JP3009175U - Printed wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] To make sure the excision work of the discarded substrate part is reliable and easy. [Structure] Circuit board portions 2a, 2b on which wiring patterns for electrically connecting various electronic parts are printed, and discarded board portions 3a-3h connected to the circuit board portions 2a, 2b via a dividing line 4. A printed wiring board 1 configured by the following, wherein one or both sides of each of the discarded board portions 3a to 3h:
Copper foil reinforcing members 5a to 5h for reinforcing rigidity are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is a printed wiring board including a circuit board portion on which a wiring pattern for electrically connecting various electronic components is printed, and a waste board portion connected to the circuit board portion through a dividing line. The present invention relates to a printed circuit board, and more particularly, to a structure of a printed wiring board that enables easy and reliable cutting of a discarded printed circuit board portion.

[0002]

[Prior art]

 A printed wiring board consisting of a circuit board part and a waste board part needs to be cut off from the wiring board part by dividing the unnecessary part of the waste board part with a dividing line when actually mounted on electronic equipment. There is. Therefore, the dividing line is formed, for example, in a perforated shape so that the waste substrate portion can be surely divided along the dividing line during the cutting operation.

However, a wiring pattern of copper foil is formed on the circuit board portion, and soldering for connecting the wiring pattern and the terminals of the IC chip to be mounted is also performed. In terms of strength, the circuit board section is stronger than the discarded board section.

Further, while the circuit board portion has a large shape, the abandoned board portion is a strip-shaped elongated shape that is usually formed in the peripheral portion of the abandoned board portion. The shape is weaker than that of the circuit board. Therefore, even if you try to cut off the discarded board from the perforation, which is the dividing line, the strength of the discarded board is weaker than the strength of the circuit board. Problems such as cracking occur.

Therefore, conventionally, a jig for sandwiching the discarded board portion along the perforations is used, and the discarded board portion is sandwiched by the jig and bent to cut off the discarded board portion from the circuit board portion. That is, a special jig for cutting off the discarded substrate portion was required (this is referred to as Prior Art 1).

On the other hand, in order to eliminate such inconvenience, various inventions have been hitherto made, for example, a printed wiring board described in Japanese Utility Model Laid-Open No. 57-53670 (referred to as Prior Art 2). ), The pre-divided insulating board (discarded board) is joined to the circuit board in a butt-joining manner so that when the insulating board is separated from the circuit board, it can be accurately divided along the dividing line. There is something.

[0007]

[Problems to be solved by the device]

 However, in the above-mentioned conventional technique 1, a special jig for cutting off the discarded substrate portion is required, and it is also necessary to prepare some types of jigs according to the shape of the discarded substrate portion. There was a problem that the cost was high. Further, in the above-mentioned conventional technique 2, since a previously divided insulating substrate (discarded substrate) is joined to the circuit board in a form of butt-joining, a step reverse to the step of forming the original circuit board is added. The workability was extremely poor.

The present invention was devised to solve such a problem, and its purpose is a printed wiring board which can surely and easily perform the excision work of the discarded board portion with an extremely simple structure. To provide.

[0009]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the printed wiring board according to claim 1 of the present invention has a circuit board portion on which a wiring pattern for electrically connecting various electronic components is printed, and the circuit board portion and a dividing line. It is applied to a printed wiring board composed of a waste board portion connected thereto, and a reinforcing member for reinforcing rigidity is provided on one or both surfaces of the waste board portion. A printed wiring board according to a second aspect of the present invention is the printed wiring board according to the first aspect, wherein the reinforcing member is formed of copper foil. Further, a printed wiring board according to a third aspect of the present invention is the printed wiring board according to the first or second aspect, in which the reinforcing member is provided except for the outer peripheral portion of the discarded substrate portion.

[0010]

[Action]

 The operation of the printed wiring board according to claim 1 will be described. A reinforcing member that reinforces rigidity is provided on one side or both sides of the discarded substrate portion. For example, when the printed wiring board is for one side and the wiring pattern is printed only on one side, the reinforcing member provided in the discarded board section is also only one side in accordance with this. In addition, when the printed wiring board is for both sides, the wiring pattern is also printed on both sides. In this case, therefore, the reinforcing member provided on the discarding board part is also provided for both sides. However, if the strength is sufficient on one side, the reinforcing member may be provided on only one side.

As a result, the difference between the rigidity of the discarded board portion and the rigidity of the circuit board portion is reduced. Therefore, when the discarded board portion is bent, the stress is concentrated on the parting line where the strength is weak. Therefore, even without using a jig or the like, it is possible to reliably cut off the discarded substrate portion along the dividing line.

The operation of the printed wiring board according to the second aspect will be described. The reinforcing member provided on the discarded substrate portion is formed of copper foil. That is, since the reinforcing member is formed of the same copper foil as the wiring pattern printed on the circuit board portion, when the wiring pattern is printed on the circuit board portion, the reinforcing member can be simultaneously provided on the discarding board portion by the printing. Is something that can be done. This eliminates the need for a new step of providing the reinforcing member on the discarded substrate portion, so that work efficiency does not decrease as compared with the conventional case.

The operation of the printed wiring board according to claim 3 will be described. The reinforcing member is provided excluding the outer peripheral portion of the discarded substrate portion. As a result, even if soldering is performed by dipping or the like, the problem that the solder adheres to the side surface of the substrate does not occur.

[0014]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall perspective view showing an example of the structure of the printed wiring board of the present invention. The printed wiring board 1 includes two circuit board portions 2a and 2b on which wiring patterns (not shown) for electrically connecting various electronic components (not shown) are printed, and the circuit board portions 2a and 2b and the dividing lines. It is composed of eight discarded substrate parts 3a to 3h which are connected via 4.

In this embodiment, the dividing line 4 is basically formed so that the slit-shaped long hole 4a and the two round holes 4b, 4b are continuously repeated. However, although not shown in the drawing, the perforation shape has only the round holes 4b arranged at regular intervals, the shape having only the long holes 4a arranged at regular intervals, or the shape obtained by appropriately combining the long holes 4a and the round holes 4b. And so on.

The discarding board portions 3a to 3g are formed in the peripheral portions of the circuit board portions 2a and 2b mainly, and thus have a strip-shaped elongated shape (3a to 3f). Therefore, in terms of shape, the discarded board portions 3a to 3f are weaker in strength than the circuit board portions 2a and 2b. However, depending on the shapes of the circuit board portions 2a and 2b, there are cases where the circuit board portions 2a and 2b have a rectangular shape like the discarded substrate portions 3g and 3h.

Then, a reinforcing member (the present embodiment) for reinforcing rigidity is provided on one surface of each of the discarded board portions 3a to 3h (the surface on the same side as the wiring pattern is printed on the circuit board portions 2a and 2b). In the example, copper foils 5a to 5h are provided, respectively. These reinforcing members (indicated by hatching in the figure) 5a to 5h are provided on the whole of the discarded substrate parts 3a to 3h, leaving at least 1 to 2 mm from the outer peripheral part thereof.

As described above, by providing the copper foil as a reinforcing member also to the discarded board portions 3a to 3h, the difference between the rigidity of the discarded board portions 3a to 3h and the rigidity of the circuit board portions 2a and 2b is reduced. Therefore, when the discarded substrate parts 3a to 3h are bent, the stress is concentrated on the parting line 4 (4a, 4b), which is weak in strength, and this stress can be obtained without using a jig. The discard board portions 3a to 3h can be accurately cut off from the circuit board portions 2a and 2b along the dividing line 4.

By providing the reinforcing members 5a to 5h leaving at least 1 to 2 mm from the outer peripheral portions of the discarded board portions 3a to 3h, even when soldering is performed by a dip or the like, the solder can be attached to the printed wiring board 1. It is prevented that the side surface, more accurately, even the outer peripheral side surface (including the parting line 4 portion) of the discarded substrate portions 3a to 3h is attached.

When the reinforcing members 5a to 5h are formed of copper foil, since they are made of the same material (copper foil) as the wiring patterns formed on the circuit boards 2a and 2b, when the wiring patterns are printed, By the printing, the reinforcing members 5a to 5h can be simultaneously formed on each of the discarded substrate portions 3a to 3h. Therefore, a new step of providing only the reinforcing members 5a to 5h on the discarded substrate parts 3a to 3h is unnecessary.

Further, in the above embodiment, the printed wiring board 1 in which the wiring pattern is formed only on one side is described, but in the case of the double-sided printed wiring board in which the wiring patterns are formed on both sides, The reinforcing member provided on the discarded substrate portion may be provided on both sides according to this. However, if one side has sufficient strength (that is, if there is no significant difference between the rigidity of the circuit board and the rigidity of the waste board), it is not always necessary to provide reinforcing members on both sides. Alternatively, it may be provided on only one side.

[0022]

[Effect of device]

 In the printed wiring board according to claim 1 of the present invention, since the reinforcing member that reinforces the rigidity is provided on one side or both sides of the discarded board part, the rigidity of the discarded board part and the rigidity of the circuit board part are improved. Therefore, when the discarded substrate is bent, the stress is concentrated on the parting line where the strength is weak. Therefore, it is possible to easily and surely cut off the discarded substrate portion along this dividing line without using a jig or the like unlike the conventional case. Further, the printed wiring board according to claim 2 of the present invention is configured such that the reinforcing member provided in the discarded board portion is formed of copper foil, so that when the wiring pattern is printed on the circuit board portion, the A reinforcing member can be provided at the same time on the discarded substrate part. Therefore, a new step of providing a reinforcing member on the discarded substrate section is not required, so that it is possible to prevent a decrease in work efficiency. Further, since the printed wiring board according to the third aspect of the present invention is configured such that the reinforcing member is disposed except the outer peripheral portion of the board portion, even when soldering is performed by dipping, for example, the solder is It is possible to prevent problems such as adhesion to the side surface.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an example of the structure of a printed wiring board of the present invention.

[Explanation of symbols]

 1 Printed wiring board 2a, 2b Circuit board part 3a to 3h Discarded board part 4 Dividing line 5a to 5h Reinforcing member (copper foil)

Claims (3)

[Scope of utility model registration request] 1. A printed wiring board comprising a circuit board portion on which a wiring pattern for electrically connecting various electronic components is printed, and a waste board portion connected to the circuit board portion through a dividing line. The printed wiring board according to claim 1, wherein a reinforcing member that reinforces rigidity is provided on one surface or both surfaces of the waste board portion. 2. The printed wiring board according to claim 1, wherein the reinforcing member is a copper foil. 3. The printed wiring board according to claim 1, wherein the reinforcing member is provided excluding the outer peripheral portion of the discarded substrate portion.