JP2011187514A - Aggregate printed wiring board, printed wiring board device, print head, and image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that part of coupling pieces is left on a printed wiring board device or part of the printed wiring board device is cut when cutting the coupling pieces on an aggregate printed wiring board including a plurality of printed wiring board devices connected via the coupling pieces. <P>SOLUTION: The aggregate printed wiring board 1 includes a plurality of printed wiring boards 2 having conductor patterns formed of metallic foil layers 3 formed on its surface 17 where the boards are coupled via a plurality of the coupling pieces 4. Since the coupling piece 4 includes a recognition mark formed of the metallic film layer 3 on the surface 17, a cutting edge of the coupling piece 4 is positioned while being corrected by the recognition mark, and the coupling piece 4 can be removed from the printed wiring board 2 accurately by the cutting edge. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a collective printed wiring board in which a plurality of printed wiring boards (bare boards) are connected.

  When a printed wiring board device is manufactured by fixing (mounting) electronic components on a relatively small printed wiring board, it takes time to position and transport the printed wiring board, resulting in a reduction in manufacturing efficiency. For this reason, a collective printed wiring board in which the printed wiring boards are connected to each other by connecting pieces or the like is used (for example, see Patent Documents 1 to 10).

  In general, the collective printed wiring board is handled as one board in the manufacturing stage, and electronic components are generally fixed to pads or the like formed on the front surface and / or the back surface thereof. That is, the assembled printed circuit board is directly subjected to a heating and cooling process such as SMD (Surface Mount Device) reflow, COB (Chip On Board) cure, etc., when fixing electronic components.

  After that, the printed wiring board is cut off from the collective printed wiring board (inspected) to inspect each printed wiring board device, or the printed wiring board device is inspected as it is and printed from the collective printed wiring board. By dividing the wiring board, a printed wiring board device as a finished product is completed.

  However, if each printed wiring board device is cut off by cutting the connecting pieces of the collective printed wiring board or the like, a part of the connecting pieces may remain in the cut portion of the printed wiring board. In this case, it becomes a big problem for the printed wiring board device in which all or a part of the peripheral edge of the printed wiring board serves as a positioning reference.

  Further, if each printed wiring board device is cut off by cutting the connecting pieces of the collective printed wiring board, a part of the printed wiring board may be cut. In this case, a problem of disconnection occurs for a printed wiring board device in which a conductor pattern is formed in the vicinity of the peripheral edge of the printed wiring board.

Japanese Patent Laid-Open No. 04-320597 JP-A-11-176974 JP-A-11-163482 Japanese Patent Laid-Open No. 02-031490 Japanese Patent Laid-Open No. 03-250800 Japanese Patent Laid-Open No. 06-112600 Japanese Patent Laid-Open No. 06-169137 JP 2009-283959 A JP 09-2104080 A JP-A-11-191668

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an aggregate printed wiring board and the like that can separate individual printed wiring boards with high accuracy.

(First invention)
1st invention is the collective printed wiring board which connected the some printed wiring board which formed the conductor pattern which consists of metal foil layers on the surface by the some connecting piece, and a connection piece recognizes consisting of a metal foil layer on the surface side It is characterized by having a mark.

  With this configuration, the cutting device for the connecting piece can position the cutting blade or the like with high accuracy based on the recognition mark formed on the connecting piece. The printed wiring board is not cut off more than necessary by a cutting blade or the like.

(Second invention)
The printed wiring board device according to the second invention is obtained by fixing a plurality of electronic components to the collective printed wiring board of the first invention and cutting the connecting piece.
(Third invention)
A print head according to a third aspect of the invention includes the printed wiring board device of the second aspect in which the electronic component is a light emitting element, and a lens array in which a plurality of rod lenses are arranged and arranged, and one lens surface of the lens array and the light emitting element. The lens array and the printed wiring board device are fixed to the housing so that the two face each other.
(Fourth invention)
According to a fourth aspect of the present invention, there is provided an image forming apparatus comprising: a photoconductor that forms an electrostatic latent image on a surface; and the printhead according to the third invention facing the photoconductor.

  Since the printed wiring board device according to the third invention, the print head (device) according to the fourth invention, and the image forming apparatus according to the fifth invention use the collective printed wiring board according to the first invention or the second invention, The effect of the first invention or the second invention described above is achieved. For this reason, each apparatus can be manufactured with high accuracy and at low cost.

  The present invention can provide a printed wiring board or a printed wiring board device whose peripheral portion is processed with high accuracy despite using the collective printed wiring board device.

Plan view of the assembly printed wiring board Enlarged view of connecting piece (enlarged view of portion A in FIG. 1) Enlarged view of connecting piece (enlarged view of portion B in FIG. 1) Cross-sectional view of connecting piece (cross-section BB in FIG. 2, cross-section CC in FIG. 3) Plan view of a printed circuit board with electronic components fixed Perspective view of the end of an assembled printed circuit board with electronic components fixed Plan view of printed wiring board device An enlarged perspective view of an end portion (portion D in FIG. 7) of the printed wiring board device Side view of printed wiring board device (see arrow E in FIG. 8) Plan view of print head Perspective view of the end of the print head Cross section of print head The figure for demonstrating the structure of an image forming apparatus. Diagram showing the positional relationship between the print head and photoconductor Plan view of the assembly printed wiring board

  Hereinafter, the present invention will be described in detail with reference to the drawings.

An embodiment of the present invention will be described with reference to FIGS.
[Aggregate printed wiring board]
As shown in FIG. 1, the collective printed wiring board 1 according to the present invention is arranged in a line in the short direction (X direction) of the printed wiring board 2 and is connected to each other by connecting pieces 4 ( The five printed wiring boards 2 and the glass epoxy discarded board 5 surrounding the outside of the five printed wiring boards 2 are connected by a connecting piece 4 (made of glass epoxy).

(Printed wiring board)
On the surface 17 of the printed wiring board 2, a conductor made of a metal foil layer 3 (for example, a copper foil layer) for fixing light emitting elements as electronic components to be described later in a straight line shape (straight line or staggered pattern) in the longitudinal direction. A pattern (solid pattern) is formed.

  Further, as shown in FIG. 1 and the like, a positioning mark 7 for use as a positioning reference is formed on the surface 17 of the printed wiring board 2 when the electronic component 10 is mounted on the printed wiring board 2. The positioning mark 7 is formed by the metal foil layer 3 and is formed simultaneously with the formation of the conductor pattern 3.

  The five long printed wiring boards 2 are configured so that the electrical and mechanical functions such as the routing of the conductor pattern 3 made of the metal foil layer 3 and the positions of the pads are the same. Although other conductor patterns are not shown in FIG. 1 and the like, the conductor pattern includes an elongated wiring pattern 26 made of the metal foil layer 3 shown in FIG. 8 in addition to the solid pattern.

(Linked piece)
As shown in FIG. 1, the connecting pieces 4 that connect the printed wiring boards 2 and the printed wiring board 2 and the discarded board 5 have a plurality of long holes 9 that penetrate in the thickness direction (plate thickness direction = Z direction). It is formed by providing. In addition, as shown in FIG. 2 to FIG. 4, formation of the connection piece 4 (formation of the long hole 9) and a recognition mark 12 used when cutting the connection piece 4 are formed on all the connection pieces 4. ing. The recognition mark 12 is formed by the metal foil layer 3 and is formed simultaneously with the formation of the conductor pattern 3. For this reason, the recognition mark 12 can also be used as a positioning reference when the electronic component 10 is mounted on the printed wiring board 2, similarly to the positioning mark 7.

[Manufacturing method of collective printed wiring board]
Next, a method for manufacturing the above-described collective printed wiring board 1 will be described.
First, a rectangular flat insulating substrate 6 made of glass epoxy or the like is prepared. Then, a plurality of printed wiring boards 2 including a plurality of conductor patterns made of the metal foil layer 3 and positioning marks 7 made of the metal foil layer 3 are formed on the surface 17 of the insulating base 6.

  At this time, on the straight line along the area of the insulating base material 6 located between the printed wiring boards 2 and on the straight line along the area of the insulating base material 6 located between the printed wiring boards 2 and the discarding board 5. A plurality of recognition marks 12 made of the metal foil layer 3 are formed. Since the conductor pattern, the positioning mark 7 and the recognition mark 12 are simultaneously formed on the surface 17 of the insulating base 6, the mutual positional relationship is highly accurate.

  A specific example of the method for manufacturing the aggregate printed wiring board 1 will be described in more detail. For example, an insulating base 6 having a metal foil layer 3 such as a copper foil formed on the surface thereof is prepared and resistant to an etching solution. The positioning mark 7, the recognition mark 12 and the conductor pattern 3 are formed on the metal foil layer 3 using ink or the like. Then, unnecessary portions of the metal foil layer 3 are dissolved and removed using a solvent such as a ferric chloride solution. As a result, the positioning mark 7, the recognition mark 12 and the conductor pattern made of the metal foil layer 3 are formed on the surface of the insulating material 6. The recognition marks 12 are formed at predetermined intervals along the peripheral edge of the printed wiring board 2.

  Next, using a cutting device such as a router or a dicer provided with a recognition device capable of recognizing the position information of the recognition mark 12, the elongated hole 9 penetrating in the thickness direction (Z direction) of the insulating base material 6 is formed on the printed wiring board. 2 along the peripheral edge. The cutting device recognizes the position of the recognition mark 12 and removes the area other than the area where the recognition mark 12 is formed and the area in the vicinity of the area to form the elongated hole 9, thereby forming the connecting piece 4. (See FIGS. 2 and 3). Then, the above-described collective printed wiring board 1 can be manufactured.

  Although the illustration of the solder resist layer is omitted in FIG. 1 and the like, the solder resist layer may be formed on the entire surface of the printed wiring board and the discarded board excluding the positioning mark, the recognition mark, the solid pattern, and the pad. . Here, the solder resist layer is a protection that prevents unnecessary solder, conductive adhesive, etc. from adhering to the surface of the conductor pattern made of the metal foil layer 3 when the electronic component 10 is fixed or covered with solder. A coating layer.

  In addition, the solder resist layer serves as a permanent protection mask, protecting the conductor pattern of the printed wiring board 2 from humidity and dust, and at the same time has an insulator function to protect the conductor pattern from electrical troubles. It is an excellent protective film that can withstand high heat and gold plating when soldering. As a method for forming a solder resist layer, a photolithography method is generally used in which an active energy ray is irradiated through a mask pattern.

[Printed wiring board equipment]
Next, the printed wiring board device 11 obtained by fixing the light emitting elements 10 to the individual printed wiring boards 2 constituting the collective printed wiring board 1 will be described.
First, a thermosetting conductive adhesive is applied to the solid pattern 3 of the five printed wiring boards 2 constituting the collective printed wiring board 1. Then, 20 light emitting elements 10 are formed on the conductive adhesive applied to the metal foil layer 3 (solid pattern) of each printed wiring board 2 using the technique described in Japanese Patent No. 4289656. Position and place with high accuracy. The issuing element 10 is placed on a conductive adhesive applied to the metal foil layer 3 (solid pattern) of each printed wiring board 2 while correcting the position using the positioning mark 7 and / or the recognition mark 12. May be.

  After placing a total of 100 light emitting elements 10 on the conductive adhesive applied to the collective printed wiring board 1, the collective printed wiring board 1 is placed in a heating oven (oven) and heated to, for example, 110 ° C. To cure the conductive adhesive. Then, all the light emitting elements 10 are fixed to the collective printed wiring board 1.

  Then, as shown in FIGS. 8 and 9, it is connected to the pad 14 on the surface of the light emitting element 10 and the metal foil layer 3 (wiring pattern) on the surface 17 of the printed wiring board 2 using a wire bonding apparatus (not shown). The pad 15 is electrically connected by the gold wire 13.

  Specifically, the molten gold wire 13 protruding from the tip of the capillary of the wire bonding apparatus is connected to the pad 15 of the printed wiring board 2 by ball bonding, and the capillary is moved while the gold wire 13 is fed out from the tip of the capillary. The gold wire 13 located at the tip is pressed against the aluminum pad 14 of the light emitting element 10 to make stitch bonding connection. Although a plurality of sets of pads 14, gold wires 13 and pads 15 are actually formed, only one set is shown in FIGS. 11 and 12 for simplicity of explanation.

  After the wire bonding for all the light emitting elements 10 is finished, if the connecting pieces 4 are divided (cut), a total of five printed wiring board devices 11 can be obtained. At this time, the cutting device that cuts the connecting piece 4 can cut the connecting piece 4 while recognizing the recognition mark 12 formed on the connecting piece 4 and correcting the position of the cutting blade or the like. Can be cut and removed. For this reason, the remainder of the connection piece 4 can be very reduced at the peripheral edge of the printed wiring board 2, and the printed wiring board is not cut off more than necessary by a cutting blade or the like.

[Print head]
Next, the case where the above-described printed wiring board device 11 is used for the print head 20 shown in FIGS. 10 to 12 will be described.
The print head 20 has a housing 23 in which a lens array 22 in which a plurality of rod lenses 21 are arranged and fixed is fixed with an adhesive or the like, and one lens surface of the lens array 22 and the light emitting element 10 are opposed to the housing 23. And a printed wiring board device 11 fixed with an adhesive or the like. Note that the light emitting element refers to a semiconductor element in which a plurality of (for example, 256) light emitting points are formed in a straight line.

  As shown in FIG. 12, when the print head 20 emits the light emitting point (LED) of the light emitting element 10 fixed to the surface 17 of the printed wiring board device 11, the light emitted from the light emitting point is the lens array 22. Thus, the distance to the image forming point (focal position) that converges (condenses) is set to the conjugate length TC. The conjugate length TC is a distance L from the light emitting point to the lower surface (one lens surface) of the lens array 22, a distance L from the upper surface (the other lens surface) of the lens array 22 to the imaging point, and the lens array 22. And a relationship of TC = T + 2L is established.

  In the print head 20 according to the present invention, the connecting piece 4 at the peripheral edge of the printed wiring board 2 is removed with high accuracy, so that the printed wiring board device 11 is attached to the housing 23 in a good state. For this reason, the bending of the optical axis of the light emitted from each light emitting point of the light emitting element 10 is small, and the linearity of the imaging point is high.

[Image forming apparatus]
As shown in FIG. 13, the image forming apparatus according to the present invention is a so-called tandem digital color printer 131, and an image forming process unit 110 that forms an image corresponding to image data of each color, and an image forming process unit 110. And an image processing unit 140 that performs predetermined image processing on the image data received from the personal computer 102 or the image reading apparatus 103.

  The image forming process unit 110 includes four image forming units 111Y, 111M, 111C, and 111K that are arranged in parallel at a predetermined interval. Each of these image forming units 111Y, 111M, 111C, and 111K forms a latent image on the photosensitive drum 25 as an image carrier that carries a toner image, and the surface of the photosensitive drum 25. A charging device 113 that is uniformly charged at a predetermined potential, a print head 20 as an exposure device that exposes the photosensitive drum 25 whose surface is charged by the charging device 113, and an electrostatic latent image obtained by the print head 20 A developing device 115 for developing and a cleaner (blade) 116 for cleaning the surface of the photosensitive drum 25 after transfer are provided.

  Further, a density detection circuit 117 that detects the toner image density of a test patch (density sample) formed on the photosensitive drum 25 is provided in the vicinity of the downstream side of the developing device 115 so as to face the photosensitive drum 25. It has been. The density detection circuit 117 is connected to the control unit 130 and outputs a toner image density detection value. Here, the image forming units 111Y, 111M, 111C, and 111K are configured in substantially the same manner except for the toner stored in the developing device 115. The image forming units 111Y, 111M, 111C, and 111K form yellow (Y), magenta (M), cyan (C), and black (K) toner images, respectively.

  In addition, the image forming process unit 110 includes an intermediate transfer belt 121 onto which the toner images of the respective colors formed on the photosensitive drums 25 of the image forming units 111Y, 111M, 111C, and 111K are transferred, and the image forming units 111Y. , 111M, 111C, and 111K toner images are sequentially transferred (primary transfer) to the intermediate transfer belt 121, and a primary transfer roll 122 as a primary transfer charging device and a superimposed toner image transferred onto the intermediate transfer belt 121 are recorded. A secondary transfer roll 123 as a secondary transfer charging device that performs batch transfer (secondary transfer) onto a paper P that is a material (recording paper), and a fixing device 125 that fixes the secondary transferred image onto the paper P. I have.

  The image forming process unit 110 performs an image forming operation based on a control signal such as a synchronization signal supplied from the control unit 130. At that time, image data input from the personal computer 102 or the image reading device 103 is subjected to image processing by the image processing unit 140 and supplied to each of the image forming units 111Y, 111M, 111C, and 111K via the interface. .

  For example, in the yellow image forming unit 111Y, the surface of the photosensitive drum 25 uniformly charged at a predetermined potential by the charging device 113 emits light based on the image data obtained from the image processing unit 140. The electrostatic latent image is formed on the photosensitive drum 25 by being exposed by the print head 20. This electrostatic latent image is developed by the developing device 115, and a yellow toner image is formed on the photosensitive drum 25. Similarly, magenta, cyan, and black toner images are formed on the respective photosensitive drums 25 of the image forming units 111M, 111C, and 111K.

  The respective color toner images formed on the respective photosensitive drums 25 of the image forming units 111Y, 111M, 111C, and 111K are sequentially transferred by the primary transfer roll 122 onto the intermediate transfer belt 121 that rotates in the direction of arrow G in FIG. A toner image superimposed on the intermediate transfer belt 121 is formed by electrostatic attraction.

  The superimposed toner image is conveyed to an area (secondary transfer portion) where the secondary transfer roll 123 is disposed as the intermediate transfer belt 121 rotates. When the superimposed toner image is conveyed to the secondary transfer unit, the paper P is supplied to the secondary transfer unit in accordance with the timing at which the toner image is conveyed to the secondary transfer unit.

  Then, the superimposed toner images are collectively electrostatically transferred onto the conveyed paper P by the transfer electric field formed by the secondary transfer roll 123 in the secondary transfer portion. Thereafter, the sheet P on which the superimposed toner image is electrostatically transferred is peeled off from the intermediate transfer belt 121 and conveyed to the fixing device 125 by the conveying belt 124.

  The unfixed toner image on the paper P conveyed to the fixing device 125 is fixed on the paper P by being subjected to fixing processing by heat and pressure by the fixing device 125. Then, the paper P on which the fixed image is formed is conveyed to a paper discharge placement unit (not shown) provided in the discharge unit of the digital color printer 131. That is, since the image forming apparatus according to the present invention includes the print head 1, it can form a high-quality image.

Another embodiment of the present invention will be described with reference to FIG.
FIG. 15 is a plan view of the aggregate printed wiring board (illustration of the solder resist is omitted). In order to simplify the description, the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

The difference between the collective printed wiring board 41 according to the second embodiment and the collective printed wiring board 1 according to the first embodiment is only the presence or absence of the discarded board 5.
As shown in FIG. 15, even if there is no discarded substrate 5, each connecting piece 4 includes the recognition mark 12, so that the same effect as that of the first embodiment can be obtained.

  The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto. Those skilled in the art will recognize from the claims, the detailed description of the invention, and the drawings. Modifications and additions can be made without departing from the technical idea of the present invention.

  For example, in the above-described embodiment, the electronic component 10 is fixed to the printed wiring board 2 in a staggered manner, but may be fixed on a straight line. In the above-described embodiments, the printed wiring board is a collective printed wiring board having five sheets, but a plurality of printed wiring boards (two or more) may be used.

  In the embodiment described above, the electronic component (light emitting element) 10 is fixed to the printed wiring board 2 with a thermosetting conductive adhesive. However, the present invention is not limited to this. A paste) may be used and heated and fixed in a reflow furnace.

  The present invention is applied to an aggregate printed wiring board in which a plurality of printed wiring boards to which electronic components are fixed are connected.

1 Collective printed circuit board 2 Printed circuit board 3 Metal foil layer (conductor pattern)
4 Connecting piece 5 Discarded substrate 6 Insulating base material 7 Positioning mark 9 Slot 10 Electronic component (light emitting element)
DESCRIPTION OF SYMBOLS 11 Printed wiring board apparatus 12 Recognition mark 20 Print head 21 Rod lens 22 Lens array 23 Housing 25 Photosensitive drum

Claims (4)

In a collective printed wiring board in which a plurality of printed wiring boards formed with a conductive pattern made of a metal foil layer on the surface are connected by a plurality of connecting pieces,
The connecting piece includes a recognition mark made of the metal foil layer on the front surface side.   A printed wiring board device obtained by fixing a plurality of electronic components to the collective printed wiring board according to claim 1 and cutting a connecting piece. The printed wiring board device according to claim 2, wherein the electronic component is a light emitting element;
A lens array in which a plurality of rod lenses are arranged and arranged,
A print head in which the lens array and the printed wiring board device are fixed to a housing so that one of the lens surfaces of the lens array faces the light emitting element. A photoreceptor that forms an electrostatic latent image on the surface;
An image forming apparatus comprising the print head according to claim 3 facing the photoconductor.

Images