JPS6126283A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS6126283A JPS6126283A JP14800284A JP14800284A JPS6126283A JP S6126283 A JPS6126283 A JP S6126283A JP 14800284 A JP14800284 A JP 14800284A JP 14800284 A JP14800284 A JP 14800284A JP S6126283 A JPS6126283 A JP S6126283A
- Authority
- JP
- Japan
- Prior art keywords
- metal conductor
- wiring board
- printed wiring
- thin metal
- thick metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は任意の個所にフレキシブル性をもたせることが
でき、部品取付は性、半田付は性にも優れた印刷配線基
板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed wiring board that can be provided with flexibility at any location and has excellent component attachment and soldering properties.
従来例の構成とその問題点
従来から印刷配線基板の任意の個所にフレキシブル性を
有せしめるためにはフレキシブル配線基板が利用されて
おり、ポリイミドやポリエステル等のフレキシブル配線
基板の裏面にベーク板、ガラスエポキシ板等の硬質板を
接着したり、また、厚い金属導体を一次エソテングで部
分的に薄くしポリイミド等のフィルムを接着した後に二
次エツチングでパターンを形成し、軟質部と硬質部を形
成することが行なわれてきた。Conventional structure and its problems A flexible wiring board has been used to provide flexibility to any part of a printed wiring board. A hard plate such as an epoxy board is bonded, or a thick metal conductor is partially thinned by primary etching, a film such as polyimide is bonded, and a pattern is formed by secondary etching to form a soft part and a hard part. Things have been done.
しかしながら、上述した従来の印刷配線基板では硬質板
を接着したり、エツチングを２回おこなう等する関係で
製造工程が複雑であり、高価になってし１うという欠点
を有していた。However, the above-mentioned conventional printed wiring board has the disadvantage that the manufacturing process is complicated because it requires bonding a hard plate, etching is performed twice, etc., and it is expensive.
発明の目的
本発明の目的は、製造工程を複雑にすることなく、任意
の箇所にフレキ７ブル性を有せしめることができる印刷
配線基板を提供することにある。OBJECTS OF THE INVENTION An object of the present invention is to provide a printed wiring board that can be made flexible at any location without complicating the manufacturing process.
発明の構成
本発明の印刷配線基板は、他面に薄い金属導体を形成し
た絶縁フィルムの片面に厚い金属導体を設け、上記薄い
金属導体にエツチングによってノくターン形成する時に
上記厚い金属導体を部分的に除去して相対的に硬質部と
軟質部を形成したことを特長とするものである。Structure of the Invention In the printed wiring board of the present invention, a thick metal conductor is provided on one side of an insulating film having a thin metal conductor formed on the other side. The feature is that a relatively hard part and a soft part are formed by removing the parts.
実施例の説明
第１図乃至第５図は本発明の印刷配線基板の一実施例を
示しており、第１図乃至第４図において、１はポリイミ
ド等の絶縁フィルム、３は絶縁フィルム１に接着された
薄い金属導体（２０〜５ｏμ）で、エツチングで形成さ
れたパターンを有する。DESCRIPTION OF EMBODIMENTS FIGS. 1 to 5 show an embodiment of the printed wiring board of the present invention. In FIGS. 1 to 4, 1 is an insulating film such as polyimide, and 3 is an insulating film 1. Bonded thin metal conductor (20-5oμ) with etched pattern.
２は絶縁フィルム１に接着された厚い金属導体（１００
〜２００μ）で、パターン３をエツチングすると同時に
一部分６をエツチングで除去し、薄い金属導体３のみと
しである。前記・くターン３の上には電子部品４を半田
付けで接続する。厚い金属導体２の側においては薄い金
属導体のノくターン６と厚い金属導体７とに孔をあけ、
メッキ等の方法で表裏を導通させるスルホールを有する
。このように構成することによシ、表裏に導体を有する
部分は堅牢となり、厚い導体を除去した部分は柔軟とな
り、第１図のように自由に曲げることができる。2 is a thick metal conductor (100
~200μ), and at the same time as etching the pattern 3, a portion 6 is removed by etching, leaving only the thin metal conductor 3. An electronic component 4 is connected to the circuit board 3 by soldering. On the side of the thick metal conductor 2, holes are made in the notch 6 of the thin metal conductor and the thick metal conductor 7;
It has through-holes that make the front and back conductive using methods such as plating. By configuring it in this manner, the portions having conductors on the front and back sides are strong, and the portions from which the thick conductors have been removed are flexible and can be bent freely as shown in FIG.
なお、絶縁フィルム１の端部に端子を形成する場合には
、第４図に示すように厚い金属導体２の部分に凹凸のコ
ム形状部分８を構成し、プレス加工で打ち抜くことによ
りコム端子９を構成するとよい。In addition, when forming a terminal at the end of the insulating film 1, as shown in FIG. 4, an uneven comb-shaped part 8 is formed in a part of the thick metal conductor 2, and a comb-shaped part 9 is formed by punching it out by press working. It is recommended to configure
発明の効果
以上のように本発明の印刷配線基板は構成されるため、
次のような効果が得られる。Effects of the Invention Since the printed wiring board of the present invention is configured as described above,
The following effects can be obtained.
（１）任意の個所に柔軟部と堅牢部が同時にエツチング
で形成されるので、寸法精度が良く、製造コストも安価
になる。(1) Since the flexible part and the solid part are simultaneously formed at arbitrary locations by etching, dimensional accuracy is good and manufacturing cost is low.
（２）堅牢部を有するため１部品の装着、半田付けが安
易にできる。(2) Since it has a robust part, one part can be easily mounted and soldered.
（３）堅牢なコム状の端子を設けることができるので、
他の印刷基板やコネクタ等の部品との接続が確実にでき
る。(3) A robust comb-shaped terminal can be provided, so
Reliable connection with other printed circuit boards, connectors, and other parts.
（４）堅牢部は表裏に導体があるので、スルーホールで
接続することにより高密度の両面基板ができる。(4) Since the robust part has conductors on the front and back sides, a high-density double-sided board can be created by connecting with through holes.
第１図は本発明の印刷配線基板の一実施例を示す斜視図
、第２図は同印刷配線基板の背面斜視は第３図は同印刷
配線基板の断面図、第４図は同印刷配線基板の他の実施
例を示す要部拡大平面図である。
１・・・・・・柔軟な絶縁フィルム、２・・・・・・厚
い金属導体、３・・・・・薄い金属導体、４・・・・電
子部品、５・・・・柔軟部の厚い金属導体の除去部、６
．了・・・・・スルーホール部、８・・・・・コム状端
子の導体除去部、９・・・・・・表裏に導体を有したコ
ム状端子部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図Fig. 1 is a perspective view showing an embodiment of the printed wiring board of the present invention, Fig. 2 is a rear perspective view of the printed wiring board, Fig. 3 is a sectional view of the printed wiring board, and Fig. 4 is a cross-sectional view of the printed wiring board. FIG. 7 is an enlarged plan view of a main part showing another example of the substrate. 1...Flexible insulating film, 2...Thick metal conductor, 3...Thin metal conductor, 4...Electronic component, 5...Thick flexible part Removal part of metal conductor, 6
．． End: Through-hole portion, 8: Conductor removal portion of comb-shaped terminal, 9: Comb-shaped terminal portion with conductors on the front and back sides. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure
Claims (2)
い金属導体を形成し、かつエッチングでのパターン形成
時に厚い金属導体を部分的に除去して薄い金属導体のみ
とし、相対的に堅牢部と柔軟部を形成したことを特徴と
する印刷配線基板。(1) A thick metal conductor is formed on one side of the insulating film and a thin metal conductor is formed on the other side, and the thick metal conductor is partially removed during pattern formation by etching, leaving only the thin metal conductor, making it relatively robust. A printed wiring board characterized by forming a flexible part and a flexible part.
牢部にはプレス加工で打抜いてコム状の端子を形成した
ことを特徴とする特許請求の範囲第１項記載の印刷配線
基板。(2) The printed wiring board according to claim 1, characterized in that a comb-shaped terminal is formed by punching out a solid part with a thick metal conductor and a thin metal conductor on the front and back sides by press working.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14800284A JPS6126283A (en) | 1984-07-16 | 1984-07-16 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14800284A JPS6126283A (en) | 1984-07-16 | 1984-07-16 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6126283A true JPS6126283A (en) | 1986-02-05 |
Family
ID=15442912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14800284A Pending JPS6126283A (en) | 1984-07-16 | 1984-07-16 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6126283A (en) |
-
1984
- 1984-07-16 JP JP14800284A patent/JPS6126283A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61203695A (en) | Part mounting system for single-side wiring board | |
| JPS6126283A (en) | Printed circuit board | |
| JPS6188471A (en) | Connector | |
| JPH02214191A (en) | Connection structure of flexible printed wiring board | |
| JPH0752790B2 (en) | Parent-child board mounting method | |
| JPS6141272Y2 (en) | ||
| JPS6020300Y2 (en) | printed wiring board | |
| JPS60176577U (en) | Printed board | |
| JPS60180186A (en) | Printed board | |
| JPS63237495A (en) | Composite circuit board | |
| JPH051098Y2 (en) | ||
| JPH0227573Y2 (en) | ||
| JPS61220497A (en) | Copper-lined flexible circuit board | |
| JPH01289191A (en) | Three-dimensional printed wiring board structure | |
| JPS5856471U (en) | Chip parts mounting device | |
| JPS6312188A (en) | Structure for attaching flexible circuit | |
| JPS5939960U (en) | printed wiring board | |
| JPS6327097A (en) | Printed board | |
| JPS5986285A (en) | Device for connecting printed board | |
| JPS6335118B2 (en) | ||
| JPS59152692A (en) | Printed circuit board associated in multiple dimensions | |
| JPS602867U (en) | Circuit component mounting device | |
| JPS59104569U (en) | Printed circuit board test terminal device | |
| JPS5914400U (en) | Electrical component mounting structure on printed circuit board | |
| JPS59207684A (en) | Mounting board |