KR970004988A - Solderless prevention device for automatic soldering of chip parts to printed circuit board - Google Patents
Solderless prevention device for automatic soldering of chip parts to printed circuit board Download PDFInfo
- Publication number
- KR970004988A KR970004988A KR1019950015389A KR19950015389A KR970004988A KR 970004988 A KR970004988 A KR 970004988A KR 1019950015389 A KR1019950015389 A KR 1019950015389A KR 19950015389 A KR19950015389 A KR 19950015389A KR 970004988 A KR970004988 A KR 970004988A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- lands
- soldering
- land
- Prior art date
Links
Abstract
1. 청구범위에 기재된 발명이 속한 기술분야1. TECHNICAL FIELD OF THE INVENTION
본 발명은 칩부품의 리드를 인쇄회로기판에 형성된 패턴의 랜드에 자도납땜 공정시 미납땜을 방지하기 위한 인쇄회로기판의 랜드 구조에 관한 것이다.The present invention relates to a land structure of a printed circuit board for preventing unsoldering during the self-soldering process on the land of the pattern formed on the printed circuit board.
2. 발명이 해결하려고 하는 기술적 과제2. The technical problem to be solved by the invention
본 발명은 칩부품을 인쇄회로기판에 자동납땜시 미납땜 부분이 발생하지 않도록 인쇄회로기판에 형성된 패턴의 랜드 형태를 크게 변경하여 인쇄회로기판에 칩부품을 자동납땜시 미납땜 방지장치를 제공함에 있다.The present invention provides a solderless prevention device when automatically soldering chip components to a printed circuit board by greatly changing the land shape of the pattern formed on the printed circuit board so that unsoldering parts do not occur when the chip components are automatically soldered to the printed circuit board. have.
3. 발명의 해결방법이 요지3. Summary of the Invention
본 발명은 칩부품(3)의 리드(4)와 납땜하기 위한 인쇄회로기판(1)에 형성된 각각 랜드는 전방 중앙에 사각형으로된 하나의 전방랜드(2a)와, 이격된 후방에는 각각 두개의 후방랜드(2b)를 형성하되, 상기 후방랜드(2b)는 양측으로 서로 대향되게 사각형 중앙에서 외측으로 크기가 신장된 랜드를 형성하여 상기 칩부품(3)의 리드(4)를 인쇄회로기판(1)에 형성된 전·후방 랜드(2a,,2b)에 자동납땜시 미납땜 부분이 전혀 발생되지 않도록 인쇄 회로기판(1)의 전·후방랜드(2a,2b)를 구성한 것이다.According to the present invention, each of the lands formed on the printed circuit board 1 for soldering with the lead 4 of the chip component 3 has one front land 2a having a quadrangle at the front center, and two at the rear spaced apart from each other. The rear lands 2b are formed, and the rear lands 2b form lands extending in size from the center of the square to the opposite sides on both sides thereof, thereby forming the leads 4 of the chip component 3 on the printed circuit board. The front and rear lands 2a and 2b of the printed circuit board 1 are configured so that no soldered portions are generated at the time of automatic soldering on the front and rear lands 2a and 2b formed in 1).
4. 발명의 중요한 용도4. Important uses of the invention
본 발명은 칩부품을 인쇄회로기판에 자동납땜시 미납땜 부분이 발생하지 않도록 인쇄회로기판에 형성된 패턴의 랜드 형태를 변경하여 인쇄회로기판에 칩부품을 자동납땜시 미납땜 부분이 발생되지 않게되어 납땜 품질을 향상시킬 수 있고, 추가로 작업자가 미납땜부분을 찾아 납땜할 필요가 없는 효과가 있다.The present invention is to change the land shape of the pattern formed on the printed circuit board so that the unsolded part does not occur when the automatic soldering of the chip component to the printed circuit board so that the unsoldering portion of the chip component on the printed circuit board is not generated The soldering quality can be improved and additionally, the operator does not need to find and solder unsoldered parts.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명의 인쇄회로기판에 형성된 랜드의 구성도, 제4도는 본 발명의 인쇄회로기판의 랜드에 칩부품의 리드가 납땜시 상태도.3 is a configuration diagram of lands formed on the printed circuit board of the present invention, and FIG. 4 is a state diagram when the lead of the chip component is soldered to the land of the printed circuit board of the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950015389A KR970004988A (en) | 1995-06-12 | 1995-06-12 | Solderless prevention device for automatic soldering of chip parts to printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950015389A KR970004988A (en) | 1995-06-12 | 1995-06-12 | Solderless prevention device for automatic soldering of chip parts to printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970004988A true KR970004988A (en) | 1997-01-29 |
Family
ID=66523985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950015389A KR970004988A (en) | 1995-06-12 | 1995-06-12 | Solderless prevention device for automatic soldering of chip parts to printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970004988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6742417B2 (en) | 2002-06-04 | 2004-06-01 | Yong-Su Ha | Socket wrench |
-
1995
- 1995-06-12 KR KR1019950015389A patent/KR970004988A/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6742417B2 (en) | 2002-06-04 | 2004-06-01 | Yong-Su Ha | Socket wrench |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| SUBM | Submission of document of abandonment before or after decision of registration |