JPH04184992A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH04184992A JPH04184992A JP31290790A JP31290790A JPH04184992A JP H04184992 A JPH04184992 A JP H04184992A JP 31290790 A JP31290790 A JP 31290790A JP 31290790 A JP31290790 A JP 31290790A JP H04184992 A JPH04184992 A JP H04184992A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hole
- chip component
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000136 polysorbate Polymers 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、プリント基板に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a printed circuit board.
（従来の技術）
近年、高密度実装技術の進歩により、電気部品等のチッ
プ部品化−が進んでおり、これにともなってプリント基
板も高密度なものとなってきた。(Prior Art) In recent years, with the advancement of high-density packaging technology, the use of chip components such as electrical components has progressed, and along with this, printed circuit boards have also become high-density.
第７図は、従来のプリント基板の一例を示す斜視図、第
８図は、その断面図である。両図に示すようにプリント
基板１００の表面と裏面にはそれぞれ配線パターン１０
１（裏面の配線パターン１０１は図示省略）、１０２と
チップランド１０３゜１０４が形成されており、チップ
ランド１０３゜１０４間には抵抗等のチップ部品１０５
がハンダ１０８によって取付けられている。FIG. 7 is a perspective view showing an example of a conventional printed circuit board, and FIG. 8 is a sectional view thereof. As shown in both figures, there are wiring patterns 10 on the front and back sides of the printed circuit board 100, respectively.
1 (the wiring pattern 101 on the back side is not shown), 102 and chip lands 103 and 104 are formed, and chip parts 105 such as resistors are formed between the chip lands 103 and 104.
is attached by solder 108.
また、プリント基板１００の表面と裏面の各配線パター
ン１０２は、各配線パターン１０２に一体に形成されて
いるスルホールランド１０７により、プリント基板１０
０に形成したスルホール（貫通孔）めっき１０６を通し
て電気的に接続されている。Further, each wiring pattern 102 on the front and back sides of the printed circuit board 100 is connected to the printed circuit board 100 by a through-hole land 107 that is integrally formed with each wiring pattern 102.
It is electrically connected through through-hole plating 106 formed at 0.
（発明が解決しようとする課題）
前記したように、従来のプリント基板１００では、表面
と裏面の各配線パターン１０２を電気的に接続するため
のスルホールランド１０７とスルホールめっき１０６は
、プリント基板１００の高密度化と小形化にともなって
、プリント基板１００に対する占有面積が大きくなり、
チップ部品の実装面の利用効率が低下するという問題が
生じてきた。(Problems to be Solved by the Invention) As described above, in the conventional printed circuit board 100, the through-hole land 107 and the through-hole plating 106 for electrically connecting each wiring pattern 102 on the front and back surfaces of the printed circuit board 100 are With the increase in density and miniaturization, the area occupied by the printed circuit board 100 increases,
A problem has arisen in which the utilization efficiency of the mounting surface of chip components is reduced.
本発明は上記した課題を解決する目的でなされ、チップ
部品の実装面の利用効率を高くすることができるプリン
ト基板を提供しようとするものである。The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a printed circuit board that can increase the efficiency of use of the mounting surface of chip components.
、 ［発明の構成］
（課題を解決するための手段）
前記した課題を解決するために第１の本発明は、表面と
裏面にそれぞれ配線パターンとスルホールランドが形成
されると共に、前記表面と裏面のスルホールランド間に
貫通孔が形成されたプリント基板において、前記貫通孔
にチップ部品を挿入し、前記チップ部品を介して前記表
面と裏面の配線パターンを電気的に接続したことを特徴
としている。, [Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the first invention provides a structure in which a wiring pattern and a through-hole land are respectively formed on the front surface and the back surface, and A printed circuit board in which a through hole is formed between through-hole lands is characterized in that a chip component is inserted into the through hole, and the wiring patterns on the front and back surfaces are electrically connected via the chip component.
また、第２の本発明は、表面と裏面にそれぞれ配線パタ
ーンが形成されたプリント基板において、前記各配線パ
ターンをプリント基板縁部まで形成すると共に、前記各
配線パターンが形成された前記プリント基板縁部にチッ
プ部品を挿入する溝部を形成し、前記溝部に挿入される
チップ部品を介して前記表面と裏面の配線パターンを電
気的に接続したことを特徴としている。The second aspect of the present invention also provides a printed circuit board in which wiring patterns are formed on each of the front and back surfaces, in which each of the wiring patterns is formed up to the edge of the printed circuit board, and the edge of the printed circuit board on which each of the wiring patterns is formed is provided. The device is characterized in that a groove portion is formed in the groove portion into which a chip component is inserted, and the wiring patterns on the front and back surfaces are electrically connected via the chip component inserted into the groove portion.
また、第３の本発明は、表面と裏面にそれぞれ配線パタ
ーンが形成されたプリント基板において、前記各配線パ
ターンをプリント基板縁部まで形成し、プリント基板側
面に形成した側面パターンを介して前記表面と裏面の配
線パターンを電気的に接続したことを特徴としている。Further, the third aspect of the present invention provides a printed circuit board in which wiring patterns are formed on each of the front and back surfaces, in which each of the wiring patterns is formed up to the edge of the printed circuit board, and the wiring patterns are formed on the surface of the printed circuit board through a side pattern formed on a side surface of the printed circuit board. It is characterized by electrically connecting the wiring pattern on the back side.
（作用）
第１の本発明によれば、プリント基板の表面と裏面の配
線パターンを、表面と裏面のスルホールランド間に形成
した貫通孔に挿入されるチップ部品を介して電気的に接
続することにより、チップ部品をプリント基板内にも実
装することができるので、チップ部品の実装面の利用効
率の向上を図ることができる。(Function) According to the first aspect of the present invention, the wiring patterns on the front and back surfaces of the printed circuit board are electrically connected via the chip component inserted into the through hole formed between the through-hole lands on the front and back surfaces. As a result, the chip component can be mounted inside the printed circuit board, so that the efficiency of utilization of the mounting surface of the chip component can be improved.
また、１２の本発明によれば、プリント基板の表面と裏
面の配線パターンを、プリント基板縁部に形成した溝部
伸挿入されるチップ部品を介して電気的に接続すること
により、チップ部品をプリント基板内にも実装すること
ができるので、チップ部品の実装面の利用効率の向上を
図ることができる。Further, according to the present invention, the chip components are printed by electrically connecting the wiring patterns on the front and back surfaces of the printed circuit board through the chip components inserted into the grooves formed at the edge of the printed circuit board. Since it can also be mounted inside a substrate, it is possible to improve the utilization efficiency of the mounting surface of the chip component.
また、第３の本発明によれば、プリント基板の表面と表
面の配線パターンを、プリント基板側面に形成した側面
パターンを介して電気的に接続することにより、スルホ
ールランドやスルホールをを形成することになく表面と
裏面の配線パターンを接続することができるので、チッ
プ部品の実装面の利用効率の向上を図ることができる。Further, according to the third aspect of the present invention, through-hole lands and through-holes can be formed by electrically connecting the front surface of the printed circuit board and the wiring pattern on the front surface via the side surface pattern formed on the side surface of the printed circuit board. Since it is possible to connect the wiring patterns on the front and back surfaces without any problems, it is possible to improve the utilization efficiency of the mounting surface of the chip component.
（実施例）
以下、本発明を図示の実施例に基づいて詳細に説明する
。(Example) Hereinafter, the present invention will be explained in detail based on the illustrated example.
第１図は、本発明の第１の実施例に係るプリント基板を
示す斜視図、第２図は、その断面図である。両図に示す
ように、本実施例に係るプリント基板１の表面と裏面に
は、それぞれ配線パターン２．３と、この配線パターン
２．３と一体にスルホールランド４．５が形成されてい
る。各スルホールランド４．５はそれぞれ対向位置に配
置されている。また、各スルホールランド４．５の略中
央部には、プリント基板１を貫通するようにして円形の
スルホール（貫通孔）６が形成されており、このスルホ
ール６内には例えば円柱状に形成された抵抗等のチップ
部品７が挿入されている。スルホール６内に挿入された
チップ部品７の両端部の各電極７ａ、７ｂは、ハンダ８
によって表面と裏面のスルホールランド４．５に接続さ
れている。FIG. 1 is a perspective view showing a printed circuit board according to a first embodiment of the present invention, and FIG. 2 is a sectional view thereof. As shown in both figures, a wiring pattern 2.3 and a through-hole land 4.5 are formed integrally with the wiring pattern 2.3 on the front and back surfaces of the printed circuit board 1 according to this embodiment, respectively. The through hole lands 4.5 are arranged at opposite positions. Further, a circular through hole (through hole) 6 is formed approximately at the center of each through hole land 4.5 so as to penetrate through the printed circuit board 1, and within this through hole 6, for example, a columnar through hole is formed. A chip component 7 such as a resistor is inserted. Each electrode 7a, 7b at both ends of the chip component 7 inserted into the through hole 6 is bonded with solder 8.
It is connected to the through-hole land 4.5 on the front and back sides.
尚、スルホール６の径は、挿入されるチップ部品７の径
に応じて決定される。Note that the diameter of the through hole 6 is determined depending on the diameter of the chip component 7 to be inserted.
このように、プリント基板１の表面の配線パターン２と
裏面の配線パターン３を、スルホール６内に挿入したチ
ップ部品７を介して接続することによって、プリント基
板１の表面と裏面の配線パターン２．３上に実装してい
たチップ部品７をプリント基板１内に実装することがで
きるので、チップ部品の実装面の利用効率の向上を図る
ことができる。In this way, by connecting the wiring pattern 2 on the front surface and the wiring pattern 3 on the back surface of the printed circuit board 1 via the chip component 7 inserted into the through hole 6, the wiring pattern 2 on the front surface and the back surface of the printed circuit board 1 is connected. Since the chip component 7 mounted on the printed circuit board 3 can be mounted inside the printed circuit board 1, it is possible to improve the utilization efficiency of the mounting surface of the chip component.
また、スルホール６に挿入されるチップ部品７の形状は
、第３図（ａ）、（ｂ）に示すように、円錐形や上部に
傘部を設けた円柱形に形成することもできる。尚、形状
としては角錐形や角柱形でもよく、この場合、スルホー
ル６の形状は、挿入されるチップ部品７の形状に対応し
て形成される。Further, the shape of the chip component 7 inserted into the through hole 6 can be formed into a conical shape or a cylindrical shape with an umbrella section provided at the top, as shown in FIGS. 3(a) and 3(b). The shape may be a pyramid or a prism, and in this case, the shape of the through hole 6 is formed to correspond to the shape of the chip component 7 to be inserted.
このように、チップ部品７の形状を円錐形や上部に傘部
を設けた円柱形に形成することによって、これうのチッ
プ部品７をスルホール６に挿入した場合に落下すること
を防止することができるので、チップ部品７のスルホー
ル６への挿入の自動化を図ることが可能となる。In this way, by forming the chip component 7 into a conical shape or a cylindrical shape with an umbrella section at the top, it is possible to prevent the chip component 7 from falling when inserted into the through hole 6. Therefore, it becomes possible to automate the insertion of the chip component 7 into the through hole 6.
また、第１．２図に示したように、スルホール６内にチ
ップ部品７を挿入することができるので、第４図に示す
ように本実施例のプリント基板１を多数（図では３つ）
積層して、各プリント基板１全部あるいは任意のプリン
ト基板１間の配線パターンを接続することによって、配
線密度が向上し高密度実装が可能となる。Furthermore, as shown in FIG. 1.2, the chip components 7 can be inserted into the through holes 6, so as shown in FIG.
By stacking them and connecting the wiring patterns between all or arbitrary printed circuit boards 1, the wiring density is improved and high-density packaging becomes possible.
第５図は、本発明の第２の実施例に係るプリント基板を
示す斜視図である。FIG. 5 is a perspective view showing a printed circuit board according to a second embodiment of the invention.
本実施例においては、プリント基板１ｏの表面と裏面に
は、プリント基板１０の縁部まで配線パターン（裏面は
図示省略）１１と一体に形成されたチップランド（裏面
は図示省略）１２が設けられている。各チップランド１
２はそれぞれ対向位置に配置されている。また、プリン
ト基板１０のチップランド１２が設けられている縁部に
は、抵抗等のチップ部品１３が挿入される溝部１４が形
成されている。In this embodiment, a chip land 12 (the back side is not shown) formed integrally with a wiring pattern 11 (the back side is not shown) up to the edge of the printed board 10 is provided on the front and back sides of the printed circuit board 1o. ing. Each chip land 1
2 are arranged at opposing positions. Furthermore, a groove 14 into which a chip component 13 such as a resistor is inserted is formed at the edge of the printed circuit board 10 where the chip land 12 is provided.
そして、この溝部１４にチップ部品１３を挿入してチッ
プ部品１３の両端をハンダ（図示省略）によって表面と
裏面のチップランド１２に接続することにより、前記実
施例同様表面と裏面の配線、パターン１１はチップ部品
１３を介して電気的に接続され、チップ部品の実装面の
利用効率の向上を図ることができる。Then, by inserting the chip component 13 into this groove 14 and connecting both ends of the chip component 13 to the chip lands 12 on the front and back surfaces with solder (not shown), wiring and patterns 11 on the front and back surfaces are connected as in the previous embodiment. are electrically connected via the chip component 13, and it is possible to improve the utilization efficiency of the mounting surface of the chip component.
尚、本実施例では、溝部１４に挿入されるチップ部品１
３によって表面と裏面の配線パターン１１を電気的に接
続する以外にも、プリント基板２０の表面あるいは裏面
にそれぞれ形成される配線パターン間を電気的に接続す
ることもできる。Note that in this embodiment, the chip component 1 inserted into the groove 14
In addition to electrically connecting the wiring patterns 11 on the front and back surfaces using the wiring pattern 3, it is also possible to electrically connect the wiring patterns formed on the front and back surfaces of the printed circuit board 20, respectively.
第６図は、本発明の第３の実施例に係るプリント基板を
示す斜視図である。FIG. 6 is a perspective view showing a printed circuit board according to a third embodiment of the present invention.
本実施例においては、プリント基板２０の表面と裏面の
縁部まで形成した配線パターン（裏面は図示省略）２１
と連続的にプリント基板２０の側面にも側面パターン２
２を形成した構成である。In this embodiment, the wiring pattern 21 is formed up to the edges of the front and back surfaces of the printed circuit board 20 (the back surface is not shown).
The side pattern 2 is also continuously formed on the side surface of the printed circuit board 20.
This is a configuration in which 2 is formed.
そして、本実施例においても、この側面パターン２２を
介してプリント基板２０の表面の配線パターン２１と裏
面の配線パターン（図示省略）を接続することによって
、前記実施例同様チップ部品の実装面の利用効率の向上
を図ることができる。Also in this embodiment, by connecting the wiring pattern 21 on the front surface of the printed circuit board 20 and the wiring pattern (not shown) on the back surface through this side pattern 22, the mounting surface of the chip component can be utilized as in the previous embodiment. Efficiency can be improved.
［発明の効果］
以上、実施例に基づいて具体的に説明したように本発明
によれば、スルホールやプリント基板縁部に形成した溝
部に挿入されるチップ部品を介して表面と裏面の配線パ
ターンを接続したり、プリント基板側面に設けた側面パ
ターンによって表面と裏面の配線パターンを接続するこ
とができるので、チップ部品の実装面の利用効率が向上
することにより、従来のプリント基板に比べて大幅な高
密度実装化を図ることができる。[Effects of the Invention] As described above in detail based on the embodiments, according to the present invention, the wiring patterns on the front and back surfaces are connected through the through-holes and the chip components inserted into the grooves formed on the edges of the printed circuit board. It is also possible to connect the wiring patterns on the front and back sides using the side pattern provided on the side of the printed circuit board, which improves the efficiency of using the mounting surface of chip components, significantly reducing the cost compared to conventional printed circuit boards. High-density packaging can be achieved.
第１図は、第１の本発明に係るプリント基板を示す斜視
図、第２図は、その断面図、第３図（ａ）、（ｂ）は、
それぞれ第１の本発明に係るプリント基板のスルホール
に挿入されるチップ部品を示す断面図、第４図は、第１
の本発明に係るプリント基板を積層した状態を示す断面
図、第５図は、本発明の第２の実−例に係るプリント基
板を示す斜視図、第６図は、本発明の第３の実施例に係
るプリント基板を示す斜視図、第７図は、従来のプリン
ト基板を示す斜視図、第８図は、その断面図である。
１．１０．２０・・・プリント基板
２．３，１１．２１・・・配線パターン４．５・・・ス
ルホールランド
６・・・スルホール（貫通孔）
７．１３・・・チップ部品
１２・・・チップランド
１４・・・溝部 ２０・・・側面パターン向人弁
理士三好秀和
第１図
第２図FIG. 1 is a perspective view showing a printed circuit board according to the first invention, FIG. 2 is a sectional view thereof, and FIGS. 3(a) and (b) are
FIG. 4 is a sectional view showing a chip component inserted into a through hole of a printed circuit board according to the first invention,
FIG. 5 is a perspective view showing a printed circuit board according to a second embodiment of the present invention, and FIG. 6 is a cross-sectional view showing a laminated state of printed circuit boards according to the present invention. FIG. 7 is a perspective view showing a printed circuit board according to an embodiment, FIG. 7 is a perspective view showing a conventional printed circuit board, and FIG. 8 is a cross-sectional view thereof. 1.10.20... Printed circuit board 2.3, 11.21... Wiring pattern 4.5... Through hole land 6... Through hole (through hole) 7.13... Chip component 12...・Chip land 14... Groove 20... Side pattern Patent attorney Hidekazu Miyoshi Figure 1 Figure 2
Claims (3)
ランドが形成されると共に、前記表面と裏面のスルホー
ルランド間に貫通孔が形成されたプリント基板において
、前記貫通孔にチップ部品を挿入し、前記チップ部品を
介して前記表面と裏面の配線パターンを電気的に接続し
たことを特徴とするプリント基板。(1) In a printed circuit board in which a wiring pattern and a through-hole land are formed on the front surface and the back surface, and a through hole is formed between the through hole land on the front surface and the back surface, a chip component is inserted into the through hole, and the chip component is inserted into the through hole. A printed circuit board, characterized in that the wiring patterns on the front and back surfaces are electrically connected through a component.
プリント基板において、前記各配線パターンをプリント
基板縁部まで形成すると共に、前記各配線パターンが形
成された前記プリント基板縁部にチップ部品を挿入する
溝部を形成し、前記溝部に挿入されるチップ部品を介し
て前記表面と裏面の配線パターンを電気的に接続したこ
とを特徴とするプリント基板。(2) In a printed circuit board with wiring patterns formed on the front and back surfaces, each wiring pattern is formed up to the edge of the printed circuit board, and a chip component is inserted into the edge of the printed circuit board on which each wiring pattern is formed. 1. A printed circuit board, characterized in that a groove is formed in the printed circuit board, and the wiring patterns on the front surface and the back surface are electrically connected through a chip component inserted into the groove.
プリント基板において、前記各配線パターンをプリント
基板縁部まで形成し、プリント基板側面に形成した側面
パターンを介して前記表面と裏面の配線パターンを電気
的に接続したことを特徴とするプリント基板。(3) In a printed circuit board in which wiring patterns are formed on the front and back surfaces, each wiring pattern is formed up to the edge of the printed circuit board, and the wiring patterns on the front and back surfaces are connected through the side pattern formed on the side surface of the printed circuit board. A printed circuit board characterized by electrical connections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31290790A JPH04184992A (en) | 1990-11-20 | 1990-11-20 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31290790A JPH04184992A (en) | 1990-11-20 | 1990-11-20 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04184992A true JPH04184992A (en) | 1992-07-01 |
Family
ID=18034894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31290790A Pending JPH04184992A (en) | 1990-11-20 | 1990-11-20 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04184992A (en) |
-
1990
- 1990-11-20 JP JP31290790A patent/JPH04184992A/en active Pending
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