JP2018160571A - Manufacturing method of individual substrate, manufacturing method of assembly, and manufacturing method of optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an individual substrate capable of managing the accuracy of a width dimension of an individual substrate regardless of the positional accuracy of a cut formed in a large substrate, a manufacturing method of an assembly, and a manufacturing method of an optical device.SOLUTION: In a cutting step, a connecting piece connecting a unit substrate and another substrate in the width direction of the unit substrate is cut, and the cutting edge is set as the outermost in the width direction of the unit substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device.

  In the method of manufacturing an individual substrate described in Patent Document 1, a plurality of long substrates are arranged in the short direction, and adjacent substrates are connected by a plurality of first connecting portions in the longitudinal direction. A step of preparing a substrate group having a first portion and a short second portion where the length of the connecting portion per unit length is long; a step of mounting components on the surface of the substrate that is the first portion; The process of mounting a light emitting element on the back surface of this and the process of cut | disconnecting a some connection part are included.

JP2015-66793A

  When a single substrate is cut out from a large substrate in which a plurality of cuts defining the outer shape of the single substrate (unit substrate) are formed, a connecting piece between the outer edge of the large substrate and the cut, or adjacent cuts The individual substrates are cut out by punching the connecting pieces between them. And if the part which constituted the cut constitutes the outermost part of the individual substrate in the width direction of the individual substrate, the dimensional accuracy of the width of the individual substrate is the positional accuracy of the cut formed on the large substrate. It depends on.

  The subject of this invention is managing the precision of the width dimension of an individual board | substrate, without being dependent on the positional accuracy of the notch formed in the large sized board | substrate.

  According to a first aspect of the present invention, there is provided a manufacturing method of an individual substrate, a preparation step of preparing a large substrate in which a unit substrate and another substrate are connected by a connecting piece in a width direction of the unit substrate, and the connecting piece. And a cutting step in which the cut edge is the outermost part in the width direction of the unit substrate.

  According to claim 2 of the present invention, in the method of manufacturing an individual substrate according to claim 1, a plurality of the connecting pieces are formed side by side in the intersecting direction intersecting the width direction. In the cutting step, the plurality of connecting pieces are cut so that the cutting edges are arranged on a straight line when viewed from the thickness direction of the unit substrate.

  The method for manufacturing an individual substrate according to claim 3 of the present invention is the method for manufacturing an individual substrate according to claim 1 or 2, wherein, in the cutting step, in the intersecting direction intersecting the width direction, The connecting piece is cut so that a total length of the cutting edges is shorter than a total length of portions other than the cutting edges.

  The method for manufacturing an individual substrate according to claim 4 of the present invention is the method for manufacturing an individual substrate according to any one of claims 1 to 3, wherein the preparatory step intersects the width direction. In the crossing direction, the large substrate having the connecting pieces formed only at both ends of the unit substrate is prepared.

  The method for manufacturing an individual substrate according to claim 5 of the present invention is the method for manufacturing an individual substrate according to any one of claims 1 to 3, wherein the connecting piece intersects the width direction. Three or more are formed side by side in the intersecting direction. In the cutting step, the cut edges of the connecting pieces at both ends in the arranging direction of the connecting pieces are the outermost portions in the width direction of the unit substrate in the intersecting direction. The connecting piece is cut so as to form the structure.

  The method for manufacturing an individual substrate according to claim 6 of the present invention is the method for manufacturing an individual substrate according to any one of claims 1 to 5, wherein in the preparation step, the unit substrate in the width direction is provided. The large substrate having the connecting piece formed on both sides is prepared.

  The method for manufacturing an individual substrate according to claim 7 of the present invention is the method for manufacturing an individual substrate according to any one of claims 1 to 6, wherein the step is performed between the preparation step and the cutting step. And a mounting step of mounting the light emitting element or the light receiving element on the unit substrate.

  According to an eighth aspect of the present invention, there is provided an assembly manufacturing method in which a cutting edge of an individual substrate manufactured by the individual substrate manufacturing method according to any one of claims 1 to 7 is brought into contact with a housing. Thus, the method includes a positioning step of positioning the individual substrate on the housing and an attaching step of attaching the individual substrate in a positioned state to the housing.

  According to a ninth aspect of the present invention, there is provided a method of manufacturing an exposure apparatus, wherein the cutting edge of an individual substrate manufactured by the method of manufacturing an individual substrate according to claim 7 is brought into contact with the housing, thereby A first positioning step of positioning the individual substrate, a first attachment step of attaching the individual substrate in a positioning state to the housing, the light emitting element or the light receiving element positioned in the first positioning step, And a second positioning step of positioning the optical component on the housing so as to face the optical component, and a second mounting step of attaching the optical component in a positioned state to the housing.

  According to the method for manufacturing an individual substrate of claim 1 of the present invention, the accuracy of the width dimension of the individual substrate can be managed without depending on the positional accuracy of the cut formed in the large substrate.

  According to the manufacturing method of the individual substrate of claim 2 of the present invention, compared to the case where one connecting piece is formed in the intersecting direction intersecting the width direction, the individual substrate is positioned relative to the positioning object. Positioning accuracy can be improved.

  According to the method for manufacturing an individual substrate of claim 3 of the present invention, compared with the case of preparing a large substrate in which the total length of the cutting edges is longer than the total length of the portions other than the cutting edges in the crossing direction. Thus, the accuracy of the width dimension of the individual substrate can be improved.

  According to the manufacturing method of the individual substrate of claim 4 of the present invention, the positioning of the individual substrate with respect to the positioning object is more than in the case where the connecting piece is formed only in the central portion of the unit substrate in the crossing direction. Accuracy can be improved.

  According to the method for manufacturing a single substrate according to claim 5 of the present invention, all three or more cutting edges constitute the outermost portion in the width direction of the unit substrate, and the outermost position varies in the width direction. In comparison with the case where the unit substrate is bent, it is possible to improve the positioning accuracy of the individual substrate with respect to the positioning target object while equalizing the bending rigidity of the unit substrate before the cutting step.

  According to the method for manufacturing an individual substrate of claim 6 of the present invention, the accuracy of the width dimension of the individual substrate is effective as compared with the case where the connecting piece is formed only on one side in the width direction of the unit substrate. Can be improved.

  According to the method for manufacturing an individual substrate of claim 7 of the present invention, the individual substrate can be used for an optical device.

  According to the method for manufacturing an assembly of claim 8 of the present invention, as compared with the case where the individual substrate manufactured by the method for manufacturing an individual substrate according to any one of claims 1 to 7 is not used. The individual substrate can be accurately positioned on the housing.

  According to the method for manufacturing an exposure apparatus of claim 9 of the present invention, as compared with the case where the individual substrate manufactured by the method for manufacturing an individual substrate according to claim 7 is not used, The light emitting element or the light receiving element can be accurately positioned.

It is the top view which showed the piece board manufactured by the manufacturing method of the piece board which concerns on 1st Embodiment of this invention. It is the top view which showed a part of large sized board | substrate used for the manufacturing method of the separate board | substrate which concerns on 1st Embodiment of this invention. It is the top view which showed the connection piece of the large sized board used for the manufacturing method of the separate board | substrate which concerns on 1st Embodiment of this invention. It is the top view which showed the whole large sized board | substrate used for the manufacturing method of the separate board | substrate which concerns on 1st Embodiment of this invention. It is the top view which showed the whole large sized board | substrate used for the manufacturing method of the separate board | substrate which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the exposure apparatus manufactured by the manufacturing method of the assembly which concerns on 1st Embodiment of this invention, and the manufacturing method of an optical apparatus. 1 is an exploded perspective view showing an exposure apparatus manufactured by an assembly manufacturing method and an optical device manufacturing method according to a first embodiment of the present invention. It is the top view which showed the separate board | substrate manufactured by the manufacturing method of the separate board | substrate which concerns on 2nd Embodiment of this invention. It is the top view which showed the separate board | substrate manufactured by the manufacturing method of the separate board | substrate which concerns on 3rd Embodiment of this invention. It is the top view which showed a part of large sized board | substrate used for the manufacturing method of the separate substrate which concerns on 3rd Embodiment of this invention. It is the top view which showed the separate board | substrate manufactured by the manufacturing method of the separate board | substrate which concerns on 4th Embodiment of this invention. It is the top view which showed the whole large sized board | substrate used for the manufacturing method of the separate substrate which concerns on 4th Embodiment of this invention. It is the top view which showed the individual board manufactured by the manufacturing method of the individual board which concerns on 5th Embodiment of this invention. It is the top view which showed the whole large sized board | substrate used for the manufacturing method of the separate substrate which concerns on 5th Embodiment of this invention.

<First Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to the first embodiment of the present invention will be described with reference to FIGS.

  First, an exposure apparatus manufactured by the method for manufacturing an optical apparatus according to the present embodiment will be described. Next, a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device will be described.

(Exposure equipment)
The exposure apparatus 10 will be described with reference to FIGS. In addition, the arrow H shown to each figure shows an apparatus up-down direction (vertical direction), the arrow W shows an apparatus width direction (horizontal direction), and the arrow D shows an apparatus depth direction (horizontal direction). The exposure apparatus 10 is an example of an optical apparatus.

  As shown in FIG. 6, the exposure device 10 is disposed below the photosensitive drum 12 constituting the image forming device (not shown). The exposure apparatus 10 includes an individual substrate 20, a housing 30, and a lens array 40.

[Individual substrate]
The individual substrate 20 is disposed so that the plate surface faces the photosensitive drum 12. As illustrated in FIG. 7, the individual substrate 20 includes a unit substrate 22 extending in the apparatus depth direction and a plurality of LED arrays 24 mounted on the surface of the unit substrate 22. The LED array 24 is an example of a light emitting element.

  As shown in FIG. 1, the unit substrate 22 has a rectangular shape extending in the apparatus depth direction when viewed from above. In this embodiment, the length (L3 in FIG. 1) of the unit substrate 22 in the apparatus depth direction (“substrate longitudinal direction” described later) is 300 [mm], and the unit substrate 22 in the apparatus width direction (described later). The length of “substrate width direction”) (L4 in FIG. 1) is 7 [mm].

  Furthermore, a wiring pattern 26 extending in the apparatus depth direction is formed in the unit substrate 22, and long holes 28 extending in the apparatus width direction are formed at both ends in the longitudinal direction of the unit substrate 22. A plurality of convex portions 62 and 64 are formed on the outer periphery of the unit substrate 22.

  Specifically, four protrusions 62 are formed on each of the pair of long sides 22A forming the unit substrate 22, and two protrusions 64 are formed on each of the short sides 22B.

  The protrusions 62 are arranged at intervals in the apparatus depth direction, and the protrusion 62 formed on the innermost side (upper side in the drawing) in the apparatus depth direction is one end of the unit substrate 22 in the apparatus depth direction. Is formed. Further, the convex portion 62 formed on the most front side (lower side in the drawing) in the apparatus depth direction is formed on the other end portion of the unit substrate 22 in the apparatus depth direction. The “one end portion of the unit substrate 22” is a range from one end of the unit substrate 22 to 20 [%] when the length L3 of the unit substrate 22 in the apparatus depth direction is 100 [%]. The “other end portion of the unit substrate 22” is a range from the other end of the unit substrate 22 to 20%.

  Further, in the convex portion 62 formed on the long side 22A, the outer edge 62A in the apparatus width direction (substrate width direction to be described later) constitutes the outermost portion in the width direction of the unit substrate 22 (individual substrate 20). Yes. Further, the edge 62A is arranged on a straight line when viewed from above (plate thickness direction). The edge 62A is an example of a cutting edge.

  Further, in each long side 22A, the total length of the edge 62A is shorter than the total length of the portion other than the edge 62A. Specifically, the total length T1 of the edge 62A is M1 × N1, where the length of one edge 62A is M1 and the number of edges 62A is N1. On the other hand, the total length T2 of the portion other than the edge 62A is a value obtained by subtracting T1 from the length L3 of the unit substrate 22 described above.

  Further, each LED array 24 is elongated in the apparatus depth direction, and is arranged in a staggered manner along the longitudinal direction of the unit substrate 22. Each LED array 24 includes a plurality of LEDs 24A (Light Emitting Diode) arranged in the longitudinal direction.

[Lens Array]
The lens array 40 is an example of an optical component. As shown in FIGS. 6 and 7, the lens array 40 is disposed between the individual substrate 20 and the photosensitive drum 12 and has a rectangular parallelepiped shape extending in the apparatus depth direction. Yes.

[Case]
The housing 30 is disposed so as to face the photosensitive drum 12, has a trapezoidal shape when viewed from the apparatus depth direction, and extends in the apparatus depth direction.

  Further, as shown in FIGS. 6 and 7, a hole 32 that penetrates in the vertical direction of the apparatus and extends in the depth direction of the apparatus is formed in the housing 30. The housing 30 supports the lens array 40 by sandwiching the lens array 40 from the device width direction at the portion of the hole 32 on the photosensitive drum 12 side.

  Specifically, the lens array 40 is formed by contacting the pair of side surfaces 30A facing the device width direction and the pair of side surfaces 40A facing the device width direction in the lens array 40 while forming the holes 32. The body 30 is positioned and sandwiched.

  Further, a concave portion 34 is formed in a portion of the housing 30 opposite to the photosensitive drum 12. The casing 30 supports the individual substrate 20 by sandwiching the individual substrate 20 with the recess 34. In this embodiment, the length L7 of the recess 34 of the housing 30 in the device width direction is the same as the length L4 of the unit substrate 22 in the device width direction (see FIG. 1).

  Specifically, the width of the device is determined by contacting the pair of side surfaces 34A facing the device width direction with the edge 62A of the convex portion 62 of the unit substrate 22 constituting the individual substrate 20 while forming the recess 34. In the direction, the individual substrate 20 is positioned and sandwiched by the housing 30 (details will be described later).

  In this state, the lens array 40 is disposed between the LED array 24 of the individual substrate 20 and the photosensitive drum 12.

(Operation of exposure equipment)
Next, the operation of the exposure apparatus 10 will be described.

  The LED array 24 of the exposure apparatus 10 emits laser light toward the lens array 40 as shown in FIG. 6 based on image data input from the outside. The lens array 40 transmits the laser light emitted from the LED array 24 and forms an image on the charged photosensitive drum 12. As a result, an electrostatic latent image based on the image data is formed on the photosensitive drum 12.

(Production method)
Next, a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device will be described. In addition, the arrow X shown in FIGS. 1-5 shows the board | substrate longitudinal direction of each board | substrate (The large sized board | substrate 90 mentioned later and the unit board | substrate 22), and the arrow Y shows the board | substrate width direction of each board | substrate. The substrate longitudinal direction when describing the unit substrate 22 corresponds to the apparatus depth direction (arrow D) used when describing the exposure apparatus 10, and the substrate width direction when describing the unit substrate 22 is exposure. This corresponds to the apparatus width direction (arrow W) used when the apparatus 10 is described.

[Manufacturing method of individual substrate]
First, a method for manufacturing the individual substrate 20 (see FIG. 7) using the large substrate 90 will be described. The individual substrate 20 is manufactured by a process including a preparation process, a mounting process, and a cutting process.

[Preparation process]
In the preparation step, as shown in FIG. 5, a large substrate 90 in which a plurality of slits 92 that define the unit substrate 22 is formed is prepared. Hereinafter, the large substrate 90 will be specifically described.

  The large substrate 90 is a substrate on which a plurality of unit substrates 22 (see FIG. 1) are formed, and has a rectangular shape extending in the longitudinal direction of the substrate when viewed from the thickness direction. In the present embodiment, as an example, the length of the large substrate 90 in the substrate longitudinal direction (L1 in FIG. 5) is 320 [mm], and the length of the large substrate 90 in the substrate width direction (in FIG. 5). L2) is 95 [mm].

  When mounting the LED array 24 on the unit substrate 22, the plurality of slits 92 defining the outer shape of each unit substrate 22, the wiring pattern 26 formed on each unit substrate 22, and the LED array 24 are mounted on the large substrate 90. A reference long hole 28 is formed. A portion surrounding the plurality of unit substrates 22 in the outer peripheral portion of the large substrate 90 is a discarded substrate 96.

  Further, in the discarded substrate 96 of the large substrate 90, circular holes 98 are formed at both ends in the substrate width direction on the other side (downward in the drawing) in the substrate longitudinal direction.

  The slit 92 is divided into a slit 92A extending in the substrate longitudinal direction that defines the substrate width direction of the unit substrate 22, and a slit 92B extending in the substrate width direction that defines the substrate longitudinal direction of the unit substrate 22. . The slit 92A is an example of a cut.

  A plurality of slits 92A are formed at intervals in the longitudinal direction of the substrate. Further, a plurality of slits 92A formed at intervals in the substrate longitudinal direction are formed at intervals in the substrate width direction. The slit 92B is formed between a pair of slits 92A that define one side of the unit substrate 22 in the longitudinal direction.

  Between each of the slits 92 </ b> A, a connecting piece 94 </ b> A that connects the adjacent unit substrates 22 or a connecting piece 94 </ b> A that connects the unit substrate 22 and the discard substrate 96 is used. In other words, the unit substrate 22 and the other substrate are connected by the connecting piece 94A in the substrate width direction. Here, the “other substrate” is a substrate used as a unit substrate, a substrate used in a different application from the unit substrate, or a substrate discarded without being used as a substrate.

  Further, a connecting piece 94B that connects the unit substrate 22 and the discard substrate 96 is formed between the slit 92A and the slit 92B. The width of the slit 92A formed in the large substrate 90 (L5 in FIG. 2) is 0.8 [mm], and the length of the connecting piece 94A between the adjacent slits 92A (L6 in FIG. 2). Is 0.8 [mm].

  Here, a plurality of slits 92A are formed. As a result, a plurality of connecting pieces 94A are formed side by side in the longitudinal direction of the substrate at intervals. In the present embodiment, four connecting pieces 94A are formed side by side in the longitudinal direction of the substrate at intervals.

  Further, the connecting piece 94A formed on the most one side (upper side in the figure) in the substrate longitudinal direction is formed at one end of the unit substrate 22 in the substrate longitudinal direction. Furthermore, the connecting piece 94A formed on the other side (lower side in the drawing) in the substrate longitudinal direction is formed at the other end of the unit substrate 22 in the substrate longitudinal direction.

  Further, by cutting the connecting piece 94A in a cutting process described later, a convex portion 62 (see FIG. 1) is formed at the end of the unit substrate 22 in the substrate width direction. As described above, the length of the slit 92A and the connecting piece 94A in the substrate longitudinal direction is such that the total length of the edge 62A of the convex portion 62 is shorter than the total length of the portion other than the edge 62A. Is decided.

  The wiring patterns 26 are respectively formed on the unit substrate 22 and extend in the substrate longitudinal direction. Further, two long holes 28 are formed on each unit substrate 22 so as to sandwich each wiring pattern 26 from the longitudinal direction of the substrate.

[Mounting process]
In the mounting process, a plurality of LED arrays 24 are mounted on N unit substrates 22 formed on the large substrate 90, as shown in FIG.

  Specifically, the LED array 24 is mounted on each unit substrate 22 with reference to the long hole 28 formed in each unit substrate 22. For example, the center positions of the two long holes 28 formed in one unit substrate 22 are detected from an image including the long holes 28 imaged by the imaging device. Then, with reference to the center position of the two long holes 28, the LED arrays 24 are mounted in a staggered manner on the unit substrate 22 on which the long holes 28 are formed as a reference.

  As described above, the N unit substrates 22 are formed on the large substrate 90. For this reason, the center position of the two long holes 28 is detected N times, and each time it is detected, the LED array 24 is mounted on the unit substrate 22 on which the reference long holes 28 are formed.

[Cutting process]
In the cutting step, the connecting pieces 94A and 94B are punched out by a so-called punching method, and N pieces of the substrate 20 are cut out from the large substrate 90 (see FIG. 1).

  First, the pins fixed to the punch table are respectively inserted into the two holes 98 (see FIG. 4) formed in the large substrate 90, and the large substrate 90 is placed on the punch table. In this way, the large substrate 90 is positioned on the punch base using the hole 98.

  Further, as shown in FIG. 3, in the connecting piece 94A, a portion having a width of 0.4 [mm] centered on the center line C of the slit 92A (shaded portion in the figure) is punched out.

  Accordingly, as shown in FIGS. 1 and 2, four convex portions 62 are formed on each of the pair of long sides 22A forming the unit substrate 22, and two convex portions 64 are formed on each of the short sides 22B. Individually formed.

  As described above, the convex portion 62 formed on the most end side in the substrate longitudinal direction is formed on one end portion of the unit substrate 22 in the substrate longitudinal direction. Further, the convex portion 62 formed on the most other end side in the substrate longitudinal direction is formed on the other end portion of the unit substrate 22 in the substrate longitudinal direction.

  Furthermore, as described above, the edge 62A of the convex portion 62 formed on the long side 22A constitutes the outermost part in the substrate width direction of the unit substrate 22 (the individual substrate 20). Further, the edges 62A of the convex portions 62 arranged in the longitudinal direction of the substrate are arranged on a straight line when viewed from above (the plate thickness direction).

  Furthermore, as described above, in each long side 22A, the total length of the edge 62A is shorter than the total length of the portion other than the edge 62A.

  In this way, the individual substrate 20 is manufactured from the large substrate 90.

[Manufacturing method of assembly, manufacturing method of optical device]
Next, an assembly manufacturing method and an optical device manufacturing method will be described with reference to a process of manufacturing the exposure apparatus 10 (see FIG. 6) using the individual substrate 20. The exposure apparatus 10 is manufactured by a first positioning process, a first mounting process, a second positioning process, and a second mounting process.

[First positioning process]
In the first positioning step, as shown in FIG. 6, the individual substrate 20 is positioned in the recess 34 formed in the housing 30. Specifically, the edges 62 </ b> A of the convex portions 62 formed on the pair of long sides 22 </ b> A (see FIG. 1) of the unit substrate 22 are abutted (contacted) with the pair of side surfaces 34 </ b> A constituting the concave portion 34. Then, the individual substrate 20 is fitted into the recess 34, and the plate surface of the individual substrate 20 is brought into contact with the bottom surface 34 </ b> B of the recess 34.

  In this way, the individual substrate 20 is positioned on the housing 30.

[First installation process]
In the first attachment step, an adhesive (not shown) is applied to the peripheral edge of the individual substrate 20 positioned in the housing 30 and the side surface 34 </ b> A of the recess 34, and the individual substrate 20 is attached to the housing 30.

[Second positioning process]
In the second positioning step, the lens array 40 is sandwiched from the device width direction in the upper portion of the device vertical direction in the hole 32 formed in the housing 30.

  Specifically, a pair of side surfaces 30A facing the device width direction in the housing 30 and a pair of side surfaces 40A facing the device width direction in the lens array 40 are brought into contact with each other. As a result, the LED array 24 of the individual substrate 20 and the lens array 40 are made to face each other.

  In this way, the lens array 40 is positioned on the housing 30.

[Second mounting process]
In the second attachment step, an adhesive (not shown) is applied to the periphery of the lens array 40 and the housing 30 to attach the lens array 40 to the housing 30.

(Summary)
As described above, in the cutting step, four protrusions 62 are formed on each of the pair of long sides 22A forming the unit substrate 22 by punching the connecting pieces 94A and 94B. And the edge 62A of the convex part 62 formed in 22 A of long sides comprises the outermost part of the board | substrate width direction of the unit board | substrate 22 (individual board | substrate 20). Thus, the accuracy of the width dimension (L4 in FIG. 1) of the individual substrate 20 is managed without depending on the positional accuracy of the slit 92A formed in the large substrate 90.

  Further, in the cutting step, by cutting out the connecting pieces 94A and 94B, the four protrusion edges 62A formed on one long side 22A of the unit substrate 22 are viewed from above (in the plate thickness direction). Arranged on a straight line. Thereby, compared with the case where one convex part is formed in one long side, it is suppressed that the piece board | substrate 20 inclines with respect to the side surface 34A of the recessed part 34 seeing from upper direction, and a piece. The positioning accuracy of the substrate 20 with respect to the housing 30 is improved.

  In the cutting step, the connecting pieces 94A and 94B are punched out so that the total length of the edge 62A is shorter than the total length of the portions other than the edge 62A in each of the long sides 22A. For this reason, compared with the case where the total length of edge 62A is long with respect to the total length of parts other than edge 62A, the precision of the width dimension of the board | substrate 20 improves.

  In the preparation step, large substrates 90 having connection pieces 94A formed on both sides of the unit substrate 22 in the substrate width direction are prepared. In the cutting step, connection pieces 94A on both sides of the unit substrate 22 in the substrate width direction are prepared. Punch out. Thus, the convex portions 62 on both sides of the unit substrate 22 in the substrate width direction constitute the outermost part of the unit substrate 22 in the substrate width direction. For this reason, for example, compared with the case where the connection piece 94A is formed only on one side of the unit substrate 22 in the substrate width direction, the unit substrate 22 ( The accuracy of the width dimension of the individual substrate 20) is effectively improved.

  As an assembly manufacturing method, by using the individual substrate 20, the individual substrate 20 is accurately positioned on the housing 30.

  As an optical device manufacturing method, the individual substrate 20 is used, and the individual substrate 20 is accurately positioned on the lens array 40 via the housing 30.

Second Embodiment
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to the second embodiment of the present invention will be described with reference to FIG. In addition, about 2nd Embodiment, a different part from 1st Embodiment is mainly demonstrated.

  In the preparation step, a large substrate 90 (see FIG. 5) similar to that of the first embodiment is prepared.

  Further, in the cutting process, the connecting pieces 94A and 94B are punched out by using a punch die different from that of the first embodiment, so that a pair of lengths of the unit substrate 122 constituting the individual substrate 120 is obtained as shown in FIG. Two projections 62 and two projections 66 are formed on each side 122A.

  The convex part 62 and the convex part 66 are arranged at intervals in the substrate longitudinal direction, and the convex part 62 is formed at both ends of the unit substrate 122 in the substrate longitudinal direction. And the two convex parts 66 are arrange | positioned at intervals in the board | substrate longitudinal direction so that it may be pinched | interposed into the convex part 62 formed in the both ends of the unit board | substrate 122. FIG.

  Furthermore, the outer edge 66 </ b> A in the substrate width direction of the convex portion 66 is located on the inner side in the substrate width direction as compared with the edge 62 </ b> A of the convex portion 62. That is, the edge 62A of the convex part 62 formed on the long side 122A constitutes the outermost part of the unit substrate 122 in the substrate width direction.

  As described above, in the preparation step, the same large substrate 90 as that in the first embodiment is prepared. That is, before the cutting step, the bending rigidity of the unit substrate 122 is equal to the bending rigidity of the unit substrate 22 of the first embodiment.

  In addition, convex portions 62 constituting the outermost part of the unit substrate 122 in the substrate width direction are formed only at both ends of the unit substrate 122 in the substrate longitudinal direction. For this reason, the convex portions formed on the long side 122A are all in the substrate longitudinal direction due to positional variations of the outermost portion in the substrate width direction as compared with the unit substrate 22 that constitutes the outermost portion in the substrate width direction. It is suppressed that the central convex portion becomes the outermost part in the substrate width direction.

  Further, by suppressing the convex portion on the center side in the substrate longitudinal direction from becoming the outermost part in the substrate width direction, the individual substrate 120 is suppressed from being inclined with respect to the side surface 34A of the concave portion 34, The positioning accuracy of the individual substrate 120 with respect to the housing 30 is improved.

  In other words, in the individual substrate manufacturing method according to the second embodiment, all the convex portions formed on the long side 22A constitute the outermost part in the substrate width direction, and the outermost position in the substrate width direction is Compared with the case where it varies, the positioning accuracy with respect to the housing 30 is improved while the bending rigidity of the unit substrate 122 before the cutting step is made equal.

  Other operations are the same as those in the first embodiment.

<Third Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a third embodiment of the present invention will be described with reference to FIGS. In addition, about 3rd Embodiment, a different part from 1st Embodiment is mainly demonstrated.

  In the preparation step, as shown in FIG. 10, a large substrate 190 is prepared in which connecting pieces 94 </ b> A are formed only at both ends of the unit substrate 172 in the substrate longitudinal direction. That is, in the large substrate 190, the number of slits 192A extending in the longitudinal direction of the substrate is smaller than the number of slits 92A in the large substrate 90 of the first embodiment.

  Further, in the cutting step, by cutting out the connecting pieces 94A and 94B, two protrusions 62 are provided on each of the pair of long sides 172A of the unit substrate 172 constituting the individual substrate 170 as shown in FIG. It is formed. And the convex part 62 is formed only in the both ends of the board | substrate longitudinal direction of the unit board | substrate 172. FIG.

  As described above, the protrusions 62 are formed only at both ends of the unit substrate 172 in the substrate longitudinal direction. For this reason, for example, as compared with the case where the convex portion is formed only in the central portion of the unit substrate in the longitudinal direction of the substrate, the individual substrate 170 is suppressed from being inclined with respect to the side surface 34A of the concave portion 34. The positioning accuracy of the single substrate 170 with respect to the housing 30 is improved.

  Other operations are the same as those in the first embodiment.

<Fourth embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a fourth embodiment of the present invention will be described with reference to FIGS. In addition, about 4th Embodiment, a different part from 1st Embodiment is mainly demonstrated.

  In the preparation step, as shown in FIG. 12, a large substrate 240 on which only one unit substrate 222 is formed is prepared.

  The large substrate 240 has a rectangular shape extending in the substrate longitudinal direction, and has a pair of outer edges 240A extending in the substrate longitudinal direction and a pair of outer edges 240B extending in the substrate width direction. In the large substrate 240, slits 192 </ b> A that define the substrate width direction of the unit substrate 222 and extend in the substrate longitudinal direction are formed on each side of the unit substrate 222. The slit 192A is an example of a cut.

  Further, a connecting piece 194 that connects the discarded substrate 196 and the unit substrate 222 is formed between each slit 192A and each outer edge 240B.

  Further, in the cutting step, by cutting out the connecting piece 194, two convex portions 262 are formed on each of the pair of long sides 222A of the unit substrate 222 constituting the individual substrate 220 as shown in FIG. Is done.

  The convex portions 262 are formed only at both ends of the unit substrate 222 in the longitudinal direction of the substrate. In the convex portion 262, an outer edge 262A in the substrate width direction is a straight line extending in the substrate longitudinal direction, and constitutes the outermost portion of the unit substrate 222 in the width direction. The edge 262A is an example of a cutting edge.

  About an effect | action, it is the same as that of 1st Embodiment.

<Fifth Embodiment>
An example of the individual substrate manufacturing method, the assembly manufacturing method, and the optical device manufacturing method according to the fifth embodiment of the present invention will be described with reference to FIGS. In addition, about 5th Embodiment, a different part from 1st Embodiment is mainly demonstrated.

  In the preparation step, as shown in FIG. 14, a large substrate 290 on which only one unit substrate 272 is formed is prepared.

  The large substrate 290 has a rectangular shape extending in the substrate longitudinal direction, and has a pair of outer edges 290A extending in the substrate longitudinal direction and a pair of outer edges 290B extending in the substrate width direction. In the large substrate 290, a slit 242A extending in the substrate longitudinal direction for defining the substrate width direction of the unit substrate 272 is formed only on one side (right side in the figure) of the unit substrate 222 in the substrate width direction. . The slit 242A is an example of a cut.

  Further, a connecting piece 244 that connects the discard substrate 246 and the unit substrate 272 is formed between the slit 242A and each outer edge 290B.

  Further, in the cutting step, the protrusions 312 are formed on the long side 272A on one side in the substrate width direction of the unit substrate 272 constituting the individual substrate 270 by punching the connecting piece 244, as shown in FIG. Two are formed.

  The convex portions 312 are formed only at both ends of the long side 272A of the unit substrate 272 in the substrate longitudinal direction. Further, in the convex portion 312, the outer edge 312 </ b> A in the substrate width direction is a straight line extending in the substrate longitudinal direction and constitutes the outermost portion in the width direction of the unit substrate 272.

  The long side on the other side of the unit substrate 272 in the substrate width direction is configured by an outer edge 290 </ b> A of the large substrate 290.

  The operation is the same as that of the first embodiment other than the operation that occurs when the convex portions are formed on both sides of the unit substrate in the substrate width direction.

  Although the present invention has been described in detail with respect to specific embodiments, the present invention is not limited to such embodiments, and various other embodiments can be taken within the scope of the present invention. This will be apparent to those skilled in the art. For example, in the above-described embodiment, the slits 92A, 192A, and 242A extend in one direction when viewed from the thickness direction of the substrate. However, the slit may have another shape, for example, a circle. A shape, an elliptical shape, a polygonal shape, etc. may be sufficient.

  In the first embodiment, four connecting pieces 94A arranged in the longitudinal direction of the substrate are formed on one long side 22A. However, a number of connecting pieces other than four may be formed.

  In the above embodiment, the light emitting element is mounted on the individual substrate. However, for example, when the individual substrate is not used in the exposure apparatus (optical device), the light emitting element may not be mounted. . For example, as an example in which an individual substrate is not used in an exposure apparatus, an individual substrate on which functional components other than light emitting elements are mounted may be used in another electronic device such as an arithmetic device or a measurement device. The functional parts include electronic parts such as connectors and structural parts such as positioning pins. In addition, when the light emitting element is mounted on the individual substrate, the positional accuracy of the light emitting element with respect to the housing is increased by positioning the individual substrate of the above embodiment on the housing. In addition, when a functional component other than the light emitting element is mounted on the individual substrate, the positional accuracy of the functional component with respect to the housing is increased.

  Although not specifically described in the above embodiment, as a method for manufacturing an assembly, the lens array 40 may not be attached to the housing 30, and both end portions in the width direction of the individual substrate 20 are used as the housing. The individual substrates may be positioned and attached to the housing by contacting them.

  Moreover, in the said embodiment, although connection piece 94A, 94B, 194, 244 was cut | disconnected by what is called a punching method, you may cut | disconnect by other methods, such as a laser, for example.

  In the above embodiment, the exposure apparatus 10 is manufactured by the manufacturing method of the optical device. However, the reading unit (for example, Contact Image Sensor) is manufactured by the manufacturing method of the optical device by mounting the light receiving element on the individual substrate. May be.

  Further, in the method of manufacturing an optical device according to the above embodiment, the lens array 40 is attached to the housing 30 after the individual substrate 20 is attached to the housing 30, but after the lens array 40 is attached to the housing 30, The individual substrate 20 may be attached to the housing 30. That is, you may perform a 1st positioning process and a 1st attachment process after a 2nd positioning process and a 2nd attachment process.

10 Exposure device (an example of an optical device)
20 pieces of substrate 22 unit substrate 24 LED array (an example of light emitting element)
30 Housing 40 Lens array (an example of an optical component)
62A edge (an example of a cutting edge)
90 Large substrate 92A Slit (an example of cut)
94A Connecting piece 120 Individual substrate 122 Unit substrate 170 Individual substrate 172 Unit substrate 190 Large substrate 192A Slit (an example of cut)
194 Connection piece 220 Single substrate 222 Unit substrate 240 Large substrate 242A Slit (an example of cut)
244 connecting piece 262A edge (an example of a cutting edge)
270 Single substrate 272 Unit substrate 290 Large substrate 312A Edge (an example of a cutting edge)

Claims (9)

A preparation step of preparing a large substrate in which a unit substrate and another substrate are connected by a connecting piece in the width direction of the unit substrate;
A cutting step of cutting the connecting piece and setting the cut cutting edge as the outermost part in the width direction of the unit substrate;
A method of manufacturing an individual substrate comprising: A plurality of the connecting pieces are formed side by side in the intersecting direction intersecting the width direction,
2. The method of manufacturing an individual substrate according to claim 1, wherein in the cutting step, the plurality of connecting pieces are cut such that the cutting edges are arranged on a straight line when viewed from the thickness direction of the unit substrate.   In the cutting step, the connecting piece is cut so that a total length of the cutting edges is shorter than a total length of portions other than the cutting edges in a crossing direction intersecting the width direction. Item 3. A method for producing an individual substrate according to Item 1 or 2.   In the said preparation process, the said large sized board in which the said connection piece is formed only in the both ends of the said unit board | substrate in the crossing direction which cross | intersects with respect to the said width direction is prepared. The manufacturing method of the separate board | substrate of description. Three or more of the connecting pieces are formed side by side in the intersecting direction intersecting the width direction,
In the cutting step, in the intersecting direction, the connecting pieces are cut so that cutting edges of the connecting pieces at both ends in the arrangement direction of the connecting pieces constitute the outermost part in the width direction of the unit substrate. The manufacturing method of the separate board | substrate of any one of 1-3.   6. The method for manufacturing an individual substrate according to claim 1, wherein, in the preparation step, the large substrate on which the connecting pieces are formed on both sides of the unit substrate in the width direction is prepared.   The method for manufacturing an individual substrate according to any one of claims 1 to 6, further comprising a mounting step of mounting a light emitting element or a light receiving element on the unit substrate between the preparation step and the cutting step. Positioning for positioning the individual substrate on the housing by bringing a cutting edge of the individual substrate manufactured by the method for manufacturing an individual substrate according to any one of claims 1 to 7 into contact with the housing. Process,
An attaching step for attaching the individual substrate in a positioned state to the housing;
A method of manufacturing an assembly comprising: A first positioning step of positioning the individual substrate on the housing by bringing a cutting edge of the individual substrate manufactured by the method of manufacturing an individual substrate according to claim 7 into contact with the housing;
A first attachment step of attaching the individual substrate in a positioning state to the housing;
A second positioning step of positioning the optical component in the housing such that the light emitting element or the light receiving element positioned in the first positioning step and the optical component face each other;
A second attachment step of attaching the optical component in a positioning state to the housing;
An optical device manufacturing method comprising: