JPH0923058A - Soldering method of printed board - Google Patents

Soldering method of printed board

Info

Publication number
JPH0923058A
JPH0923058A JP17240995A JP17240995A JPH0923058A JP H0923058 A JPH0923058 A JP H0923058A JP 17240995 A JP17240995 A JP 17240995A JP 17240995 A JP17240995 A JP 17240995A JP H0923058 A JPH0923058 A JP H0923058A
Authority
JP
Japan
Prior art keywords
printed circuit
soldering
reflow
circuit board
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17240995A
Other languages
Japanese (ja)
Inventor
Masaaki Kobayashi
林 正 明 小
Fumio Shibuya
谷 文 夫 渋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17240995A priority Critical patent/JPH0923058A/en
Publication of JPH0923058A publication Critical patent/JPH0923058A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce manhour and cost when components are mounted on both sides of a printed board. SOLUTION: A printed board 1 of both sides reflow technique and a printed board 2 of one side reflow/one side flow tequnique are separably linked by a bridge 3 in the manner in which the reflow technique is applied to the surfaces 1A, 2A side. As to soldering, after cream solder is printed on wiring patterns of the surfaces 1A, 2A of the reflow tequnique, and chip components are mounted on the solder, soldering is performed by passing the boards through a reflow furnace. After that, the printed boards 1 and 2 are cut off by the bridge 3, the back 1B of the printed board 1 is similarly subjected to soldering by the reflow technique. As to the printed board 2, leads of a lead component 9 are inserted into through holes from the surface 2A side, and soldering is performed by dipping the back 2B side in a flow vessel. In the conventional method, soldering is performed sheet after sheet, so that four processes are required in total, but in this embodiment, it suffices in three process.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板の両面に
電子部品を半田付け付けするための方法に関する。
FIELD OF THE INVENTION The present invention relates to a method for soldering electronic components to both sides of a printed circuit board.

【0002】[0002]

【従来の技術】近年、プリント基板上への部品実装技術
においては、品質の良い製品を如何に低コストで作るか
が重要視されている。プリント基板への電子部品の実装
は、リフロー工法またはフロー工法と呼ばれる方法で半
田付けすることが多い。また、実装密度を上げるため
に、プリント基板の両面に部品を実装することが行なわ
れている。プリント基板の両面に部品を実装する場合、
両面ともリフロー工法またはフロー工法で半田付けする
場合と、片面をリフロー工法で半田付けし、もう一方の
面をフロー工法で半田付けする場合とがある。
2. Description of the Related Art In recent years, in the technology of mounting components on a printed circuit board, it has been emphasized how to manufacture high quality products at low cost. Electronic components are often mounted on a printed circuit board by soldering by a method called a reflow method or a flow method. Moreover, in order to increase the mounting density, components are mounted on both surfaces of a printed circuit board. When mounting components on both sides of the printed circuit board,
There are cases where both surfaces are soldered by the reflow method or the flow method, and cases where one surface is soldered by the reflow method and the other surface is soldered by the flow method.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、プリン
ト基板の両面に部品を実装する場合、従来は工法毎にプ
リント基板を分けて1枚ずつ半田付けを行なっていたた
め、1枚につき両面の必ず2回の半田付け工程を必要と
するとともに、異なる工法または異なる種類のプリント
基板への切り替え回数が多いほど工程ロスが発生し、コ
ストが増加するという問題があった。
However, when components are mounted on both sides of a printed circuit board, conventionally, the printed circuit board is divided for each construction method and soldering is performed one by one. In addition to the need for the soldering process, there is a problem in that the process loss occurs and the cost increases as the number of times of switching to different construction methods or different types of printed circuit boards increases.

【0004】本発明は、このような従来の問題を解決す
るものであり、プリント基板の両面に部品を実装する場
合の工数およびコストを低減することのできる半田付け
方法を提供することを目的とする。
The present invention solves such a conventional problem, and an object of the present invention is to provide a soldering method which can reduce the number of steps and costs for mounting components on both surfaces of a printed circuit board. To do.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明による半田付け方法は、両面リフロー工法ま
たは両面フロー工法のプリント基板と、片面リフロー/
片面フロー工法のプリント基板を同じ工法が同じ面にな
るように複数枚を分離可能に連結するとともに、同じ工
法の面にその工法で部品を半田付けした後、工法の異な
るプリント基板を分離して、反対側の面にそれぞれの工
法により部品を半田付けするようにしたものである。
In order to achieve the above object, a soldering method according to the present invention is a double-sided reflow method or a double-sided flow method printed circuit board and a single-sided reflow method.
Separately connect multiple printed circuit boards of the single-sided flow method so that the same method is on the same side, and solder parts to the same method surface by the same method, then separate printed circuit boards of different method. The parts are soldered to the opposite surface by each method.

【0006】[0006]

【作用】したがって本発明によれば、分離可能に連結さ
れた複数のプリント基板の同じ工法を有する側の面に部
品実装を行ない、次に工法の異なるプリント基板を分離
して、反対側の面にそれぞれの工法により部品を半田付
けすることにより、複数のプリント基板の片面に対する
部品実装を同時に行なうことができ、プリント基板組立
時の工数およびコストを低減することができる。
Therefore, according to the present invention, components are mounted on the surface of the plurality of separably connected printed circuit boards having the same construction method, then the printed circuit boards of different construction methods are separated, and the opposite surface is separated. By soldering the components by the respective methods, the components can be mounted on one surface of the plurality of printed circuit boards at the same time, and the number of steps and costs for assembling the printed circuit boards can be reduced.

【0007】[0007]

【実施例】図1は本発明の一実施例を示すプリント基板
の正面図(a)と断面図(b)である。図1(a)にお
いて、1は両面リフロー工法の第1のプリント基板、2
は片面リフロー/片面フロー工法の第2のプリント基板
であり、3は両者を分離可能に連結する複数のブリッジ
であり、長孔3aと丸孔3bとの間に形成されている。
4および5は、それぞれ第1および第2のプリント基板
1、2の両側に設けられた保持部であり、このプリント
基板を電子部品実装装置(チップ装着機等)または半田
付け装置(リフロー炉やディップ槽等)にセッティング
する際に使用する。これら保持部4、5は、それぞれブ
リッジ3と同様に、長孔6a、7aと丸孔6b、7bと
の間に形成されたブリッジ6、7を有し、半田付け終了
後にはプリント基板1、2の本体部から切り離せるよう
になっている。8は各プリント基板1、2に半田付けさ
れた表面実装用のチップ部品、9は第2のプリント基板
2に半田付けされたリード部品である。
FIG. 1 is a front view (a) and a sectional view (b) of a printed circuit board showing an embodiment of the present invention. In FIG. 1 (a), 1 is a first printed circuit board of a double-sided reflow process, 2
Is a second printed circuit board of the single-sided reflow / single-sided flow method, and 3 is a plurality of bridges that connect the two so that they can be separated from each other, and are formed between the long hole 3a and the round hole 3b.
Reference numerals 4 and 5 denote holding portions provided on both sides of the first and second printed circuit boards 1 and 2, respectively, and these printed circuit boards are mounted on an electronic component mounting device (chip mounting machine or the like) or a soldering device (reflow furnace or Used when setting in a dip tank, etc.) Like the bridge 3, these holding portions 4 and 5 have bridges 6 and 7 formed between the long holes 6a and 7a and the round holes 6b and 7b, respectively. It can be separated from the main body of 2. Reference numeral 8 is a chip component for surface mounting soldered to each printed circuit board 1 and 2, and 9 is a lead component soldered to the second printed circuit board 2.

【0008】次に本実施例における半田付け方法につい
て説明する。図1(b)において、1A、2Aはそれぞ
れ第1および第2のプリント基板1、2の表面を示し、
その配線パターン部分にクリーム半田を印刷し、その上
にチップ部品8を装着した後、プリント基板をリフロー
炉に通して表面1A、2Aにチップ部品8を半田付けす
る。その後、第1のプリント基板1と第2のプリント基
板2とをブリッジ3の部分で分割する。次に、分割した
第1のプリント基板1の裏面1Bの配線パターン部分に
クリーム半田を印刷し、その面にチップ部品8を装着
し、リフロー炉に通して半田付けする。また分割したも
う一方の第2のプリント基板2には、その表面2Aから
リード部品のリードをスルーホールに通して裏面2Bに
出るようにした後、プリント基板2の裏面2B側をフロ
ー槽(ディップ槽)に浸けて半田付けする。このとき、
裏面2B側にチップ部品8を混載する場合には、リード
部品9の挿入前にチップ装着用接着剤によりチップ部品
8を先に接着しておく。
Next, the soldering method in this embodiment will be described. In FIG. 1 (b), 1A and 2A indicate the surfaces of the first and second printed circuit boards 1 and 2, respectively.
After cream solder is printed on the wiring pattern portion and the chip component 8 is mounted thereon, the printed circuit board is passed through a reflow oven to solder the chip component 8 to the surfaces 1A and 2A. Then, the first printed circuit board 1 and the second printed circuit board 2 are divided at the bridge 3. Next, cream solder is printed on the wiring pattern portion on the back surface 1B of the divided first printed circuit board 1, the chip component 8 is mounted on the surface, and soldering is performed by passing through a reflow oven. On the other side of the other divided second printed circuit board 2, the leads of the lead components are passed through the through holes from the front surface 2A to the rear surface 2B, and then the rear surface 2B side of the printed circuit board 2 is subjected to a flow tank (dip). Dip it in a bath and solder it. At this time,
When the chip components 8 are mixedly mounted on the back surface 2B side, the chip components 8 are first bonded by the chip mounting adhesive before the lead components 9 are inserted.

【0009】このように、従来は両面リフロー工法の第
1のプリント基板1の半田付け工程に2回、リフロー/
フロー工法の第2のプリント基板2の半田付け工程に2
回の計4回の工程を必要とするところ、本実施例では、
1回目のリフロー工程で第1および第2のプリント基板
1、2の表面1A、2Aに半田付けを行ない、プリント
基板1、2の分割後、2回目のリフロー工程で第1のプ
リント基板1の裏面1Bに半田付けを行ない、3回目の
フロー工程で第2のプリント基板2の裏面2Bに半田付
けを行なって、計3回の半田付け工程で終了するため、
プリント基板に電子部品を実装する工数およびコストを
低減することができる。
As described above, in the conventional soldering process of the first printed circuit board 1 of the double-sided reflow method, the reflow / reflow process is performed twice.
2 in the soldering process of the second printed circuit board 2 of the flow method
Where a total of four steps are required, in this embodiment,
In the first reflow process, soldering is performed on the surfaces 1A and 2A of the first and second printed circuit boards 1 and 2, and after the printed circuit boards 1 and 2 are divided, the second printed circuit board 1 is subjected to the second reflow process. Since the back surface 1B is soldered and the back surface 2B of the second printed circuit board 2 is soldered in the third flow process, the soldering process is completed three times in total.
It is possible to reduce man-hours and costs for mounting electronic components on the printed circuit board.

【0010】上記実施例は、両面リフロー工法の第1の
プリント基板1とリフロー/フロー工法の第2のプリン
ト基板2とをブリッジ3で分離可能の連結した例である
が、両面フロー工法のプリント基板とリフロー/フロー
工法のプリント基板の組み合わせでもよく、2枚、2種
類の組み合わせでなく、より多くの枚数、種類の組み合
わせでもよい。その場合、片面はすべて同じ工法のもの
にし、反対の面も同じ工法のものどうしを集めることに
より、プリント基板の分割回数を少なくすることができ
る。また、分離可能な連結方法としては、長孔等による
ブリッジ3の代わりに、ミシン目によるブリッジや、V
カットやルータカット等による薄肉部を有する溝でもよ
い。
The above embodiment is an example in which the first printed circuit board 1 of the double-sided reflow method and the second printed circuit board 2 of the reflow / flow method are connected by the bridge 3 so that they can be separated. The combination of the substrate and the printed circuit board of the reflow / flow method may be used, or the combination of two or two types may be combined, and the number and the number of types may be increased. In that case, the number of times of division of the printed circuit board can be reduced by collecting one side of the same construction method and collecting the other side of the same construction method. Further, as a separable connection method, instead of the bridge 3 made of a long hole, a bridge made of perforations or a V
A groove having a thin portion formed by cutting or router cutting may be used.

【0011】[0011]

【発明の効果】本発明は、上記実施例から明らかなよう
に、分離可能に連結された複数のプリント基板の同じ工
法を有する側の面に部品実装を行ない、次に工法の異な
るプリント基板を分離して、反対側の面にそれぞれの工
法により部品を半田付けすることにより、複数のプリン
ト基板の片面に対する部品実装を同時に行なうことがで
き、プリント基板組立時の工数およびコストを低減する
ことができる。特に、プリント基板実装の種類が多い程
その切り換え回数も多いため、異なるプリント基板の種
類に比例して、工数およびコストの低減度合が大きくな
るという効果を有する。
As is apparent from the above-described embodiment, the present invention mounts components on the surface of a plurality of separably connected printed circuit boards having the same construction method, and then the printed boards of different construction methods are mounted. By separating and soldering the components to the opposite surface by each method, it is possible to mount the components on one surface of multiple printed circuit boards at the same time, reducing the number of steps and cost for assembling the printed circuit boards. it can. In particular, as the number of types of printed circuit boards mounted increases, the number of times of switching increases. Therefore, there is an effect that the degree of reduction in man-hours and costs increases in proportion to the types of different printed circuit boards.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)本発明の一実施例におけるプリント基板
の正面図 (b)同プリント基板の断面図
FIG. 1A is a front view of a printed circuit board according to an embodiment of the present invention, and FIG. 1B is a sectional view of the same printed circuit board.

【符号の説明】[Explanation of symbols]

1 第1のプリント基板 2 第2のプリント基板 1A、2A 表面 1B、2B 裏面 3 ブリッジ 4、5 保持部 6、7 ブリッジ 8 チップ部品 9 リード部品 1 1st printed circuit board 2 2nd printed circuit board 1A, 2A Front surface 1B, 2B Back surface 3 Bridge 4, 5 Holding part 6, 7 Bridge 8 Chip component 9 Lead component

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 両面リフローまたは両面フロー工法のプ
リント基板と、片面リフロー/片面フロー工法のプリン
ト基板を同じ工法が同じ面になるように複数枚を分離可
能に連結するとともに、同じ工法の面にその工法で部品
を半田付けした後、工法の異なるプリント基板を分離し
て、反対側の面にそれぞれの工法により部品を半田付け
するプリント基板の半田付け方法。
1. A double-sided reflow or double-sided flow method printed circuit board and a single-sided reflow / single-sided flow method printed circuit board are separably connected so that the same method is the same side, and the same method is used. A method of soldering a printed circuit board, in which components are soldered by the method and then the printed circuit boards having different methods are separated and the component is soldered to the opposite surface by each method.
【請求項2】 複数枚のプリント基板をブリッジ、ミシ
ン目、または薄肉部で分離可能に連結した請求項1記載
の半田付け方法。
2. The soldering method according to claim 1, wherein a plurality of printed circuit boards are detachably connected to each other at a bridge, a perforation or a thin portion.
JP17240995A 1995-07-07 1995-07-07 Soldering method of printed board Pending JPH0923058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17240995A JPH0923058A (en) 1995-07-07 1995-07-07 Soldering method of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17240995A JPH0923058A (en) 1995-07-07 1995-07-07 Soldering method of printed board

Publications (1)

Publication Number Publication Date
JPH0923058A true JPH0923058A (en) 1997-01-21

Family

ID=15941429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17240995A Pending JPH0923058A (en) 1995-07-07 1995-07-07 Soldering method of printed board

Country Status (1)

Country Link
JP (1) JPH0923058A (en)

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