JP2911286B2 - Circuit board manufacturing method - Google Patents
Circuit board manufacturing methodInfo
- Publication number
- JP2911286B2 JP2911286B2 JP4027960A JP2796092A JP2911286B2 JP 2911286 B2 JP2911286 B2 JP 2911286B2 JP 4027960 A JP4027960 A JP 4027960A JP 2796092 A JP2796092 A JP 2796092A JP 2911286 B2 JP2911286 B2 JP 2911286B2
- Authority
- JP
- Japan
- Prior art keywords
- divided
- slit
- substrate
- circuit board
- guide groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Description
【０００１】[0001]
【産業上の利用分野】本発明は、縦横に複数の回路パタ
ーンを形成した基板を分割して複数の回路基板を製造す
る方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plurality of circuit boards by dividing a board on which a plurality of circuit patterns are formed vertically and horizontally.
【０００２】[0002]
【従来の技術】従来、部品の実装効率を上げる目的か
ら、一枚の基板に複数の回路パターンを形成してこの一
枚の基板から複数の回路基板が取れるようにしている。
これらの回路基板は例えば特開昭６１−２７６９６号公
報に開示されているように容易に分割できるように構成
されていて、部品を実装してハンダ付け等が終了し完成
品となった後分割されていた。2. Description of the Related Art Conventionally, in order to increase the mounting efficiency of components, a plurality of circuit patterns are formed on a single substrate so that a plurality of circuit boards can be removed from the single substrate.
These circuit boards are configured so that they can be easily divided as disclosed in, for example, Japanese Patent Application Laid-Open No. 61-27696. It had been.
【０００３】ところで、最近は容易に分割するための構
成として、図５に開示されているように、Ｘ方向、Ｙ方
向に分割案内溝（１）（１）…を形成するか、又は図６
に開示されているように、Ｘ方向にのみ分割案内溝
（１）（１）…を形成し、そしてＹ方向にはスリット
（２）…を形成するようにしている。[0003] Recently, as a configuration for easy division, as shown in FIG. 5, divided guide grooves (1) (1)... Are formed in an X direction and a Y direction, or FIG.
, The divided guide grooves (1) (1) are formed only in the X direction, and the slits (2) are formed in the Y direction.
【０００４】[0004]
【発明が解決しようとする課題】しかし、図５の構成で
は、Ｘ方向、Ｙ方向の両方向に分割案内溝を形成（カッ
ト歯等により溝を彫る）し、且つ分割する作業が必要で
あり、作業効率が悪かった。However, in the configuration shown in FIG. 5, it is necessary to form a dividing guide groove in both the X direction and the Y direction (carving the groove with cut teeth or the like) and to divide the groove. Work efficiency was poor.
【０００５】又、図６の構成では、スリットはプレス加
工で行なえ、そしてＸ方向のみに分割案内溝を形成し、
且つ分割するだけでよく、作業効率は向上するが、強度
が弱いためにＡ、Ｂ、Ｃの部分がソリ易く例えばハンダ
槽に基板を入れてディップハンダを行なう場合に、この
ようにＡ、Ｂ、Ｃの部分がソリを起こすと、半田品質が
悪化することになった。In the configuration shown in FIG. 6, the slit can be formed by press working, and divided guide grooves are formed only in the X direction.
The work efficiency is improved, but the strength is weak, but the parts A, B, and C are easily warped. , C caused warpage, resulting in poor solder quality.
【０００６】[0006]
【課題を解決するための手段】本発明は、縦横に分けら
れた複数の領域内に回路パターンを形成した基板のこの
各領域間に一方向に延びるスリットを打ち抜き形成し、
且つ各領域間に他方向に延びる分割案内溝を形成してこ
の分割案内溝に沿って分割するようにしたものにおい
て、スリットを打ち抜き形成するときにこのスリット内
に分割案内溝を跨ぐ接続部を形成するようにしたもので
ある。According to the present invention, there is provided a substrate having a circuit pattern formed in a plurality of areas divided vertically and horizontally, and a slit extending in one direction is formed by punching a slit extending between the areas.
Further, in a configuration in which a divided guide groove extending in the other direction is formed between the respective regions and divided along the divided guide groove, a connecting portion that straddles the divided guide groove in the slit when punching and forming the slit. It is to be formed.
【０００７】[0007]
【作用】本発明は上記の如きであり、一方向にのみ分割
案内溝を形成し、且つ分割するだけで複数の回路基板を
製造でき、又分割前の基板は、接続部による連結により
所定の強度を有し、ソリを起こしにくい。The present invention is as described above. A plurality of circuit boards can be manufactured only by forming a divided guide groove in only one direction and dividing the board. It has strength and is hard to warp.
【０００８】[0008]
【実施例】本発明の実施例を図面に基づいて説明する。An embodiment of the present invention will be described with reference to the drawings.
【０００９】図１において、基板（１０）はＡ〜Ｌ領域
（点線で囲った領域）に分けられ、まず初めにこのＡ〜
Ｌ領域の夫々に同一の回路パターンが形成される。そし
て、その後、各領域間にＹ方向に延びるスリット（１
１）（１１）（１１）をプレスにより打ち抜き形成す
る。この時、対角上で隣接した夫々の領域を接続する接
続部（１２）（１２）…を残してプレス加工がなされ
る。In FIG. 1, the substrate (10) is divided into areas A to L (areas surrounded by dotted lines).
The same circuit pattern is formed in each of the L regions. Then, after that, the slits (1
1) (11) (11) is stamped and formed by pressing. At this time, the press working is performed while leaving the connecting portions (12) (12)... Connecting the diagonally adjacent areas.
【００１０】次に、各領域間にＸ方向からカット歯によ
って分割案内溝（１３）（１３）（１３）が形成され
る。この分割案内溝（１３）と前記接続部（１２）の関
係は図２に示すように、分割案内溝（１３）を跨ぐ如き
形状に接続部（１２）を形成している。Next, divided guide grooves (13), (13) and (13) are formed between the regions by cutting teeth from the X direction. As shown in FIG. 2, the relationship between the division guide groove (13) and the connection part (12) is such that the connection part (12) is formed so as to straddle the division guide groove (13).
【００１１】この後、この基板（１０）はハンダ槽に入
れられてディップハンダがなされるが、この場合、接続
部（１２）（１２）…による連結があるので、基板（１
０）のＡ−Ｂ−Ｃ，Ｄ−Ｅ−Ｆ…夫々の部分はソリを起
こしにくく、ハンダ付け不良を防止できる。Thereafter, the substrate (10) is placed in a solder bath and subjected to dip soldering. In this case, since there is a connection by the connecting portions (12) (12).
0) ABC, DEF,..., The respective portions are less likely to warp, thereby preventing poor soldering.
【００１２】そして最後に、分割案内溝（１３）（１
３）（１３）に沿って基板（１０）を分割する（一般的
には手で割る）。而して、分割案内溝（１３）と接続部
（１２）は前述した如き関係にあるので、この分割のみ
で基板（１０）からは１２枚の回路基板を製造すること
ができる。Finally, the divided guide grooves (13) (1)
3) Divide the substrate (10) along (13) (generally by hand). Thus, since the division guide groove (13) and the connection part (12) have the above-mentioned relation, twelve circuit boards can be manufactured from the substrate (10) only by this division.
【００１３】尚、接続部（１２）の形状は図２のものに
限られず、例えば図３、図４の如き形状であってもよ
い。The shape of the connecting portion (12) is not limited to the shape shown in FIG. 2, and may be, for example, a shape as shown in FIGS.
【００１４】[0014]
【発明の効果】本発明は上記の如きであり、一方向にの
み分割案内溝を形成し、且つ分割するだけで複数の回路
基板を製造でき、又分割前の基板は接続部による連結に
より所定の強度を有し、ソリを起こしにくいため、作業
効率を向上でき且つハンダ不良等を起こしにくい。The present invention is as described above. A plurality of circuit boards can be manufactured only by forming a division guide groove in only one direction and dividing the board. Since it has the strength described above and is less likely to warp, work efficiency can be improved, and solder defects and the like are less likely to occur.
【図１】本発明に係わる基板の平面図である。FIG. 1 is a plan view of a substrate according to the present invention.
【図２】本発明に係わる基板の要部の平面図である。FIG. 2 is a plan view of a main part of a substrate according to the present invention.
【図３】本発明の他の実施例に係わる基板の要部の平面
図である。FIG. 3 is a plan view of a main part of a substrate according to another embodiment of the present invention.
【図４】本発明の他の実施例に係わる基板の要部の平面
図である。FIG. 4 is a plan view of a main part of a substrate according to another embodiment of the present invention.
【図５】従来例に係わる基板の平面図である。FIG. 5 is a plan view of a substrate according to a conventional example.
【図６】従来例に係わる基板の要部の平面図である。FIG. 6 is a plan view of a main part of a substrate according to a conventional example.
１０ 基板 １１ スリット １２ 接続部 １３ 分割案内板 DESCRIPTION OF SYMBOLS 10 Substrate 11 Slit 12 Connection part 13 Division guide plate
Claims (1)
ターンを形成した基板のこの各領域間に一方向に延びる
スリットを打ち抜き形成し、且つ各領域間に他方向に延
びる分割案内溝を形成してこの分割案内溝に沿って分割
するようにしたものにおいて、スリットを打ち抜き形成
するときにこのスリット内に分割案内溝を跨ぐ接続部を
形成するようにしたことを特徴とする回路基板の製造方
法。1. A slit extending in one direction is formed between a plurality of regions vertically and horizontally formed in a substrate on which a circuit pattern is formed between the respective regions, and a divided guide groove extending in the other direction is formed between the respective regions. In the circuit board formed and divided along the divided guide grooves, a connection portion that straddles the divided guide grooves is formed in the slit when the slit is punched out. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027960A JP2911286B2 (en) | 1992-02-14 | 1992-02-14 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027960A JP2911286B2 (en) | 1992-02-14 | 1992-02-14 | Circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05226805A JPH05226805A (en) | 1993-09-03 |
| JP2911286B2 true JP2911286B2 (en) | 1999-06-23 |
Family
ID=12235459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4027960A Expired - Lifetime JP2911286B2 (en) | 1992-02-14 | 1992-02-14 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2911286B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068160B (en) * | 2012-12-25 | 2015-09-09 | 广东欧珀移动通信有限公司 | A kind of split type circuit board |
-
1992
- 1992-02-14 JP JP4027960A patent/JP2911286B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05226805A (en) | 1993-09-03 |
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