JP2011166056A - Collective printed wiring board, printed wiring board device, print head, and image formation apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a collective printed wiring board including a display part visible from both surfaces of the collective printed wiring board without adversely affecting fixation of an electronic component to each individual printed wiring board, and the like. <P>SOLUTION: In the collective printed wiring board 1 constituted by connecting a plurality of printed wiring boards 2 each formed with a conductor pattern formed of a metal foil layer 3 on at least a surface 17 of an insulation base material having translucency, a display part 7 for displaying a quality determination result of the printed wiring board 2 is formed on each of the printed wiring boards 2, the thickness direction (Z-direction) of the printed wiring board 2 in the display part 7 is formed of only an insulation base material, and at least a metal foil layer or a silk layer is formed around the display part 7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a collective printed wiring board in which a plurality of printed wiring boards (bare boards) are connected.

  When a printed wiring board device is manufactured by fixing (mounting) electronic components on a relatively small printed wiring board, it takes time to position and transport the printed wiring board, resulting in a reduction in manufacturing efficiency. For this reason, the collective printed wiring board which connected the printed wiring board mutually by the connection piece etc. is used conventionally (for example, refer patent documents 1-10).

  This collective printed wiring board is generally handled as a single board in the manufacturing stage, and electronic components are generally fixed to pads or the like formed on the front surface and / or back surface thereof. That is, the assembled printed circuit board is directly subjected to a heating and cooling process such as SMD (Surface Mount Device) reflow, COB (Chip On Board) cure, etc., when fixing electronic components.

  After that, the printed wiring board is separated from the collective printed wiring board (divided) to inspect each printed wiring board device, or the printed wiring board device is inspected as it is and printed from the collective printed wiring board. By dividing the wiring board, a printed wiring board device as a finished product is completed.

  The collective printed circuit board used in the manufacture of the printed circuit board device described above has problems such as the conductor pattern being disconnected in some printed circuit boards in the inspection of the assembled printed circuit board before fixing the electronic components. May be discovered. In this case, since an electronic component is wasted if the electronic component is fixed to a (bad) printed wiring board having such a defect, various means for identifying the defective printed wiring board have been proposed (for example, Patent Document 9). And 10).

Japanese Patent Laid-Open No. 04-320597 JP-A-11-176974 JP-A-11-163482 Japanese Patent Laid-Open No. 02-031490 Japanese Patent Laid-Open No. 03-250800 Japanese Patent Laid-Open No. 06-112600 Japanese Patent Laid-Open No. 06-169137 JP 2009-283959 A JP 09-2104080 A JP-A-11-191668

  Patent Document 9 includes a display portion for providing a cutout portion in the collective printed wiring board, connected to the cutout portion by a connecting portion that can be cut by pressing, and displaying a result of determining the quality of the conductor pattern. Technologies are described. However, when the display unit is cut by pressing, there is a problem that powder of a base material such as glass epoxy is generated from the cut surface of the collective printed wiring board.

  This problem will be described in more detail. As described above, when a printed wiring board device is manufactured using a collective printed wiring board, electronic components are fixed to the individual printed wiring boards as they are. For this reason, when the electronic component is positioned and fixed on the collective printed wiring board by the electronic component mounting apparatus, the substrate powder may be scattered from the cut surface to the surface of the fixed electronic component due to vibration generated in the collective printed wiring board. . Then, when a light emitting element or a light receiving element is adopted as an electronic component, the powder of the base material blocks the optical axis of the light emitting element or the light receiving element, thereby inducing a problem as a printed wiring board device.

  Patent Document 9 describes a technique including a display unit that identifies a non-defective product or a defective product by closing a through hole provided at a predetermined position of the collective printed wiring board with a seal. However, if a through hole is made in each printed wiring board constituting the collective printed wiring board, there is a problem that the flatness of the printed wiring board near at least the through hole is deteriorated. The collective printed wiring board having such a problem cannot be employed in a printed wiring board apparatus in which electronic components must be fixed with high accuracy on individual printed wiring boards.

  The present invention has been made to solve such a problem, and does not adversely affect the fixing of electronic components to individual printed wiring boards and is visible from both sides of the collective printed wiring board. An object of the present invention is to provide an aggregate printed wiring board or the like provided with

(First invention)
The first invention is a collective printed wiring board in which a plurality of printed wiring boards in which a conductive pattern made of a metal foil layer is formed on at least the surface of a translucent insulating base material. A display unit is provided for displaying the result of judgment on the quality of the wiring board. The thickness direction of the printed wiring board in the display unit is made of only an insulating base material, and at least a metal foil layer or a silk layer is formed around the display unit. It is characterized by that.

  With this configuration, the assembly printed wiring board before fixing the electronic components is inspected for a conductor pattern or the like, and when a defect of a specific printed wiring board is found, the display portion of the defective printed wiring board is displayed on the surface. Alternatively, it is possible to confirm that both sides (front and back) are defective by painting (marking) from one side of the back using an oil-based magic or the like. That is, if the display portion is painted from the front surface with oily magic or the like, it can be confirmed that the printed wiring board is defective from the back surface without painting the back surface.

  Further, if the display portion is painted with oil-based magic or the like from the back surface, it can be confirmed that the printed wiring board is defective from the front surface without painting the surface. For this reason, the manufacturing man-hour of a printed wiring board apparatus can be reduced, and a printed wiring board apparatus can be manufactured cheaply. Furthermore, since the display part is made of an insulating base material of the printed wiring board, the presence of the display part does not affect the flatness of each printed wiring board, and powder of the insulating base material may be generated from the display part. No.

(Second invention)
A second invention is a collective printed circuit board in which a plurality of printed circuit boards in which a conductor pattern made of a metal foil layer is formed on at least the surface of a light-transmitting insulating base material is connected. In addition, the discarded board is provided with a display unit for displaying the result of judgment of the quality of the printed wiring board at a position corresponding to each printed wiring board, and the thickness direction of the discarded board in the display unit is insulated. It consists of only a base material, The circumference | surroundings of the display part are characterized by the metal foil layer or the silk layer being formed at least.

  With this configuration, the assembly printed wiring board before fixing the electronic components is inspected for a conductor pattern or the like, and when a defect of a specific printed wiring board is found, it corresponds to the defective printed wiring board on the discarded board. It is possible to confirm that the display portion formed at the position is defective from both sides (front side and back side) by painting from one side of the front side or back side using an oil-based magic or the like. In other words, if the display portion is painted with oil-based magic or the like from the front surface of the discarded substrate, it can be confirmed that the printed circuit board is defective even from the rear surface of the discarded substrate without painting the back surface of the discarded substrate.

  Further, if the display portion is painted with oil-based magic from the back surface of the discarded substrate, it can be confirmed that the printed circuit board is defective even from the surface of the discarded substrate without painting the surface of the discarded substrate. For this reason, the manufacturing man-hour of a printed wiring board apparatus can be reduced, and a printed wiring board apparatus can be made cheap. Furthermore, since the display part of the discarded board is made of the insulating base material of the printed wiring board, the presence of the display part of the discarded board does not affect the flatness of each printed wiring board and is insulated from the display part of the discarded board. Substrate powder is not generated.

(Third invention)
A printed wiring board device according to a third invention is obtained by fixing a plurality of electronic components to the collective printed wiring board of the first invention or the second invention, and disconnecting the connection.
(Fourth invention)
A print head according to a fourth aspect of the present invention includes the printed wiring board device according to the third aspect of the present invention in which the electronic component is a light emitting element, and a lens array in which a plurality of rod lenses are arranged and arranged, and one lens surface of the lens array and the light emitting element The lens array and the printed wiring board device are fixed to the housing so that the two face each other.
(Fifth invention)
According to a fifth aspect of the present invention, there is provided an image forming apparatus comprising: a photoconductor for forming an electrostatic latent image on a surface; and the printhead according to the fourth invention facing the photoconductor.

  The printed wiring board device according to the third invention, the print head according to the fourth invention, and the image forming apparatus according to the fifth invention use the collective printed wiring board according to the first invention or the second invention. The effect of 1 invention or 2nd invention is show | played. For this reason, each apparatus can be manufactured with high accuracy and at low cost.

  According to the present invention, marking on the display unit and confirmation of a defective substrate can be simplified, so that a printed wiring board device can be manufactured at low cost. In addition, since the display unit is made of an insulating base material of a printed wiring board, the presence of the display unit does not affect the flatness of each printed wiring board, and powder of the insulating base material may be generated from the display unit. No.

Plan view of assembly printed wiring board (Example 1) FIG. 1 is a partially enlarged view of a portion A of the collective printed wiring board of FIG. 1 (Example 1). Rear view of the assembly printed wiring board (Example 1) FIG. 3 is a partially enlarged view of a portion E of the collective printed wiring board in FIG. 3 (Example 1). DD sectional view in FIG. 2 (Example 1) Partial enlarged view of a portion A showing a state in which the display portion is marked (Example 1) 6 is a partially enlarged view of the portion E in the state of FIG. 6 (Example 1). Plan view of an assembled printed wiring board to which electronic components are fixed (Example 1) A perspective view of an end portion of a collective printed wiring board to which electronic components are fixed (Example 1) Plan view of printed wiring board device (Example 1) An enlarged perspective view of an end portion (portion B in FIG. 10) of the printed wiring board device (Example 1) Side view of printed wiring board device (Example 1) Plan view of print head (Example 1) A perspective view of an end of a print head (Example 1) Cross section of print head (Example 1) FIG. 1 is a diagram for explaining a configuration of an image forming apparatus (first embodiment). FIG. 10 is a diagram illustrating a positional relationship between a print head and a photoconductor (Example 1). Example of a partially enlarged view of a display portion on the surface of an aggregate printed wiring board and the vicinity thereof (Example 2) Example of a partially enlarged view of the display portion on the back side of the assembly printed wiring board and the vicinity thereof (Example 2) Cross section of the display and its vicinity Cross section of the display and its vicinity Cross section of the display and its vicinity Plan view of assembly printed wiring board (Example 3) Plan view of assembly printed wiring board (Example 4) Plan view of the assembly printed wiring board 25 is a partial enlarged view of the connecting portion of the collective printed wiring board of FIG. 25 as viewed from the side (the arrow F in FIG. 25). HH sectional view in FIG. 2 (Example 1)

  Hereinafter, the present invention will be described in detail with reference to the drawings.

An embodiment of the present invention will be described with reference to FIGS.
1 is a plan view of the collective printed wiring board (the solder resist 8 is not shown), FIG. 2 is an enlarged view of a portion A of the collective printed wiring board 1 in FIG. 1, and FIG. 3 is the collective printed wiring board shown in FIG. FIG. 4 is an enlarged view of a portion E of the collective printed wiring board 1 of FIG. 3, FIG. 5 is a sectional view taken along the line DD in FIG. 2, and FIG. 1 is an enlarged view of a portion A in FIG. 1 showing a marked state, and FIG. 7 is an enlarged view of a portion E in FIG. 3 in the state of FIG.

  8 is a plan view of the collective printed circuit board 1 in which the electronic components 10 are fixed to the collective printed circuit board 1 of FIG. 1 (illustration of the solder resist 8 is omitted), and FIG. 9 is an illustration of the collective printed circuit board 1 of FIG. FIG. 10 is a plan view of the printed wiring board device 11 obtained by cutting off the connecting piece 4 of the collective printed wiring board 1 of FIGS. 8 and 9 (solder resist 8). 11 is an enlarged perspective view of a portion B of the printed wiring board device 11 of FIG. 10 (illustration of the solder resist 8 is omitted), and FIG. 12 is a side view of the printed wiring board device 11 of FIG. FIG. 13 is a plan view of the print head, FIG. 14 is a perspective view of the end of the print head 20 in FIG. 13, and FIG. 15 is a cross-sectional view of the print head 20 in FIG. Figure 16 is a diagram figure 17 showing the positional relationship between the print head and the photosensitive member for explaining a configuration of an image forming apparatus. Although illustration of the solder resist 8 is omitted in FIG. 1 and the like, the solder resist 8 is applied to the entire surface of the printed wiring board and the discarding board excluding the display unit 7, the solid pattern, and the pads described later.

[Aggregate printed wiring board]
As shown in FIG. 1, the collective printed wiring board 1 according to the present invention is arranged in a line in the short direction (X direction) of the printed wiring board 2 and is connected to each other by connecting pieces 4 ( The five printed wiring boards 2 and the glass epoxy discarded board 5 surrounding the outside of the five printed wiring boards 2 are connected by a connecting piece 4 (made of glass epoxy).

  On the surface 17 of the printed wiring board 2, a conductor made of a metal foil layer 3 (for example, a copper foil layer) for fixing light emitting elements as electronic components to be described later in a straight line shape (straight line or staggered pattern) in the longitudinal direction. A pattern (solid pattern) is formed. Although other conductor patterns are not shown in FIGS. 1 and 3 and the like, the conductor patterns include an elongated wiring pattern made of the metal foil layer 3 shown in FIG. 11 in addition to the solid pattern. .

  As shown in FIG. 1, the connecting pieces 4 that connect the printed wiring boards 2 and the printed wiring board 2 and the discarded board 5 have a plurality of long holes 9 that penetrate in the thickness direction (plate thickness direction = Z direction). It is formed by providing. More specifically, each of the connecting pieces 4 and the printed wiring is obtained by punching out one glass epoxy board using a mold having a protrusion provided at a position corresponding to the long hole 9 in FIG. A substrate 2 is formed. Note that the five long printed wiring boards 2 are configured such that the electrical and mechanical functions such as the routing of the conductor pattern made of the metal foil layer 3 and the positions of the pads are the same.

(Display section)
As shown in FIGS. 1 to 7, each printed wiring board 2 is provided with a display unit 7 for displaying the quality determination result of the printed wiring board 2. The thickness direction (Z direction) of the printed wiring board 2 in the display unit 7 is composed of only the insulating base 6 as shown in FIGS. 2, 4 and 5, and the periphery of the display unit 7 is at least a metal foil. A conductor pattern composed of the layer 3 is formed.

The display unit 7 will be described in more detail.
When the display unit 7 determines that the individual printed wiring boards 2 constituting the collective printed wiring board 1 are defective as a result of inspections such as the presence or absence of disconnection of the conductor pattern and the presence or absence of scratches on the printed wiring board. As shown in FIG. 6, it is used for marking using oil-based magic, oil-based ink or the like.

  For example, as a result of inspecting the collective printed wiring board 1 shown in FIG. 1 using an appearance inspection apparatus, if a break in the conductor pattern is found on the fifth printed wiring board 2 from the paper surface, The display unit 7 is marked (FIG. 6). When no abnormality is found on the printed wiring board (good printed wiring board), the display unit 7 is not marked.

  As shown in FIG. 5, the display unit 7 includes only an insulating base material 6 having translucency in the thickness direction. In other words, the metal foil layer 3, the solder resist layer 8, and the silk layer 16 are not present in the thickness direction of the display unit 7. And since the metal foil layer 3 is provided so that the display part 7 may be surrounded, the range (outer edge) of the display part 7 is shown clearly. Moreover, since the display part 7 consists of the insulating base material 6 which has translucency, if the display part 7 is marked from the surface 17 of the printed wiring board 2 using black oil-based ink etc. (FIG. 6), the printed wiring board 2 will be shown. The presence or absence of marking can be confirmed from the back surface 18 (FIG. 7).

  Therefore, it is not necessary to mark the display unit 7 from both sides of the printed wiring board 2, and only by marking from the front surface 17 or the back surface 18 of the printed wiring board 2, the electronic component mounting apparatus, the board appearance inspection apparatus, and the operator Can confirm whether it is a non-defective product or a defective product from both sides of the printed wiring board 2.

  In addition, the insulating base material which has translucency means the material which can confirm the presence or absence of the said light from the surface, when light is applied from the back surface of a printed wiring board. For example, a glass epoxy material. The solder resist layer 8 covers the front surface 17 and the back surface 18 of the printed wiring board 2 other than the display unit 7, and covers the surface of the conductor pattern made of the metal foil layer 3 when the electronic component 10 is fixed by coating with solder or the like. A protective coating layer that prevents unnecessary solder, conductive adhesive, etc. from adhering to the surface. In addition, the solder resist layer 8 serves as a permanent protection mask, which protects the conductor pattern of the printed wiring board 2 from humidity and dust, and at the same time has an insulator function to protect the conductor pattern from electrical troubles. Chemical resistance and heat resistance It is a protective film that can withstand high heat and gold plating when soldering. As a method for forming the solder resist layer 8, a photolithography method is generally used in which an active energy ray is irradiated through a mask pattern.

[Printed wiring board equipment]
Next, the printed wiring board device 11 obtained by fixing the light emitting elements 10 to the individual printed wiring boards 2 constituting the collective printed wiring board 1 will be described. In the following, description will be made on the assumption that only the fifth sheet from the paper in the collective printed wiring board 1 shown in FIGS. 1 and 3 is defective.

  First, a thermosetting conductive adhesive is applied to the solid pattern 3 of a non-defective printed wiring board 2 in which the display unit 7 is not marked in the collective printed wiring board 1. Then, on the conductive adhesive applied to the metal foil layer 3 (solid pattern) of each printed wiring board 2, 20 using a technique described in Japanese Patent No. 4289656, Japanese Patent No. 4289656, etc. The light emitting elements 10 are positioned and placed with high accuracy.

  A total of 80 light emitting elements 10 are placed on the conductive adhesive applied to the collective printed circuit board 1, and then the collective printed circuit board 1 is placed in a heating furnace (oven) and heated to, for example, 110 ° C. To cure the conductive adhesive. If it does so, all the light emitting elements 10 will be fixed to the assembly printed wiring board 1 in which the display part 7 does not have marking.

  Then, as shown in FIGS. 11 and 12, it is connected to the pad 14 on the surface of the light emitting element 10 and the metal foil layer 3 (wiring pattern) on the surface 17 of the printed wiring board 2 using a wire bonding apparatus (not shown). The pad 15 is electrically connected by the gold wire 13.

  Specifically, the wire bonding apparatus first confirms that there is no marking on the display unit 7 by a CCD camera provided in the wire bonding apparatus. Then, as shown in FIGS. 11 and 12, the gold wire 13 protruding and melted from the tip of the capillary of the wire bonding apparatus is connected to the pad 15 of the printed wiring board 2 by ball bonding, and the gold wire 13 is fed out from the tip of the capillary. The capillary is moved, and the gold wire 13 positioned at the tip of the capillary is pressed against the aluminum pad 14 of the light emitting element 10 to make stitch bonding connection.

  When the wire bonding apparatus recognizes that the display unit 7 is marked by the CCD camera, the above operation is not performed, and the presence or absence of marking on the display unit 7 of the next printed wiring board 2 is confirmed. Although a plurality of sets of pads 14, gold wires 13 and pads 15 are actually formed, only one set is shown in FIGS. 11 and 12 for simplicity of explanation.

  After the wire bonding for all the light emitting elements 10 is finished, if the connection pieces 4 are divided (cut), a total of four printed wiring board devices 11 excluding one which is a defective printed wiring board can be obtained.

  As described above, the use of the collective printed wiring board 1 according to the present invention makes it possible to easily mark non-defective / defective products on each printed wiring board 2. Further, since the display unit 7 is composed only of the insulating base material 6 of the printed wiring board 2, the presence of the display unit 7 does not affect the flatness of the individual printed wiring board 2, and the display base unit 7 is insulated from the insulating base material. No 6 powder is generated.

[Print head]
Next, the case where the above-described printed wiring board device 11 is used for the print head 20 shown in FIGS. 13 to 15 will be described.
The print head 20 has a housing 23 in which a lens array 22 in which a plurality of rod lenses 21 are arranged and fixed is fixed with an adhesive or the like, and one lens surface of the lens array 22 and the light emitting element 10 are opposed to the housing 23. And a printed wiring board device 11 fixed with an adhesive or the like. Note that the light emitting element refers to a semiconductor element in which a plurality of (for example, 256) light emitting points are formed in a straight line.

  As shown in FIG. 15, when the print head 20 emits the light emitting point (LED) of the light emitting element 10 fixed to the surface 17 of the printed wiring board device 11, the light emitted from the light emitting point is the lens array 22. Thus, the distance to the image forming point (focal position) that converges (condenses) is set to the conjugate length TC. The conjugate length TC is a distance L from the light emitting point to the lower surface (one lens surface) of the lens array 22, a distance L from the upper surface (the other lens surface) of the lens array 22 to the imaging point, and the lens array 22. And a relationship of TC = T + 2L is established.

  The print head 20 according to the present invention has high flatness of the printed wiring board device 11 and less warpage and distortion, so that the bending of the optical axis of the light emitted from each light emitting point of the light emitting element 10 is small, and the image forming point. High linearity. Moreover, since the powder of the insulating base material 6 does not come out from the display unit 7 of the printed wiring board device 11, the powder does not adhere on the light emitting point of the light emitting element 10.

[Image forming apparatus]
As shown in FIG. 16, the image forming apparatus according to the present invention is a so-called tandem digital color printer 131, and an image forming process unit 110 that forms an image corresponding to image data of each color, and an image forming process unit 110. And an image processing unit 140 that performs predetermined image processing on the image data received from the personal computer 102 or the image reading apparatus 103.

  The image forming process unit 110 includes four image forming units 111Y, 111M, 111C, and 111K that are arranged in parallel at a predetermined interval. Each of these image forming units 111Y, 111M, 111C, and 111K forms a latent image on the photosensitive drum 25 as an image carrier that carries a toner image, and the surface of the photosensitive drum 25. A charging device 113 that is uniformly charged at a predetermined potential, a print head 20 as an exposure device that exposes the photosensitive drum 25 whose surface is charged by the charging device 113, and an electrostatic latent image obtained by the print head 20 A developing device 115 for developing and a cleaner (blade) 116 for cleaning the surface of the photosensitive drum 25 after transfer are provided.

  Further, a density detection circuit 117 that detects the toner image density of a test patch (density sample) formed on the photosensitive drum 25 is provided in the vicinity of the downstream side of the developing device 115 so as to face the photosensitive drum 25. It has been. The density detection circuit 117 is connected to the control unit 130 and outputs a toner image density detection value. Here, the image forming units 111Y, 111M, 111C, and 111K are configured in substantially the same manner except for the toner stored in the developing device 115. The image forming units 111Y, 111M, 111C, and 111K form yellow (Y), magenta (M), cyan (C), and black (K) toner images, respectively.

  In addition, the image forming process unit 110 includes an intermediate transfer belt 121 onto which the toner images of the respective colors formed on the photosensitive drums 25 of the image forming units 111Y, 111M, 111C, and 111K are transferred, and the image forming units 111Y. , 111M, 111C, and 111K toner images are sequentially transferred (primary transfer) to the intermediate transfer belt 121, and a primary transfer roll 122 as a primary transfer charging device and a superimposed toner image transferred onto the intermediate transfer belt 121 are recorded. A secondary transfer roll 123 as a secondary transfer charging device that performs batch transfer (secondary transfer) onto a paper P that is a material (recording paper), and a fixing device 125 that fixes the secondary transferred image onto the paper P. I have.

  The image forming process unit 110 performs an image forming operation based on a control signal such as a synchronization signal supplied from the control unit 130. At that time, image data input from the personal computer 102 or the image reading device 103 is subjected to image processing by the image processing unit 140 and supplied to each of the image forming units 111Y, 111M, 111C, and 111K via the interface. .

  For example, in the yellow image forming unit 111Y, the surface of the photosensitive drum 25 uniformly charged at a predetermined potential by the charging device 113 emits light based on the image data obtained from the image processing unit 140. The electrostatic latent image is formed on the photosensitive drum 25 by being exposed by the print head 20. This electrostatic latent image is developed by the developing device 115, and a yellow toner image is formed on the photosensitive drum 25. Similarly, magenta, cyan, and black toner images are formed on the respective photosensitive drums 25 of the image forming units 111M, 111C, and 111K.

  The respective color toner images formed on the respective photosensitive drums 25 of the respective image forming units 111Y, 111M, 111C, and 111K are sequentially transferred onto the intermediate transfer belt 121 that rotates in the direction of arrow G in FIG. A toner image superimposed on the intermediate transfer belt 121 is formed by electrostatic attraction.

  The superimposed toner image is conveyed to an area (secondary transfer portion) where the secondary transfer roll 123 is disposed as the intermediate transfer belt 121 rotates. When the superimposed toner image is conveyed to the secondary transfer unit, the paper P is supplied to the secondary transfer unit in accordance with the timing at which the toner image is conveyed to the secondary transfer unit.

  Then, the superimposed toner images are collectively electrostatically transferred onto the conveyed paper P by the transfer electric field formed by the secondary transfer roll 123 in the secondary transfer portion. Thereafter, the sheet P on which the superimposed toner image is electrostatically transferred is peeled off from the intermediate transfer belt 121 and conveyed to the fixing device 125 by the conveying belt 124.

  The unfixed toner image on the paper P conveyed to the fixing device 125 is fixed on the paper P by being subjected to fixing processing by heat and pressure by the fixing device 125. Then, the paper P on which the fixed image is formed is conveyed to a paper discharge placement unit (not shown) provided in the discharge unit of the digital color printer 131. That is, since the image forming apparatus according to the present invention includes the print head 1, it can form a high-quality image.

Another embodiment of the present invention will be described with reference to FIGS.
18 is a partially enlarged view of the display unit 7 and its vicinity on the surface 17 of each printed wiring board constituting the collective printed circuit board. FIG. 19 is a partially enlarged view of the display unit 7 and its vicinity in FIG. 27 is a cross-sectional view taken along the line HH in FIG. The collective printed wiring board according to the second embodiment is different only in the display unit 7 and the vicinity thereof in the collective printed wiring board 1 shown in the first embodiment. Therefore, only the difference will be described. About the same part, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  Example 1 showed the collective printed wiring board 1 in which the display unit 7 was surrounded by the metal foil layer 3. In the second embodiment, the display unit 7 is surrounded by the silk layer 16 instead of the metal foil layer 7. Explaining in more detail with reference to FIGS. 18, 19, and 27, the individual printed wiring boards 41 constituting the collective printed wiring board are formed on portions of the front surface 17 and the back surface 18 of the insulating base 6 except for the display unit 7. A solder resist 8 is applied. A silk layer 16 is further formed around the display unit 7 on the surface of the solder resist 8 on the surface 17 of the printed wiring board 41.

  Since the silk layer 16 does not transmit light, the outer edge of the display portion 7 that transmits light becomes clear. For this reason, also in the collective printed wiring board concerning Example 2, the same effect as the collective printed wiring board 1 concerning Example 1 can be acquired.

  The silk layer is a layer made of a non-translucent thermosetting marking ink. For example, a resin (epoxy resin), a filler (inorganic filler such as ceramic particles), a solvent (a directional hydrocarbon type) Solvent), a curing agent (amino curing agent), a liquid in which a coloring pigment (titanium oxide) and the like are mixed, and one that is thermally cured at about 125 ° ± 5 ° is employed. 18, 19, and 27 show the configuration in which the silk layer 16 is formed only on the front surface 17, it may be formed only around the display portion 7 on the back surface 18, or both sides (the front surface 17 and the front surface 17). A silk layer 16 may be formed around the display section 7 on the back surface 18).

Another embodiment of the present invention will be described with reference to FIG.
FIG. 23 is a plan view of the aggregate printed wiring board (illustration of the solder resist 8 is omitted). In order to simplify the description, the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

The difference between the collective printed wiring board 41 according to the third embodiment and the collective printed wiring board 1 according to the first embodiment is only the presence or absence of the discarded board 5.
As shown in FIG. 23, even if there is no discarded substrate 5, each printed wiring board 2 includes the display unit 7, so that the same effect as in the first embodiment can be obtained.

Another embodiment of the present invention will be described with reference to FIG.
FIG. 24 is a plan view of the aggregate printed wiring board (illustration of the solder resist 8 is omitted). In order to simplify the description, the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The only difference between the collective printed wiring board 42 according to the first embodiment and the collective printed wiring board 1 according to the first embodiment is that the display unit 7 is provided on the discarded board and the position of the connecting piece 4 is different. It is. As shown in FIG. 24, even if the display unit 7 is provided at the position of the discarded substrate 5 corresponding to each printed wiring board 2, the same effect as in the first embodiment can be obtained. Note that the specifications of the display unit 7 and the vicinity thereof in FIG. 24 are the same as the specifications shown in FIG. 2, FIG. 4, and FIG.

  The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto. Those skilled in the art will recognize from the claims, the detailed description of the invention, and the drawings. Modifications and additions can be made without departing from the technical idea of the present invention.

  For example, in the above-described embodiment, the electronic component 10 is fixed to the printed wiring board 2 in a staggered manner, but may be fixed on a straight line. In the above-described embodiments, the printed wiring board is a collective printed wiring board having five sheets, but a plurality of printed wiring boards (two or more) may be used.

  In the embodiment described above, the electronic component (light emitting element) 10 is fixed to the printed wiring board 2 with a thermosetting conductive adhesive. However, the present invention is not limited to this. A paste) may be used and heated and fixed in a reflow furnace.

  In the above-described embodiment, the printed wiring boards 2 and the printed wiring boards 2 and the discard board 5 are connected by the connecting pieces 4. However, FIG. 25 (illustration of the solder resist 8 is omitted) and FIG. As shown in FIG. 26 (illustration of the solder resist 8 is omitted), it may be connected by a V groove and cut (separated).

  Moreover, in above-mentioned Example 1, although the metal foil layer 3 provided around the display part 7 was formed on both surfaces of the printed wiring board 2, the metal foil layer 3 has only the surface 17 (see FIG. 20) or only the back surface 18 (FIG. 21). Furthermore, the metal foil layer 3 is not limited to the one on the front surface 17 and / or the back surface 18 of the printed wiring board 2 as in the above-described embodiment, but as shown in FIG. 6 may be present. In this case, needless to say, the solder resist layer 8, the silk layer 16, and the metal foil layer 3 are not provided in the area 24 (the portion surrounded by the broken line) constituting the display unit 7, and only the translucent insulating substrate 6 is formed. It is necessary. Therefore, the present invention can also be applied to a multilayer printed wiring board.

  The present invention is applied to an aggregate printed wiring board in which a plurality of printed wiring boards to which electronic components are fixed are connected.

DESCRIPTION OF SYMBOLS 1 Collective printed wiring board 2 Printed wiring board 3 Metal foil layer 4 Connection piece 5 Discard substrate 6 Insulating base material 7 Display part 8 Solder resist 10 Electronic component (light emitting element)
DESCRIPTION OF SYMBOLS 11 Printed wiring board apparatus 16 Silk layer 20 Print head 21 Rod lens 22 Lens array 23 Housing 25 Photosensitive drum

Claims (5)

In a collective printed wiring board in which a plurality of printed wiring boards formed with a conductor pattern made of a metal foil layer on at least the surface of an insulating base material having translucency are connected,
Each of the printed wiring boards is provided with a display unit that displays a result of judging whether the printed wiring board is good or bad.
The thickness direction of the printed wiring board in the display unit consists only of the insulating base material,
An assembly printed wiring board, wherein at least the metal foil layer or the silk layer is formed around the display portion In a collective printed wiring board in which a plurality of printed wiring boards formed with a conductor pattern made of a metal foil layer on at least the surface of an insulating base material having translucency are connected,
The aggregate printed wiring board is further connected to a discarded board,
The discard board is provided with a display unit for displaying a quality determination result of the printed wiring board at a position corresponding to each of the printed wiring boards.
The thickness direction of the discarded substrate in the display unit consists only of the insulating base material,
An assembly printed wiring board, wherein at least the metal foil layer or the silk layer is formed around the display portion   A printed wiring board device obtained by fixing a plurality of electronic components to the collective printed wiring board according to claim 1 or 2 and disconnecting the connection. The printed circuit board device according to claim 3, wherein the electronic component is a light emitting element.
A lens array in which a plurality of rod lenses are arranged and arranged,
A print head in which the lens array and the printed wiring board device are fixed to a housing so that one of the lens surfaces of the lens array faces the light emitting element. A photoreceptor that forms an electrostatic latent image on the surface;
An image forming apparatus comprising: the print head according to claim 4 facing the photoconductor.

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