JPS62264689A - Manufacture of metal-ceramics junction unit with circuit - Google Patents
Manufacture of metal-ceramics junction unit with circuitInfo
- Publication number
- JPS62264689A JPS62264689A JP10893586A JP10893586A JPS62264689A JP S62264689 A JPS62264689 A JP S62264689A JP 10893586 A JP10893586 A JP 10893586A JP 10893586 A JP10893586 A JP 10893586A JP S62264689 A JPS62264689 A JP S62264689A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- metal
- ceramic
- metal plate
- become
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 14
- 238000005530 etching Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、回路付金属〜セラミックス接合体の製造方法
に関する。さらに詳しくは、電気および電子部品の基盤
として用いる回路構成された金属−セラミックス接合体
を製造する方法を提供することに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a metal-ceramic bonded body with a circuit. More specifically, the present invention relates to providing a method for manufacturing a metal-ceramic bonded body having a circuit structure for use as a base for electrical and electronic components.
従来の技術
従来の回路付金属−セラミックス接合体を製造する方法
は、アルミナ基盤、ＡρＮ基盤、ＳｉＣ基盤等のセラミ
ックスＩＳＩにＡａ −Ｐｄ 、 Ａｕ 。BACKGROUND OF THE INVENTION A conventional method for manufacturing a metal-ceramic bonded body with a circuit is to use Aa-Pd, Au on a ceramic ISI such as an alumina substrate, an AρN substrate, or a SiC substrate.
ＣＩＪＷの粉末からつくったペーストをスクリーン印刷
によりセラミックスに付着させることからなる回路印刷
を行ない、焼成炉で６００℃〜１０００℃に加熱し、厚
膜回路を形成させる方法が用いられてぎた。特にハイブ
リッドＩＣ，パワートランジスタモジュール等の大電力
を必要とするものは、ＭＯ又はＷペーストを用い、焼成
により回路構成し、メッキ等で必要な特性を持った導体
回路を作成する方法が用いられている。A method of circuit printing has been used in which a paste made from CIJW powder is attached to ceramics by screen printing and heated in a firing oven to 600 DEG C. to 1000 DEG C. to form a thick film circuit. In particular, for products that require large amounts of power, such as hybrid ICs and power transistor modules, methods are used in which MO or W paste is used, the circuit is constructed by firing, and a conductor circuit with the necessary characteristics is created by plating, etc. There is.
しかし、このような従来技術の方法では回路の膜厚を厚
く出来ないばかりか、たとえばＭＯ及びＷを用いる方法
では直接ハンダ付けが出来ない為、メッキ工程が必要と
なる等の不都合がある。又、大電力を必要とする電子部
品に使用する場合は放熱性を向上させる為に放熱板を取
り付けなければならない。この為、従来技術の方法でセ
ラミックス基盤上に必要な回路構成を行うと、工程が複
雑になり、歩留りが低下し、コストアップとなる欠点が
ある。However, such conventional methods not only cannot increase the film thickness of the circuit, but also have disadvantages such as, for example, methods using MO and W, which cannot be directly soldered and require a plating process. Furthermore, when used in electronic components that require large amounts of power, a heat sink must be attached to improve heat dissipation. For this reason, if the necessary circuit structure is formed on a ceramic substrate using the conventional method, the process becomes complicated, the yield decreases, and the cost increases.
又、電子部品搭載用基盤どして、金属−セラミックス接
合体を用いる時、導体部である金属部分を所定の形状に
つくり、セラミックス３３５１１ｉ上に精度よく配置し
、接合することが必要となるが、該金属部分を所定の形
状につくった時、多くの小さな要素にわかれる為、セラ
ミックス基盤上に精度よく配置し、直接接合する事は、
手間がかかり、効率が悪い。又、金属板をセラミックス
基盤に直接接合し、その後、金属板部分をエツチングに
より所定の形状に配置する製造方法があるが、該金属板
の厚さが厚い場合、エツチングが表面から行なわれてい
く為、第４図に示すように、エツチングされた端部での
ダレがひどくなり、導体金屑部分の表層部の面積と接合
部の面積との間に無視できない差を生じ、精度の良い回
路構成を行なえない欠点がある。さらに、金属板を所定
の形状及び配置に近い回路に構成し、セラミックス基盤
に直接接合し、その後、切断及び切削により不要部分を
取り除く製造方法があるが、切断及び切削を行なう為に
与える機械的衝撃がセラミックス基盤を破壊する危険が
あるばかりか、複雑な回路を構成出来ない欠点がある。Also, when using a metal-ceramic bonded body as a board for mounting electronic components, it is necessary to make the metal part that is the conductor into a predetermined shape, place it on the ceramic 33511i with precision, and bond it. When the metal part is made into a predetermined shape, it is divided into many small elements, so it is difficult to accurately place them on the ceramic substrate and bond them directly.
It is time consuming and inefficient. There is also a manufacturing method in which a metal plate is directly bonded to a ceramic substrate, and then the metal plate portion is arranged in a predetermined shape by etching, but if the metal plate is thick, etching is performed from the surface. As a result, as shown in Figure 4, the etched edges become severely sagged, creating a non-negligible difference between the area of the surface layer of the conductor scrap and the area of the joint, resulting in a circuit with high precision. It has the disadvantage that it cannot be configured. Furthermore, there is a manufacturing method in which a metal plate is configured into a circuit close to a predetermined shape and arrangement, directly bonded to a ceramic substrate, and then unnecessary parts are removed by cutting and machining. Not only is there a risk that the impact may destroy the ceramic base, but it also has the disadvantage that complex circuits cannot be constructed.
発明が解決しようとする問題点
本発明は、上述のごとき欠点がなく、安価で、膜厚が厚
く、粘度良く回路構成され、放熱性、高周波特性のすぐ
れた、回路付金属−セラミックス接合体を製造する方法
を提供せんとするものである。Problems to be Solved by the Invention The present invention provides a metal-ceramic bonded body with a circuit that does not have the above-mentioned drawbacks, is inexpensive, has a thick film, has a circuit structure with good viscosity, and has excellent heat dissipation and high frequency characteristics. The purpose is to provide a manufacturing method.
問題を解決する為の手段
本発明は、一枚の金属板から、プレスにより、回路とな
る部分以外の部分の板厚を、回路となる部分の板厚より
薄クシた金属板を加工してつくり、次にプレスにより押
し込み加工し回路構成された側をセラミックス基盤上に
面する様装置し、該金属板とセラミックス基盤とを直接
接合法で接合させた後、該接合体の金属板の回路となる
部分だけが保護されるように形成したレジストで覆って
エツチングする事により、該金属板の回路部分以外の部
分を除去することからなる回路付金属−セラミックス接
合体の製造方法を提供せんとするものである。Means for Solving the Problem The present invention is based on a single metal plate, which is machined using a press so that the thickness of the part other than the part that will become the circuit is thinner than the thickness of the part that will become the circuit. The metal plate and the ceramic substrate are bonded by a direct bonding method, and then the circuit-formed side of the metal plate is pressed using a press so that it faces the ceramic substrate, and the circuit of the metal plate of the bonded body is The present invention aims to provide a method for manufacturing a metal-ceramic bonded body with a circuit, which comprises removing the parts of the metal plate other than the circuit part by covering the metal plate with a resist formed so that only the parts that are protected by etching are etched. It is something to do.
本発明によれば、金属板をプレスにより、回路となる部
分以外の部分の板厚が回路となる部分の板厚より薄くな
る様加工し、セラミックス基盤と直接接合させた後回路
部分をレジストで覆ってエツチングを行なう為、エツチ
ングの時間が短縮され、エツチングダレが小さく、回路
部分の導体金属部が厚く、精度良く回路構成され、熱放
散性、高周波特性にすぐれた回路付金属−セラミックス
接合体を製造出来る。According to the present invention, a metal plate is processed by pressing so that the thickness of the part other than the part that will become the circuit is thinner than that of the part that will become the circuit, and after directly bonding to the ceramic substrate, the circuit part is coated with a resist. Metal-ceramic bonded metal-ceramics bonded body with a circuit that is covered and etched, so the etching time is shortened, etching sag is small, the conductor metal part of the circuit part is thick, the circuit is configured accurately, and the metal-ceramic bond has excellent heat dissipation and high frequency characteristics. can be manufactured.
実施例−１
第１図に示すように、回路となる部分以外の部分の銅板
の厚さが、回路となる部分の厚さより薄くなる様形成さ
れた銅板をプレスで成形加工してつくった。その後、成
形加工した金属部を第１図に示すようにアルミナ基盤の
上に載せ、金属とセラミックスとの接触面を直接接合法
で接合させた。Example 1 As shown in FIG. 1, a copper plate was formed by press forming so that the thickness of the copper plate in parts other than the part that would become the circuit was thinner than the thickness of the part that would become the circuit. Thereafter, the formed metal part was placed on an alumina substrate as shown in Fig. 1, and the contact surfaces between the metal and the ceramic were joined by a direct joining method.
次に該接合体の金属部分にレジストを２０μ風の厚さに
全面塗布し、９０℃で６０分間、加熱乾燥させ、回路パ
ターンに相当するレジストを金属表面に残すことのでき
るフォトマスク（ネガ）を該接合体の上に置ぎ、紫外線
で露光を行ない現像した。Next, a photomask (negative) that can leave a resist corresponding to the circuit pattern on the metal surface by coating the entire surface of the metal part of the bonded body with resist to a thickness of 20 μm and drying it by heating at 90°C for 60 minutes. was placed on the bonded body, exposed to ultraviolet light, and developed.
１３０℃で６０分間加熱硬化を行なった後、塩化第二鉄
溶液中に浸せきし、第２図の斜線部分が完全に除去され
るまでエツチングを行なった。エツチング終了後レジス
トを除去した。この時の断面を第３図に示す。図から理
解出来る様に、プレスで押し込んだ板厚までエツチング
すれば良いので、エツチングダレは（記号；ａ）１３０
μｍであり、精度的に問題のない製品が得られた。After heat curing at 130° C. for 60 minutes, it was immersed in a ferric chloride solution and etched until the shaded area in FIG. 2 was completely removed. After etching was completed, the resist was removed. A cross section at this time is shown in FIG. As you can understand from the figure, it is only necessary to etch to the thickness of the plate pressed in with a press, so the etching sag is (symbol; a) 130
μm, and a product with no problems in accuracy was obtained.
比 較 例
実施例−１に示したと同様の銅板に、実施例−１と同様
のプレス加工をＵず、均一な厚さのままアルミナ基盤に
直接接合させ、実施例−１と同様の方法でエツチングを
行なった。エッヂングダレは第４図に示す形状となり、
（記号；ｂ）２６２μ雇であり、この為銅板表面の面積
が小さい製品となった。Comparison Example A copper plate similar to that shown in Example-1 was directly bonded to an alumina substrate with a uniform thickness without being pressed in the same manner as in Example-1. I did etching. The edging sag has the shape shown in Figure 4,
(Symbol; b) The thickness was 262μ, which resulted in a product with a small surface area of the copper plate.
発明の効果
上記のごとき本発明の方法によって製造した回路付金属
−セラミックス接合体は、金属板からプレスにより回路
となる部分以外の部分の板厚を、回路となる部分の板厚
より薄クシた金属板と、セラミックス基盤とを直接接合
した後、回路以外の部分をエツチングにより除去してつ
くられるものである為、エツチングダレが小さく、精度
良く回路構成され、回路部分の導体金属部が厚い接合体
として形成出来る。このため、本発明の方法によれば、
熱放散性、高周波特性に優れた製品を安価に得る事が出
来る。Effects of the Invention The metal-ceramic bonded body with a circuit produced by the method of the present invention as described above can be pressed from a metal plate so that the thickness of the part other than the part that becomes the circuit is thinner than the part that becomes the circuit. Since it is made by directly bonding a metal plate and a ceramic substrate and then removing the non-circuit parts by etching, etching sag is small, the circuit is constructed with high precision, and the conductive metal part of the circuit part is thickly bonded. It can be formed as a body. Therefore, according to the method of the present invention,
Products with excellent heat dissipation and high frequency characteristics can be obtained at low cost.
第１図は本発明で用いる、プレス加工により回路構成さ
れた銅板の断面図。
第２図は本発明で用いる、プレス加工により回路構成さ
れた銅板の平面図。
第３図はアルミナ１ｆｆｉにプレス加工により回路構成
された銅板を直接接合し、エツチングにより不要部分を
除去した後の断面図。
゛第４図は、アルミナ基盤に厚さの均一な銅板を直接接
合し、その後エツチングにより回路構成した後の断面図
。
１・・・銅 板
２・・・セラミックス基盤
３・・・プレス押し込み部FIG. 1 is a cross-sectional view of a copper plate used in the present invention, in which a circuit is formed by press working. FIG. 2 is a plan view of a copper plate used in the present invention and configured with a circuit by press working. Figure 3 is a cross-sectional view after a copper plate with a circuit structure is directly bonded to alumina 1ffi by press working and unnecessary parts are removed by etching.゛Figure 4 is a cross-sectional view after a copper plate of uniform thickness is directly bonded to an alumina substrate, and then a circuit is constructed by etching. 1...Copper plate 2...Ceramics base 3...Press press part
Claims (1)
部分以外の部分の板厚を回路となる部分の板厚より薄く
した金属板をつくり回路となる部分だけがセラミックス
に接触するように配置して該金属板とセラミックスとを
直接接合し、その後該金属板の回路となるべき部分だけ
がレジストで覆われるようにレジスト膜を形成した後エ
ッチングすることにより、該金属板の回路部分以外の部
分を除去することを特徴とする回路付金属−セラミック
ス接合体の製造方法。A metal plate is made from a continuous metal plate by pressing the parts other than the part that will become the circuit to be thinner than the part that will become the circuit, and placed so that only the part that will become the circuit is in contact with the ceramic. The metal plate and the ceramic are directly bonded together, and then a resist film is formed so that only the part of the metal plate that is to become the circuit is covered with resist, and then etched, thereby removing the parts of the metal plate other than the circuit part. 1. A method for manufacturing a metal-ceramic bonded body with a circuit, characterized by removing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10893586A JPS62264689A (en) | 1986-05-13 | 1986-05-13 | Manufacture of metal-ceramics junction unit with circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10893586A JPS62264689A (en) | 1986-05-13 | 1986-05-13 | Manufacture of metal-ceramics junction unit with circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62264689A true JPS62264689A (en) | 1987-11-17 |
Family
ID=14497378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10893586A Pending JPS62264689A (en) | 1986-05-13 | 1986-05-13 | Manufacture of metal-ceramics junction unit with circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62264689A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038A1 (en) * | 1990-04-16 | 1992-04-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| JP2594475B2 (en) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | Ceramic circuit board |
| JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
| JP2017085077A (en) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | Metal plate molding for circuit board and method for manufacturing power module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5541744A (en) * | 1978-09-19 | 1980-03-24 | Tokyo Shibaura Electric Co | Method of manufacturing printed circuit board |
-
1986
- 1986-05-13 JP JP10893586A patent/JPS62264689A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5541744A (en) * | 1978-09-19 | 1980-03-24 | Tokyo Shibaura Electric Co | Method of manufacturing printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038A1 (en) * | 1990-04-16 | 1992-04-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| US5354415A (en) * | 1990-04-16 | 1994-10-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for forming a ceramic circuit board |
| JP2594475B2 (en) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | Ceramic circuit board |
| EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| JPH09181423A (en) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | Ceramic circuit board |
| JP2017085077A (en) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | Metal plate molding for circuit board and method for manufacturing power module |
| JP2018041973A (en) * | 2015-10-27 | 2018-03-15 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
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