JPS62199434A - Laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laminate used for mounting electronic components.

(Conventional technology) Conventionally, when mounting electronic components on a laminate,
For example, as shown in FIG. 5, a recess C is provided in a laminate 1, and a conductor pattern 2 is formed across the surface of the laminate 1 and the inside of the recess C by an additive method, a photoetching method, etc. The electronic component 3 is mounted inside to reduce the protruding portion. Note that 4 in the figure indicates the part where the electronic component 3 and the conductive pattern 2 are soldered.

Conventionally, as shown in FIG. 6, the recess C of the laminate 1 is formed by laminating a plurality of flat prepregs 1a and integrating them by heating and pressing, as shown in FIG. Since it was formed by cutting with an end mill or the like, there were problems in that the number of man-hours was large and the manufacturing cost was high.

(Problems to be Solved by the Invention) The present invention was made in view of the above circumstances, and it is an object of the present invention to provide a laminate that requires fewer man-hours and does not increase manufacturing costs even when electronic components are mounted with fewer protruding parts. It is an object.

[Structure of the Invention] (Means for Solving the Problems) The present invention involves heating and pressurizing a flat prepreg with multiple layers of prepreg in which through holes are formed in advance so that the through holes coincide with each other. I made him wear it.

(Function) Even when mounting electronic components with fewer protruding parts, the recesses for mounting the components are already formed, so cutting can be done using an end mill, etc.

becomes unnecessary.

(Example) Hereinafter, details of an example of the present invention will be described based on the drawings.

FIG. 1 is a side view showing one embodiment of the present invention, and parts common to FIGS. 5 to 7 are given the same reference numerals.

In the figure, 1a is a flat prepreg, 1b is a prepreg with the same shape and size as the prepreg 1a, and has a rectangular hole drilled in a predetermined position in advance, and 2a is a prepreg 1b.
The conductor pattern 2b is formed across the surface of the prepreg 1a and the inside of the through hole, and the conductor pattern 2b is formed on the surface of the prepreg 1a, and these are integrally molded by heating and pressing. Note that C is a recess for mounting electronic components.

FIG. 2 is a diagram showing a method for manufacturing the laminate of this example.

In the figure, 1a is a flat prepreg, 1b is a prepreg with the same shape and size as the prepreg 1a, and has a rectangular through hole H drilled in a predetermined position in advance, and 2' is a prepreg 1.
Copper foil of the same size as a and 1b, 5 is cushion material, 5a,
5b is a mold of the press device. A part of the mold 6b is shaped to project slightly more than the other part, and this projecting part corresponds to the position of the through hole H of the prepreg 1b.

In addition, in this embodiment, one side of the through hole H formed in the prepreg 1b on the upper side in the figure is connected to the prepreg 1b on the lower side.
It is made slightly smaller than one side of the through hole H.

In the laminate of this example, the prepreg 1b in the area where the recess C is required is removed in advance, and a conductive surface is formed with copper foil 2' across the surface of the prepreg 1b and the inside of the recess C. The conductive surface is made into a conductive pattern using an etching method.

Thus, the laminate of this example does not require cutting using an end mill or the like when mounting electronic components.

In this embodiment, the copper foil 2' is crimped onto the prepreg 1b and the conductor pattern is formed by photo-etching, but the conductor pattern may also be directly formed by the additive method. When forming a conductor pattern by the additive method, a flat mold is used as the mold 6b of the press device.

FIG. 3 is a side view showing another embodiment of the present invention.

In the figure, 1a is a flat prepreg, 1b is a prepreg with a through hole, 2 is a conductive pattern, 3 is an electronic component, and 4 is a soldering part.

In this embodiment, the recesses C formed by the through holes of the prepreg 1b are formed in vertical rows along the bends of the laminate.

Therefore, when the laminate is bent as shown in Figure 4,
Since the tension caused by bending is absorbed by the recess C, there is no risk that the conductor pattern 2 will peel off or that the electronic component will have a poor connection.

Note that a laminate having such a shape is suitable for an internal board of a hand belt computer in which a display is integrated above the keyboard and the display portion is raised toward the front.

[Effects of the Invention] As explained above, in the laminate of the present invention, multiple layers of prepreg in which through holes are formed in advance are adhered to a flat prepreg by heating and pressing so that the through holes are aligned. This eliminates the need for cutting using an end mill or the like even when electronic components are mounted with fewer protruding parts. Therefore, the number of man-hours is reduced, and manufacturing costs can be held down.

[Brief explanation of drawings]

FIG. 1 is a side view showing one embodiment of the present invention, FIG. 2 is a diagram explaining a method for manufacturing a laminate of the same embodiment, and FIG.
4 and 4 show an embodiment of the present invention, FIG. 5 shows a state in which electronic components are mounted on a conventional laminate, and FIGS. 6 and 7 show a conventional laminate. ! It is a figure explaining the method of making i. 1・・・・・・・・・・・・Laminated plates 1a, 1b・
...Prepreg 2.2a, 2b ......Conductor pattern 2'...Copper foil 3...・Electronic parts 4...
......Soldering is part 5...
・・・・・・Cushion material 6a, 6b・・・Mold C・・・・・・・・・・・・Concave part H・・・・・・
・・・・・・・・・・・・Toru General applicant Toshiba Corporation Patent attorney Sa Suyama - Figure 1 Figure 2 I and Figure 3 a Figure 4 Figure 50 Figure 7

Claims (2)

[Claims] (1) A laminate comprising a flat prepreg and a plurality of layers of prepreg in which through-holes are formed in advance, which are adhered by heating and pressing so that the through-holes are aligned. (2) The laminate according to claim 1, wherein a conductor pattern is formed across the surface of a prepreg having through holes and the inside of the through holes.