JPH0562063U - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH0562063U
JPH0562063U JP212392U JP212392U JPH0562063U JP H0562063 U JPH0562063 U JP H0562063U JP 212392 U JP212392 U JP 212392U JP 212392 U JP212392 U JP 212392U JP H0562063 U JPH0562063 U JP H0562063U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
divided
division
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP212392U
Other languages
Japanese (ja)
Inventor
三喜雄 牛嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP212392U priority Critical patent/JPH0562063U/en
Publication of JPH0562063U publication Critical patent/JPH0562063U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】 【目的】 分割可能なプリント配線板において分割し易
く分割後の分割面の凹凸が少ないプリント配線板を提供
する。 【構成】 分割可能なプリント配線板10には、分割さ
れ、機器等に組み込まれるプリント配線板10a,10
bの周囲に余片11が配設されている。該余片11に
は、プリント配線板10a(10b)の外縁となる外形
線12を基準とし、該外形線12に長手方向の1辺を重
ねて複数の長孔13が穿設されている。また、長孔1
3,13の間には外形線12を接線としてミシン目孔1
4が長孔13の隙間幅よりも小さい径で穿設されてい
る。
(57) [Summary] [Object] To provide a printed wiring board which is easy to divide in a dividable printed wiring board and has less unevenness on the divided surface after division. [Structure] The dividable printed wiring board 10 is divided into printed wiring boards 10a, 10a to be incorporated into equipment or the like.
An extra piece 11 is arranged around b. A plurality of elongated holes 13 are formed in the extra piece 11 with the outline 12 as the outer edge of the printed wiring board 10a (10b) as a reference and one side in the longitudinal direction being overlapped with the outline 12. Also, the long hole 1
A perforation hole 1 is provided with a contour line 12 as a tangent line between 3 and 13.
4 has a diameter smaller than the gap width of the long hole 13.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、分割可能なプリント配線板の分割構造に関するものである。 The present invention relates to a dividable printed wiring board dividing structure.

【0002】[0002]

【従来の技術】[Prior Art]

プリント配線板に電子部品等を半田付けする際には、電子部品の搭載及び半田 付けの自動化を行うために硝子エポキシ樹脂等により成形されたプリント配線板 を幾つか並べて形成した1枚の集合プリント配線板に電子部品を搭載し、これら を半田付けした後にそれぞれを分割するようにしたものが多く使用されている。 従来、この種のプリント配線板の分割構造は、図8に示すようにプリント配線 板100にミシン目孔101が穿設されたものがあり、このプリント配線板10 0によるとミシン目孔101に沿って図9に示すようにプリント配線板100a 及びプリント配線板100bとに分割される。 When soldering electronic parts etc. to a printed wiring board, one collective print is formed by arranging several printed wiring boards molded with glass epoxy resin etc. to automate mounting and soldering of electronic parts. It is often used to mount electronic components on a wiring board, solder them, and then divide them. Conventionally, in this type of divided structure of a printed wiring board, there is one in which a perforation hole 101 is provided in a printed wiring board 100 as shown in FIG. 8. According to this printed wiring board 100, the perforation hole 101 is formed. Along with that, it is divided into a printed wiring board 100a and a printed wiring board 100b as shown in FIG.

【0003】 また、図10に示すようにプリント配線板110に複数の長孔111を穿設し 、この長孔110aに沿って図11に示すようにプリント配線板110a及びプ リント配線板110bとに分割されるプリント配線板110も知られている。Further, as shown in FIG. 10, a plurality of elongated holes 111 are formed in the printed wiring board 110, and along the elongated holes 110a, a printed wiring board 110a and a printed wiring board 110b are formed as shown in FIG. A printed wiring board 110 divided into two is also known.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、上述した従来のプリント配線板の分割構造では図8のプリント 配線板100においては分割後の分割面が図9に示すように分割面全体が細かい 櫛歯状になり仕上げ作業が必要となる。また、図10のプリント配線板110に おいては図11に示すように分割面はプリント配線板100に比べると滑らかな 面が多いが、連結部112が長く取られるているので分割しづらいという問題が あり、この問題を解消するために連結部112を短くすることが考えられるが、 連結部112を短くすると連結状態が不安定になり分割前の電子部品を搭載する 際に連結部112が折れる恐れがあるという問題点があった。 However, in the above-mentioned conventional printed wiring board division structure, in the printed wiring board 100 of FIG. 8, the division surface after division becomes a fine comb tooth shape as shown in FIG. 9, and finishing work is required. . Further, in the printed wiring board 110 of FIG. 10, as shown in FIG. 11, there are many divided surfaces that are smoother than the printed wiring board 100, but it is difficult to divide because the connecting portion 112 is long. There is a problem, and it is conceivable to shorten the connecting portion 112 in order to solve this problem. However, if the connecting portion 112 is shortened, the connected state becomes unstable, and the connecting portion 112 becomes unclear when the electronic component before division is mounted. There was a problem that it might break.

【0005】 そこで本考案は、上記問題点を解消するために、分割し易く分割後の分割面の 凹凸を少なく分割することができるプリント配線板を提供することを目的として いる。Therefore, in order to solve the above-mentioned problems, an object of the present invention is to provide a printed wiring board which can be easily divided and can be divided with less unevenness on the divided surface after the division.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

次に、上記の目的を達成するための手段を、実施例に対応する図1乃至図6を 参照して説明する。 この考案のプリント配線板は、プリント配線板を分割する分割部分に穿設され た複数の長孔3,13と、該長孔3,13と長孔3,13の間に穿設されたミシ ン目孔4,14,14aを具備したことを特徴としている。 Next, means for achieving the above object will be described with reference to FIGS. 1 to 6 corresponding to the embodiment. The printed wiring board of the present invention has a plurality of long holes 3 and 13 formed at divided portions for dividing the printed wiring board, and a miss hole formed between the long holes 3 and 13 and the long holes 3 and 13. It is characterized in that it is provided with a mesh hole 4, 14, 14a.

【0007】[0007]

【作用】[Action]

プリント配線板の分割部分に穿設された複数の長孔3(13)と、長孔3(1 3),3(13)の間に穿設されたミシン目孔4(14,14a)により、容易 に分割でき分割後の分割面の凹凸が減少される。 By the plurality of long holes 3 (13) formed in the divided portion of the printed wiring board and the perforation holes 4 (14, 14a) formed between the long holes 3 (13) and 3 (13) , It can be easily divided, and the unevenness of the divided surface after division is reduced.

【0008】[0008]

【実施例】【Example】

図1は本考案によるプリント配線板の第1実施例を示す平面図、図2は図1に おける分割後の平面図である。 図1に示すように、この第1実施例によるプリント配線板1はプリント配線板 1をプリント配線板1aとプリント配線板1bとに分割する分かれ目を分割線2 とし、この分割線2を中心線として一定間隔で複数の長孔3が穿設されている。 そして、長孔3と長孔3の間には前記分割線2を中心線として長孔3の隙間幅 と同径のミシン目孔4が穿設されている。 1 is a plan view showing a first embodiment of a printed wiring board according to the present invention, and FIG. 2 is a plan view after division in FIG. As shown in FIG. 1, in the printed wiring board 1 according to the first embodiment, a dividing line 2 that divides the printed wiring board 1 into a printed wiring board 1a and a printed wiring board 1b is a dividing line 2, and the dividing line 2 is a center line. A plurality of long holes 3 are formed at regular intervals. A perforation hole 4 having the same diameter as the gap width of the long hole 3 is formed between the long holes 3 with the dividing line 2 as the center line.

【0009】 図2に示すように、上述した構成のプリント配線板1によると長孔3,3の間 にミシン目孔4を穿設したことにより分割線2に沿って容易に分割することがで きる。また、分割後の分割面の凹凸を少なくすることができる。 なお、上述した第1実施例において、長孔3の隙間幅とミシン目孔4の径を同 一としたが、分割線2を中心線としていればミシン目孔4の径は長孔3の隙間幅 よりも小さくてもよく、この場合分割後の分割面の凹凸はより少なくなる。As shown in FIG. 2, according to the printed wiring board 1 having the above-described structure, the perforation holes 4 are provided between the long holes 3 and 3 so that the printed wiring board 1 can be easily divided along the dividing line 2. it can. Further, it is possible to reduce the unevenness of the divided surface after the division. In the above-described first embodiment, the gap width of the long hole 3 and the diameter of the perforation hole 4 are the same, but if the dividing line 2 is the center line, the diameter of the perforation hole 4 is the same as that of the long hole 3. It may be smaller than the gap width, and in this case, the unevenness of the divided surface after division becomes smaller.

【0010】 次に第2実施例について図3乃至図6を参照して説明する。 図3に示すように、この実施例のプリント配線板10は、分割され、機器等に 組み込まれるプリント配線板10aとプリント配線板10bの周囲に余片11を 有している。 そして、図4に示すように、プリント配線板10aないしプリント配線板10 bの外縁となる外形線12を基準とし、該外形線12に長手方向の1辺を重ねて 複数の長孔13が余片11に穿設されている。 また、長孔13と長孔13の間には外形線12を接線としてミシン目孔14が 長孔13の隙間幅よりも小さい径(図中では2分の1の径)で穿設されている。Next, a second embodiment will be described with reference to FIGS. 3 to 6. As shown in FIG. 3, the printed wiring board 10 of this embodiment is divided into a printed wiring board 10a and a printed wiring board 10b to be incorporated in a device or the like, and an extra piece 11 is provided around the printed wiring board 10a and the printed wiring board 10b. Then, as shown in FIG. 4, with reference to the outline 12 that is the outer edge of the printed wiring board 10a or the printed wiring board 10b, one side in the longitudinal direction is overlapped with the outline 12 to form a plurality of elongated holes 13. It is provided in the piece 11. A perforation hole 14 having a diameter smaller than the gap width of the long hole 13 (one-half diameter in the figure) is provided between the long holes 13 with the outer shape line 12 as a tangent line. There is.

【0011】 図5に示すように、上述したプリント配線板10によると、分割されるプリン ト配線板10aないし10bの外縁となる外形線12に長孔13の長手方向の1 辺を重ねて穿設し、長孔13,13間に外形線12を接線として長孔13の隙間 幅よりも小さい径のミシン目孔14を穿設したことでプリント配線板10a及び プリント配線板10bを分割する際には、個々のミシン目孔14の共有する中心 線12aから分割され、凸部は外形線12よりミシン目孔14の半径分しか出な いため規定の形状をヤスリ等による仕上げを要せずに得ることができる。As shown in FIG. 5, according to the above-described printed wiring board 10, one side in the longitudinal direction of the elongated hole 13 is overlapped and punched on the outline 12 which is the outer edge of the divided printed wiring boards 10a and 10b. When the printed wiring board 10a and the printed wiring board 10b are divided by forming a perforation hole 14 having a diameter smaller than the gap width of the long hole 13 with the outer shape line 12 as a tangent line between the long holes 13 and 13. Is divided from the center line 12a shared by the individual perforation holes 14, and the convex portion is only the radius of the perforation hole 14 from the outer shape line 12, so the prescribed shape is not required to be finished with a file or the like. Obtainable.

【0012】 また、プリント配線板10a,10bの外縁の精度を向上させるためには、第 1実施例と同様にミシン目孔14の径を小さくすれば良く、さらに、図6のよう に、外形線12を中心線とするミシン目孔14aを穿設しても良い。 これにより、プリント配線板10a,10bは、外形線12上で分割されるの で、プリント配線板10a,10bの外縁から突出する凸部を殆ど無くすことが できる。Further, in order to improve the accuracy of the outer edges of the printed wiring boards 10a and 10b, it is sufficient to reduce the diameter of the perforation holes 14 as in the first embodiment. Furthermore, as shown in FIG. Perforation holes 14a having the line 12 as the center line may be formed. As a result, the printed wiring boards 10a and 10b are divided on the outer shape line 12, so that it is possible to almost eliminate the convex portions protruding from the outer edges of the printed wiring boards 10a and 10b.

【0013】 また、余片11がプリント配線板10a,10bの外側を囲むように配設され ているので電子部品を搭載及び半田付けする時にプリント配線板10が撓むこと がない。この為、従来板厚が1.0mm以下のプリント配線板を自動搭載機に載せ る場合、プリント配線板の寸法が大きいと撓みが原因で自動搭載機に載せること ができず大きさが限定されていたが(150mm×150mm以下)、撓みがないの で板厚が1.0mm以下でも大きさの大きい(例えば220mm×210mm)サイズ のプリント配線板でも自動搭載機に載せることができる。 さらに、余片11に銅箔を残すことで、プリント配線板10の撓みを前記以上 に抑えることができる。Further, since the extra pieces 11 are arranged so as to surround the outer sides of the printed wiring boards 10a and 10b, the printed wiring board 10 does not bend when electronic components are mounted and soldered. Therefore, when a conventional printed wiring board with a thickness of 1.0 mm or less is placed on the automatic mounting machine, if the size of the printed wiring board is large, it cannot be placed on the automatic mounting machine due to bending, and the size is limited. However, since there is no bending (150 mm x 150 mm or less), a printed wiring board of a large size (for example, 220 mm x 210 mm) with a thickness of 1.0 mm or less can be mounted on the automatic mounting machine. Further, by leaving the copper foil on the extra piece 11, the flexure of the printed wiring board 10 can be suppressed more than the above.

【0014】 そして、図7に示すように分割後の形状が複雑なプリント配線板20において も、上述した分割構造を利用し、分割部分を一定方向(図中では横方向)に分割 できるように配設することで、電子部品を搭載及び半田付けした後に分割する際 に治具を使わず手で簡単に分割でき、凸凹のないプリント配線板20a,20b を得ることができる。Then, even in the printed wiring board 20 having a complicated shape after division as shown in FIG. 7, it is possible to divide the divided portion in a certain direction (horizontal direction in the drawing) by using the above-described division structure. By disposing the electronic parts, the electronic parts can be easily divided by hand without using a jig when the electronic parts are mounted and soldered, and the printed wiring boards 20a and 20b having no unevenness can be obtained.

【0015】[0015]

【考案の効果】[Effect of the device]

以上説明したように本考案によるプリント配線板は、容易に分割でき分割後の 分割面の凹凸が少なくできるという効果がある。 As described above, the printed wiring board according to the present invention has an effect that it can be easily divided and the unevenness of the divided surface after division can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案によるプリント配線板の第1実施例を示
す平面図
FIG. 1 is a plan view showing a first embodiment of a printed wiring board according to the present invention.

【図2】図1における分割後の平面図FIG. 2 is a plan view after division in FIG.

【図3】第2実施例を示す全体構成図FIG. 3 is an overall configuration diagram showing a second embodiment.

【図4】図3における要部拡大平面図FIG. 4 is an enlarged plan view of an essential part in FIG.

【図5】図4における分割後の平面図FIG. 5 is a plan view after division in FIG.

【図6】第2実施例の変形例を示す平面図FIG. 6 is a plan view showing a modification of the second embodiment.

【図7】他の分割構成のプリント配線板の全体構成図FIG. 7 is an overall configuration diagram of a printed wiring board having another configuration.

【図8】従来のミシン目孔のみを用いた場合の平面図FIG. 8 is a plan view when only a conventional perforation hole is used.

【図9】図8における分割後の平面図9 is a plan view after division in FIG.

【図10】従来の長孔のみを用いた場合の平面図FIG. 10 is a plan view when only a conventional long hole is used.

【図11】図10における分割後の平面図11 is a plan view after division in FIG.

【符号の説明】[Explanation of symbols]

3,13…長孔、4,14,14a…ミシン目孔。 3, 13 ... Long holes, 4, 14, 14a ... Perforated holes.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 プリント配線板を分割する分割部分に穿
設された複数の長孔(3,13)と、該長孔と長孔の間
に穿設されたミシン目孔(4,14,14a)を具備し
たことを特徴とするプリント配線板。
1. A plurality of elongated holes (3, 13) formed in a divided portion for dividing a printed wiring board, and perforated holes (4, 14,) formed between the elongated holes. A printed wiring board comprising: 14a).
JP212392U 1992-01-24 1992-01-24 Printed wiring board Pending JPH0562063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP212392U JPH0562063U (en) 1992-01-24 1992-01-24 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP212392U JPH0562063U (en) 1992-01-24 1992-01-24 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH0562063U true JPH0562063U (en) 1993-08-13

Family

ID=11520580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP212392U Pending JPH0562063U (en) 1992-01-24 1992-01-24 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0562063U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210921A (en) * 2000-01-28 2001-08-03 Mitsumi Electric Co Ltd Printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210921A (en) * 2000-01-28 2001-08-03 Mitsumi Electric Co Ltd Printed board

Similar Documents

Publication Publication Date Title
US5105261A (en) Semiconductor device package having particular lead structure for mounting multiple circuit boards
JPH0562063U (en) Printed wiring board
JP3088314B2 (en) Terminal for metal substrate
JP3740804B2 (en) Manufacturing method of high-frequency unit
JP3009175U (en) Printed wiring board
JPH0745975Y2 (en) Multi-sided board
JPH0515462U (en) Printed wiring board
JP2911286B2 (en) Circuit board manufacturing method
JPS5810889A (en) Method of dividing board into multiple boards
JP3315155B2 (en) Printed circuit board manufacturing method
JP2632020B2 (en) Multiple printed wiring board
JPH0650990Y2 (en) Lead terminal parts
JPH021821Y2 (en)
JPH0432779Y2 (en)
JPS6339987Y2 (en)
JPH0639472Y2 (en) Printed wiring board
JPH0582709A (en) Electronic compoenets and package structure thereof
JPH0723970Y2 (en) Printed wiring board
JPS6242399B2 (en)
JP2000012995A (en) Mounting apparatus for terminal components on printed circuit board
JPH0648899Y2 (en) Printed board
JPH06342963A (en) Printed circuit board and dividing method therefor
JPH051098Y2 (en)
JPH0625975Y2 (en) Assembly board
JPH0538772U (en) Electronic component terminal mounting structure