JPS59186387A - Method of bonding printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is a printed circuit board in which a sub printed circuit board is inserted into a mother printed circuit board, soldered tips are applied, and the printed circuit boards are electrically and mechanically connected to each other. 1 is a perspective view showing a case where a plurality of conventional printed circuit boards are electrically and mechanically joined. In FIG. 1, 1 is a mother printed board, and this mother printed board 1 includes resistors,
This is a printed wiring board on which electronic components such as capacitors and integrated circuits are inserted and arranged, and the components are electrically and mechanically connected using solder disks and the like. Reference numeral 2 indicates a sub-printed board. This sub-printed board 2 is a printed wiring board similar to the mother printed board 1, and has a protrusion 3 on one side of a rectangle for joining with the mother printed board. 4.2N4b are printed patterns provided on the front and back sides of the protruding portion 3 of the sub-printed board 2, respectively. Reference numeral 5 denotes a square hole, and the square hole 5 (-i is provided in the mother printed circuit board l, and the square hole 5 is opened so that the protrusion 3 of the sub-printed circuit board 2 is inserted. Around the square hole 5 on the back surface of the mother printed circuit board 1, printed patterns 6a and 6b are provided at the same positions as the printed backs 74 of the sub printed circuit board 2 in opposing parts.

FIG. 2 shows a state in which the protrusion 3 of the sub-printed board 2 shown in FIG. 1 is inserted into the square hole 5 of the mother printed board 1 and soldered. 1a and 1b are mother printed circuit boards. 4. a, 4. b is the printed pattern of the sub-printer/1/substrate 2. 5a and 5b are parts of the square hole 5, respectively, and the square hole parts 5a and 51] are caused by errors in manufacturing the sub-printed board 2 and the master printed board 1. 6a is a printed pattern of the mother printed circuit board 1, and this printed pattern 6
a and the printed pattern 4a of the sub-printed board 2 are electrically and mechanically connected by solder 7, ].

I/, :, 61] is a printed pattern of the mother printed board J, and this printed pattern 6b and the printed pattern 4b of the sub printed board 2 are electrically and mechanically connected by solder 7b.

However, in the printed circuit board shown in Figure 1, the sub-printed board 2 is soldered only on the back side of the mother printed circuit board 1, so if a force in the direction C in Figure 2 is applied due to vibration etc., the solder may break. Cracks may occur at certain locations 7a, 7b, or print patterns 4a, 4b16a,
There was a problem with 6b peeling off.

OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned conventional problems, and allows the printed patterns provided on both sides of the sub-printed board to be independently connected to the printed patterns of the main print board, and furthermore, The purpose is to strengthen the bonding force between the mother printed circuit board and the mother printed circuit board.

Structure of the Invention The present invention involves forming a through-hole pattern in a hole of a mother printed circuit board, dividing the through-hole pattern by forming holes in the mother printed circuit board, and inserting a sub-printed circuit board having a protruding portion. By soldering the printed patterns on the front and back sides of this sub-printed board to the divided through-hole patterns of this mother printed board, the bonding force between them is strengthened.

DESCRIPTION OF EMBODIMENTS The configuration of an embodiment of the present invention will be described below with reference to the drawings.

FIGS. 3A and 3B are diagrams showing main parts of a mother printed circuit board according to an embodiment of the present invention. In Figure 3A, 1e
is the mother printed circuit board. 8 is a hole, and this hole 8
is formed on the mother printed circuit board 1e, and a through hole pattern 9 is formed by performing through hole processing around the periphery.

FIG. 3B shows a state in which a square hole]O is formed by punching out the portion indicated by the dashed line in FIG. 3A. The through hole pattern 9 shown in FIG. 3 is divided into two through hole patterns 9a and 9b by a square hole 10. As shown in FIG. IIa1]], b is the pore edge of Oa, and this pore edge], 1. a,]1
bK has no through-hole processing, so solder will not adhere to it.

12a1121] is located at one end of the through-hole pattern 9 and farthest from the hole edges 11a and 1.1b.

FIG. 3C is an enlarged view of the divided through-hole pattern 9b in FIG. 3B. In FIG. 3C, a through-hole pattern 9b is formed along one end of the hole edge 11b of the mother printed circuit board 1e.

FIG. 4 is a perspective view showing the sub printed board 2 inserted into the mother printed board 1e according to an embodiment of the present invention and after being soldered. As shown in FIG. 4, three printed patterns (4a14c, 4d) formed on one side of the sub-printed board 2 are electrically and mechanically independent from each other through the mother printed board 1e. It is connected to the hole pattern 9a. Similarly, on the back surface of the sub-printed board 2, a plurality of printed patterns (4b (g)) are electrically and mechanically connected independently of each other to the through-hole patterns 9b of the mother printed board 1e.

FIG. 5 is a cross-sectional view taken along line cl-d' in FIG. 4. In FIG. 5, 7e is solder, and this solder 7e electrically and mechanically connects the printed pattern 4a of the sub-printed board 2 and the printed pattern 9a of the mother printed board 1f.

7f is solder, and this solder 7f is used to connect the sub-printer [-print pattern 4b of board 2 and mother printed board 1].
The printed pattern 9b of g is connected electrically and mechanically. The solder 7e, 7f also adheres to one end of the through-hole patterns ], 2a, ], 2b, and strongly joins the sub printed board 2 and the mother printed board le. That is, in the embodiment shown in FIG. 5, there is no space 5a15b as in the conventional example shown in FIG. 2, and the printed pattern 4az4b of the printed circuit board 2 is
Through-hole patterns 9a, 9 of mother printed circuit board I
Since the solder is applied to almost the entire surface of B, and the soldering area increases, the structure is strong against force in the C direction.

In this way, in this embodiment, if the mother printed board 1c is processed as shown in FIG. 3B, the printed pattern 9 a N 9 b of the mother printed board 1e and the printed pattern of the sub printed board 2 will be formed as shown in FIG. 4a and 4b have a large contact area with each other, so a strong bond can be achieved. Further, as shown in FIG. 5, a plurality of printed patterns can be individually formed on the front and back sides of the sub-printed board 2 and connected to the mother printed board 1e.

Effects of the Invention The present invention has the above-mentioned configuration, and according to the present invention, the printed patterns provided on both sides of the sub printed circuit board can be independently bonded, and the divided through hole patterns on the mother printed circuit board can be joined independently. By providing this, the effect of increasing the contact area that can be soldered and strengthening the bonding force between the sub printed board and the master printed board can be obtained.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a conventional mother printed board and sub printed board, Fig. 2 is a cross-sectional view of the bonding portion between the sub printed board and the sub printed board, and Fig. 3 A is a perspective view of a conventional mother printed board and sub printed board. FIG. 3B is a perspective view showing one step in manufacturing a mother printed board in the printed circuit board bonding method, and FIG. 3C is a perspective view showing the mother printed board in the same embodiment.
4 is an enlarged perspective view of a part of a mother printed circuit board, FIG. 4 is a perspective view of a mother printed circuit board and a sub-printed board joined by a printed circuit board joining method according to an embodiment of the present invention, and FIG. It is a dd' cross-sectional view of. 1e: Mother printed circuit board, 2 Sub printed circuit board,
3.Protrusion, /1. a, 41)・Print pattern, 7e17F solder, 8 holes, 9 through hole pattern, 9. +, 91) Divided through-hole pattern, 10・hole, lla, jib・hole edge, l 2
a-, 121) One end of the printed pattern. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 7 Child Figure 3 Figure 8 Figure 4 Figure 5

Claims (1)

[Claims] Holes are formed in the mother printed circuit board, through-hole processing is performed to form a through-hole pattern in most of the above parts, holes are formed in the mother printed circuit board to divide the above-mentioned through-hole pattern, and printed on the front and back of the protrusion. Insert the protruding part of the sub-printed board on which the pattern has been formed into the hole of the mother printed board, and solder dip the printed pattern on the front and back of the sub-printed board into the divided through-hole pattern of the mother printed board. A method for joining printed circuit boards characterized by soldering.