JPH0192168U - - Google Patents

Info

Publication number
JPH0192168U
JPH0192168U JP18678887U JP18678887U JPH0192168U JP H0192168 U JPH0192168 U JP H0192168U JP 18678887 U JP18678887 U JP 18678887U JP 18678887 U JP18678887 U JP 18678887U JP H0192168 U JPH0192168 U JP H0192168U
Authority
JP
Japan
Prior art keywords
printed wiring
cutting
shape
wiring board
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18678887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18678887U priority Critical patent/JPH0192168U/ja
Publication of JPH0192168U publication Critical patent/JPH0192168U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるミシン目形状を有したプ
リント配線板の平面図、第2図は同ミシン目詳細
図、第3図は同ミシン目部切断後のプリント配線
板の平面図、第4図は従来のミシン目形状を有し
たプリント配線板の平面図、第5図は従来のミシ
ン目詳細図、第6図は従来のミシン目部切断後の
プリント配線板の平面図である。 1……プリント配線板、2……部品実装機保持
部、3……スリツト、4……孔、5……基板部。
Fig. 1 is a plan view of a printed wiring board having a perforation shape according to the present invention, Fig. 2 is a detailed view of the perforation, Fig. 3 is a plan view of the printed wiring board after cutting the perforation, and Fig. 4 The figure is a plan view of a printed wiring board having a conventional perforation shape, FIG. 5 is a detailed view of the conventional perforation, and FIG. 6 is a plan view of the conventional printed wiring board after cutting at the perforation. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Component mounter holding part, 3... Slit, 4... Hole, 5... Board part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 各種電子部品を実装するランド部と配線パター
ンを備えた数枚のプリント配線板間や、前記プリ
ント配線と、その両側に設けられた部品実装機に
保持される保持部との間の切断部において、切断
後の形状・寸法を均一にするための、切断部を台
形状のスリツトと正三角形の孔よりなるミシン目
形状としたプリント配線板。
At the cutting part between the land part on which various electronic components are mounted and several printed wiring boards equipped with wiring patterns, or between the printed wiring and the holding part held by the component mounting machine installed on both sides thereof. , a printed wiring board whose cut portion has a perforation shape consisting of a trapezoidal slit and an equilateral triangular hole in order to make the shape and dimensions uniform after cutting.
JP18678887U 1987-12-08 1987-12-08 Pending JPH0192168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18678887U JPH0192168U (en) 1987-12-08 1987-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18678887U JPH0192168U (en) 1987-12-08 1987-12-08

Publications (1)

Publication Number Publication Date
JPH0192168U true JPH0192168U (en) 1989-06-16

Family

ID=31477995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18678887U Pending JPH0192168U (en) 1987-12-08 1987-12-08

Country Status (1)

Country Link
JP (1) JPH0192168U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018160571A (en) * 2017-03-23 2018-10-11 富士ゼロックス株式会社 Manufacturing method of individual substrate, manufacturing method of assembly, and manufacturing method of optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018160571A (en) * 2017-03-23 2018-10-11 富士ゼロックス株式会社 Manufacturing method of individual substrate, manufacturing method of assembly, and manufacturing method of optical device

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