JPS60127797A - Multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multilayer printed wiring board having wiring for mounting electronic components and electrically connecting the components, and having at least two signal layers. It is.

Prior Art Conventionally, in this type of multilayer printed wiring board, two adjacent signal layers are arranged as shown in the cross-sectional view of FIG. The plan view of the layer 3 and the outer layer viewed from the 14th m is as shown in Fig. 2, for example.

Wiring pattern 4 on first layer 1 and wiring pattern 5 on second layer 2
are specified to run orthogonally so that they do not overlap each other. That is, the wiring pattern 4 of the first layer 1 ran in the X direction, the wiring pattern 5 of the second layer 2 ran in the Y direction, and these wiring patterns 4 and 5 only crossed each other at position 7. .

However, in this layer structure, if there are an extremely large number of wiring patterns 4 in the X direction (and an extremely small number of wiring patterns 5 in the Y direction), there are too many wiring patterns in the first layer 1 for the wiring area. , while some wiring cannot be patterned, Y
The second layer 2, in which the wiring pattern in the direction is specified, has a drawback that the wiring pattern is too small for the wiring area.

Furthermore, even if the wiring in the X direction, which cannot be patterned in the first layer 1, is placed in the second layer 2, which has fewer patterns, the wiring channel, which is a route that can be patterned, will be connected to the first layer and the second layer.
Since the layers were set at the same position, the wiring patterns in the X direction overlapped vertically in the first and second layers.
Therefore, a considerable amount of crosstalk occurs, which has the drawback of causing malfunction.

Object of the Invention The object of the present invention is to
A multilayer print that solves the above drawbacks by arranging each wiring pattern in parallel and not overlapping when viewed from the wiring board surface, in layers with wiring patterns in the same direction. Our goal is to provide wiring boards.

Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a wiring channel, which is a wiring route in one layer, in a multilayer printed wiring board having a layered structure in which two or more signal layers are stacked adjacent to each other. and wiring channels, which are wiring paths in adjacent layers, are arranged in a parallel relationship and at the same time separated by a certain distance in a direction perpendicular to the wiring direction. A configuration is adopted in which the wiring patterns do not overlap when the wiring patterns are overlapped.

EXAMPLES Next, the present invention will be explained in detail by way of examples with reference to the drawings.

In the plan view of the first embodiment of the present invention shown in FIG.
The two-layer printed wiring board 8 of the present invention has two layers with an insulating layer in between.
In each of the first layer and the second layer of these signal layers, the wiring is a route that allows wiring so that two wiring patterns each pass between a series of plurality of through holes 13. Wiring channels 9 and 10 in the first layer 3, where channels are set, are shown by solid lines, 9 is in the Y direction, 1
Is 0 the wiring channel in the X direction? are doing. In addition, wiring channels 11 and 12 in the 2nd N are shown by broken lines, and 11 is in the Y direction,
12 indicates a wiring channel in the X direction. Then, wiring channels 9 and 10 in the first layer and wiring channel 1 in the second layer.
1.12 is set at a certain distance in a direction perpendicular to the wiring direction.

By setting up such wiring channels, the first
Even if the wires are routed in the same direction in both layers, the wiring patterns do not overlap vertically, and noise due to crosstalk is significantly reduced compared to when the wiring patterns overlap vertically. Also, the first layer.

It becomes possible for the wiring patterns to run in the same direction in both the second layers, and as a result, the efficiency of accommodating the wiring patterns is considerably improved.

FIG. 4 shows a second embodiment of the present invention, in which the power supply/ground N2
A cross-sectional view of a six-layer printed wiring board including the power supply and
Ground layers 15 and 18 and signal layers 14, 16, 17
．． It consists of 19.

Here, the first embodiment of the present invention is applied to adjacent signal layers 16 and 17. In this way, as in the first embodiment, crosstalk of the printed wiring board can be reduced and the pattern accommodation rate can be improved.

FIG. 5 shows a third embodiment of the present invention, which is a cross-sectional view of a part of the layer structure of a multilayer printed wiring board, in which four signal layers are successively stacked adjacent to each other. In this embodiment, the multilayer printed wiring board includes a power/ground layer 21.
26 and signal layer 20° 22 + 23 t 24 +
25 + 27, of which four signal layers 22 + 23 + 24.25 are successively laminated, the signal layers 22 and 24 are arranged as a wiring pattern in the X direction, and the signal layers 23 and 25 are arranged as a wiring pattern in the Y direction. It is specified to be used for patterns.

If the same conventional wiring channel is applied to these four signal layers, there will be one signal layer in the middle between the wiring channels of signal layers 22 and 24 and signal layers 23 and 25, but The wiring patterns of the above and below may overlap, causing crosstalk.

In order to solve this drawback, the wiring channels of the signals N22 and 23 and the signal layers 24 and 25 are arranged at 10 in FIG.
9 and 12 and 11, the upper and lower wiring patterns are not the same, which has the effect of reducing crosstalk.

Note that in the first, second, and third embodiments, the case where there are two wiring channels between the through holes is described;
It is similarly applicable when there are one or more wiring channels between through holes.

Effects of the Invention As explained above, the present invention employs a configuration in which the respective wiring channels are arranged in parallel and not overlapping in adjacent signal layers, thereby reducing crosstalk between layers. , and has the effect of improving the wiring pattern accommodation rate.

[Brief explanation of the drawing]

1 and 2 are examples of a two-layer printed wiring board according to the prior art. FIG. 1 is a sectional view thereof, FIG. FIG. 4 is a plan view of the two-layer printed wiring board of the embodiment. FIG. 5 shows cross-sectional views of a second embodiment and a third embodiment of the present invention, respectively. 1.2... Signal layer, 3... Insulating layer, 4
...Wiring pattern of the first layer (signal layer 1), 5.
...Wiring pattern of second layer (signal layer 2), 6...
2-layer printed wiring board, 7... position where wiring patterns 4 and 5 intersect at right angles, 8. 2-layer printed wiring board, 9°... in the first layer. Wiring channel in the Y direction, 10°...Wiring channel in the X direction in the first layer, 11...Wiring channel in the Y direction in the second layer, 12......X in the 2nd N Wiring channel in direction, 13...Through hole, 1
4116117+19.20°22.23124.25
．． 27...Signal layer, 15°1B, 21.26.
...Power supply/ground layer. r---■What agent Patent attorney Kuri 1) Haru Yu, ゛(--2-L-
).

Claims (1)

[Claims] In a multilayer printed wiring board that has a layer structure in which two or more signal layers are stacked adjacent to each other, a wiring channel is a route that can be routed in one layer, and a wiring is a route that can be routed in adjacent layers. The channels are parallel to each other and are spaced a certain distance apart in a direction perpendicular to the wiring direction, so that the wiring patterns do not overlap when viewed from the board surface. Features multilayer printed wiring board.