JPH01289191A - Three-dimensional printed wiring board structure - Google Patents

Abstract

PURPOSE:To efficiently utilize the area and space on a first board by a method wherein slots are provided in a first board, insertions to be inserted into the slots are provided on a second board, and the insertions are provided with long lands. CONSTITUTION:On the front and rear surfaces of a first board 1, conductive patterns are provided, consisting of land sections 2a and line sections 2b. In the first board 1, slots 5 are provided, penetrating from the front surface to the rear surface. On a second board 6, again, there are land sections 7a and line sections 7b, provided on the front and rear surfaces. Insertions 6a to be inserted into the slots 5 are formed on the second board 6. Catches 6b are provided on the board 6, to be arrested by the edges of the slots 5 upon insertion of the insertions 6a into the slots 5. It is so designed that the land sections 7a on the insertions 6a are longer than the slots 5 are deep. The insertions 6a are inserted into the slots 5, and then solder is applied for the connection of the land sections 2a near the circumferences of the slots 5 and the land sections 7a on the insertions 6a.

Description

TECHNICAL FIELD The present invention relates to a three-dimensional printed wiring board structure in which a conductive pattern on one printed wiring board is connected to a conductive pattern on another printed wiring board.

BACKGROUND OF THE INVENTION In order to miniaturize devices, it is necessary not only to simply miniaturize components, but also to consider the wiring method for connecting component terminals. Along with the possibility of miniaturization of printed wiring boards,
It is suitable for performing highly reliable wiring without errors using techniques such as automatic wiring assembly, and is currently used in various electronic and communication equipment.

Additionally, as products become more diverse, it is possible to develop product variations by adding or deleting small circuit boards as functional blocks.

SUMMARY OF THE INVENTION An object of the present invention is to provide a three-dimensional printed wiring board structure that can improve the efficiency of using the area on the printed wiring board and the efficiency of using the space on the printed wiring board.

In order to achieve the above object, in the three-dimensional printed wiring board structure according to the present invention, a long hole penetrating from the front surface to the back surface is formed in the first substrate, and a plurality of land portions are formed on the front and back surfaces near the periphery of the long hole. At the same time, the second substrate is provided with at least one insertion portion that is inserted into the elongated hole formed in the first substrate, and a plurality of land portions that are longer than the depth of the elongated hole are provided on at least one of the front and back surfaces of the insertion portion. The insertion portion is inserted into the elongated hole, and at least one land portion formed in the insertion portion is soldered to the land portions on both the front and back surfaces near the periphery of the elongated hole.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the accompanying drawings.

As shown in the figure, in the three-dimensional printed wiring board structure according to the present invention, a conductive pattern 2 consisting of land portions 2a and line portions 2b is formed on both the front and back surfaces of the first substrate 1. Electronic components 3 such as resistors are mounted on the first substrate 1, and the electronic components 3 are soldered to corresponding lands 2a. Further, the first substrate 1 is provided with a long hole 5 penetrating from the front surface to the back surface thereof. A plurality of land portions 2a are formed on the front and back surfaces near the periphery of the elongated hole 5.

On the other hand, conductive patterns 7 made up of land portions 7a and line portions 7b are formed on both the front and back surfaces of the second substrate 6, similarly to the first substrate. Further, an electronic component 8 is also mounted on the second board 6, and the electronic component 8 is soldered to the corresponding land portion 7a.

The second board 6 is formed with an insertion part 6a that is inserted into the elongated hole 5 of the first board 1, and a lock that is engaged with the periphery of the elongated hole 5 when the insertion part 6a is inserted into the elongated hole 5. A stop portion 6b is formed on the side of the insertion portion 6a.

A plurality of land portions 7a are formed on both the front and back surfaces of the insertion portion 6a. Land portion 7a formed in insertion portion 6a
is formed longer than the depth of the elongated hole 5, that is, the thickness of the first substrate 1, and extends in the depth direction of the elongated hole 5.

The insertion portion 6a of the second substrate 6 configured as described above is inserted into the long hole 5 of the first substrate 1, and the locking portion 6b is locked to the periphery of the long hole 5 and positioned. After this positioning, the elongated hole 5
The conductive patterns 2 and 7 of both substrates 1 and 6 are connected by soldering the land portion 2a formed near the periphery of the board and the corresponding land portion 7a formed in the insertion portion 6a. At the same time, both substrates 1 and 6 are fixed to each other.

In the above embodiment, the case where the conductive pattern 7 is formed on both the front and back surfaces of the second substrate is explained.
The conductive pattern 7 formed on the second substrate 6 may be formed on either the front or back surface.

In addition, in the three-dimensional printed wiring board according to the present invention configured as described above, as shown in FIG.
The line portion 2b-1 formed on the back surface of the first substrate 1, the first
A land portion 2a-2 on the back surface of the substrate 1, a land portion 7a-1 formed on the back surface of the second substrate 6. A line portion 7b-1 formed on the back surface of the second board 6, a land portion 7a-2 formed on the back surface of the second board 6, and a lead wire 8a of an electronic component 8a soldered to the land portion 7a-2. -L electronic parts 8
a Lead wire 8a-2 of S electronic component 8a, lead wire 8a
Land portion 7 on the surface of the second board 6 soldered to -2
a-3, line portion 7b- formed on the surface of the second substrate 6
2. Land portion 7a-4 on the surface of the second substrate 6, first substrate 1
, the land portion 2a-3 on the back surface of the first board 1, the line portion 2b-2 on the back surface of the first board 1, the land portion 2a-4 on the back surface of the first board 1, and the lead of the electronic component 8b soldered to the land portion 2a-4. Wire 8b-1, electronic component 8b, lead wire 8b-2 of electronic component 8b, land portion 2a-5 on the surface of first substrate 1 soldered to lead wire 8b-2, line on the surface of first substrate 1 portion 2b-3, land portion 2a-6 on the surface of the first substrate 1
, a land portion 7a-5 on the front surface of the second substrate 6, a line portion 7b-3 on the front surface of the second substrate 6, a land portion 7a-6 on the front surface of the second substrate 6, a land portion 2a on the back surface of the first substrate 1. -7, 1st
Both the front and back surfaces of the first substrate 1 and the second substrate 6 are formed by forming a conductive path that sequentially passes through the line portion 2b-4 on the back surface of the substrate 1 and terminates at the land portion 2a-8 on the back surface of the first substrate 1. It becomes possible to form wiring patterns in all directions.

As described in detail, in the three-dimensional printed wiring board according to the present invention, a long hole penetrating from the front surface to the back surface is formed in the first substrate, and a plurality of land portions are formed on the front and back surfaces near the periphery of the long hole. At the same time, the second substrate is provided with at least one insertion portion that is inserted into the elongated hole formed in the first substrate. The insertion part is inserted into the elongated hole, and at least one land formed in the insertion part is soldered to the land parts on both the front and back surfaces near the periphery of the elongated hole. It is possible to efficiently utilize the area and space on the board.Also, since it is soldered on both the front and back sides of the first board, it is possible to short-circuit the conductive patterns on both the front and back sides, which increases the conductivity. In addition to increasing the degree of freedom in pattern placement, the load applied to the second board is distributed into tensile load and compressive load on both the front and back surfaces of the first board, resulting in a strong connection structure that is unlikely to cause peeling of the conductive pattern. It will be done.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a three-dimensional printed wiring board structure according to the present invention, Fig. 2 is a partial cross-sectional view of the three-dimensional printed wiring board structure according to the invention, and Fig. 3 shows an example of wiring of the three-dimensional printed wiring board. This is a diagram. Explanation of symbols of main parts 1...First substrate 2...Conductive pattern 2a...Land I 2b----
・-Line section 3...Electronic parts 5...
...Long hole 6...Second substrate 6a...
...Insertion part 6b...Locking part 7...
... Conductive pattern 7a ... Land portion 7
b...Line section 8...Electronic component applicant Pioneer Corporation

Claims (3)

[Claims] (1) A three-dimensional printed wiring board structure in which a conductive pattern formed on a second substrate is connected to a conductive pattern consisting of land portions and line portions formed on both the front and back surfaces of the first substrate, A long hole penetrating from the front surface to the back surface is formed in the substrate, and a plurality of lands are formed on the front and back surfaces near the periphery of the long hole, and at least one land portion is formed in the second substrate to be inserted through the long hole. a plurality of lands longer than the depth of the elongated hole are formed on at least one of the front and back surfaces of the insertion portion, and at least one land is formed in the insertion portion by inserting the insertion portion into the elongated hole. A three-dimensional printed wiring board structure, characterized in that the parts are soldered to land parts on both the front and back surfaces near the periphery of the elongated hole. (2) The three-dimensional printed wiring board structure according to claim 1, wherein a locking portion is formed on a side of the insertion portion to be locked to a peripheral edge of the elongated hole. (3) The second substrate has a conductive pattern on both the front and back surfaces, and at least one land portion on each of the front and back surfaces of the second substrate is connected to a land portion formed on both the front and back surfaces of the second substrate. The three-dimensional printed wiring board structure according to claim 1 or 2, characterized in that the three-dimensional printed wiring board structure is attached.