JPS5810889A - Method of dividing board into multiple boards - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for dividing a multi-chip substrate, and more particularly to a method for dividing a multi-chip substrate.

Figures 1 to 4 are explanatory diagrams showing an example of a method for dividing a conventional multi-chip board, and Fig. 1 is a front view showing a conventional multi-chip board having perforations on which circuit components are mounted. , FIG. 2 is a side view of FIG. 1, FIG. 6 is a front view showing a printed circuit board formed by division, and FIG. 4 is a side view of FIG. 6. The multi-chip board 1 shown in FIG. 1 is made up of eight printed circuit boards 5, each having a circuit component 4, arranged in series through connecting portions 6 formed by perforations 2. Such a board 1 is obtained by making perforations 2 in a predetermined board material, mounting circuit components 4 thereon, and soldering them. Conventionally, such a multi-piece board 1 is bent at two large parts of the sewing machine, that is, the joint part 6, by an operator's hand or with a jig or the like, as shown by the arrow 6 in FIG. Section 6.4
A method of dividing the circuit board into separate printed circuit boards 5 as shown in the figure has been used.

However, the conventional dividing method of dividing in this way has the following disadvantages.

■ A sixth layer is formed on the end surface of the printed circuit board 5 formed by dividing.
As shown in the figure, a sawtooth-like remaining portion 7 of the substrate is generated, and as a result, the external dimensions become irregular.

■ When the printed circuit board 5 formed in this way is assembled into a predetermined chassis 8 as shown in FIG. It can be difficult. In FIG. 5, 10 is a lead leg of a circuit component, and 11 is a solder. Furthermore, the inventors have confirmed that the above-mentioned gap a is generally around 1 mm.

(2) Since the impact generated when the circuit parts 4 and the pattern 9 are bent and divided in the direction of the arrow 6 in FIG. 2 is transmitted to the circuit parts 4 and the pattern 9, cracks are likely to occur in these circuit parts 4 and the like.

6 to 10 are explanatory diagrams showing another example of a method for dividing a conventional multi-chip board, and FIG. 6 is a front view showing a conventional multi-chip board having a V-groove on which circuit components are mounted. , FIG. 7 is a lower side view of FIG. 6, FIG. 8 is a right side view of FIG. 6, FIG. 9 is a front view showing the printed circuit board formed by division, and FIG. 10 is a side view of FIG. 9. It is a diagram. The multi-piece nine board 12 shown in FIG. 6 is made up of eight printed circuit boards 15, each having a circuit component 14, arranged in series via a V-groove 16. Similar to the above-mentioned substrate 1, such a substrate 12 is made of a predetermined substrate material with a groove processed to form a V-groove 16.
is formed, and then the circuit component 14 is mounted and obtained by soldering. And traditionally,
This multi-piece board 12 is bent at the V-groove 16 by hand or with a jig or the like by an operator as shown by the arrow 16 in FIG. 7 to form a separate body as shown in FIG. 9.10. A method of dividing the printed circuit board 15 into several printed circuit boards 15 has been used.

However, even with the conventional dividing method of dividing in this way, there are problems listed below.

■ As shown in FIG. 11, the remaining portion 1 of the printed circuit board 15 is shaped like Teenoζ and sawtooth on the pheasant side of the printed circuit board 15 formed by the division.
7 occurs, resulting in irregular external dimensions.

■ The printed circuit board 15 formed in this way is
When assembled into a predetermined chassis 18 as shown in the figure, the gap between the end of the notch 19 of the printed circuit board 15 and the chassis 18 tends to be large, making soldering difficult. In FIG. 11, 20 is a lead leg of a circuit component, and 21 is a solder. Furthermore, the inventors have confirmed that the above-mentioned gap is generally Q, about 5 mm.

(2) Since the impact when dividing by bending in the direction of arrow 16 in FIG. 7 is transmitted to the circuit components 14 and 19, cracks are likely to occur in these circuit components 14 and the like.

■ Manufacturing cost increases as V-groove processing is required.

■ ■ It is impossible to mount components with chip surfaces due to warping of the board due to variations in the depth of the grooves 13 that occur during groove machining.

(2) When the material of the multi-cavity substrate 12 is glass epoxy, (2) the blade is significantly worn during groove machining, which increases the manufacturing cost. Furthermore, in this case, there is a problem that mass production is poor due to the labor required to replace the blade.

(2) Since V-groove processing can generally only be performed in a straight line direction, it is difficult to apply it to manufacturing a large number of printed circuit boards with complicated shapes.

The present invention has been made in view of the actual situation in the prior art, and its purpose is to be able to divide a multi-chip board into a plurality of printed circuit boards having neat end surfaces;
Another object of the present invention is to provide a method for dividing a multi-chip board, which can minimize impact on circuit components and the like during division.

To achieve this objective, the present invention uses a specific mold to divide a multi-chip board into a plurality of single printed circuit boards, the mold being formed on the multi-chip board. A plurality of punches are disposed at positions facing the joints forming the boundaries of the individual printed circuit boards, and have shapes and dimensions that are equal to or slightly larger than the joints, and these punches are housed so as to be movable up and down. a punch plate having a hole capable of housing a circuit component; and a die plate having a hole at an opposing position into which the punch can be inserted.

Hereinafter, a method for dividing a multi-piece substrate according to the present invention will be explained based on the drawings. 12 to 16 are explanatory diagrams showing one embodiment of the present invention, FIG. 12 is a front view showing a multi-chip board on which circuit components are mounted, and FIG. 13 is a multi-chip board shown in FIG. 12. FIG. 14 is a side view showing the state when the board is divided; FIG. 14 is a front view showing the printed circuit board formed by dividing;
5 is a side view of FIG. 14, and FIG. 16 is a partially enlarged view of FIG. 15. The multi-piece substrate 22 shown in FIG.
It is made up of eight printed circuit boards 26 each having a surface-mounted circuit component 25 connected thereto. Such a board 22 is obtained by drilling a through hole 25 in a predetermined board material and fixing the surface-mounted circuit component 25 to the board via an adhesive 27. Note that the above-mentioned connecting portion 24 can have a rectangular shape with a width of 1 mm and a length of 3 mm, for example.

In the present application, such a multi-cavity board 22 is divided using a specific splitting die, and the splitting die is, for example, the 13th splitting die.
In other words, this split mold has the configuration as shown in the figure, consisting of a punch 28, a punch plate 29, and a die plate 3.
The punch 28 consisting of 0 is disposed at a position facing the connecting portion 24 of the multi-cavity substrate 22, and has a shape and size that is equal to or slightly larger than the connecting portion 24, for example, 1.5 mm in width and 1.5 mm in length. It has a rectangular cross section with a diameter of 4 mm, and has a cross section of 26 mm, corresponding to the number of connecting parts 24.
This is the actual setting. Also, the punch plate 29 is connected to the punch 28
is arranged so as to surround the hole 31 in which is accommodated in a vertically movable manner, the outer periphery of the punch 28, and the substrate holding part 62 having a thickness of, for example, 2 mm, and the part where the circuit component 25 is not added, It has a substrate holding part 33 with a diameter of, for example, 5 mm, and a cavity 34 with a height of, for example, 3 mm, in which the circuit component 25 can be accommodated. Further, the die plate 30 is provided with 26 punch holes 35 at positions facing the punches 28 into which the punches 28 can be inserted.

Then, at our company, we use the above-mentioned split mold, that is, as shown in FIG. 13, we place the multi-cavity substrate 22 shown in FIG. By lowering 28 in the direction of arrow 36, each of the connecting portions 24 can be punched out and divided into eight printed circuit boards 26. The printed circuit board 26 formed in this way is
1415.1 because it is a mechanical division according to 8.
As shown in FIG. 6, the end surface is extremely neat without becoming sawtooth or tapered, and the end surface does not protrude outside from the end surface of the connecting portion 24. Also, the punch plate 29 has a substrate holding portion. 32, 33 and the cavity 64, the influence of impact on the circuit components 25 when the punch 28 is lowered can be minimized. The printed circuit board 26 thus obtained is the 17th printed circuit board 26.
When assembled into a predetermined chassis 37 as shown in the figure, the gap C between the end of the pattern 38 of the printed circuit board 26 and the chassis 37 can be made small, for example Q, 2 mm. Therefore, soldering between the chassis 37 and the pattern 38 becomes easier. In addition, in FIG. 17, 39 is solder.

In the above description, eight printed circuit boards 26 are arranged in series on the multi-chip board 22, but it goes without saying that the number of printed circuit boards is not limited to eight. Furthermore, it goes without saying that the number and shape of the connecting portions 24, the number and shape of the punches 28, the number of punch holes 35, the thickness of the substrate holding portions 32 and 33, and the height of the cavity 54 are not limited to those described above. It is. Further, the dividing method of the present invention can be applied to a multi-piece substrate having perforations as shown in FIG.

Since the multi-chip board dividing method of the present application is configured as described above, it is possible to easily obtain printed circuit boards with neat end faces, and to minimize the impact on circuit components etc. during division. As a result, the shape and dimensions of the divided printed circuit boards are stabilized, and the soldering work becomes easier, which improves the efficiency of dividing work and mass productivity compared to the past. This has the effect of reducing costs.

[Brief explanation of the drawing]

Figures 1 to 4 are explanatory diagrams showing an example of a method of dividing a conventional multi-chip board, and Fig. 1 is a front view showing a conventional multi-chip board with holes and holes on which circuit components are mounted. , FIG. 2 is a side view of FIG. 1, FIG. 6 is a front view showing the printed circuit board formed by division, FIG. 4 is a side view of FIG. 6, and FIG. 5 is the printed circuit shown in FIG. 3. Figure 6 is a partial cross-sectional view showing how the board is assembled into the chassis, and Figure 10 is an explanatory diagram showing another example of the conventional method of dividing a multi-chip board. FIG. 7 is a front view showing a conventional multi-chip board with grooves, FIG. 7 is a lower side view of FIG. 6, FIG. 8 is a right side view of FIG. 6, and FIG. 9 is a printed circuit board formed by dividing. 10 is a side view of FIG. 9, FIG. 11 is a partial side view showing a state in which the printed circuit board shown in FIG. 9 is assembled into the chassis, and FIGS.
FIG. 6 is an explanatory diagram showing one embodiment of the present invention, and FIG. 12 is a front view showing a multi-chip board on which circuit components are mounted. FIG. 13 is a diagram showing the multi-chip board shown in FIG. 14 is a front view showing the printed circuit board formed by division, FIG. 15 is a side view of FIG. 14, FIG. 16 is a partially enlarged view of FIG. 15, and FIG. 17 is a front view showing the printed circuit board formed by division. 15 is a partial side view showing a state in which the printed circuit board shown in FIG. 14 is assembled into a chassis. FIG. 1.22...Multi-piece board 2...Perforation hole 26...Through hole 24...
Connecting portion 25... Surface mounted circuit component 26... Printed circuit board 27... Adhesive 28 Punch
29... Punch plate 30... Die rate
61... Hole 32-133... Board holding part slot 4... Cavity 35... Punch hole slot 8...
Pattern agent patent attorney Junnosuke Nakamura 1 Figure

Claims (1)

[Claims] (1) In a method for dividing a multi-chip board, in which a multi-chip board formed by connecting a plurality of printed circuit boards in series via a joint part is divided into a plurality of separate printed circuit boards, the joint part A plurality of punches are disposed in a position facing the connecting portion and have a shape and size that is equal to or slightly larger than the shape and size of the connecting portion, and a hole in which these punches are accommodated so as to be movable up and down, and a hole that surrounds the outer periphery of the punches. a punch plate having a cavity capable of accommodating a board holding part disposed in the area where the circuit part is not attached, a board holding part placed in the part where the circuit component is not attached, and a punch plate into which the punch can be inserted into a position facing the punch; Using a split mold consisting of a die plate having punch holes, the nine multi-piece substrates are placed between the die plate and the upstream punch plate, and the connecting portions are punched out with the punch. A method for dividing a multi-chip board, characterized by dividing it into separate printed circuit boards.