CN207303071U - A kind of high-power patch encapsulation triode - Google Patents
A kind of high-power patch encapsulation triode Download PDFInfo
- Publication number
- CN207303071U CN207303071U CN201721182046.5U CN201721182046U CN207303071U CN 207303071 U CN207303071 U CN 207303071U CN 201721182046 U CN201721182046 U CN 201721182046U CN 207303071 U CN207303071 U CN 207303071U
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- shell
- base
- launch site
- heat
- collecting zone
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 53
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000002633 protecting effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It the utility model is related to electronic component technology field, more particularly to a kind of high-power patch encapsulation triode, including encapsulating shell, it is arranged at three pins of encapsulating shell side, three pins are connected with work department, the work department includes collecting zone, base and launch site, three pins respectively with collecting zone, base and launch site, the collecting zone, base and launch site are connected with flip-chip in turn, the encapsulating shell includes upper shell and lower housing shell, three pins are connected from upper shell insertion encapsulating shell with work department, the lower housing shell is equipped with insulating layer successively from top to bottom, heat-conducting layer and heat dissipating layer, the collecting zone, base and launch site are equipped with copper wire with pin connection position；The utility model is big using power, has High-radiation performance effect, ensures the high-power security used.
Description
Technical field
Electronic component technology field is the utility model is related to, triode is encapsulated more particularly to a kind of high-power patch.
Background technology
Triode, full name should be transistor, also referred to as bipolar transistor, transistor, be a kind of control electricity
Its effect of the semiconductor devices of stream is that small-signal is zoomed into the larger electric signal of range value, also serves as noncontacting switch.It is brilliant
Body triode, is one of basic component of semiconductor, has Current amplifier effect, is the core element of electronic circuit.Triode
It is the PN junction that two close proximities are made on a block semiconductor substrate, bulk semiconductor is divided into three parts by two PN junctions, in
Between be partly base, two side portions are launch site and collecting zone, and arrangement mode has two kinds of PNP and NPN.
With the development of electronic technology, the demand of transistor incrementally increases, and towards miniaturization, but
It is that difficulty of processing is big.
At present, the encapsulation triode being connected on electronic circuit board plays the role of switch and amplification.Existing encapsulation three
The paster Ji Dao whole region corresponding to three pins of pole pipe is designed with silver-plated area, and triode is mounted on by conducting resinl and is equipped with
In the paster Ji Dao in silver-plated area；And this structure has some disadvantages, since the paster Ji Dao whole region is designed with silver-plated area,
Thus cause pin production cost higher, and triode is mounted on equipped with layering is easily produced in silver-plated area's the paster Ji Dao, can
It is low by property.
Utility model content
Use power big to solve the above problems, the utility model provides one kind, there is High-radiation performance effect, ensure big work(
The high-power patch encapsulation triode for the security that rate uses.
Technical solution is used by the utility model：A kind of high-power patch encapsulation triode, including encapsulating shell, are set
Three pins in encapsulating shell side, three pins are connected with work department, and the work department includes collecting zone, base and hair
Area is penetrated, three pins are connected with turn with collecting zone, base and launch site, the collecting zone, base and launch site respectively
Flip-chip, the encapsulating shell include upper shell and lower housing shell, and three pins are inserted into encapsulating shell and work department from upper shell
It is connected, the lower housing shell is equipped with insulating layer, heat-conducting layer and heat dissipating layer, the collecting zone, base and launch site successively from top to bottom
Copper wire is equipped with pin connection position.
Further improvement of these options is that the heat-conducting layer offers some air holes.
Further improvement of these options is that the heat-conducting layer is copper thermally conductive sheet.
Further improvement of these options is that the upper shell forms an encapsulating shell with lower housing shell riveted.
Further improvement of these options is that the insulating layer is a dielectric film.
Further improvement of these options is that the copper wire is set around collecting zone, base and launch site and is connected with pin
Position.
The beneficial effects of the utility model are：
1st, a kind of high-power patch encapsulation triode, in a first aspect, being equipped with encapsulating shell, packaging protection is played by encapsulating shell
Effect, protecting effect is good, is arranged at three pins of encapsulating shell side, and erecting and welding effect, installation are connected by three pins
Convenient welding, three pins are connected with work department, play working effect by work department, using effect is good；Second aspect,
The work department includes collecting zone, base and launch site, and aggregation charge effect is played by collecting zone, and management is played by base stage
Charge effect, plays transmitting charge effect, using effect is good, and work efficiency is strong by launch site；The third aspect, described three are drawn
With collecting zone, base and launch site, work is used easy to connect respectively for foot, and aggregation charge emission same effects are good, easy to connect；
Fourth aspect, the collecting zone, base and launch site are connected with flip-chip in turn, and lead is played a role by flip-chip
Effect, has many clear advantages compared with traditional lead key closing process, can save space；Fourth aspect, the envelope
Dress shell includes upper shell and lower housing shell, easily manufactured by upper shell and lower housing shell combined use, reduces cost, described three
Pin is connected from upper shell insertion encapsulating shell with work department, and good connecting effect, the lower housing shell is equipped with insulation successively from top to bottom
Layer, heat-conducting layer and heat dissipating layer, play insulation effect by insulating layer, heat-conducting effect are played by heat-conducting layer, are risen by heat dissipating layer
To heat dissipation effect, at work, heat-conducting layer is dispersed heat derives to the heat sink that inside is sent, good heat dissipation effect；The
Five aspects, the collecting zone, base and launch site and pin connection position are equipped with copper wire, this reality can be effectively improved by copper wire
Power is used with new, during high-power use, internal structure can send excessive heat, pass through thermally conductive sheet and heat dissipation
Piece can effectively play heat conduction and heat dissipation effect, ensure the high-power security used of the utility model.
2nd, the heat-conducting layer offers some air holes, and the ventilative of the utility model can be further improved by air hole
Heat-conducting effect, improves the heat dissipation effect of heat dissipating layer.
3rd, the heat-conducting layer is copper thermally conductive sheet, and copper has efficient heat-conducting effect, improves the use effect of the utility model
Fruit, good heat conduction effect, improves high-power using effect.
4th, upper shell and the lower housing shell riveted forms an encapsulating shell, is molded by riveted, can reduce manufacture cost, makes
Make conveniently.
5th, the insulating layer is a dielectric film, can effectively play insulation effect by dielectric film, while dielectric film is fibre
Dimension insulation has heat-resisting effect, prevents internal structure from overheating, causes dielectric film to melt, and improves protecting effect.
6th, the copper wire is set around collecting zone, base and launch site and pin link position, is set by winding, Neng Gouyou
Effect improves the power that uses of the utility model, raising using effect.
Brief description of the drawings
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the structure diagram of the utility model；
Fig. 3 is the schematic diagram of the utility model lower housing shell.
Attached drawing identifier declaration：Triode 100, encapsulating shell 110, upper shell 111, lower housing shell 112, insulating layer 112a, heat conduction
Layer 112b, heat dissipating layer 112c, air hole 112d, pin 120, work department 130, collecting zone 131, base 132, launch site 133, fall
Cartridge chip 140, copper wire 150.
Embodiment
The utility model is further described below in conjunction with attached drawing.
As shown in FIG. 1 to 3, it is respectively the schematic diagram of the stereogram of the utility model, structure diagram and lower housing shell.
A kind of high-power patch encapsulation triode 100, including encapsulating shell 110, be arranged at 110 side of encapsulating shell three draw
Foot 120, three pins 120 are connected with work department 130, and the work department 130 includes collecting zone 131, base 132 and transmitting
Area 133, three pins 120 respectively with collecting zone 131, base 132 and launch site 133, the collecting zone 131, base 132
Flip-chip 140 is connected with turn with launch site 133, the encapsulating shell 110 includes upper shell 111 and lower housing shell 112, and described three
A pin 120 is inserted into encapsulating shell 110 from upper shell 111 and is connected with work department 130, and the lower housing shell 112 is set successively from top to bottom
There are insulating layer 112a, heat-conducting layer 112b and heat dissipating layer 112c, the collecting zone 131, base 132 and launch site 133 and pin 120
Connection position is equipped with copper wire 150.
Heat-conducting layer 112b offers some air hole 112d, and the utility model can be further improved by air hole 112d
Ventilative heat-conducting effect, improve the heat dissipation effect of heat dissipating layer 112c.
Heat-conducting layer 112b is copper thermally conductive sheet, and copper has efficient heat-conducting effect, improves the using effect of the utility model,
Good heat conduction effect, improves high-power using effect.
Upper shell 111 forms an encapsulating shell 110 with 112 riveted of lower housing shell, is molded by riveted, can reduce and be manufactured into
This, it is easily manufactured.
Insulating layer 112a is a dielectric film, can effectively play insulation effect by dielectric film, while dielectric film is fiber
Insulation has heat-resisting effect, prevents internal structure from overheating, causes dielectric film to melt, and improves protecting effect.
Copper wire 150 is set around collecting zone 131, base 132 and launch site 133 and 120 link position of pin, is set by winding
Put, can effectively improve the utility model uses power, improves using effect.
In a first aspect, being equipped with encapsulating shell 110, packaging protection effect is played by encapsulating shell 110, protecting effect is good, sets
Three pins 120 in 110 side of encapsulating shell, connect erecting and welding effect, erecting and welding is convenient, institute by three pins 120
State three pins 120 and be connected with work department 130, working effect is played by work department 130, using effect is good；Second aspect, institute
Stating work department 130 includes collecting zone 131, base 132 and launch site 133, and aggregation charge effect is played by collecting zone 131, leads to
Cross base stage and play management charge effect, transmitting charge effect is played by launch site 133, using effect is good, and work efficiency is strong；The
With collecting zone 131, base 132 and launch site 133, work is used easy to connect respectively for three aspects, three pins 120, is gathered
It is good to collect charge emission same effects, easy to connect；Fourth aspect, the collecting zone 131, base 132 and launch site 133 connect successively
Flip-chip 140 is connected to, the effect of lead is played a role by flip-chip 140, is had compared with traditional lead key closing process
There are many clear advantages, space can be saved；Fourth aspect, the encapsulating shell 110 include upper shell 111 and lower housing shell 112,
It is used in combination by upper shell 111 and lower housing shell 112, it is easily manufactured, reduce cost, three pins 120 are from upper shell 111
Insertion encapsulating shell 110 is connected with work department 130, and good connecting effect, the lower housing shell 112 is equipped with insulating layer successively from top to bottom
112a, heat-conducting layer 112b and heat dissipating layer 112c, insulation effect is played by insulating layer 112a, and heat conduction is played by heat-conducting layer 112b
Effect, heat dissipation effect is played by heat dissipating layer 112c, and at work, the heat derives that heat-conducting layer 112b sends inside extremely radiate
Piece is dispersed, good heat dissipation effect；5th aspect, the collecting zone 131, base 132 and launch site 133 are connected with pin 120
There is copper wire 150 in position, and the use power of the utility model can be effectively improved by copper wire 150, process is used high-power
In, internal structure can send excessive heat, can effectively play heat conduction and heat dissipation effect by thermally conductive sheet and heat sink, ensure
The high-power security used of the utility model.
Embodiment described above only expresses the several embodiments of the utility model, its description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
- A kind of 1. high-power patch encapsulation triode, it is characterised in that：Including encapsulating shell, be arranged at encapsulating shell side three draw Foot, three pins are connected with work department, and the work department includes collecting zone, base and launch site, three pins point Flip-chip, the encapsulating shell are not connected with turn with collecting zone, base and launch site, the collecting zone, base and launch site Including upper shell and lower housing shell, three pins are connected from upper shell insertion encapsulating shell with work department, and the lower housing shell is by upper Arrive down and be equipped with insulating layer, heat-conducting layer and heat dissipating layer successively, the collecting zone, base and launch site and pin connection position are equipped with copper Silk.
- A kind of 2. high-power patch encapsulation triode according to claim 1, it is characterised in that：The heat-conducting layer offers Some air holes.
- A kind of 3. high-power patch encapsulation triode according to claim 2, it is characterised in that：The heat-conducting layer is copper Thermally conductive sheet.
- A kind of 4. high-power patch encapsulation triode according to claim 3, it is characterised in that：The upper shell and lower casing Body riveted forms an encapsulating shell.
- A kind of 5. high-power patch encapsulation triode according to claim 4, it is characterised in that：The insulating layer is exhausted for one Velum.
- A kind of 6. high-power patch encapsulation triode according to claim 5, it is characterised in that：The copper wire is set around collection Electric area, base and launch site and pin link position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721182046.5U CN207303071U (en) | 2017-09-15 | 2017-09-15 | A kind of high-power patch encapsulation triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721182046.5U CN207303071U (en) | 2017-09-15 | 2017-09-15 | A kind of high-power patch encapsulation triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207303071U true CN207303071U (en) | 2018-05-01 |
Family
ID=62441557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721182046.5U Expired - Fee Related CN207303071U (en) | 2017-09-15 | 2017-09-15 | A kind of high-power patch encapsulation triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207303071U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729268A (en) * | 2019-09-19 | 2020-01-24 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
-
2017
- 2017-09-15 CN CN201721182046.5U patent/CN207303071U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729268A (en) * | 2019-09-19 | 2020-01-24 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
| CN110729268B (en) * | 2019-09-19 | 2021-04-16 | 广东合科泰实业有限公司 | High-efficient type paster triode with good heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 523000 Dongguan, Guangdong, Songshan Lake high tech Industrial Development Zone, New Town Road, 5, hung Ho, 7 A, Long Yi Zhi Valley, A701 Patentee after: DONGGUAN NANJING ELECTRONICS LTD. Address before: 523000 Yi Hongrong high tech Industrial Park, No. 7, Chi Ling Industrial Road, Houjie Town, Dongguan, Guangdong. Patentee before: DONGGUAN NANJING ELECTRONICS LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 |