Bottom mounting base and top compressing member for compressing tested device, the bottom mounting base include being used to support entire survey
The base substrate of fixture on probation, the bottom for the device limiting plate that blocks tested device and for coordinating with top compressing member
Seat, the base substrate are equipped with to be fixedly mounted with the limiting plate installing zone of the device limiting plate, set for testing with the external world
The standby connecting contact pin being electrically connected and the test circuit arranged according to the surface pads that tested device is connect with device, the device
In the limiting plate installing zone of the base substrate, the device limiting plate is used to block limiting plate detachable equipped with several
The card slot of tested device, and be equipped with can the surface weldering that connects of electrode pin each with tested device for each card slot inner wall
Disc electrode passes through the test circuit electricity on base substrate between the surface pads electrode and the connecting contact pin of the base substrate
Even, the tested device that realization is inserted into card slot is electrically connected with extraneous test equipment；The floor installation is limited in the device
The upper surface of plate, and the base center is equipped with to be inserted into and be pressed on for top compressing member section components in card slot and is tested device
Cavity on part；
The top compressing member includes closing the head cover in susceptor surface, the head cover for being pressed on tested top device for covering
Briquetting and the spring for buffering, the head cover are hinged with the pedestal；The head cover briquetting is mounted on the top by spring
For capping to the one side of pedestal, the top of head cover briquetting and one end connection of spring, the other end of spring are packed in head cover the bottom of towards
The one side of seat realizes that head cover briquetting makees straight reciprocating motion along head cover vertical direction；The head cover briquetting and groove position are one by one
Corresponding, i.e., head cover lid is closed in susceptor surface, and the bottom of head cover briquetting is pressed on the tested device top in corresponding card slot just
Portion realizes the contact connectio of tested each electrode pin of device and respective card slot surface pads electrode.
2. a kind of chip package semi-conductor discrete device fixture for testing as described in claim 1, it is characterised in that：The bottom
Seat substrate is rectangular slab, and respectively sets row's connecting contact pin positioned at the opposite both sides of limiting plate installing zone, for being inserted into test
Tooling is installed to the aging test of the aging board seat of honour.
3. a kind of chip package semi-conductor discrete device fixture for testing as claimed in claim 2, it is characterised in that：The device
Part limiting plate is packed in the upper surface of the base substrate by screw.
4. a kind of chip package semi-conductor discrete device fixture for testing as described in claim 1, it is characterised in that：Head cover one
Side is hinged on one side with pedestal, the head cover another side clamping opposite with pedestal.
5. a kind of chip package semi-conductor discrete device fixture for testing as claimed in claim 4, it is characterised in that：Pedestal
One side bottom opposite with pedestal hinge side is equipped with groove, and one side opposite with hinge side of head cover is equipped with what can be coordinated with groove
Holding section, and when head cover is pressed on susceptor surface completely, the holding section of head cover is caught in the groove of pedestal so that head cover briquetting
It is pressed on above corresponding card slot.
6. a kind of chip package semi-conductor discrete device fixture for testing as claimed in claim 5, it is characterised in that：The top
Lid, head cover briquetting and pedestal are the metal device of easy heat radiation.
7. a kind of chip package semi-conductor discrete device fixture for testing as described in claim 1, it is characterised in that：The survey
Examination circuit is aging circuit.
8. a kind of chip package semi-conductor discrete device fixture for testing as described in claim 1, it is characterised in that：Device limits
Card slot shape and tested device matching on the plate of position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721765554.6U CN207586266U (en) | 2017-12-18 | 2017-12-18 | A kind of chip package semi-conductor discrete device fixture for testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721765554.6U CN207586266U (en) | 2017-12-18 | 2017-12-18 | A kind of chip package semi-conductor discrete device fixture for testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207586266U true CN207586266U (en) | 2018-07-06 |
Family
ID=62738430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721765554.6U Active CN207586266U (en) | 2017-12-18 | 2017-12-18 | A kind of chip package semi-conductor discrete device fixture for testing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207586266U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107907718A (en) * | 2017-12-18 | 2018-04-13 | 浙江杭可科技股份有限公司 | A kind of chip package semi-conductor discrete device fixture for testing |
| CN109342912A (en) * | 2018-09-30 | 2019-02-15 | 西安微电子技术研究所 | The frock clamp of SMD surface mount packages device ageing |
| CN109738775A (en) * | 2018-12-21 | 2019-05-10 | 贵州航天计量测试技术研究所 | A kind of encapsulation diodes age test fixture and method |
| CN110927412A (en) * | 2019-11-28 | 2020-03-27 | 江苏德普尔门控科技有限公司 | Test fixture convenient to accessory fast switch over |
-
2017
- 2017-12-18 CN CN201721765554.6U patent/CN207586266U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107907718A (en) * | 2017-12-18 | 2018-04-13 | 浙江杭可科技股份有限公司 | A kind of chip package semi-conductor discrete device fixture for testing |
| CN109342912A (en) * | 2018-09-30 | 2019-02-15 | 西安微电子技术研究所 | The frock clamp of SMD surface mount packages device ageing |
| CN109738775A (en) * | 2018-12-21 | 2019-05-10 | 贵州航天计量测试技术研究所 | A kind of encapsulation diodes age test fixture and method |
| CN110927412A (en) * | 2019-11-28 | 2020-03-27 | 江苏德普尔门控科技有限公司 | Test fixture convenient to accessory fast switch over |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207586266U (en) | A kind of chip package semi-conductor discrete device fixture for testing | |
| CN201194023Y (en) | Integrated circuit testing apparatus | |
| US7663388B2 (en) | Active thermal control unit for maintaining the set point temperature of a DUT | |
| CN204989229U (en) | Chip test fixture and test system | |
| CN107907718A (en) | A kind of chip package semi-conductor discrete device fixture for testing | |
| CN111352024A (en) | High-power laser chip test aging clamp | |
| CN207380199U (en) | Manual chip testing lid | |
| CN106872873B (en) | A kind of three-dimensional stacked package module test tooling of single plate and test method | |
| CN100432679C (en) | Vertical probe card | |
| CN112578149B (en) | Aging equipment for chip reliability test | |
| CN202929057U (en) | Testing pedestal and testing device | |
| KR101250890B1 (en) | Test socket for semiconductor | |
| CN201007722Y (en) | Semiconductor component testing table with flexible buffering heat conduction foundation | |
| CN109342912A (en) | The frock clamp of SMD surface mount packages device ageing | |
| EP2058860A3 (en) | Fully testable surface mount die package configured for two-sided cooling | |
| CN111103521A (en) | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device | |
| CN208125883U (en) | A kind of high-power chip test device | |
| KR101217823B1 (en) | Jig unit for testing LED chip | |
| CN207528773U (en) | A kind of aging test device for TO-252 diode packages | |
| CN215768668U (en) | SMD surface mount device testing clamp | |
| CN202255841U (en) | Adjustable LED (light-emitting diode) photoelectrical test fixture | |
| KR101173190B1 (en) | Test socket assembly for heat package | |
| CN207396682U (en) | Reliability test system and its printed circuit-board assembly | |
| CN202794406U (en) | Chip encapsulation discrete device testing device | |
| CN107664706B (en) | LED measuring clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |