JPH062693U - Tape carrier with excellent bendability - Google Patents

Abstract

(57) [Abstract] [Purpose] In a tape carrier that connects two or more terminals across the front and back sides of the mounting board, that is, the end surface, a portion corresponding to the end surface where the lead cross section does not occur and the front and back surfaces are formed. The purpose is to provide a tape carrier that is compatible with the mounting board and has compact wiring. [Structure] By forming the punched portion 7 at the base film portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corner portions 5, the leads 2 do not come into contact with the corner portions 5 of the mounting substrate 4 and lead disconnection is prevented. Since the base film of the portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corners 5 is the punched portion 7, the lead in that portion fits into the end surface 6 of the mounting substrate 4 and compact wiring can be performed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a tape carrier.

[0002]

[Prior art]

 When the conventional tape carrier is folded and used, the connection is as shown in FIG. That is, FIG. 3 (A) is an example in which there is no base film in the bent portion. In this case, the wiring can be made very compact, but a large strain force is applied to the corner portion 5 of the mounting board, and the lead is often disconnected. In the case of FIG. 3B, the base film 3 is continuous to the bent portion and is also on the side surface, but since the base film is thicker, the corner portion 5 becomes circular and the end face 6 is further formed. Both the corresponding portion and the portion 7 corresponding to the front and back surfaces are circular, and compact wiring cannot be performed. In addition, since it has a base film, its bending strength is stronger than that of the copper foil alone, but its connection workability is extremely poor. In order to further improve the case of this figure (B), a tape type integrated circuit board characterized in that two elongated slits are provided in parallel in a portion to be a bent portion (Japanese Utility Model Laid-Open No. 1-160834). ) Is disclosed.

[0003]

[Problems to be solved by the device]

 However, the tape-type integrated circuit board described in Japanese Utility Model Laid-Open No. 1-160834 is equivalent to the end face 6 even if the elongated base film portion between the two elongated slits contacts the corner of the mounting substrate to prevent disconnection. Since the base film exists in the part, the tape carrier of the part corresponding to the end face 6 and the part 7 corresponding to the front and back surfaces cannot be sufficiently flat, and there is a problem that compact wiring cannot be performed. .

An object of the present invention is to solve the above-mentioned drawbacks, in a tape carrier that connects two or more terminals across the front and back sides of the mounting board, that is, the end surface, does not cause breakage of the leads on the end surface, and It is an object of the present invention to provide a tape carrier capable of compact wiring, in which the portions corresponding to the end faces and the portions corresponding to the front and back sides are familiar.

[0005]

[Means and Actions for Solving the Problems]

 The gist of the present invention is to prevent the lead from breaking due to bending by making the part corresponding to the end surface of the base film excluding the corners of the mounting substrate a punched part, and the part corresponding to the end surface and the part corresponding to the front and back sides. It is possible to obtain familiar and compact wiring.

That is, the above-mentioned object of the present invention corresponds to the end surface of the tape carrier excluding the corners of the mounting board in a tape carrier that connects two or more terminals across the front and back surfaces of the mounting board, that is, the end surface. This is achieved by a tape carrier excellent in bendability, which is characterized in that the base film portion is a punched portion.

The main point of the present invention is that the leads of the tape carrier do not come into contact with the corners of the mounting board, and the base film portion corresponding to the end face has excellent flexibility. Therefore, the width of the punched part of the base film should be one excluding the corners, but due to the problem of assembly accuracy, the width of the punched part of the base film, which is 100 to 500 μm narrower than the thickness of the substrate, should be small. It is reasonable.

The punching part of the present invention means that the region is a part of the base film that is punched out and has excellent flexibility, and the punching shape may be a slit shape or a round shape. It may be a hole. Further, in the case of a slit shape, one slit may be provided, or a plurality of thin slits may be provided, and in the case of a round hole, they may be provided in a staggered pattern.

[0009]

【Example】

 FIG. 2 is a plan view of an embodiment of the present invention. The punched portion 7 is a base film portion corresponding to the end surface 6 excluding the corner portion 5 of the mounting substrate. The rest of the structure is the same as that of the conventional tape carrier, but the main purpose of the present invention is to limit the width of the punched portion of the base film corresponding to the end surface of the mounting substrate. FIG. 1 shows a cross section when the tape carrier of the present invention is mounted and used. As is clear from this figure, the base film portion 7 corresponding to the end surface 6 excluding the corner portion 5 of the mounting board 4 is used as the punched portion 7, so that the lead 2 is brought into contact with the corner portion 5 of the mounting board 4. The lead film can be prevented from being broken, and the base film of the portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corners 5 is the punched portion 7. Therefore, the lead of that portion fits in the end surface 6 of the mounting substrate. Compact wiring is possible.

From the above description, in order to prevent the breakage of the leads, it is conceivable to chamfer the corner portions 5 of the substrate so as not to apply a large strain to the leads. However, the chamfering of the mounting board increases the number of work steps and increases the cost. Therefore, the method of the present invention can achieve the purpose well without increasing the cost. This is because the punched part can be machined at the same time as the device hole and sprocket hole, so it can be provided without changing the work process or method.

[0011]

[Effect of device]

 The tape carrier of the present invention, which has excellent bendability, can improve the quality without increasing the processing cost by using the tape carrier which does not cause the disconnection of the lead and allows the compact wiring.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment when a tape carrier of the present invention is mounted.

FIG. 2 is a plan view of a tape carrier of the present invention, one embodiment (A) and another embodiment (B).

FIG. 3 is a cross-sectional view when a conventional tape carrier is mounted, one example (A) and another example (B).

[Explanation of symbols]

 1 LSI Chip 2 Lead 3 Base Film 4 Mounting Substrate 5 Corner of Mounting Substrate 6 End Face of Mounting Substrate 7 Corresponding to Front and Back 8 Stamping

Claims (1)

[Scope of utility model registration request] 1. A front and back surface of a mounting board, that is, an end surface,
In a tape carrier that connects two or more terminals,
A tape carrier excellent in bendability, characterized in that a portion of the base film corresponding to the end face excluding the corner portion of the mounting substrate is a punched portion.