JPH03205814A - Electronic parts for surface mounting - Google Patents
Electronic parts for surface mountingInfo
- Publication number
- JPH03205814A JPH03205814A JP180290A JP180290A JPH03205814A JP H03205814 A JPH03205814 A JP H03205814A JP 180290 A JP180290 A JP 180290A JP 180290 A JP180290 A JP 180290A JP H03205814 A JPH03205814 A JP H03205814A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- soldering
- plate
- hole
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、表面実装用電子部品に関し、特に平板状の半
田付け端子を有する表面実装用電子部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface mount electronic component, and more particularly to a surface mount electronic component having a flat soldering terminal.
従来この種の表面実装用電子部品の端子形状は、第2図
に示すように平板状になっていた。これをプリント基板
のパターン上に形戒された半田付けランドに半田付けす
ることにより、部品を回路に接続し、かつ基板上に固定
していた。Conventionally, the terminal shape of this type of surface-mounted electronic component has been flat as shown in FIG. By soldering this to soldering lands marked on the printed circuit board pattern, the component was connected to the circuit and fixed on the board.
上述した従来の表面実装用電子部品の端子形状が平板状
のため、端子面とプリント板のランド面との間にブラッ
クスの気泡を生じやすく、半田付けの引きはがし強度が
十分得られない場合がある。特に、半田付け端子の総面
積に比べて部品の自重が大きい時に、耐落下強度が不足
するという欠点がある。Because the terminals of the conventional surface-mount electronic components mentioned above are flat, black bubbles tend to form between the terminal surface and the land surface of the printed circuit board, making it difficult to obtain sufficient peel strength for soldering. There is. Particularly, when the weight of the component is large compared to the total area of the soldering terminal, there is a drawback that the drop resistance is insufficient.
更に平板状の端子は半田付けに際し大きな熱容量を必要
とし、他の部品に比較して半田付けに要する時間が長く
なるという欠点がある。なおこれは半田付け強度を増す
ために、端子面積を大きくする程顕著になる。Furthermore, flat terminals require a large heat capacity when soldering, and have the disadvantage that the time required for soldering is longer than that for other components. Note that this becomes more noticeable as the terminal area is increased in order to increase the soldering strength.
本発明の目的は、半田付け用の平板状端子に切り欠き、
あるいは穴を設けることにより、半田付け強度が強く、
且つ小熱容量で半田付け可能な表面実装用電子部品を提
供することにある。The object of the present invention is to provide a flat terminal for soldering with a notch,
Alternatively, by providing a hole, the soldering strength is increased.
Another object of the present invention is to provide a surface-mounted electronic component that can be soldered with a small heat capacity.
第1の発明の表面実装用電子部品は、少なくとも1つの
平板状の半田付け端子を有し、該端子の端面又は側面に
少なくとも1つの切り欠きを有する。The surface mount electronic component of the first invention has at least one flat soldering terminal, and has at least one notch on the end or side surface of the terminal.
第2の発明の表面実装用電子部品は、少なくとも1つの
平板状の半田付け端子を有し、該端子の端面または側面
に少くとも1つの穴を有する。The surface mount electronic component of the second invention has at least one flat soldering terminal and at least one hole on the end or side surface of the terminal.
第3の発明の表面実装用電子部品は、少なくとも1つの
平板状の半田付け端子を有し、該端子の端面または側面
に少くとも1つの切り欠きと少くとも1つの穴を有する
。A surface mount electronic component according to a third aspect of the invention has at least one flat soldering terminal, and has at least one notch and at least one hole on the end or side surface of the terminal.
第1図(A>は平板状の半田付け端子に1つの切り欠き
を、第1図(B)は1つの穴を、第1図(C)は2つの
切り欠きを設けた本発明の一実施例の斜視図である。第
1図のように半田付け端子1a.1bに切り欠きが入っ
ている表面実装用電子部品の半田付けは、半田が切り欠
いた部分まで入り込み、半田付けされる周囲表が長くな
るため、半田付け強度が増加する。また、切り欠きを入
れた分だけ半田付け端子の面積が減るため小さな熱容量
で半田付けできる。なお、半田付け端子が第1図(B)
、第1図(C)のような形状でも第1図(A)と同様な
結果が得られる。Figure 1 (A) shows a flat soldering terminal with one notch, Figure 1 (B) has one hole, and Figure 1 (C) has two notches. 1 is a perspective view of an embodiment. When soldering a surface mount electronic component in which the soldering terminals 1a and 1b have notches as shown in FIG. 1, the solder penetrates into the notches and is soldered. As the peripheral surface becomes longer, the soldering strength increases. Also, since the area of the soldering terminal is reduced by the amount of the notch, soldering can be performed with a small heat capacity.The soldering terminal is shown in Figure 1 (B).
, the same results as in FIG. 1(A) can be obtained even with the shape shown in FIG. 1(C).
更に平板状の半田付け端子の端面または側面に切り欠き
と穴を設けても同様な結果が得られる。Furthermore, similar results can be obtained by providing notches and holes on the end or side surface of the flat soldering terminal.
以上説明したように、本発明の表面実装用電子部品は、
半田付け用の平板状端子に切り欠き、あるいは穴を設け
ることにより、半田付け強度が強く、大きな自重を持つ
部品に対する耐落下強度が大きくなる。また半田付け端
子に切り欠き、あるいは穴を設けることにより、半田付
け端子面とプリント板のランド面との間に生ずる気泡が
軽減されると共に、平板状端子の端面周囲が長くなるた
め半田付けの引きはがし強度も向上し、装置の信頼性を
向上することができる。また、小さい熱容量で半田付け
が可能となるため、例えばレーザービーム等により、部
品を一点一点半田付けするような生産形態の場合にも、
半田付けに要する時間を短縮することができる効果があ
る。As explained above, the surface mount electronic component of the present invention is
By providing a notch or a hole in a flat terminal for soldering, the soldering strength is increased and the drop resistance against components with a large weight is increased. In addition, by providing a notch or hole in the soldering terminal, air bubbles that occur between the soldering terminal surface and the land surface of the printed circuit board are reduced, and the circumference of the end surface of the flat terminal becomes longer, making it easier to solder. The peel strength is also improved, and the reliability of the device can be improved. In addition, since soldering can be performed with a small heat capacity, it is possible to solder the parts one by one using a laser beam, for example.
This has the effect of shortening the time required for soldering.
第l図(A)は平板状の半田付け端子に1つの切り欠き
を、第1図(B)は1つの穴を、第1図(C)は2つの
切り欠きを設けた本発明の実施例の斜視図、第2図は従
来の表面実装用部品の斜視図である。
la,lb・・・切り欠きを1つ設けた半田付け用端子
、2a,2b・・・穴を1つ設けた半田付け用端子、3
a,3b・・・切り欠きを2つ設けた半田付け用端子、
4a,4b・・・従来の半田付け用端子。1(A) shows a flat soldering terminal with one notch, FIG. 1(B) has one hole, and FIG. 1(C) shows an embodiment of the present invention with two notches. An example perspective view, FIG. 2 is a perspective view of a conventional surface mount component. la, lb...Soldering terminal with one notch, 2a, 2b...Soldering terminal with one hole, 3
a, 3b...Soldering terminal with two notches,
4a, 4b... Conventional soldering terminals.
Claims (3)
端子の端面又は側面に少なくとも1つの切り欠きを有す
ることを特徴とする表面実装用電子部品。1. An electronic component for surface mounting, comprising at least one flat soldering terminal and at least one notch on an end or side surface of the terminal.
端子の端面または側面に少くとも1つの穴をあけたこと
を特徴とする表面実装用電子部品。2. An electronic component for surface mounting, comprising at least one flat soldering terminal, and at least one hole formed in the end or side surface of the terminal.
端子の端面または側面に少くとも1つの切り欠きと少く
とも1つの穴をあけたことを特徴とする表面実装用電子
部品。3. 1. An electronic component for surface mounting, comprising at least one flat soldering terminal, and at least one notch and at least one hole formed in the end or side surface of the terminal.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP180290A JPH03205814A (en) | 1990-01-08 | 1990-01-08 | Electronic parts for surface mounting |
DE69104734T DE69104734T2 (en) | 1990-01-08 | 1991-01-03 | Electronic component mountable on the surface of a printed circuit board and assembly method. |
EP91300037A EP0437312B1 (en) | 1990-01-08 | 1991-01-03 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
US07/637,557 US5148349A (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
AU68683/91A AU644395B2 (en) | 1990-01-08 | 1991-01-04 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
KR1019910000091A KR910015207A (en) | 1990-01-08 | 1991-01-07 | Structures of electronic components that can be mounted on the surface of a printed circuit board and mounting methods thereof |
CA002033699A CA2033699C (en) | 1990-01-08 | 1991-01-07 | Electronic part with heat radiating member |
HK85397A HK85397A (en) | 1990-01-08 | 1997-06-19 | Electronic part mountable on the surface of a printed circuit board and method of mounting the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP180290A JPH03205814A (en) | 1990-01-08 | 1990-01-08 | Electronic parts for surface mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03205814A true JPH03205814A (en) | 1991-09-09 |
Family
ID=11511704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP180290A Pending JPH03205814A (en) | 1990-01-08 | 1990-01-08 | Electronic parts for surface mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03205814A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002111170A (en) * | 2000-09-29 | 2002-04-12 | Mitsumi Electric Co Ltd | Mounting mechanism of metallic plate in printed wiring board |
WO2012066944A1 (en) * | 2010-11-15 | 2012-05-24 | アイシン・エィ・ダブリュ株式会社 | Connection terminal and circuit component |
-
1990
- 1990-01-08 JP JP180290A patent/JPH03205814A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002111170A (en) * | 2000-09-29 | 2002-04-12 | Mitsumi Electric Co Ltd | Mounting mechanism of metallic plate in printed wiring board |
WO2012066944A1 (en) * | 2010-11-15 | 2012-05-24 | アイシン・エィ・ダブリュ株式会社 | Connection terminal and circuit component |
WO2012067109A1 (en) * | 2010-11-15 | 2012-05-24 | アイシン・エィ・ダブリュ株式会社 | Connection terminal and circuit component |
CN103125148A (en) * | 2010-11-15 | 2013-05-29 | 爱信艾达株式会社 | Connection terminal and circuit component |
JPWO2012067109A1 (en) * | 2010-11-15 | 2014-05-12 | アイシン・エィ・ダブリュ株式会社 | Connection terminals and circuit components |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH087655Y2 (en) | Mounting structure for surface mount components | |
JPH03205814A (en) | Electronic parts for surface mounting | |
JP2636332B2 (en) | Printed board | |
JPS6020300Y2 (en) | printed wiring board | |
JP2000124587A (en) | Fitting method and fitting structure of electronic circuit unit to printed board | |
JPS62180973U (en) | ||
JPS6236316Y2 (en) | ||
JPS6246296Y2 (en) | ||
JP2591766Y2 (en) | Printed board | |
JPH08195540A (en) | Electric circuit device | |
JPH0766074A (en) | Surface mounting component | |
JPS631093A (en) | Electronic parts mounting board device | |
JPS62243393A (en) | Printed board | |
JPS63133695A (en) | Printed wiring board | |
JPH0227573Y2 (en) | ||
JPS6035258Y2 (en) | Printed board | |
JPH02309601A (en) | Structure and fitting method of chip component | |
JPH03203208A (en) | Chip-shaped electronic parts | |
JPH04184992A (en) | Printed board | |
JPH11330662A (en) | Printed board device | |
KR970004988A (en) | Solderless prevention device for automatic soldering of chip parts to printed circuit board | |
JPH03185785A (en) | Flexible wiring board | |
JPH077253A (en) | Printed wiring board for electronic component | |
JPH0487681U (en) | ||
JPH0569976U (en) | Electronic component mounting structure |