JPS6332998A - Multilayer printed interconnection board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A signal pattern that requires shielding on an inner layer board of a multilayer printed wiring board (for example, a signal pattern of a high voltage level mixed in a signal pattern of a low voltage level, or vice versa) A linear ground pattern is formed around the signal pattern that requires shielding.
A plate-shaped ground pattern having the same outer shape as the linear ground pattern is formed on another corresponding surface adjacent to the inner layer substrate on which the signal pattern is formed, thereby preventing the influence of other signal patterns, resulting in stable operation. Improves reliability.

[Industrial application field]

The present invention relates to a multilayer printed wiring board in which a specific signal pattern formed on an inner layer board is shielded.

7. Advances in highly integrated technology for electronic components. Accompanying small size.

High-density printed wiring boards, on which these electronic components are mounted, are often used as units that make up various electronic devices. With the advent of printed wiring boards, different types of signal patterns are mixed on the same layer board.

[Conventional technology]

In a conventional shield for a signal pattern that requires a shield, which is formed on an inner layer board of a multilayer printed wiring board, the signal pattern is surrounded in a plane by ground level wiring or the like.

[Problem that the invention seeks to solve]

In the above-mentioned conventional multilayer printed wiring board, signal patterns that require shielding are shielded two-dimensionally, but because they are not shielded three-dimensionally, electrical (especially electromagnetic) The problem was that it was subject to major failures, resulting in malfunctions and low reliability.

[Means for solving problems]

The present invention solves the above-mentioned problems and provides a multilayer printed wiring board in which signal patterns requiring shielding are shielded two-dimensionally and three-dimensionally.

That is, the shield structure of the partial signal pattern 2 of the inner layer board 13 in the multilayer printed wiring board 1 is formed by forming a linear ground pattern 4 on the same plane around the signal pattern 2 to form the signal pattern 2. This problem is solved by forming a plate-shaped ground pattern 5 having the same external shape as the ground pattern 4 on a corresponding surface of another inner layer substrate adjacent to the inner layer substrate 13.

[Effect]

The above-mentioned multilayer printed wiring board can be used to shield the signal pattern on the side where there is less, for example, when a low voltage level signal pattern and a high voltage level signal pattern coexist on the same layer surface, and provide electricity to other signal levels. (Electromagnetic) interference is prevented, malfunctions are eliminated, and reliability is improved.

〔Example〕

1 and 2 are views for explaining one embodiment of the present invention, with FIG. 1 being an exploded perspective view and FIG. 2 being an exploded side sectional view.

In the figure, predetermined pie holes (holes for connecting signals) 3 are provided on a plurality of (five boards are shown in the drawing) substrates 1) to 15 made of glass epoxy resin, etc., and signals are connected between the same type of pie holes 3. For example, when forming different types of signal patterns on the same inner layer board 13 and shielding the signal pattern 2 that requires shielding, first connect the signal pattern 2 with a linear ground pattern. An inner layer substrate 13 surrounded by 4 and shielded from other signal patterns on the same plane 2, and further provided with the signal pattern 4.
After forming a plate-shaped ground pattern 5 having a shape equal to or slightly larger than the linear ground pattern 4 on each side of the inner layer substrates 12 and 14 facing the signal pattern 4 adjacent to the inner layer substrates 12 and 14, Questions 12 and 13 and 1
A plurality of insulating plates 6 such as prepreg are interposed between the ground patterns 4 and 5 between the ground patterns 3 and 14, and are bonded and laminated with an adhesive.

In this embodiment, five multilayer printed wiring boards 1 are laminated, but the present invention can also be applied to three or more multilayer printed wiring boards 1.

Further, although the explanation has been given in which a signal pattern requiring shielding is formed on the substrate 13, the present invention can also be applied to signal patterns requiring shielding on other inner layer substrates 12 and 14.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, signal patterns that require shielding can be shielded two-dimensionally or three-dimensionally, so electromagnetic interference to signal patterns can be prevented, malfunctions can be eliminated, and reliability can be improved. It is extremely effective for improvement.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view illustrating an embodiment of the present invention. FIG. 2 is an exploded side sectional view illustrating the present invention. In the figure, 1 is a multilayer printed wiring board, 2 is a signal pattern that requires shielding, 3 is a pie hole, 4 is a linear ground pattern, 5 is a plate-shaped ground pattern, 6 is an insulating plate, 1)
．． Reference numeral 15 indicates a substrate, and 12 to 14 indicate inner layer substrates, respectively. b Fukari 1 Chest J Chu Lqsu 31 minute square flight 1 trace movement 2nd figure

Claims (1)

[Claims] The shield structure of a part of the signal pattern (2) of the inner layer board (13) in the multilayer printed wiring board (1) is provided by forming the shield structure of the signal pattern (2) on the same plane as the signal pattern (2). A linear ground pattern (4) is formed around the periphery, and the ground pattern (4) is placed on the corresponding surface of another inner layer substrate adjacent to the inner layer substrate (13) on which the signal pattern (2) is formed.
) A multilayer printed wiring board characterized in that a plate-like ground pattern (5) having the same outer shape as that of (5) is formed.