JPS62117387A - Manufacture of wiring substrate - Google Patents
Manufacture of wiring substrateInfo
- Publication number
- JPS62117387A JPS62117387A JP25721285A JP25721285A JPS62117387A JP S62117387 A JPS62117387 A JP S62117387A JP 25721285 A JP25721285 A JP 25721285A JP 25721285 A JP25721285 A JP 25721285A JP S62117387 A JPS62117387 A JP S62117387A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- become
- manufacturing
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、基板材料から所望の配線基板を作る配線基
板の製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a wiring board for making a desired wiring board from a substrate material.
所望の形状を有する配線基板を作る場合、従来、１枚の
基板材料から、このような配線基板を１つずつ切り出す
ことが行われている。しかしながら、配線基板上にチッ
プを搭載したり、ワイヤーボンディングを行ったりする
場合には、このように配線基板が１つずつ別れていたの
では、工程が複雑で生産性を向上させることもできない
。そこで、第４図（ａｌ、 ｆｂｌにみるような方法が
考えられたこの方法は、まず、積層板等の基板材料１を
用意し〔第４図４８１）、つぎに、この７．％板＋Ａ料
１上に、プレス打抜き等によってミシン口４・・・を入
れて、配線基板２の外形を形成するものである〔第４図
（ｂ）〕。このようにして外形が形成された配線基板２
は、第５図（ａ）にみるように、ミシン目４・・・の接
続部４ａ・・・によって基板材料１と接続されているた
め、この両者は、完全に分離されないでつながった状態
となっている。したがって、第４図４８１にみるように
、１枚の基板材料１上に複数の配線基板２・・・を形成
した場合であっても、１枚の基板材料１と同様に扱える
ため、それ以後の工程は単純化し、生産性も向上する。When manufacturing a wiring board having a desired shape, conventionally, such wiring boards are cut out one by one from a single board material. However, when mounting chips on a wiring board or performing wire bonding, if the wiring boards are separated one by one in this way, the process is complicated and productivity cannot be improved. Therefore, in this method, a method as shown in FIG. 4 (al, fbl) was considered. First, a substrate material 1 such as a laminate is prepared [FIG. 4 481], and then the method shown in 7. Perforations 4 are formed on the board + A material 1 by press punching or the like to form the outer shape of the wiring board 2 [FIG. 4(b)]. Wiring board 2 whose outer shape is formed in this way
As shown in FIG. 5(a), is connected to the substrate material 1 by the connection portion 4a of the perforation 4, so the two are not completely separated but connected. It has become. Therefore, as shown in FIG. 4 481, even if a plurality of wiring boards 2... are formed on one board material 1, they can be handled in the same way as one board material 1, and henceforth. This simplifies the process and improves productivity.
ところが、このようにミシン目４・・・によって外形を
形成する方法では、工程が完了して各配線基板２・・・
を基板材料１から切り離すと、第５図（ｂｌにみるよう
に、その端面にミシン１］４・・・の接続部分４ａが残
るため、端面の仕上げ加工を施さなければ、所望の形状
が得られず、問題となっている。However, in this method of forming the outer shape by the perforations 4..., each wiring board 2...
When the is separated from the substrate material 1, the connecting portion 4a of the sewing machine 1]4 remains on the end surface, as shown in FIG. This has become a problem.
この発明は、以上の問題に鑑みてなされたものであって
、端面の什ト−げ加工等が不要で、かつ、工程を屯純化
でき生産性の高い配線基板の製法を提供することを目的
としている。This invention was made in view of the above problems, and the purpose is to provide a manufacturing method for a wiring board that does not require processing such as edge finishing on the end face, can simplify the process to a large extent, and has high productivity. It is said that
以上の目的を達成するため１、この発明は、所望の配線
基板となる部分を含んだ基板材料から前記配線基板を得
るにあたり、半抜き加圧によって前記基板材料における
配線基板となる部分を相対的に突出させ、それ以外の部
分を相対的にへこませて配線基板の外形を形成するとと
もに１、ての配線基板となる部分をそれ以外の部分で保
持するようにして次工程へ送ることを特徴とする配線基
板の製法を要旨としている。なお、この発明でいう半抜
き加■、とは、プレス打抜きを途中で止める、いわゆる
、半抜き加工や、後述するように、プレス打抜きを行っ
たあと、その部分を再度元の穴に途中まで戻しおさめる
、いわゆる、ブソシプ、バンク加工等を言う。In order to achieve the above objects, 1. In obtaining the wiring board from a board material including a portion to become a desired wiring board, the part to become the wiring board in the board material is relatively The outer shape of the wiring board is formed by making the wiring board protrude and the other parts are relatively recessed, and 1. The part that will become the wiring board is held by the other parts and sent to the next process. The gist is the manufacturing method of the featured wiring board. Note that "half-blanking" in this invention refers to so-called half-blanking processing in which press punching is stopped midway, and as will be described later, after press punching is performed, the part is re-inserted halfway to the original hole. It refers to the so-called busoshipu, bank processing, etc.
以下に、この発明を、その一実施例をあられず図面を参
照しつつ、くわしく説明する。Hereinafter, one embodiment of the present invention will be explained in detail with reference to the drawings.
以下の実施例では、製造される配線基板が、素子の搭載
用等に用いられる凹部（窪穴：キャビティ）を有したも
のである場合を示しているが、この発明は、このような
凹部を有さない配線基板の製造に適用することも、もち
ろん、可能である。In the following example, a case is shown in which the wiring board to be manufactured has a recess (cavity) used for mounting elements, etc., but the present invention does not require such a recess. Of course, it is also possible to apply the present invention to the manufacture of wiring boards that do not have the same.
まず、第１図（ａｌ、 （ｂｌの実施例について、説明
する。First, the embodiment shown in FIGS. 1(al and bl) will be described.
所望の配線基板となる部分を含んだ基板材料ｌを用意す
る。このような基板材料１としては、たとえば、ガラス
布にエポキシ樹脂を含浸、硬化させたもの等があげられ
るが、半抜き加工が可能であれば、それ以夕）の（Ａ料
からなるものを用いることもできる。また、ぞの表面に
、半抜き加工前にあらかじめ、回路を形成しておくこと
もでき、そのようにすることで、配線基板の凹部内等に
も容易に回路を形成できるようにもなる〔第１図（ａ）
〕所定の形状のＩ゛１抜き型を装着したプレス機械によ
って、前記基板材料１＋の配線基板２となる部分を半抜
き加下し、この配線基板２となる部分を相対的に突出さ
せ、基板材料１のそれ以外の部分を相対的にへこませて
、配線基板２の外形を形成するとともに、配線基板２内
の所定の場所を相対的にへこませて凹部３を形成する。A substrate material 1 containing a portion that will become a desired wiring board is prepared. Examples of such substrate material 1 include glass cloth impregnated with epoxy resin and cured. It is also possible to form a circuit on the surface of the groove in advance before the half-blanking process, and by doing so, it is possible to easily form a circuit even in the recess of the wiring board. [Figure 1 (a)
] Using a press machine equipped with an I1 cutting die of a predetermined shape, the part that will become the wiring board 2 of the board material 1+ is half-cutted, the part that will become the wiring board 2 is relatively protruded, and the board is cut out. The other parts of the material 1 are relatively recessed to form the outer shape of the wiring board 2, and a predetermined location within the wiring board 2 is relatively recessed to form a recess 3.
このように打抜き型によって半抜き加工を行うためには
、プレス機械のシリンダ等を調整して、そのストローク
を基板材料１の厚み以下にし、完全に打抜かれてしまわ
ないようにずればよい６ｊ：た、凹部３の深さも、ごの
ストローク調整によ−）で行うことができる〔第１図（
ｂ）〕。In order to perform half punching with a punching die in this way, it is necessary to adjust the cylinder of the press machine, etc. so that the stroke is equal to or less than the thickness of the substrate material 1, and to deviate so as not to completely punch out 6j: In addition, the depth of the recess 3 can also be adjusted by adjusting the stroke (see Fig. 1).
b)].
このようにして外形や凹部３が形成された配線基板２ば
、第３図（ａ）にみるように、基板材料１のその他の部
分から半抜き加＝１゛された状態で、この基板材料Ｉに
おける、前記その他の部分によって保持されるようにな
っている。このため、図にみるように、１枚の基板材料
１上に、複数の配線基板２・・・が形成された場合であ
っても、１枚の基板材料Ｉと同様に扱え、それ以後の工
程は単純化できて、自動化が容易であり、生産性も向上
する。しかも、この配線占（板２は、前述し７たよう乙
こ、所定の形状を有する打抜き型によって半抜き加工さ
れたものであって、！、（板＋４’ｆ’＋１のそれ以外
の部分とは、１トに接触し”ζ保持されているだ番」で
ある。このため、ビン打加−１“やチップ搭載、ワイヤ
ーボンディング等の工程が完了して基板＋４料１から抜
き出したこの配線）、（板２は、第３図（ｂｌにみるよ
うに、すでに外形が出来あがっており、従来のように端
面の仕］二げ加圧を施ず必要がないのである。As shown in FIG. 3(a), the wiring board 2 with the outer shape and the recess 3 formed in this way is half-blanked from the other parts of the board material 1. It is held by the other parts of I. Therefore, as shown in the figure, even if a plurality of wiring boards 2 are formed on one board material 1, they can be handled in the same way as one board material I, and subsequent The process can be simplified, automated easily, and productivity improved. Moreover, this wiring board 2 is half-cutted using a punching die having a predetermined shape as described in 7 above. is the number that is in contact with 1 and is held "ζ".Therefore, this is the number that is extracted from the board + 4 material 1 after the processes such as bottle stamping - 1, chip mounting, and wire bonding have been completed. As shown in FIG. 3 (bl), the outer shape of the board 2 has already been completed, and there is no need to apply pressure to the end surface as in the past.
つぎに、第２図（ハ）〜（Ｃ１の実施例について説明す
る。Next, the embodiments shown in FIGS. 2(C) to (C1) will be described.
この実施例においても、使用できる基板材料Ｉの種類は
、先の実施例とかわらない。すなわち、基板材料１とし
ては、半抜き加工が可能な＋Ａ料であれば、通常このよ
うな配線２１（板用途に用いられる、あらゆるものを使
用することができる。また、その表面に、半抜き加工前
に、あらかしめ、回路を形成しておくこともでき、その
ようにすることで、配線基板の凹部内等に容易に回路を
形成できることも、先の実施例と同じである〔第２図（
ａｌ〕。In this embodiment as well, the type of substrate material I that can be used is the same as in the previous embodiment. That is, as the substrate material 1, any type of wiring 21 (generally used for board applications) can be used as long as it is a +A material that can be processed by half-blanking. It is also possible to form a rough circuit before processing, and by doing so, the circuit can be easily formed in the recess of the wiring board, as in the previous embodiment [Second Embodiment] figure(
al].
所定の形状のＩ■抜き型を装着したプレス機織によって
、前記基板材料１トの配線基板２となる部分を打抜く。A portion of the board material 1 that will become the wiring board 2 is punched out using a press machine equipped with an I-cutting die of a predetermined shape.
それと同時に、この打抜き型によって、配線基板２の凹
部３となる部分２ａをも、この配線基板２から打抜く
〔第２図（ｈ）〕。At the same time, a portion 2a that will become the recess 3 of the wiring board 2 is also punched out from the wiring board 2 using this punching die.
[Figure 2 (h)].
以以上のようにして打抜かれた部分を、打抜き型の戻り
等の工程時６．二元の穴に途中まで戻しおさめ（再度押
込み）、配線基板２には凹部３を形成するとともに、こ
の配線基板２を、基板材料１のそれ以外の部分で保持す
る。このように、打抜いた部分を穴の途中まで戻し２お
さめるためには、プレス機杭に、埋込み量を調整、管理
する冶具を設けてやればよい〔第２図（Ｃ）〕。6. During the process of returning the punching die, etc., the punched part as described above is removed. The wiring board 2 is returned part way into the binary hole (pushed in again) to form a recess 3 in the wiring board 2, and the wiring board 2 is held by the other part of the board material 1. In this way, in order to return the punched part to the middle of the hole and embed it in the hole, the press pile may be provided with a jig for adjusting and controlling the amount of embedding [Figure 2 (C)].
以上のようにし２て外形や凹部３が形成された配線基板
２は、やはり、先の実施例と同じく、第３図ｆａ）にみ
るように、基板材料１のその他の部分によって保持され
るようになっていて、複数の配線基板２・・・が同一・
の基板（Ａ料１上に形成さでも１枚のものとして扱える
ため、それ以後の工程は単純化でき、自動化が容易で生
産性も向上する。The wiring board 2 in which the outer shape and the recessed part 3 are formed as described above is also held by the other parts of the board material 1, as in the previous embodiment, as shown in FIG. 3 fa). , and multiple wiring boards 2... are the same
Even if it is formed on the substrate (A material 1), it can be treated as one piece, so subsequent steps can be simplified, automation is easy, and productivity is improved.
しかも、第３図（ｂ）にみるように、基板＋４料１から
抜き出した配線基板２は、すでに外形が出来あがってい
て、端面の仕」二げ加工を施す必要もない。Moreover, as shown in FIG. 3(b), the wiring board 2 extracted from the board + 4 material 1 already has an outer shape, and there is no need to finish the end surface.
これまでは、この発明の配線基板の製法について、以上
２つの実施例に基づいてのみ説明してきたが、この発明
の構成は、以」二の実施例に限られるものではない。た
とえば、以−にの実施例では、いずれも、配線基板２が
凹部３を有するものであったが、前述したよ・うに、こ
の発明は、凹部３を有さない配線基板の製造に適用する
こともできる。また、凹部３が、半抜き加］に時に同時
に形成される必要もなく、座ぐり加工等によって別Ｔ程
で形成されるようであっ“Ｃも構わない。しかしながら
、以千２つの実施例の、■、うに、半抜き加玉時に同時
にこの凹部３を形成するようにしておけば、工程が少な
くなるばかりでなく、配線基板２と凹部３との位置関係
や、凹部３の寸法形状等は、同じ打抜き型を使用すれば
常に一定にすることができるため、その精度を高めるこ
とも容易となる。Up to now, the method for manufacturing a wiring board according to the present invention has been described only based on the above two embodiments, but the structure of the present invention is not limited to the following two embodiments. For example, in all of the embodiments described above, the wiring board 2 has the recess 3, but as described above, the present invention can be applied to manufacturing a wiring board that does not have the recess 3. You can also do that. In addition, the recess 3 does not need to be formed at the same time as the half-blanking process, but may be formed in a separate process by counterbore process or the like. If the recess 3 is formed at the same time as the half-blanking process, not only will the number of steps be reduced, but the positional relationship between the wiring board 2 and the recess 3, the size and shape of the recess 3, etc. If the same punching die is used, it can be kept constant at all times, making it easy to improve the accuracy.
さらに、このように半抜き加圧によって形成された凹部
３は、座ぐり加工によるもののように仕」二げ加工を行
う必要がないため、生産性も高い。また、以上２つの実
施例では、１枚の基板材料から複数の配線基板が形成さ
れるよ・うになっているが、１枚の基板材料から１枚の
配線基板が形成されるようであってもかまわない。そし
て、その場合にも、この発明によれば、配線基板は基板
材料によって保持されて次工程へ送られるようになって
いるため、たとえば、基板材料を同一・の形状にしてお
けば、配線基板の形状が異なる場合でも同一のラインに
よって作業を行・うことができ、工程を単純化すること
もできるのである。Furthermore, the recess 3 formed by half-blanking and pressurizing in this manner does not require finishing and finishing unlike counterbore machining, resulting in high productivity. Furthermore, in the above two embodiments, a plurality of wiring boards are formed from one board material, but it seems that one wiring board is formed from one board material. I don't mind. Even in that case, according to the present invention, the wiring board is held by the board material and sent to the next process, so for example, if the board material is made into the same shape, the wiring board Even if the shapes of the parts are different, the work can be done on the same line, simplifying the process.
以上のよ・うに、この発明の配線基板の製法では、半抜
き加工によって基板材料から所望の形状の配線基板を相
対的に突出させて外形を形成するとともに、基板材料の
その他の部分によってこの配線基板を保持するようにｔ
（っているため、たとえば、１枚の基板材料」−に複数
の配線基板が形成されるようであっても、１枚の基板材
料単位様に扱え、それ以降の］′、程を中線化できて、
自動化が容易であり、生産性が高い。しかも、このよう
にして形成された配線基板は、半抜き加工時に、すでに
外形が出来あがっているため、端面の仕−Ｌげ加工も不
要である。As described above, in the method for manufacturing a wiring board of the present invention, a wiring board of a desired shape is relatively protruded from the board material by half-blanking processing to form the outer shape, and the wiring board is formed using other parts of the board material. T to hold the board
(For example, even if multiple wiring boards are formed on one board material, it can be treated as one board material unit. I was able to turn it into
Easy to automate and high productivity. Furthermore, since the wiring board formed in this way has already been formed into an outer shape during the half-blanking process, there is no need to finish and curve the end face.
この発明の配線基板の製法は、以」二のように構成され
ており、半抜き加工によって基板材料から配線基板の外
形を形成するとともに、基板材料によってこの配線基板
を保持するようになっているため、その後の工程では、
配線基板をこの基板材料単位で加工することができ、工
程を単純化できて、自動化が容易であり、生産性が高い
。しかも配線基板は半抜き加工によってずでに外形が完
成されているため、その後に、端面の仕上げ加工等を行
う必要もなくなってしまう。The method for manufacturing a wiring board of the present invention is configured as follows: the outer shape of the wiring board is formed from the board material by half-blanking, and the wiring board is held by the board material. Therefore, in the subsequent process,
The wiring board can be processed in units of this board material, the process can be simplified, automation is easy, and productivity is high. Furthermore, since the outer shape of the wiring board has already been completed by half punching, there is no need to perform finishing work on the end face afterwards.
第１図（ａｌ、 （ｂ）はこの発明の一実施例の工程を
あられず説明図、第２図（ａｌ〜ｆｃ）はこの発明の別
の実施例の工程をあられず説明図、第３図ｆａｌばこの
発明によって形成された配線基板の基板材料による保持
状態をあられす平面図、第３図（ｂｌはこの発明によっ
て形成された配線基板を基板材料から抜き取った状態を
あられず平面図、第４図（ａｌ、 （ｂｌは、従来の配
線基板の製法の１−程をあられず説明図、第５図（ａｌ
はこの従来例における配線基板の基板材料による保持状
態をあられす平面図、第５図０））は従来例によって形
成された配線基板を基板材料から切り離した状態をあら
れす平面図である。
ｌ・・・基板材料 ２・・・配線基板
代理人 弁理士 松 本 武 彦
第１図
第２図
第３図
（ａ）（ｂ）
（ａ）
第
（ａ）
４図
（ｂ）
（ｂ）
ａFigures 1 (al and b) are explanatory views of the steps of one embodiment of this invention, Figures 2 (al to fc) are explanatory views of the steps of another embodiment of this invention, and Figure 3 is an explanatory diagram of the steps of another embodiment of this invention. Figure fal is a plan view showing the state in which the wiring board formed according to the present invention is held by the board material; FIG. Figure 4 (al), (bl) is an explanatory diagram of step 1 of the conventional wiring board manufacturing method, and Figure 5 (al).
5 is a plan view showing the state in which the wiring board is held by the board material in this conventional example, and FIG. l... Board material 2... Wiring board agent Patent attorney Takehiko Matsumoto Figure 1 Figure 2 Figure 3 (a) (b) (a) Figure 4 (b) (b) a
Claims (5)
前記配線基板を得るにあたり、半抜き加工によって前記
基板材料における配線基板となる部分を相対的に突出さ
せ、それ以外の部分を相対的にへこませて配線基板の外
形を形成するとともに、この配線基板となる部分をそれ
以外の部分で保持するようにして次工程へ送ることを特
徴とする配線基板の製法。(1) When obtaining the wiring board from a board material that includes a portion that will become the desired wiring board, the part that will become the wiring board in the board material is made to protrude relatively through a half-blanking process, and the other parts are relatively protruded. A method for manufacturing a wiring board, which is characterized in that the outer shape of the wiring board is formed by indenting the wiring board, and the part that will become the wiring board is held by other parts before being sent to the next process.
半抜き加工時に、同時に、配線基板となる部分からへこ
ませて形成されるようになっている特許請求の範囲第１
項記載の配線基板の製法。(2) The wiring board has a recess, and the recess is formed by recessing the portion that will become the wiring board at the same time during the half-blanking process.
Manufacturing method of wiring board described in section.
である特許請求の範囲第１項または第２項記載の配線基
板の製法。(3) The method for manufacturing a wiring board according to claim 1 or 2, wherein the half punching process is performed by stopping press punching midway.
部分を再度元の穴に途中まで戻しおさめるプッシュバッ
ク加工である特許請求の範囲第１項または第２項記載の
配線基板の製法。(4) The method for manufacturing a wiring board according to claim 1 or 2, wherein the half-blanking process is a push-back process in which the half-blanking process is performed and then the part is partially returned to the original hole.
られている特許請求の範囲第１項から第４項までのいず
れかに記載の配線基板の製法。(5) The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein a single board material is provided with a plurality of parts that become wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25721285A JPS62117387A (en) | 1985-11-15 | 1985-11-15 | Manufacture of wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25721285A JPS62117387A (en) | 1985-11-15 | 1985-11-15 | Manufacture of wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62117387A true JPS62117387A (en) | 1987-05-28 |
Family
ID=17303216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25721285A Pending JPS62117387A (en) | 1985-11-15 | 1985-11-15 | Manufacture of wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62117387A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017085102A (en) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
| WO2018211640A1 (en) * | 2017-05-17 | 2018-11-22 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
-
1985
- 1985-11-15 JP JP25721285A patent/JPS62117387A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017085102A (en) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
| JP2017085077A (en) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | Metal plate molding for circuit board and method for manufacturing power module |
| WO2018211640A1 (en) * | 2017-05-17 | 2018-11-22 | Ｊｘ金属株式会社 | Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module |
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