JP2000068613A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the number of rectangular circuit boards, which can be manufactured from one sheet of a material substrate, in a hybrid integrated circuit device to contrive to reduce the manufacturing cost of the device. SOLUTION: This method of manufacturing a hybrid integrated circuit device is a method wherein slits are bored in the parts of the two sides 11a and 11c, which are extended in parallel in the column direction of circuit boards 11 arranged in line in the form of matrix on a material substrate 12, out of the four sides of each of the circuit boards 11, while the substrate 12 is cut by a receiving cutter blade 15 and a press cutter blade 16 on cutting-plane lines 17 along the two sides 11d and 11b, which are extended in parallel in the row direction of the boards 11, out of the four sides of each circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a hybrid integrated circuit device having a rectangular circuit board among hybrid integrated circuit devices.

[0002]

2. Description of the Related Art Conventionally, in manufacturing a hybrid integrated circuit using a rectangular circuit board, as shown in FIG. 3, a plurality of rectangular circuit boards 1 having a width dimension W and a length dimension L are vertically and horizontally arranged. A material substrate 2 which can be made simultaneously in a matrix state is prepared, and a narrow slit hole 3 is formed in each of the circuit boards 1 in the material substrate 2. A plurality of narrow pieces 4 are provided in the middle of the slit holes 3 so as to surround the outside, and each of the circuit boards 1 is connected to each of the narrow pieces 4.
And is integrally connected to the material substrate 2 through the substrate.

After forming a wiring pattern on each of the circuit boards 1 on the material substrate 2 and mounting various components such as electronic parts or metal pieces, the circuit boards 1 are removed from the surroundings. The method of cutting each narrow piece 4 from above to separate it from the material substrate 2 is adopted.

[0004]

However, in this conventional method, a portion of each circuit board 1 in the material board 2 is
The slit holes 3 are formed so as to surround the outside of the circuit board 1, and a plurality of narrow pieces 4 are provided in the middle of the slit holes 3. The circuit board 1 is integrally connected to the material substrate 2 through the slits 3. In other words, all the four sides of each circuit board 1 are configured to be surrounded by the slit holes 3, so Two slit holes 3 are formed in both the circuit boards arranged in the horizontal direction and the circuit boards arranged in the horizontal direction, and each circuit board 1 is firmly attached to the material substrate 2. Have to be fairly widely spaced for support.

In other words, in the conventional method, the arrangement interval of the circuit boards 1 on one material substrate 2 is set to two for both the arrangement interval P1 in the row direction and the arrangement interval P2 in the column direction. The number of circuit boards that can be manufactured from one material substrate is reduced by that much because the number of slit holes 3 must be increased to provide the slit holes 3.

In addition, when each circuit board 2 is separated from the material board 1, the respective circuit boards 1
It is necessary to cut each narrow piece 4 integrally connected to a single tool with a special tool, which requires a considerable amount of work. There is a problem that the manufacturing cost of the hybrid integrated circuit device is considerably increased in combination with the small number of circuit boards that can be formed.

An object of the present invention is to provide a manufacturing method which can solve this problem.

[0008]

In order to achieve this technical object, a method of the present invention is to provide a method in which "a plurality of rectangular circuit boards are arranged side by side in a matrix of vertical and horizontal directions on a single material substrate. Of the four sides of each circuit board, two sides extending parallel to the column direction of each circuit board, or two sides extending parallel to the row direction of each circuit board, slit holes are formed between these two sides. After drilling so as to extend over the entire length, then, after a step of forming a wiring pattern on each circuit board in the material substrate, and a step of mounting various components such as electronic components or metal pieces, the material substrate, Of the four sides of each circuit board, two sides extending parallel to the row direction on each circuit board, or
Each of the circuit boards is cut along two sides extending parallel to the column direction. Is the thing.

[0009]

In this configuration, of the four sides of each circuit board of the material substrate, two sides extending parallel to the column direction of each circuit board, or two sides extending parallel to the row direction of each circuit board. In the portion of one side, a slit hole is formed so as to extend over the entire length of the two sides, so that the material substrate is parallel to the row direction of each circuit board among the four sides of each circuit board. By cutting along two sides extending in parallel with each other, or along two sides extending parallel to the column direction in each circuit board,
Each circuit board can be separated.

That is, according to the present invention, the material substrate is formed of two sides extending parallel to the row direction of each circuit board or two sides extending parallel to the column direction of each circuit board among the four sides of each circuit board. It is to separate each circuit board by cutting along the side, and it is necessary to form two slit holes between the circuit boards arranged in the column direction or the row direction as in the conventional case. Therefore, the arrangement interval in the column direction or the row direction on each circuit board can be narrowed by the amount that two slit holes are not provided therebetween.

Further, by forming slit holes on two sides extending parallel to the column direction or the row direction among the four sides of each circuit board, the material substrate can be moved in the column direction or the row direction and the row direction. Alternatively, each circuit board can be separated only by cutting along the row direction or the column direction without cutting along the two directions of the column direction.

Therefore, according to the present invention, the number of circuit boards that can be manufactured from one material substrate, that is, the number of hybrid integrated circuit devices can be increased as compared with the conventional case, and each circuit board can be manufactured. Since the separation of each substrate can be performed extremely simply and quickly by a very common cutting device, the production cost of the hybrid integrated circuit device can be greatly reduced.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure,
Reference numeral 12 denotes a rectangular circuit board 1 having a width dimension W and a length dimension L.
1 shows a material substrate for simultaneously manufacturing a plurality of substrates. As shown in FIG. 1, the material substrate 12 includes a plurality of the circuit boards 11 in a matrix form in a column direction and a row direction. Each of the substrates 11 is arranged so as to leave an appropriate gap therebetween, and a margin is provided around the periphery.

Further, the material substrate 12 has four sides 11a, 11b, 11c, 11
d, two slits 13, 11 c are formed in two sides 11 a, 11 c of each circuit board 11 extending in parallel with the column direction.
14 is formed so as to extend over the entire length of the two sides 11a and 11c. Although not shown in the material substrate 12 manufactured in such a configuration, various wiring patterns are formed on each of the circuit boards 11 of the material substrate 12, and then electronic components and / or Various components such as metal pieces are mounted by soldering or the like.

Next, as shown in FIG. 2, the material substrate 12 is divided into four sides 11 on each circuit board 11 by a receiving cutter blade 15 and a pressing cutter blade 16 which moves up and down.
Cutting is performed at each cutting line 17 along two sides 11b and 11d extending in parallel with the row direction in each circuit board 11 among the lines a, 11b, 11c and 11d. By cutting along the cutting lines 17, the material substrate 12 can be separated into a plurality of circuit boards 11.

That is, according to the present invention, the material substrate 12 is divided into four sides 11a, 11b, 11c,
11d, each of the circuit boards 11 is separated by cutting along a cutting line 17 along two sides 11b and 11d extending in parallel with the row direction in each of the circuit boards. Since there is no need to form two slit holes between each of the circuit boards 11 as in the related art, the arrangement interval P0 in the column direction in each circuit board 11 is not necessary.
Can be made narrower by not providing two slit holes between them, and the cutting line 17
Can be extremely easily performed by a very ordinary general cutting device having the receiving cutter blade 15 and the holding cutter blade 16.

In the above embodiment, each circuit board 11
Of the four sides 11a, 11b, 11c, and 11d of the circuit board 11, slit holes 13 and 14 are formed in portions of the two sides 11a and 11c extending in parallel with the column direction. Of the four sides 11a, 11b, 11c, 11d of the circuit board 11, two sides 11 extending parallel to the row direction of each circuit board 11
Although the case where the cutting is performed along the cutting lines 16 along the lines b and 11d has been described, the present invention is not limited to this, and the circuit board 11 out of the four sides 11a, 11b, 11c, and 11d of the circuit board 11 is not limited thereto. , A slit hole is formed in a portion of the two sides 11b and 11d extending in parallel with the row direction, and the material substrate 12 is connected to the four sides 11
Of the circuit boards 11, a, 11b, 11c and 11d may be cut along respective cutting lines along two sides 11a and 11c extending parallel to the column direction.

However, when the target circuit board 11 is rectangular, slit holes are formed in the shorter side of the four sides, and the slit is cut along the longer side of the four sides. It is preferable to configure.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a material substrate used in an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which the material substrate is separated for each circuit board.

FIG. 3 is a perspective view showing a material substrate used in a conventional method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Circuit board 11a, 11b, 11c, 11d Four sides in circuit board 12 Material board 13, 14 Slit hole 15 Receiving cutter blade 16 Holding cutter blade 17 Cutting line

Claims (1)

[Claims] 1. A plurality of rectangular circuit boards are arranged on a single material board in a matrix of vertical and horizontal directions, and out of four sides of each of the circuit boards, extend in parallel with the column direction of each of the circuit boards. On two sides, or two sides extending parallel to the row direction in each circuit board, a slit hole is formed so as to extend over the entire length of the two sides,
Then, after a step of forming a wiring pattern on each circuit board in the material substrate, and a step of mounting various components such as electronic components or metal pieces, the material substrate is formed of four sides of each circuit board. A method of manufacturing a hybrid integrated circuit device, comprising cutting along two sides of each circuit board extending parallel to the row direction or two sides of each circuit board extending parallel to the column direction.