JPH0384988A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH0384988A JPH0384988A JP22019589A JP22019589A JPH0384988A JP H0384988 A JPH0384988 A JP H0384988A JP 22019589 A JP22019589 A JP 22019589A JP 22019589 A JP22019589 A JP 22019589A JP H0384988 A JPH0384988 A JP H0384988A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- printed circuit
- circuit board
- soldering
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 238000013022 venting Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、テレビジョン受像機やデイスプレィ装置等に
使用されるプリント基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board used in television receivers, display devices, and the like.
（従来の技術）
従来のこの種のプリント基板について、第３図により説
明する。(Prior Art) A conventional printed circuit board of this type will be explained with reference to FIG.
第３図（ａ）および（ｂ）は、従来のプリント基板の側
面図および平面図で、リード端子付き部品１を実装する
プリント基板２は、上記のリード端子付き部品ｌの端子
１ａが半田付けされる金属箔配線３の近傍に空気抜き用
の複数の小貫通孔４を、金型等を用いてあけていた。3(a) and (b) are a side view and a plan view of a conventional printed circuit board, in which the printed circuit board 2 on which the component 1 with lead terminals is mounted has the terminal 1a of the component 1 with lead terminals soldered. A plurality of small through holes 4 for air venting were made using a mold or the like in the vicinity of the metal foil wiring 3.
（発明が解決しようとする課題）
しかしながら、上記の構成では、半田バスを用いて実装
する際に、第４図に示すように、溶融した半田５の中を
移動するプリント基板２の移動方向に対し、リード端子
付き部品１の前後に空気溜まり６および７が発生し易く
、後ろ側の空気溜まり７のように、端子１ａを包む状態
になると、半田付は不良が発生するという問題があった
。(Problem to be Solved by the Invention) However, in the above configuration, when mounting using a solder bus, as shown in FIG. On the other hand, air pockets 6 and 7 tend to occur before and after the component 1 with lead terminals, and when the air pockets 7 on the rear side wrap around the terminal 1a, there is a problem in that soldering defects occur. .
また、２次、３次の半田デイツプ作業を繰り返すと、リ
ード端子付き部品１の劣化につながるという問題もあっ
た。Further, there is a problem in that repeating the secondary and tertiary solder dip operations leads to deterioration of the component 1 with lead terminals.
本発明は上記の問題を解決するもので、信頼性の高い半
田付は作業が可能なプリント基板を提供するものである
。The present invention solves the above problems and provides a printed circuit board that can be soldered with high reliability.
（課題を解決するための手段）
上記の課題を解決するため、本発明は、リード端子付き
部品の実装位置にこれより大きな空気抜き用の角孔を設
けるものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a square hole for air venting larger than this at the mounting position of the component with lead terminals.
（作 用）
上記の構成により、空気溜まりが発生しないので、半田
付は品質が確保され、２次デイツプ工程が不要となる。(Function) With the above configuration, air pockets are not generated, so the quality of soldering is ensured and a secondary dip process is not required.
従って１部品の劣化も生じない。Therefore, no single component deteriorates.
（実施例） 本発明の実施例を第１図および第２図により説明する。(Example) Embodiments of the present invention will be described with reference to FIGS. 1 and 2.
第１図（ａ）および（ｂ）は１本発明によるプリント基
板の側面断面図および平面図で、本実施例が第３図に示
した従来例と異なる点は、小貫通孔４の替りに、金属箔
配線３が形成されたプリント基板２の、リード端子付き
部品１を実装する位置に。FIGS. 1(a) and 1(b) are a side sectional view and a plan view of a printed circuit board according to the present invention. The difference between this embodiment and the conventional example shown in FIG. , on the printed circuit board 2 on which the metal foil wiring 3 is formed, at the position where the component 1 with lead terminals is to be mounted.
上記のリード端子付き部品１の幅に等しく、長さが長い
空気抜き用の角孔８を設けた点である。その他は従来例
と変らないので、同じ構成部品には同一符号を付して、
その説明を省略する。The point is that a square hole 8 for air venting is provided, which has a length equal to the width of the above-mentioned component 1 with lead terminals and a long length. The rest is the same as the conventional example, so the same components are given the same symbols.
The explanation will be omitted.
第２図は、本発明の第２の実施例を示す側面断面図で、
第１の実施例と異なる点は、端子１ａが長手方向に伸び
たリード端子付き部品１を対称とした点と、角孔８の幅
寸法を厳格に抑え、リード端子付き部品ｌを挟持できる
ようにした点である。FIG. 2 is a side sectional view showing a second embodiment of the present invention.
The difference from the first embodiment is that the terminal 1a is symmetrical with the component 1 with a lead terminal extending in the longitudinal direction, and the width of the square hole 8 is strictly controlled so that the component 1 with the lead terminal can be held. This is the point I made.
その他は第１の実施例と変らないので、同じ構成部品に
は同一符号を付してその説明を省略する。Since the rest is the same as the first embodiment, the same components are given the same reference numerals and their explanations will be omitted.
このような構成により、実装時に仮接着する接着剤の使
用を廃止することができる。なお、この時、接着剤を併
用すれば、さらに仮固定は確実となる。With this configuration, it is possible to eliminate the use of adhesive for temporary bonding during mounting. Note that if an adhesive is used at this time, the temporary fixation will be even more reliable.
第１および第２の実施例ともに、半田デイツプ工程で空
気抜けが十分に行われるため、半田の流れがよく、半田
付は精度が向上し、１回の作業で済む、また、角孔８の
打抜き加工は、小貫通孔４より金型の消耗が少なく、寿
命が長く製造コストが大幅に減る。In both the first and second embodiments, sufficient air is removed during the solder dip process, so the solder flows well, the soldering accuracy improves, and only one operation is required. Punching requires less wear and tear on the mold than the small through hole 4, has a longer life, and significantly reduces manufacturing costs.
（発明の効果）
以上説明したように、本発明によれば、半田付けに際し
空気の抜けが良くなるので、半田付けの信頼性とともに
その品質が向上する。また、角孔に部品を挟持させる装
着方法を採用すると、アッセンブリ高さを低くでき製品
を薄形にまとめることができる。(Effects of the Invention) As described above, according to the present invention, air can be easily removed during soldering, so that the reliability and quality of soldering are improved. Furthermore, by adopting a mounting method in which parts are held in square holes, the height of the assembly can be lowered and the product can be made thinner.
また、金型の寿命が長くなるので製造コストが低減する
。さらに、再半田付けの必要がなくなるので１部品の劣
化を招くことがないので、製品の信頼性を大幅に向上す
る。各チップ他の部品放熱効果も大である。Additionally, the life of the mold is extended, which reduces manufacturing costs. Furthermore, since there is no need for re-soldering, there is no possibility of deterioration of a single component, which greatly improves the reliability of the product. The heat dissipation effect of each chip and other components is also great.
第１図（ａ）および（ｂ）は本発明によるプリント基板
の第１の実施例を示す側面断面図および平面図、第２図
は第２の実施例を示す側面断面図、第３図（ａ）および
（ｂ）は従来のプリント基板の側面図および平面図、第
４図は従来のプリント基板の半田付は工程を示す側面図
である。
１ ・・・ リード端子付き部品、 １ａ・・・端子、
２・・・プリント基板、 ３・・・金属箔配線、 ４
・・・小貫通孔、 ５・・・半田。
６．７・・・空気溜まり、 ８・・−角孔。1(a) and (b) are a side sectional view and a plan view showing a first embodiment of a printed circuit board according to the present invention, FIG. 2 is a side sectional view showing a second embodiment, and FIG. a) and (b) are a side view and a plan view of a conventional printed circuit board, and FIG. 4 is a side view showing the process of soldering a conventional printed circuit board. 1... Parts with lead terminals, 1a... Terminals,
2... Printed circuit board, 3... Metal foil wiring, 4
...Small through hole, 5...Solder. 6.7...Air pocket, 8...-Square hole.
Claims (1)
ト基板において、上記のリード端子付き部品を実装する
プリント基板の位置に、リード端子付き部品と同じ幅で
、長さが長い角孔を形成したことを特徴とするプリント
基板。A printed circuit board on which components with lead terminals are mounted by soldering is characterized in that a rectangular hole with the same width as the component with lead terminals and a long length is formed at the position of the printed circuit board where the components with lead terminals are mounted. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22019589A JPH0384988A (en) | 1989-08-29 | 1989-08-29 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22019589A JPH0384988A (en) | 1989-08-29 | 1989-08-29 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0384988A true JPH0384988A (en) | 1991-04-10 |
Family
ID=16747380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22019589A Pending JPH0384988A (en) | 1989-08-29 | 1989-08-29 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0384988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014187459A (en) * | 2013-03-22 | 2014-10-02 | Seiko Epson Corp | Quantum interference device, atomic oscillator, electronic apparatus and mobile body |
-
1989
- 1989-08-29 JP JP22019589A patent/JPH0384988A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014187459A (en) * | 2013-03-22 | 2014-10-02 | Seiko Epson Corp | Quantum interference device, atomic oscillator, electronic apparatus and mobile body |
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