JP2020140992A - Substrate and image forming apparatus - Google Patents
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- JP2020140992A JP2020140992A JP2019033664A JP2019033664A JP2020140992A JP 2020140992 A JP2020140992 A JP 2020140992A JP 2019033664 A JP2019033664 A JP 2019033664A JP 2019033664 A JP2019033664 A JP 2019033664A JP 2020140992 A JP2020140992 A JP 2020140992A
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- 239000000758 substrate Substances 0.000 title claims abstract description 289
- 229910000679 solder Inorganic materials 0.000 claims abstract description 91
- 239000002699 waste material Substances 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000012779 reinforcing material Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000012546 transfer Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 238000002474 experimental method Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004397 blinking Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、フロー実装される基板における電気接点を有する基板と、その基板を備える画像形成装置に関する。 The present invention relates to a substrate having electrical contacts in a flow-mounted substrate and an image forming apparatus including the substrate.
従来から電子写真技術を用いた記録紙に画像を複写する電子写真方式の画像形成装置が普及している。この画像形成装置は、正又は負の高電位に一様に帯電した感光体に対し、レーザ等の光を複写したい画像に応じて投射し、感光体上に静電荷による潜像を形成する。そして、トナー等の現像剤を潜像が形成されている部分に静電気力によって飛ばし、感光体上に現像する。次に現像された感光体上の現像剤に記録紙を重ねて、記録紙の裏面から現像剤の保持する電荷と逆極性の電荷を与え、静電気力によって現像剤を記録紙表面に吸着させて転写する。その後、記録紙に熱と圧力を与え、転写された現像剤を定着させる。このように、電子写真方式では各プロセスにおいて静電気力を利用した現像剤の移動が行われるため、様々な極性、様々な高い電圧が必要となる。 Conventionally, an electrophotographic image forming apparatus for copying an image on a recording paper using electrophotographic technology has become widespread. This image forming apparatus projects light such as a laser onto a photoconductor uniformly charged to a high positive or negative potential according to an image to be copied, and forms a latent image due to static charge on the photoconductor. Then, a developer such as toner is blown onto the portion where the latent image is formed by electrostatic force, and the developer is developed on the photoconductor. Next, the recording paper is superposed on the developer on the developed photoconductor, and the charge having the opposite polarity to the charge held by the developer is given from the back surface of the recording paper, and the developer is attracted to the surface of the recording paper by electrostatic force. Transfer. After that, heat and pressure are applied to the recording paper to fix the transferred developer. As described above, in the electrophotographic method, since the developer is transferred by utilizing the electrostatic force in each process, various polarities and various high voltages are required.
これらの電圧は、画像形成装置内に組み込まれる回路基板（以下、高圧基板と記す）で生成され、画像形成装置本体の必要な箇所に供給される。しかし、高圧基板の高圧出力部から電圧が供給される対象となる場所への接続を、ケーブルを介して行うと、コストがかかるだけでなく本体の組立工程が複雑になり、組立てに時間を要し誤って組立てを行うおそれもある。そのため、これらの課題を解決する方法として、コイルバネ状の弾性部材によるバネ接点を画像形成装置本体に備え、バネ接点に対応する高圧基板上の所定位置にジャンパ線を配置して接点とする方法が提案されている（例えば、特許文献１参照）。このような構成とすることで、高圧基板を本体に組み付ける際に、必然的に高圧基板のジャンパ線とバネ接点とが加圧接触して電気的に接続されることとなり、ケーブルを使用した場合に比べてコストと組立工数の削減が可能となる。なお、この場合は、本体側のバネ接点が高圧基板のジャンパ線に高圧基板の部品面（リード部品のボディが出る側）から接触が行われるため、部品面が画像形成装置の本体側に向いている必要がある。そのため、本体構成上、高圧基板の半田面（表面実装部品を実装する側）が画像形成装置の本体側に向いている場合には、ジャンパ接点の下に穴を空け、その穴越しにバネ接点をジャンパ接点に接触させて電気的導通をとる必要がある。 These voltages are generated by a circuit board (hereinafter referred to as a high-voltage board) incorporated in the image forming apparatus, and are supplied to necessary parts of the image forming apparatus main body. However, if the connection from the high-voltage output section of the high-voltage board to the target location where voltage is supplied is made via a cable, not only is it costly, but the assembly process of the main body is complicated, and it takes time to assemble. However, there is a risk of accidentally assembling. Therefore, as a method for solving these problems, a method in which a spring contact made of a coil spring-like elastic member is provided in the image forming apparatus main body and a jumper wire is arranged at a predetermined position on a high-voltage substrate corresponding to the spring contact to serve as a contact. It has been proposed (see, for example, Patent Document 1). With such a configuration, when assembling the high-voltage board to the main body, the jumper wire and the spring contact of the high-voltage board are inevitably in pressure contact and electrically connected, and when a cable is used. It is possible to reduce the cost and assembly man-hours. In this case, since the spring contact on the main body side contacts the jumper wire of the high-voltage board from the component surface of the high-voltage board (the side where the body of the lead component comes out), the component surface faces the main body side of the image forming apparatus. Must be. Therefore, in the main body configuration, if the solder surface of the high-voltage board (the side on which the surface mount component is mounted) faces the main body side of the image forming apparatus, make a hole under the jumper contact and make a spring contact through the hole. Must be brought into contact with the jumper contacts to provide electrical continuity.
説明図を図１０に示す。図１０（Ａ）は、高圧基板を画像形成装置本体に組み付ける直前の様子を表した図である。図１０（Ａ）は、高圧基板の部品面１００４側に設けられたジャンパ１００２、ジャンパ１００２を実装するための基板の貫通部１００３、画像形成装置の本体側バネ接点１００５を示す図である。破線で示す１００１は中心線を示す。高圧基板のジャンパ１００２の下に相当する部分に穴１０１１が空いているため、ジャンパ１００２と本体側バネ接点１００５とは接触することができる。また、図１０（Ｂ）は、製造直後の高圧基板の様子を表している。図１０（Ｂ）は、高圧基板の部品面１００４側に、リードジャンパ１００６（図１０（Ａ）のジャンパ１００２と同じもの）が実装され、リードジャンパ１００６は、高圧基板のスリット部１００７、捨て基板１００８を跨いで実装されている。また、ミシン目部１００９は捨て基板１００８を保持しており、破線で挟まれた図中上下方向の範囲をミシン目部１００９とする。１０１０は、捨て基板１００８上の破線で丸く囲まれた範囲を指している。 An explanatory diagram is shown in FIG. FIG. 10A is a diagram showing a state immediately before assembling the high-voltage substrate to the image forming apparatus main body. FIG. 10A is a diagram showing a jumper 1002 provided on the component surface 1004 side of the high-voltage substrate, a through portion 1003 of the substrate for mounting the jumper 1002, and a spring contact 1005 on the main body side of the image forming apparatus. 1001 shown by the broken line indicates the center line. Since the hole 1011 is formed in the portion of the high-voltage substrate corresponding to the bottom of the jumper 1002, the jumper 1002 and the spring contact 1005 on the main body side can come into contact with each other. Further, FIG. 10B shows a state of the high-voltage substrate immediately after production. In FIG. 10B, a lead jumper 1006 (same as the jumper 1002 in FIG. 10A) is mounted on the component surface 1004 side of the high-voltage substrate, and the lead jumper 1006 is a slit portion 1007 of the high-voltage substrate and a discarded substrate. It is implemented across 1008. Further, the perforated portion 1009 holds the discarded substrate 1008, and the range in the vertical direction in the figure sandwiched by the broken lines is defined as the perforated portion 1009. 1010 refers to the area circled by the broken line on the discarded substrate 1008.
ところで、回路基板に対する部品の実装方法は、フロー実装、リフロー実装などがあるが、大量生産される製品においては低コストのフロー実装方式が採用されることが多い。しかし、図１０（Ａ）のように穴１０１１が空いた状態の高圧基板をフロー実装すると、穴１０１１が空いているため、ジャンパ１００２の下側（本体側バネ接点１００５が接触する側）にフロー槽から噴出される半田やフラックスが付着することになる。その結果、導電性が低下するなど、接点としての信頼性が損なわれる。半田やフラックスの付着を防ぐために、図１０（Ｂ）では、リードジャンパ１００６の本体側バネ接点１００５と接触する部分が、捨て基板１００８によって隠されている。すなわち、高圧基板は、ミシン目部１００９を介して捨て基板１００８が接続された状態で、リードジャンパ１００６を含む全ての部品が実装され、その状態でフロー実装が行われる。フロー実装における半田やフラックスの塗布は、高圧基板の半田面側に行われるため、半田やフラックスは図１０（Ａ）の図中奥側から手前側方向に向かって噴射される。そのため、半田やフラックスは、捨て基板１００８に遮られてリードジャンパ１００６には付着しない。フロー実装終了後、どちらか一方の範囲１０１０を高圧基板の部品面１００４側から半田面方向に押圧して、ミシン目部１００９に応力を集中させて捨て基板１００８を割り捨てた後、画像形成装置本体に高圧基板を組み付ける。これにより、本体側バネ接点１００５とリードジャンパ１００６とが接触し、電気的導通を安定的に維持することが可能となる。 By the way, there are flow mounting, reflow mounting and the like as a method of mounting components on a circuit board, but a low-cost flow mounting method is often adopted for mass-produced products. However, when a high-voltage substrate with holes 1011 is flow-mounted as shown in FIG. 10A, the holes 1011 are open, so that the flow is on the lower side of the jumper 1002 (the side where the spring contact 1005 on the main body contacts). The solder and flux ejected from the tank will adhere. As a result, the reliability as a contact is impaired, such as a decrease in conductivity. In order to prevent adhesion of solder and flux, in FIG. 10B, a portion of the lead jumper 1006 in contact with the spring contact 1005 on the main body side is hidden by a waste substrate 1008. That is, in the high-voltage substrate, all the components including the lead jumper 1006 are mounted in a state where the discard substrate 1008 is connected via the perforation portion 1009, and the flow mounting is performed in that state. Since the solder or flux is applied to the solder surface side of the high-voltage substrate in the flow mounting, the solder or flux is injected from the back side in the figure of FIG. 10A toward the front side. Therefore, the solder and the flux are blocked by the waste substrate 1008 and do not adhere to the lead jumper 1006. After the flow mounting is completed, one of the ranges 1010 is pressed from the component surface 1004 side of the high-pressure substrate toward the solder surface to concentrate the stress on the perforated portion 1009 and discard the discarded substrate 1008, and then the image forming apparatus. Assemble the high-pressure board to the main body. As a result, the spring contact 1005 on the main body side and the lead jumper 1006 come into contact with each other, and it becomes possible to stably maintain electrical continuity.
しかしながら、図１０（Ｂ）において、捨て基板１００８の範囲１０１０を押圧して、捨て基板１００８を高圧基板からミシン目部１００９で分割させようとすると、ミシン目部１００９の一部が、高圧基板側に残存することがある。図１１は、ミシン目部１００９の一部が、高圧基板側に残存したパターンを説明する図であり、図１０（Ｂ）に示す高圧基板を高圧基板の側面方向から見たときの図である。図１１に示すように、捨て基板１００８の範囲１０１０のいずれかを押圧すると、捨て基板１００８全体が湾曲し、捨て基板１００８の最も細い部分であるミシン目部１００９に応力が集中する。ところが、図１１に示す捨て基板１００８の側面方向から見ると、捨て基板１００８は、点線で挟まれたミシン目部１００９内のどこの箇所で高圧基板と分割されてもおかしくない。具体的には、捨て基板１００８の範囲１０１０を押圧した際に、捨て基板１００８は、ミシン目部１００９内の最も弱い部分、例えば捨て基板１００８の繊維密度が低い部分や傷の入っている箇所、水分が多い箇所などで分割されることになる。その結果、図１１に示す分割パターンＡ〜Ｃのように、ミシン目部１００９における分割位置がばらつき、破断パターンＢのように、高圧基板側に、捨て基板１００８と繋がっていたミシン目部１００９の大きな部分が残存する場合がある。図１２は、図１１の分割パターンＢのように、大きなミシン目部１００９が残存してしまった状態を示す図であり、１０１２が捨て基板１００８を分割した際のミシン目部１００９の残存部である。図１２に示す状態で、中心線１００１に沿って本体側バネ接点１００５をジャンパ１００２に接触させようとすると、本体側バネ接点１００５は、ジャンパ１００２に接触する前に、ミシン目部１００９の残存部１０１２にひっかかってしまう。その結果、本体側バネ接点１００５とジャンパ１００２とが、電気的に接続できない状況が発生してしまう。 However, in FIG. 10B, when the range 1010 of the discarded substrate 1008 is pressed to divide the discarded substrate 1008 from the high-voltage substrate at the perforations 1009, a part of the perforated substrate 1009 is on the high-voltage substrate side. May remain in. FIG. 11 is a diagram for explaining a pattern in which a part of the perforation portion 1009 remains on the high-voltage substrate side, and is a view when the high-voltage substrate shown in FIG. 10B is viewed from the side surface direction of the high-voltage substrate. .. As shown in FIG. 11, when any one of the range 1010 of the discarded substrate 1008 is pressed, the entire discarded substrate 1008 is curved, and the stress is concentrated on the perforated portion 1009 which is the thinnest portion of the discarded substrate 1008. However, when viewed from the side surface direction of the discarded substrate 1008 shown in FIG. 11, the discarded substrate 1008 may be separated from the high-voltage substrate at any point in the perforation portion 1009 sandwiched by the dotted line. Specifically, when the range 1010 of the discarded substrate 1008 is pressed, the discarded substrate 1008 is the weakest portion in the perforated portion 1009, for example, a portion of the discarded substrate 1008 having a low fiber density or a scratched portion. It will be divided at places with a lot of water. As a result, the division positions in the perforations 1009 vary as shown in the division patterns A to C shown in FIG. 11, and the perforations 1009 connected to the discarded substrate 1008 on the high-voltage substrate side as in the break pattern B. Large parts may remain. FIG. 12 is a diagram showing a state in which a large perforation portion 1009 remains as in the division pattern B of FIG. 11, and is a remaining portion of the perforation portion 1009 when the discarded substrate 1008 is divided by 1012. is there. In the state shown in FIG. 12, when the main body side spring contact 1005 is brought into contact with the jumper 1002 along the center line 1001, the main body side spring contact 1005 is the remaining portion of the perforation portion 1009 before coming into contact with the jumper 1002. I get caught in 1012. As a result, a situation occurs in which the spring contact 1005 on the main body side and the jumper 1002 cannot be electrically connected.
本発明は、このような状況のもとでなされたもので、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることを目的とする。 The present invention has been made under such circumstances, and an object of the present invention is to reduce the connection portion with the discarded substrate remaining on the high-voltage substrate side when the discarded substrate is divided from the high-voltage substrate.
上述した課題を解決するために、本発明では、以下の構成を備える。 In order to solve the above-mentioned problems, the present invention includes the following configurations.
（１）部品が実装される基板において、前記部品が実装される前記基板の第１の面に金属部品により形成され、装置側接点部と電気的に接続される基板側接点部を備え、前記金属部品の直下の基板部分は、圧力を加えることにより前記基板との接続部分に応力が集中し、前記基板から分割可能な捨て基板となるようにスリット加工されており、前記捨て基板の前記第１の面の反対側の第２の面は、前記圧力を加える際に前記捨て基板の剛性を補強する補強材が固着されている第１の領域を有することを特徴とする基板。 (1) In a substrate on which a component is mounted, a substrate-side contact portion formed of a metal component and electrically connected to a device-side contact portion is provided on the first surface of the substrate on which the component is mounted. The substrate portion directly below the metal component is slit-processed so as to be a waste substrate that can be separated from the substrate by concentrating stress on the connection portion with the substrate by applying pressure, and the first of the waste substrates. The second surface opposite to the first surface has a first region to which a reinforcing material for reinforcing the rigidity of the discarded substrate is fixed when the pressure is applied.
（２）像担持体と、前記像担持体を帯電する帯電手段と、前記帯電手段により帯電された前記像担持体に潜像を形成する露光手段と、前記露光手段により形成された潜像を現像しトナー像を形成する現像手段と、前記現像手段により形成されたトナー像を被転写体に転写する転写手段と、前記帯電手段、前記現像手段及び前記転写手段の少なくとも１つに供給される電圧を生成するための前記（１）に記載の基板と、前記基板側接点部と接続される前記装置側接点部と、を備えることを特徴とする画像形成装置。 (2) An image carrier, a charging means for charging the image carrier, an exposure means for forming a latent image on the image carrier charged by the charging means, and a latent image formed by the exposure means. It is supplied to at least one of the developing means for developing and forming a toner image, the transferring means for transferring the toner image formed by the developing means to the transfer target, the charging means, the developing means, and the transfer means. An image forming apparatus including the substrate according to (1) for generating a voltage and the device-side contact portion connected to the substrate-side contact portion.
本発明によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 According to the present invention, when the discarded substrate is divided from the high-voltage substrate, the connection portion with the discarded substrate remaining on the high-voltage substrate side can be reduced.
以下に、図面を参照して本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
［画像形成装置の構成］
実施例１の画像形成装置であるレーザプリンタについて説明する。図１にモノクロレーザプリンタ（以下、単にプリンタという）の断面図を示す。プリンタは、給紙部１０１、露光手段であるレーザスキャナ１０２、トナータンク１０３、現像手段である現像ローラ１０４、像担持体である感光ドラム１０５を備えている。また、プリンタは、転写手段である転写ローラ１０６、帯電手段である帯電ローラ１０７、廃トナータンク１０８、定着ローラ１０９、加圧ローラ１１０、排出部１１１を備えている。また、図１には、搬送経路１１２、レーザ光１１３の光路（破線で表示）を示している。給紙部１０１は、印刷対象となる記録材（被転写体）である用紙Ｐを格納するもので、内部には用紙Ｐが積載されている。トナータンク１０３には、磁性体トナーが充填されている。なお、画像形成装置の構成は図１のモノクロレーザプリンタに限定されず、例えばカラーレーザプリンタ等、他の画像形成装置であってもよい。
[Configuration of image forming apparatus]
The laser printer which is the image forming apparatus of Example 1 will be described. FIG. 1 shows a cross-sectional view of a monochrome laser printer (hereinafter, simply referred to as a printer). The printer includes a paper feed unit 101, a laser scanner 102 as an exposure means, a toner tank 103, a developing roller 104 as a developing means, and a photosensitive drum 105 as an image carrier. Further, the printer includes a transfer roller 106 which is a transfer means, a charging roller 107 which is a charging means, a waste toner tank 108, a fixing roller 109, a pressure roller 110, and a discharge unit 111. Further, FIG. 1 shows an optical path (indicated by a broken line) of the transport path 112 and the laser beam 113. The paper feeding unit 101 stores the paper P, which is the recording material (transferred body) to be printed, and the paper P is loaded therein. The toner tank 103 is filled with magnetic toner. The configuration of the image forming apparatus is not limited to the monochrome laser printer of FIG. 1, and may be another image forming apparatus such as a color laser printer.
［画像形成装置の動作説明］
続いて、画像形成装置であるプリンタの動作説明を行う。プリンタは印刷ジョブを受信すると、各ローラとレーザスキャナ１０２の動作を開始する。帯電ローラ１０７は、図１には不図示の回路基板から電力を供給され、負の高電圧を発生させて、感光ドラム１０５の表面を帯電させる。パーソナルコンピュータ（ＰＣ）等から画像信号が送信されてくると、レーザスキャナ１０２は画素に応じてレーザ光を点滅させながら感光ドラム１０５の表面を走査する。感光ドラム１０５はレーザ光が照射された部分の電荷が消滅し、感光ドラム１０５上（像担持体上）に潜像が形成される。現像ローラ１０４には負の高電圧が供給されており、現像ローラ１０４の内部に有する磁石によってトナータンク１０３内の磁性体トナーを磁力によって引き寄せ、静電気力によって潜像に応じてトナーを感光ドラム１０５に移動させる。これにより、感光ドラム１０５上にトナー像が形成される。
[Explanation of operation of image forming apparatus]
Subsequently, the operation of the printer, which is an image forming apparatus, will be described. When the printer receives the print job, the operation of each roller and the laser scanner 102 is started. The charging roller 107 is supplied with electric power from a circuit board (not shown in FIG. 1) to generate a negative high voltage to charge the surface of the photosensitive drum 105. When an image signal is transmitted from a personal computer (PC) or the like, the laser scanner 102 scans the surface of the photosensitive drum 105 while blinking the laser beam according to the pixels. In the photosensitive drum 105, the electric charge of the portion irradiated with the laser beam disappears, and a latent image is formed on the photosensitive drum 105 (on the image carrier). A negative high voltage is supplied to the developing roller 104, and the magnet inside the developing roller 104 attracts the magnetic toner in the toner tank 103 by magnetic force, and the electrostatic force attracts the toner according to the latent image of the photosensitive drum 105. Move to. As a result, a toner image is formed on the photosensitive drum 105.
一方、給紙部１０１から給紙された用紙Ｐは搬送経路１１２を搬送され、転写ローラ１０６と感光ドラム１０５の間に搬送される。このとき、転写ローラ１０６には正の高電圧が印加されており、感光ドラム１０５上のトナーが転写ローラ１０６に引かれる形で用紙Ｐに転写される。トナーが載った用紙Ｐは、排出部１１１に向かって搬送される途中で、定着ローラ１０９と加圧ローラ１１０の間に搬送される。ここで用紙Ｐは、定着ローラ１０９によって数百度に加熱されるとともに加圧ローラ１１０によって圧迫され、静電気力によってのみ用紙Ｐに載っていたトナー、言い換えれば未定着のトナーが用紙Ｐに定着される。 On the other hand, the paper P fed from the paper feed unit 101 is conveyed along the transfer path 112 and is conveyed between the transfer roller 106 and the photosensitive drum 105. At this time, a positive high voltage is applied to the transfer roller 106, and the toner on the photosensitive drum 105 is transferred to the paper P in the form of being attracted by the transfer roller 106. The paper P on which the toner is placed is conveyed between the fixing roller 109 and the pressurizing roller 110 while being conveyed toward the discharge unit 111. Here, the paper P is heated to several hundred degrees by the fixing roller 109 and pressed by the pressure roller 110, and the toner on the paper P only by the electrostatic force, in other words, the unfixed toner is fixed on the paper P. ..
トナーが定着された用紙Ｐは、排出部１１１に排出され、積載されていく。一方、感光ドラム１０５の表面には用紙Ｐへの転写が行われた後も若干トナーが残る。理想的には全てのトナーが用紙Ｐへ転写されるべきであるが、実際にはトナーの持つ電荷量が一様ではないことから転写後もトナーが残る場合がある。感光ドラム１０５上に残ったトナーは、感光ドラム１０５に接触させたブレードによって剥ぎ取られ、廃トナータンク１０８に回収される。これにより感光ドラム１０５上からはトナーがなくなり、再度帯電ローラ１０７によって帯電され、レーザスキャナ１０２によって次の潜像が形成されることになる。以上の動作を繰り返しながらレーザプリンタは画像を形成する。 The paper P on which the toner is fixed is discharged to the discharge unit 111 and loaded. On the other hand, some toner remains on the surface of the photosensitive drum 105 even after the transfer to the paper P is performed. Ideally, all the toner should be transferred to the paper P, but in reality, the amount of charge contained in the toner is not uniform, so that the toner may remain even after the transfer. The toner remaining on the photosensitive drum 105 is stripped off by a blade in contact with the photosensitive drum 105 and collected in the waste toner tank 108. As a result, the toner disappears from the photosensitive drum 105, the toner is charged again by the charging roller 107, and the next latent image is formed by the laser scanner 102. The laser printer forms an image while repeating the above operation.
［高圧接点部の説明］
上述したように、レーザプリンタでは、帯電、現像、転写の各プロセスで高電圧が必要とされる。高電圧は、回路基板（以下、高圧基板と記す）２００（図２参照）によって生成され、プリンタ本体に供給される。具体的には、高電圧は高圧基板２００によって生成され、上述した帯電ローラ１０７、現像ローラ１０４、転写ローラ１０６等の高電圧が必要とされる部材に供給される。高圧基板２００（基板本体）は、フロー実装される片面基板であり、高圧基板２００とプリンタ本体の給電部を接続する方法として、図２に示す基板側接点部である高圧接点部２５０を使用する。図２は、本実施例の高圧接点部２５０を高圧基板２００の電子部品（挿入部品）が実装される第１の面である部品面２０７に直交する方向から見た図である。図２には、多角形状の捨て基板２０３、高圧基板２００の部品面２０７側に、高圧基板２００のスリット２０２及び捨て基板２０３を跨ぐように設置された金属部品であるリードジャンパ（以下、ジャンパという）２０１を示している。更に、図２には、高圧基板２００との間の１箇所に設けられ、捨て基板２０３を保持しているミシン目部２０４（接続部分）を示している。ミシン目部２０４の２つの破線で挟まれた図中、上下方向の長さは、約１ｍｍである。また、上側の破線部２０６は、捨て基板２０３と高圧基板２００との接続部（ミシン目部２０４の高圧基板２００側との接続部）の位置を示している。図中、灰色に塗られた第１の領域である半田付着部２０５は、捨て基板２０３の半田面２０８側において、レジストが剥がされて銅箔がむき出しになっている部分であり、フロー実装を行った際に半田が付着する部分である。
[Explanation of high-voltage contacts]
As mentioned above, in laser printers, high voltage is required in each process of charging, developing, and transferring. The high voltage is generated by a circuit board (hereinafter referred to as a high voltage board) 200 (see FIG. 2) and supplied to the printer main body. Specifically, the high voltage is generated by the high-voltage substrate 200 and is supplied to the above-mentioned members such as the charging roller 107, the developing roller 104, and the transfer roller 106, which require a high voltage. The high-voltage board 200 (board body) is a single-sided board on which a flow is mounted, and as a method of connecting the high-voltage board 200 and the power supply part of the printer body, the high-voltage contact part 250 which is the board-side contact part shown in FIG. .. FIG. 2 is a view of the high-voltage contact portion 250 of this embodiment viewed from a direction orthogonal to the component surface 207, which is the first surface on which the electronic component (insertion component) of the high-voltage substrate 200 is mounted. FIG. 2 shows a lead jumper (hereinafter referred to as a jumper) which is a metal component installed so as to straddle the slit 202 of the high-voltage substrate 200 and the discard substrate 203 on the component surface 207 side of the polygonal waste substrate 203 and the high-voltage substrate 200. ) 201 is shown. Further, FIG. 2 shows a perforated portion 204 (connection portion) provided at one location between the high-voltage substrate 200 and holding the discarded substrate 203. In the figure sandwiched between the two broken lines of the perforation portion 204, the length in the vertical direction is about 1 mm. Further, the broken line portion 206 on the upper side indicates the position of the connection portion between the discarded substrate 203 and the high-voltage substrate 200 (the connection portion of the perforation portion 204 with the high-voltage substrate 200 side). In the figure, the solder adhesion portion 205, which is the first region painted in gray, is a portion on the solder surface 208 side of the waste substrate 203 where the resist is peeled off and the copper foil is exposed, and the flow mounting is performed. This is the part where the solder adheres when it is done.
また、捨て基板２０３は、ジャンパ２０１の直下の基板部分であり、圧力を加えることにより高圧基板２００との接続部分に応力が集中し、高圧基板２００から分割可能（割捨可能）な捨て基板２０３となるように、スリット加工されている。また、捨て基板２０３は、フロー実装時において高圧接点部２５０を保護する保護部としても機能する。図２に示す高圧接点部２５０の使用方法は、前述した従来例の図１０（Ａ）に示す接点部と同様である。すなわち、高圧基板２００がプリンタ本体に組み付けられる際には、装置側接点部である本体側のバネ接点は、高圧基板２００の半田面２０８側から捨て基板２０３が取り除かれて形成された穴部を通って、対向する位置にあるジャンパ２０１に接触する。なお、捨て基板２０３を高圧基板２００から分割する際に押圧される図２の部分は、従来例の図１０（Ｂ）に示す範囲１０１０に対応する部分である。 Further, the discarded substrate 203 is a substrate portion directly below the jumper 201, and stress is concentrated on the connection portion with the high-voltage substrate 200 by applying pressure, and the discarded substrate 203 is separable (discardable) from the high-voltage substrate 200. It is slit processed so as to be. The discarded substrate 203 also functions as a protective portion that protects the high-voltage contact portion 250 during flow mounting. The method of using the high-voltage contact portion 250 shown in FIG. 2 is the same as that of the contact portion shown in FIG. 10 (A) of the conventional example described above. That is, when the high-voltage substrate 200 is assembled to the printer main body, the spring contact on the main body side, which is the contact portion on the device side, has a hole formed by removing the discarded substrate 203 from the solder surface 208 side of the high-voltage substrate 200. It passes through and contacts the jumper 201 at the opposite position. The portion of FIG. 2 that is pressed when the discarded substrate 203 is divided from the high-voltage substrate 200 is a portion corresponding to the range 1010 shown in FIG. 10 (B) of the conventional example.
本実施例の特徴は、捨て基板２０３の半田面２０８側に半田付着部２０５を設けることにより、フロー実装後には、捨て基板２０３の半田面２０８側の全面からミシン目部２０４の破線部２０６で示す部分まで、半田が付着していることである。図３は、高圧基板２００、及び捨て基板２０３を捨て基板２０３の側面方向から見た図であり、捨て基板２０３の半田面２０８側に半田（灰色部分）が付着した状態で、捨て基板２０３の部品面２０７側から押圧したときの様子を説明する図である。図３に示すように、捨て基板２０３の第２の面である半田面２０８側に半田が付着しており、半田は捨て基板２０３の材質よりも硬い。そのため、捨て基板２０３のミシン目部２０４の破線部２０６の端部とは反対側の端部側を押圧した場合に、半田付着部２０５に付着した補強材である半田により捨て基板２０３の剛性が補強されるため、前述した図１１のように捨て基板２０３が湾曲しなくなる。その結果、半田が付着（固着）した半田付着部２０５の端部である破線部２０６に応力が集中することになり、破線部２０６で捨て基板２０３が高圧基板２００から分割されやすくなる。すなわち、本実施例では、捨て基板２０３を押圧して高圧基板２００と分割した際に、図１１に示す分割パターンＡ〜Ｃのように、ミシン目部２０４で捨て基板２０３の分割箇所がばらつくことを抑制することができる。 The feature of this embodiment is that the solder adhesion portion 205 is provided on the solder surface 208 side of the waste substrate 203, so that after the flow is mounted, the broken line portion 206 of the perforation portion 204 from the entire surface of the waste substrate 203 on the solder surface 208 side. The solder has adhered to the indicated part. FIG. 3 is a view of the high-voltage substrate 200 and the discarded substrate 203 viewed from the side surface of the discarded substrate 203, and the discarded substrate 203 has solder (gray portion) attached to the solder surface 208 side of the discarded substrate 203. It is a figure explaining the state when pressed from the component surface 207 side. As shown in FIG. 3, solder adheres to the solder surface 208 side, which is the second surface of the waste substrate 203, and the solder is harder than the material of the waste substrate 203. Therefore, when the end side of the perforated portion 204 of the discarded substrate 203 opposite to the end portion of the broken line portion 206 is pressed, the rigidity of the discarded substrate 203 is increased by the solder which is a reinforcing material adhering to the solder adhering portion 205. Since it is reinforced, the discarded substrate 203 does not bend as shown in FIG. 11 described above. As a result, stress is concentrated on the broken line portion 206, which is the end of the solder adhering portion 205 to which the solder is adhered (fixed), and the discarded substrate 203 is easily separated from the high-voltage substrate 200 at the broken line portion 206. That is, in this embodiment, when the discard substrate 203 is pressed and divided into the high-voltage substrate 200, the division points of the discard substrate 203 are scattered at the perforations 204 as shown in the division patterns A to C shown in FIG. Can be suppressed.
［本実施例と従来例の捨て基板での分割位置の比較］
次に、実験により捨て基板２０３の分割箇所のばらつきについて検証した結果について説明する。図４は、実験に用いた高圧基板２００の捨て基板２０３の構成を示す図である。なお、図４では、ジャンパ２０１は不図示としている。図４（Ａ）は、本実施例との比較のために用意した、従来例の図１０（Ｂ）に示す捨て基板１００８と同じ構成の捨て基板２０３であり、捨て基板２０３の半田面２０８側には、半田付着部２０５は設けられていない。一方、図４（Ｂ）は、本実施例の図２に示す捨て基板２０３である。ここでは、図４（Ａ）と図４（Ｂ）に示す構成を有する捨て基板２０３を各１８個作成し、捨て基板２０３上の同じ位置を同じ強さで押圧して、高圧基板２００から破断させることにより、捨て基板２０３と高圧基板２００とを分割する実験を行った。図５は、捨て基板２０３を分割した後の高圧基板２００を示した図である。図５に示すように、捨て基板２０３を押圧して高圧基板２００から分割した際に、捨て基板２０３は必ずしも破線部２０６に沿って分割されるのではなく、破断部分を有するミシン目部２０４が残る。本実験では、図４（Ａ）、及び図４（Ｂ）の構成を有する高圧基板２００において、図５に示す破線部２０６とミシン目部２０４の破断箇所２０９との間の長さ（残存ミシン目部長さ）を測定し、その測定結果を表１に示す。
[Comparison of division positions between the discarded substrates of this example and the conventional example]
Next, the result of verifying the variation of the divided portion of the discarded substrate 203 by the experiment will be described. FIG. 4 is a diagram showing the configuration of the discarded substrate 203 of the high-voltage substrate 200 used in the experiment. In FIG. 4, the jumper 201 is not shown. FIG. 4 (A) is a waste substrate 203 having the same configuration as the waste substrate 1008 shown in FIG. 10 (B) of the conventional example, which is prepared for comparison with the present embodiment, and is on the solder side 208 side of the waste substrate 203. Is not provided with a solder bonding portion 205. On the other hand, FIG. 4B is the discarded substrate 203 shown in FIG. 2 of this embodiment. Here, 18 waste substrates 203 having the configurations shown in FIGS. 4 (A) and 4 (B) are prepared, and the same position on the waste substrate 203 is pressed with the same strength to break from the high-voltage substrate 200. An experiment was conducted in which the discarded substrate 203 and the high-voltage substrate 200 were separated. FIG. 5 is a diagram showing a high-voltage substrate 200 after dividing the discarded substrate 203. As shown in FIG. 5, when the discarded substrate 203 is pressed and separated from the high-voltage substrate 200, the discarded substrate 203 is not necessarily divided along the broken line portion 206, but the perforated portion 204 having the broken portion is formed. Remain. In this experiment, in the high-voltage substrate 200 having the configurations shown in FIGS. 4 (A) and 4 (B), the length between the broken line portion 206 shown in FIG. 5 and the break portion 209 of the perforation portion 204 (residual sewing machine). (Eye length) was measured, and the measurement results are shown in Table 1.
表１は、図４（Ａ）、（Ｂ）の構成を有する捨て基板２０３を分割した際に、高圧基板２００におけるミシン目部２０４に残る残存部分の長さの測定結果を示す表である。表１において、１番〜１８番は、実験に使用した高圧基板２００に付した番号である。「半田なし」は、図４（Ａ）に示す半田付着部２０５を有しない捨て基板２０３を使用した場合の測定結果を示し、「半田有り」は、図４（Ｂ）に示す半田付着部２０５を有する捨て基板２０３を使用した場合の測定結果を示している。なお、図中の数値の単位は、μｍである。表１の「合計」は１番〜１８番までの測定結果の合計、「平均」は、「合計」を１８で除した測定結果の平均値を示している。表１の「合計」及び「平均」が示すように、本実施例の構成の「半田あり」の方が、従来の構成の「半田なし」に比べ、平均値及び合計値ともに小さくなっている。これにより、本実施例の捨て基板２０３の構成では、捨て基板２０３を高圧基板２００から分割した際にミシン目部２０４に残る残存部分の長さが短くなっていることが分かる。 Table 1 is a table showing the measurement results of the length of the remaining portion remaining in the perforated portion 204 in the high-voltage substrate 200 when the discarded substrate 203 having the configurations of FIGS. 4A and 4B is divided. In Table 1, Nos. 1 to 18 are numbers assigned to the high-voltage substrate 200 used in the experiment. “Without solder” indicates the measurement result when the discarded substrate 203 without the solder adhesion portion 205 shown in FIG. 4 (A) is used, and “with solder” indicates the solder adhesion portion 205 shown in FIG. 4 (B). The measurement result when the discarded substrate 203 having is used is shown. The unit of the numerical value in the figure is μm. In Table 1, "total" indicates the total of the measurement results from No. 1 to No. 18, and "average" indicates the average value of the measurement results obtained by dividing the "total" by 18. As shown by "total" and "average" in Table 1, both the average value and the total value of "with solder" in the configuration of this embodiment are smaller than those of "without solder" in the conventional configuration. .. From this, it can be seen that in the configuration of the discarded substrate 203 of this embodiment, the length of the remaining portion remaining in the perforated portion 204 when the discarded substrate 203 is divided from the high-voltage substrate 200 is shortened.
このように、高圧基板２００に残存するミシン目部２０４の長さが短くなることにより、次のような効果を奏することができる。すなわち、特に画像形成装置の高圧接点では、画像形成装置本体側からのバネ接点が、分割した際に高圧基板２００のミシン目部２０４に残った残存部分に乗り上げることによる、高圧基板２００のジャンパ２０１との接触不良の発生を低減することができる。また、ミシン目部２０４に残る残存部分が長くなり接触不良が発生するおそれがある場合には、捨て基板２０３を高圧基板２００から分割した後に、目視又は機械によりミシン目部２０４の残存部が所定値よりも長くないかどうか確認する工程が必要であった。一方、本実施例では、平均的にミシン目部２０４に残る残存部分の長さを短くすることができ、その結果、ミシン目部２０４の残存部の長さを確認する工程をなくすことができ、コストを削減することができる。 As described above, by shortening the length of the perforation portion 204 remaining on the high-voltage substrate 200, the following effects can be obtained. That is, especially in the high-voltage contact of the image forming apparatus, the spring contact from the image forming apparatus main body side rides on the remaining portion remaining in the perforation portion 204 of the high-voltage substrate 200 when divided, so that the jumper 201 of the high-voltage substrate 200 It is possible to reduce the occurrence of poor contact with. If the remaining portion remaining on the perforated portion 204 becomes long and there is a risk of poor contact, the remaining portion of the perforated portion 204 is predetermined by visual inspection or mechanically after dividing the discarded substrate 203 from the high-voltage substrate 200. A step was needed to see if it was longer than the value. On the other hand, in this embodiment, the length of the remaining portion remaining in the perforation portion 204 can be shortened on average, and as a result, the step of confirming the length of the remaining portion of the perforation portion 204 can be eliminated. , Cost can be reduced.
以上説明したように、本実施例によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 As described above, according to the present embodiment, when the waste substrate is divided from the high-voltage substrate, the connection portion with the waste substrate remaining on the high-voltage substrate side can be reduced.
実施例１では、捨て基板２０３を押圧して高圧基板２００から分割した際に、高圧基板２００との接続部である捨て基板２０３のミシン目部２０４の残存部分の長さを従来よりも短くする構成について説明した。実施例２では、捨て基板のミシン目部２０４に残る残存部分の長さを更に短くする構成について説明する。 In the first embodiment, when the discarded substrate 203 is pressed and separated from the high-voltage substrate 200, the length of the remaining portion of the perforated portion 204 of the discarded substrate 203, which is the connection portion with the high-voltage substrate 200, is made shorter than before. The configuration was explained. In the second embodiment, a configuration will be described in which the length of the remaining portion remaining in the perforated portion 204 of the discarded substrate is further shortened.
［高圧接点部の説明］
図６は、本実施例の高圧接点部２５０の構成を示す図である。図６（Ａ）は、実施例１の高圧接点部２５０を、捨て基板２０３を含む高圧基板２００の部品面２０７に直交する方向から見た図である。一方、図６（Ｂ）は、本実施例の高圧接点部２５０を、捨て基板２０３を含む高圧基板２００の部品面２０７に直交する方向から見た図である。図６（Ｂ）では、半田付着部２０５のミシン目部２０４の端部が、ミシン目部２０４の破線部２０６よりも、高圧基板２００の内部の破線部６０１まで延びている点が図６（Ａ）と異なる。なお、図６（Ａ）、（Ｂ）のその他の構成は、実施例１の図２と同様の構成であり、同じ構成には同じ符号を付すことにより、ここでの説明を省略する。高圧基板２００から分離するために捨て基板２０３を押圧して分割した際に、捨て基板２０３のミシン目部２０４に残る残存部分の長さを更に短くするには、応力の集中点を次のようにすればよい。すなわち、応力の集中点を更に高圧基板２００の内側（図６（Ｂ）では、破線部２０６よりも図中上側）方向に移動させればよい。
[Explanation of high-voltage contacts]
FIG. 6 is a diagram showing the configuration of the high-voltage contact portion 250 of this embodiment. FIG. 6A is a view of the high-voltage contact portion 250 of the first embodiment viewed from a direction orthogonal to the component surface 207 of the high-voltage substrate 200 including the discarded substrate 203. On the other hand, FIG. 6B is a view of the high-voltage contact portion 250 of this embodiment viewed from a direction orthogonal to the component surface 207 of the high-voltage substrate 200 including the discarded substrate 203. FIG. 6B shows that the end of the perforated portion 204 of the solder bonding portion 205 extends from the broken line portion 206 of the perforated portion 204 to the broken line portion 601 inside the high-voltage substrate 200 (FIG. 6). Different from A). The other configurations of FIGS. 6A and 6B are the same as those of FIG. 2 of the first embodiment, and the same reference numerals are given to the same configurations, so that the description thereof will be omitted here. In order to further shorten the length of the remaining portion remaining in the perforation portion 204 of the discard substrate 203 when the discard substrate 203 is pressed to separate it from the high-voltage substrate 200, the stress concentration point is set as follows. It should be. That is, the stress concentration point may be further moved toward the inside of the high-voltage substrate 200 (in FIG. 6B, the upper side in the drawing with respect to the broken line portion 206).
具体的には、本実施例では、図６（Ｂ）に示すように、捨て基板２０３の半田面２０８（高圧基板２００の部品面２０７の反対側の面）に設けられた半田付着部２０５のミシン目部２０４側の端部である破線部６０１の位置を、次のように変更している。すなわち、図６（Ｂ）では、ミシン目部２０４側の破線部６０１の位置を、実施例１に対応した図６（Ａ）の破線部２０６から、更に本体基板である高圧基板２００の内部側に１００μｍ侵入させている。このように、図６（Ｂ）におけるミシン目部２０４の破線部６０１の位置と、実施例１の捨て基板２０３のミシン目部２０４の端部である破線部２０６の位置との差が１００μｍになるようにすることにより、次のような効果を奏する。すなわち、捨て基板２０３を押圧した際に応力が集中する箇所が、実施例１と比べて、高圧基板２００の内側方向に１００μｍ移動するため、実施例１の図５（Ｂ）に示すミシン目部２０４に残る残存部分の長さの平均値を約１００μｍ小さくすることができる。 Specifically, in this embodiment, as shown in FIG. 6B, the solder bonding portion 205 provided on the solder surface 208 of the waste substrate 203 (the surface opposite to the component surface 207 of the high-voltage substrate 200). The position of the broken line portion 601 which is the end portion on the perforation portion 204 side is changed as follows. That is, in FIG. 6B, the position of the broken line portion 601 on the perforated portion 204 side is further changed from the broken line portion 206 of FIG. 6A corresponding to the first embodiment to the internal side of the high voltage substrate 200 which is the main body substrate. Is invaded by 100 μm. As described above, the difference between the position of the broken line portion 601 of the perforated portion 204 in FIG. 6B and the position of the broken line portion 206 which is the end portion of the perforated portion 204 of the discarded substrate 203 of the first embodiment is 100 μm. By doing so, the following effects are obtained. That is, since the portion where the stress is concentrated when the discarded substrate 203 is pressed moves 100 μm inward of the high-voltage substrate 200 as compared with the first embodiment, the perforated portion shown in FIG. 5 (B) of the first embodiment. The average value of the lengths of the remaining portions remaining in 204 can be reduced by about 100 μm.
以上説明したように、本実施例によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 As described above, according to the present embodiment, when the waste substrate is divided from the high-voltage substrate, the connection portion with the waste substrate remaining on the high-voltage substrate side can be reduced.
実施例１では、高圧基板２００をフロー実装した際に半田が付着する半田付着部２０５は、捨て基板２０３の半田面２０８全体に設けられていた。実施例３では、半田付着部２０５の面積を削減した捨て基板２０３の構成について説明する。 In the first embodiment, the solder adhesion portion 205 to which the solder adheres when the high-voltage substrate 200 is flow-mounted is provided on the entire solder surface 208 of the discard substrate 203. In the third embodiment, the configuration of the discarded substrate 203 in which the area of the solder bonding portion 205 is reduced will be described.
［高圧接点部の説明］
図７は、本実施例の高圧接点部２５０の構成を示す図である。図７に示す本実施例の半田付着部７０１では、実施例１の図２に示す捨て基板２０３の半田付着部２０５と比べて、面積が削減されている。なお、図７では、実施例１の図２と同じ構成については、同じ符号を付すことで、ここでの説明を省略する。図中、灰色で示す半田付着部７０１は、捨て基板２０３の半田面２０８側において、レジストが剥がされて銅箔がむき出しになっている部分であり、フロー実装を行った際に、半田が付着する部分である。
[Explanation of high-voltage contacts]
FIG. 7 is a diagram showing the configuration of the high-voltage contact portion 250 of this embodiment. The area of the solder-bonded portion 701 of the present embodiment shown in FIG. 7 is reduced as compared with the solder-bonded portion 205 of the discarded substrate 203 shown in FIG. 2 of the first embodiment. In FIG. 7, the same components as those in FIG. 2 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted here. In the figure, the solder adhesion portion 701 shown in gray is a portion where the resist is peeled off and the copper foil is exposed on the solder surface 208 side of the waste substrate 203, and the solder adheres when the flow mounting is performed. It is the part to do.
実施例１の図３から分かるように、捨て基板２０３を押圧した際に、ミシン目部２０４の破線部２０６に近い箇所で捨て基板２０３を高圧基板２００から分離するためには、捨て基板２０３が撓まないようにすればよい。そのために必要なことは、捨て基板２０３の半田面２０８の長手方向全域にわたって半田が付着されていることであり、実施例１の図２の半田付着部２０５のように、捨て基板２０３全面に半田が付着していることは必須ではない。ここで、捨て基板２０３の半田面２０８の長手方向とは、捨て基板２０３のミシン目部２０４の破線部２０６から、破線部２０６とは反対側の捨て基板２０３の端部に向かう方向を指している。 As can be seen from FIG. 3 of the first embodiment, when the discard substrate 203 is pressed, the discard substrate 203 is used to separate the discard substrate 203 from the high-voltage substrate 200 at a position near the broken line portion 206 of the perforation portion 204. It should not be bent. What is necessary for this is that solder is adhered to the entire longitudinal direction of the solder surface 208 of the waste substrate 203, and solder is applied to the entire surface of the waste substrate 203 as in the solder adhesion portion 205 of FIG. 2 of the first embodiment. It is not essential that the is attached. Here, the longitudinal direction of the solder surface 208 of the discarded substrate 203 refers to the direction from the broken line portion 206 of the perforated portion 204 of the discarded substrate 203 toward the end portion of the discarded substrate 203 on the side opposite to the broken line portion 206. There is.
そこで、本実施例では、図７に示すように、高圧基板２００の半田面２０８に設けられた半田付着部７０１は、次のような構成となっている。すなわち、半田付着部７０１は、ミシン目部２０４と同じ幅（図中、左右方向の長さ）で、捨て基板２０３の全長（図中、上下方向の長さ）である、破線部２０６から捨て基板２０３のミシン目部２０４とは反対側の端部までの長さを有する。このような半田付着部７０１の構成により、捨て基板２０３を高圧基板２００から分割する際に、半田付着部７０１に付着した半田によって捨て基板２０３の剛性が補強され、捨て基板２０３が長手方向に撓むことを防ぐことができる。更に、本実施例の捨て基板２０３は、実施例１の捨て基板２０３よりも少ない半田量で、実施例１と同様の効果を奏することができる。 Therefore, in this embodiment, as shown in FIG. 7, the solder bonding portion 701 provided on the solder surface 208 of the high-voltage substrate 200 has the following configuration. That is, the solder bonding portion 701 is discarded from the broken line portion 206, which has the same width as the perforated portion 204 (length in the left-right direction in the figure) and the total length of the discard substrate 203 (length in the vertical direction in the figure). The substrate 203 has a length to the end opposite to the perforated portion 204. With such a configuration of the solder adhesion portion 701, when the waste substrate 203 is separated from the high-voltage substrate 200, the rigidity of the discard substrate 203 is reinforced by the solder adhering to the solder adhesion portion 701, and the waste substrate 203 is flexed in the longitudinal direction. It can be prevented from getting sick. Further, the discarded substrate 203 of the present embodiment can exhibit the same effect as that of the first embodiment with a smaller amount of solder than the discarded substrate 203 of the first embodiment.
以上説明したように、本実施例によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 As described above, according to the present embodiment, when the waste substrate is divided from the high-voltage substrate, the connection portion with the waste substrate remaining on the high-voltage substrate side can be reduced.
実施例４では、実施例３で説明した半田付着部７０１を有する捨て基板２０３を高圧基板２００から分離する際に、ミシン目部２０４に残る残存部分の長さがより短くなるような高圧基板２００の構成について説明する。 In the fourth embodiment, when the discarded substrate 203 having the solder adhesion portion 701 described in the third embodiment is separated from the high-voltage substrate 200, the high-voltage substrate 200 has a shorter length of the remaining portion remaining in the perforated portion 204. The configuration of is described.
［高圧接点部の説明］
図８は、本実施例の捨て基板２０３を含む高圧基板２００の高圧接点部２５０の構成を示す図である。図８では、実施例３の図７と比べて、高圧基板２００の半田面２０８側のミシン目部２０４の図中上部に、半田が付着しない領域８０２を介して、フロー実装を行った際に、半田が付着する半田付着部８０１が設けられている点が異なる点である。また、第２の領域である半田付着部８０１の図中左右方向の長さは、捨て基板２０３の短手方向（図中、左右方向）の長さよりも大きい。なお、図８では、実施例３の図７に示す捨て基板２０３と同じ構成には同じ符号を付し、ここでの説明を省略する。
[Explanation of high-voltage contacts]
FIG. 8 is a diagram showing a configuration of a high-voltage contact portion 250 of the high-voltage substrate 200 including the discarded substrate 203 of this embodiment. In FIG. 8, as compared with FIG. 7 of the third embodiment, when the flow is mounted on the upper part of the perforation portion 204 on the solder surface 208 side of the high-voltage substrate 200 through the region 802 where the solder does not adhere. The difference is that the solder adhesion portion 801 to which the solder adheres is provided. Further, the length of the solder bonding portion 801 in the second region in the left-right direction in the drawing is larger than the length in the lateral direction (left-right direction in the drawing) of the discarded substrate 203. In FIG. 8, the same components as those of the discarded substrate 203 shown in FIG. 7 of the third embodiment are designated by the same reference numerals, and the description thereof will be omitted here.
高圧基板２００をこのような構成にすることにより、捨て基板２０３を押圧して高圧基板２００から分割する際に、捨て基板２０３だけでなく、高圧基板２００の撓みも抑えることができる。更に、捨て基板２０３を高圧基板２００から分割する際に加える押圧に対する応力の集中点を、高圧基板２００の半田付着部８０１と捨て基板２０３の半田付着部７０１との間の狭い領域８０２に集中させることができる。これにより、捨て基板２０３は、第３の領域である領域８０２の部分で分割されやすくなり、実施例１や実施例３に比べて、ミシン目部２０４を所定の位置で破断させやすくなる。更に、ミシン目部２０４に残る残存部分の長さのばらつきも、より小さくすることができる。また、領域８０２の部分が広すぎると、この場合の効果は薄れてしまうため、領域８０２の図中上下方向の幅の目安としては、ミシン目部２０４の接続部分の長さよりも狭い方がよい。ただし、半田付着部８０１は、高圧基板２００側にも、比較的大きな半田面（ランド）を必要とし、捨て基板２０３を押圧した際に応力がかかり、剥離やひびが生じる可能性があるため、部品のランドや信号線パターンなどとは、兼用させない方がよい。なお、本実施例では、実施例３の捨て基板２０３を用いて構成を説明したが、本実施例の構成は、半田付着部２０５が捨て基板２０３の全面を占める実施例１の捨て基板２０３についても適用することができる。 By having such a configuration of the high-voltage substrate 200, when the waste substrate 203 is pressed to be separated from the high-voltage substrate 200, not only the waste substrate 203 but also the bending of the high-voltage substrate 200 can be suppressed. Further, the concentration point of the stress against the pressure applied when the waste substrate 203 is divided from the high pressure substrate 200 is concentrated in the narrow region 802 between the solder adhesion portion 801 of the high pressure substrate 200 and the solder adhesion portion 701 of the discard substrate 203. be able to. As a result, the discarded substrate 203 is more likely to be divided in the portion of the region 802, which is the third region, and the perforation portion 204 is more likely to be broken at a predetermined position as compared with the first and third embodiments. Further, the variation in the length of the remaining portion remaining in the perforation portion 204 can be further reduced. Further, if the portion of the region 802 is too wide, the effect in this case is diminished. Therefore, as a guideline for the width of the region 802 in the vertical direction in the figure, it is better to be narrower than the length of the connecting portion of the perforated portion 204. .. However, the solder adhesion portion 801 also requires a relatively large solder surface (land) on the high-voltage substrate 200 side, and stress is applied when the waste substrate 203 is pressed, which may cause peeling or cracking. It is better not to use it as a part land or signal line pattern. In this embodiment, the configuration was described using the discarded substrate 203 of the third embodiment, but the configuration of this embodiment is for the discarded substrate 203 of the first embodiment in which the solder adhesion portion 205 occupies the entire surface of the discarded substrate 203. Can also be applied.
以上説明したように、本実施例によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 As described above, according to the present embodiment, when the waste substrate is divided from the high-voltage substrate, the connection portion with the waste substrate remaining on the high-voltage substrate side can be reduced.
実施例１〜４では、高圧基板２００から分離するために捨て基板２０３を押圧した際に、捨て基板２０３及び高圧基板２００が撓むことを防ぐために、捨て基板２０３や高圧基板２００の半田面２０８に半田付着部を設けた例について説明した。実施例５では、半田の代わりに、補強材である接着剤を用いた構成について説明する。 In Examples 1 to 4, when the discarded substrate 203 is pressed to separate from the high-voltage substrate 200, the discarded substrate 203 and the high-voltage substrate 200 are soldered to the solder surface 208 in order to prevent the discarded substrate 203 and the high-voltage substrate 200 from bending. An example in which a solder adhering portion is provided in the above is described. In the fifth embodiment, a configuration in which an adhesive as a reinforcing material is used instead of the solder will be described.
［高圧接点部の説明］
図９は、本実施例の高圧接点部２５０の構成を示す図である。図９において、ハッチングで示される接着剤塗布部９０１、９０２は、それぞれ実施例４の図８に示す半田付着部７０１、８０１に対応する。接着剤塗布部９０１、９０２の形状が、半田付着部７０１、８０１と若干異なり、丸みを帯びているのは、接着剤がディスペンサーによって塗布されることを想定しているためである。例えば、メタルマスクなどを使用する場合には、接着剤塗布部９０１、９０２の形状は、図８に示す半田付着部７０１、８０１と同様の形状にすることも可能である。
[Explanation of high-voltage contacts]
FIG. 9 is a diagram showing the configuration of the high-voltage contact portion 250 of this embodiment. In FIG. 9, the adhesive application portions 901 and 902 shown by hatching correspond to the solder adhesion portions 701 and 801 shown in FIG. 8 of the fourth embodiment, respectively. The shapes of the adhesive application portions 901 and 902 are slightly different from those of the solder adhesion portions 701 and 801 and are rounded because it is assumed that the adhesive is applied by the dispenser. For example, when a metal mask or the like is used, the shapes of the adhesive application portions 901 and 902 can be the same as those of the solder adhesion portions 701 and 801 shown in FIG.
フロー実装を行う場合には、実装工程は次の手順で行われる。まず、ベアボードの銅箔面（高圧基板２００の半田面２０８）を上に向けて、表面実装用の接着剤を塗布する。次に、表面実装する部品を各々該当するロケーションに乗せ、ベアボードを上下反転させ、表面実装する部品が置かれたベアボードの銅箔面側（半田面２０８）を下から噴出される溶融半田の上を通過させることにより、表面実装部品のランドに半田付けを行う。ここで、接着剤は、ベアボードを上下反転したときに、表面実装する部品が落下しないように仮止めするために用いている。表面実装された部品を本止めするのに用いられるのが半田である。しかし、接着剤も放熱すると硬化するので、半田ほどの硬度はないが、実施例１〜４の半田のように、捨て基板２０３や高圧基板２００の撓みを抑制する補強部材として使用することができる。本実施例は、実施例４の半田の代わりに接着剤を用いた実施例であり、接着剤塗布部９０１、９０２は、実施例４の半田付着部７０１、８０１の形状とほぼ同様の形状で、接着剤塗布工程にて、接着剤塗布部９０１、９０２に接着剤が塗布される。例えば、実施例１や実施例３のように半田を使用した場合には、表面実装部品のランドでもしばしば発生するように、未半田状態（半田が付着していない状態）がありうる。一方、本実施例の場合には接着剤を使用しているため、そのような課題は生じない。なお、本実施例では、表面実装部品の仮止め用接着剤を用いたが、捨て基板２０３や高圧基板２００の撓みを抑えることができるような剛性を捨て基板２０３や高圧基板２００に付加するような部材であればよい。また、本実施例では、実施例４の半田付着部７０１、８０１を接着剤塗布部に変更した例について説明したが、実施例１〜３で説明した半田付着部を接着剤塗布部に変更しても、同様の効果を奏することができる。 When performing flow mounting, the mounting process is performed in the following procedure. First, the surface mounting adhesive is applied with the copper foil surface of the bare board (the solder surface 208 of the high-voltage substrate 200) facing upward. Next, place the surface mount components on the corresponding locations, turn the bare board upside down, and place the surface mount components on the copper foil side (solder surface 208) of the bare board on the molten solder ejected from below. Solder to the land of the surface mount component by passing through. Here, the adhesive is used to temporarily fix the surface-mounted parts so that they do not fall when the bare board is turned upside down. Solder is used to permanently fix surface mount components. However, since the adhesive also cures when heat is dissipated, it is not as hard as solder, but it can be used as a reinforcing member that suppresses bending of the discarded substrate 203 and the high-voltage substrate 200, as in the solder of Examples 1 to 4. .. This example is an example in which an adhesive is used instead of the solder of Example 4, and the adhesive application portions 901 and 902 have substantially the same shape as the solder adhesion portions 701 and 801 of Example 4. In the adhesive application step, the adhesive is applied to the adhesive application portions 901 and 902. For example, when solder is used as in Example 1 and Example 3, there may be an unsoldered state (a state in which solder is not adhered), as is often the case with lands of surface mount components. On the other hand, in the case of this embodiment, since an adhesive is used, such a problem does not occur. In this embodiment, an adhesive for temporarily fixing surface mount components was used, but the rigidity that can suppress the bending of the waste substrate 203 and the high-voltage substrate 200 is added to the discard substrate 203 and the high-voltage substrate 200. Any member may be used. Further, in this embodiment, an example in which the solder adhesion portions 701 and 801 of Example 4 are changed to the adhesive coating portion has been described, but the solder adhesion portions described in Examples 1 to 3 are changed to the adhesive coating portion. However, the same effect can be achieved.
以上説明したように、本実施例によれば、捨て基板を高圧基板から分割した際に、高圧基板側に残存する捨て基板との接続部分を小さくすることができる。 As described above, according to the present embodiment, when the waste substrate is divided from the high-voltage substrate, the connection portion with the waste substrate remaining on the high-voltage substrate side can be reduced.
２００ 高圧基板
２０１ ジャンパ
２０３ 捨て基板
２０４ ミシン目部
２０５ 半田付着部
200 High-voltage board 201 Jumper 203 Discard board 204 Perforation part 205 Solder attachment part
Claims (15)
前記部品が実装される前記基板の第１の面に金属部品により形成され、装置側接点部と電気的に接続される基板側接点部
を備え、
前記金属部品の直下の基板部分は、圧力を加えることにより前記基板との接続部分に応力が集中し、前記基板から分割可能な捨て基板となるようにスリット加工されており、
前記捨て基板の前記第１の面の反対側の第２の面は、前記圧力を加える際に前記捨て基板の剛性を補強する補強材が固着されている第１の領域を有することを特徴とする基板。 On the board on which the parts are mounted
A substrate-side contact portion formed of a metal component and electrically connected to a device-side contact portion is provided on the first surface of the substrate on which the component is mounted.
The substrate portion directly below the metal component is slit-processed so that stress is concentrated on the connection portion with the substrate by applying pressure so that the substrate portion can be separated from the substrate.
The second surface of the waste substrate on the opposite side of the first surface has a first region to which a reinforcing material for reinforcing the rigidity of the waste substrate is fixed when the pressure is applied. Board to be.
前記第１の領域と前記第２の領域との間には、前記補強材が固着されない第３の領域が設けられていることを特徴とする請求項４に記載の基板。 The substrate has a second region to which the reinforcing material is fixed to the second surface of the substrate.
The substrate according to claim 4, wherein a third region to which the reinforcing material is not fixed is provided between the first region and the second region.
前記像担持体を帯電する帯電手段と、
前記帯電手段により帯電された前記像担持体に潜像を形成する露光手段と、
前記露光手段により形成された潜像を現像しトナー像を形成する現像手段と、
前記現像手段により形成されたトナー像を被転写体に転写する転写手段と、
前記帯電手段、前記現像手段及び前記転写手段の少なくとも１つに供給される電圧を生成するための請求項１から請求項１３のいずれか１項に記載の基板と、
前記基板側接点部と接続される前記装置側接点部と、
を備えることを特徴とする画像形成装置。 Image carrier and
A charging means for charging the image carrier and
An exposure means that forms a latent image on the image carrier charged by the charging means, and
A developing means that develops a latent image formed by the exposure means to form a toner image, and
A transfer means for transferring the toner image formed by the developing means to the transfer target, and a transfer means.
The substrate according to any one of claims 1 to 13, for generating a voltage supplied to at least one of the charging means, the developing means, and the transfer means.
The device-side contact portion connected to the substrate-side contact portion,
An image forming apparatus comprising.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0388368U (en) * | 1989-12-27 | 1991-09-10 | ||
| JP3009175U (en) * | 1994-09-19 | 1995-03-28 | 船井電機株式会社 | Printed wiring board |
| JP2001326430A (en) * | 2000-05-18 | 2001-11-22 | Matsushita Electric Ind Co Ltd | Printed circuit board and its manufacturing method |
| JP2003069165A (en) * | 2001-08-23 | 2003-03-07 | Matsushita Electric Ind Co Ltd | One-sided printed-wiring board, and division method of the same |
| JP2005072256A (en) * | 2003-08-25 | 2005-03-17 | Sharp Corp | Method of manufacturing substrate and multilayer substrate and satellite broadcast receiver |
| JP2007149741A (en) * | 2005-11-24 | 2007-06-14 | Funai Electric Co Ltd | Printed board |
| JP2018014355A (en) * | 2016-07-19 | 2018-01-25 | キヤノン株式会社 | Substrate and image forming apparatus |
-
2019
- 2019-02-27 JP JP2019033664A patent/JP7336205B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0388368U (en) * | 1989-12-27 | 1991-09-10 | ||
| JP3009175U (en) * | 1994-09-19 | 1995-03-28 | 船井電機株式会社 | Printed wiring board |
| JP2001326430A (en) * | 2000-05-18 | 2001-11-22 | Matsushita Electric Ind Co Ltd | Printed circuit board and its manufacturing method |
| JP2003069165A (en) * | 2001-08-23 | 2003-03-07 | Matsushita Electric Ind Co Ltd | One-sided printed-wiring board, and division method of the same |
| JP2005072256A (en) * | 2003-08-25 | 2005-03-17 | Sharp Corp | Method of manufacturing substrate and multilayer substrate and satellite broadcast receiver |
| JP2007149741A (en) * | 2005-11-24 | 2007-06-14 | Funai Electric Co Ltd | Printed board |
| JP2018014355A (en) * | 2016-07-19 | 2018-01-25 | キヤノン株式会社 | Substrate and image forming apparatus |
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